Emission Theory of the Sputtering of Amorphous Materials: Self-Sputtering

The dependences of the coefficient of self-sputtering on the type of accelerated ions, their energy, and the angle of incidence on a target are calculated. Satisfactory coincidence between the calculated and experimental results is obtained for С–С and W–W systems. Two mechanisms of the entry of secondary particles into a flow of sputtered atoms are proposed.     

Sputtering of A 3 B 5 materials (GaP, GaAs, GaSb, InP, and InSb) by 2-to 14-keV N 2 + ions

Investigations of the general characteristics and distinctive features of sputtering of A ³ B ⁵ materials (GaP, GaAs, GaSb, InP and InSb) under bombardment with N ₂ ⁺ ions have been carried out. From the experimental data, dependences of the sputtering yield of these materials on the incidence angle and ion energy have been obtained and the surface relief patterns produced by target etching have been studied. It has been shown that the dependence on energy of the sputtering yield for GaP, GaAs, and InP can be adequately described by the Haffa-Switkovski formula for binary materials and Yudin’s approximation for elemental targets. Sputtering of GaSb and InSb proceeds in the surface layer recrystallization mode, and the sputtering yield agrees with calculations based on Onderlinden’s model. From a comparison of the experimental and calculated dependences, the surface bonding energies have been determined.     

Sputtering studies with the Monte Carlo Program TRIM.SP

The Monte Carlo Program TRIM.SP (sputtering version of TRIM) was used to determine sputtering yields and energy and angular distributions of sputtered particles in physical (collisional) sputtering processes. The output is set up to distinguish between the contributions of primary and secondary knock-on atoms as caused by in- and outgoing incident ions, in order to get a better understanding of the sputtering mechanisms and to check on previous theoretical models. The influence of the interatomic potential and the inelastic energy loss model as well as the surface binding energy on the sputtering yield is investigated. Further results are sputtering yields versus incident energy and angle as well as total angular distributions of sputtered particles and energy distributions in specific solid angles for non-normal incidence. The calculated data are compared with experimental results as far as possible. From this comparison it turns out that the TRIM.SP is able to reproduce experimental results even in very special details of angular and energy distributions.     

Sputtering of boron nitride single crystals of different structure

Results obtained in studying the sputtering of single crystals of hexagonal, rhombohedral, and cubic boron nitride modifications by computer simulations are reported. Data on sputtering the (0001) face of BN in two graphite-like modifications and the (111) face of BN crystals with a cubic lattice are presented. The energy and angular dependences of the sputtering yields and spatial and energy distributions of sputtered particles are considered for the cases of normal and oblique ion incidence. Specific features of the anisotropy of spatial distributions of sputtered particles and mechanisms of their formations are analyzed.     

Sputtering—a review of some recent experimental and theoretical aspects

After a brief outline of the present sputtering theory for a random solid, recent results of the sputtering yieldS for polycrystalline targets are discussed, in particular in view of the influence of the projectile mass and the bombarding angle. The angle dependence ofS at low bombarding energies, and results on the angular distribution of sputtered particles for oblique ion incidence point out necessary modifications of present sputtering theories with respect to the anisotropy of the collision cascades in the solid and the influence of the target surface. The energy distribution of the neutral particles ejected along the target normals is related to the theoretically predictedE ^?2-distribution of low energy recoils in the Recent mass spectrometric studies of postionized sputtered neutrals are discussed in view of the formation of sputtered molecules and the application of sputtered neutral mass spectroscopy for surface analysis. Finally, the paper deals with ion-induced surface effects on non-elementary sputtering targets, and the protracted removal of foreign atoms from a matrix.     

Determination of angle dependence of sputtering yield for a multicomponent target by the time characteristics of the sputtering process

A method for determining the variations of sputtering yield of multicomponent target based on studies of time characteristics of the sputtered particles flux has been proposed and tested on an example of the angle dependence of sputtering yield. Time dependences of variation in the fluxes of the sputtered atoms of multicomponent oxides at different incidence angles of Ar ions were studied. Angular dependences of the sputtering yield for these compounds were obtained by direct measurements and computations. It has been shown that the angular dependence of the sputtering yield in a stationary mode can be obtained from the time dependences of the fluxes of the sputtered particles.     

Sputtering yields for light ions as a function of angle of incidence

The sputtering yield of Ni, Mo, and Au have been measured at oblique angles of incidence for H⁺-, D⁺-, and⁴He⁺-ion irradiation in the energy region from 1 to 8 keV. The yields were determined from the weight loss of the targets. For Ni and Mo the dependence of the sputtering yield on the angle of incidence was found to be much stronger for H⁺- and D⁺-ion than for⁴He⁺-ion irradiation. In all cases the maximum in the yield was found at angles of incidence ϑ≧80°, where ϑ is the angle measured from the surface normal. Furthermore the ratio of the maximum yield to the yeild at normal incidence increases with increasing surface binding energy of the target material as well as with increasing ion energy in the energy region inveestigated. The results are discussed qualitatively in view of a model for the sputtering mechanism for light ions.     

Sputtering of solicon and germanium by middle-energy heavy ions

The angular and energy dependences of the sputtering ratios of silicon and germanium targets under bombardment by argon ions of ten-keV energy are studied.     

Sputtering of highly oriented pyrolytic graphite with 30 keV Argon ions

The influence of the incidence angle of 30 keV Ar⁺ ions, ion fluence and target temperature on the sputtering yield and surface microgeometry of highly oriented pyrolytic graphite (UPV-1T) samples was experimentally studied. It was found that at fluences more than 5 × 10¹⁹ ion cm^?2 the sputtering yield at room temperature in the range of the ion incidence angle from 0° to 80° is twice as small as the corresponding experimental data for both polycrystalline graphite and glassy carbon. The analysis of ion-induced relief permits us to suppose the topographical suppression mechanism of highly oriented pyrolytic graphite sputtering.     

Simulation of boron nitride sputtering process and its comparisonwith experimental data

In the paper, TRIM and TRIDYN simulation codes were used to simulate the sputtering processes of boron nitride (BN) films during bombardment of ions. The TRIM and TRIDYN codes are applicable to the simulation of sputtering processes of different target materials with amorphous and polycrystalline structure. The results of the simulations are compared with experimental data. The sputtering experiments of polycrystalline hexagonal BN (h-BN) and cubic BN (c-BN) films were performed in a Commonwealth Scientific Corporation (CSC) 38-cm ion beam source device. The comparison of calculated and experimental results indicated that a) the experimental sputtering yields of h-BN and c-BN films bombarded with Ar⁺ ions versus the angle of incidence are in reasonable agreement with the calculated results; b) the sputtering yields of h-BN and c-BN bombarded with Ar⁺ are nearly of the same values versus the angle of incidence-preferential sputtering of h-BN was not found; c) the calculated sputtering. Yields of BN as a function of Ar⁺ ion energy are very sensitive to values of the surface binding energy (SEE); and d) surface binding energy between 2 and 3 eV for BN appears to be reasonable for the simulation of sputtering process of h-BN and c-BN films     

对蓝宝石衬底上射频溅射的PbTiO3薄膜的光学特性研究

使用射频溅射和组合靶在蓝宝石 (α Al2 O3)基底上制备出了结构较好的PbTiO3 薄膜 ,提出了一种利用透射光谱来简单有效地分析弱吸收薄膜的光学特性及与光学相关的其它物理特性的方法。得出了该薄膜在 40 0nm～2 40 0nm区域内的折射率、消光系数等参量与波长的变化关系和与之相符合的柯西 (Cauchy)色散公式 ,并通过外推的方法估算出了薄膜的光学能量带隙为 3.6 5eV。     

Systematic investigation of the reactive ion beam sputter deposition process of SiO<Subscript>2</Subscript>

Ion beam sputter deposition (IBSD) is an established physical vapour deposition technique that offers the opportunity to tailor the properties of film-forming particles and, consequently, film properties. This is because of two reasons: (i) ion generation and acceleration (ion source), sputtering (target) and film deposition (substrate) are locally separated. (ii) The angular and energy distribution of sputtered target atoms and scattered primary particles depend on ion incidence angle, ion energy, and ion species. Ion beam sputtering of a Si target in a reactive oxygen atmosphere was used to grow SiO₂ films on silicon substrates. The sputtering geometry, ion energy and ion species were varied systematically and their influence on film properties was investigated. The SiO₂ films are amorphous. The growth rate increases with increasing ion energy and ion incidence angle. Thickness, index of refraction, stoichiometry, mass density and surface roughness show a strong correlation with the sputtering geometry. A considerable amount of primary inert gas particles is found in the deposited films. The primary ion species also has an impact on the film properties, whereas the influence of the ion energy is rather small.     

The Influence of Temperature on the Spectral Dependences of Aluminum’s Optical Properties

Data in the literature on the optical properties of aluminum in the range of 198–1173 K are analyzed. Analytical expressions describing the dependences of aluminum permittivity on photon energy and temperature are proposed and tested. The spectral dependences of the aluminum absorption coefficient and specular reflectance at normal incidence, as well as of the absorption-efficiency coefficients of aluminum nanoparticles in a lithium-fluoride matrix, are calculated at different temperatures. The results obtained indicate the appearance of unusual nonlinear absorption effects in nanocomposites containing aluminum nanoparticles, which manifest themselves in a decrease in the absorption efficiency with increasing temperature at photon energies exceeding 1.40 eV.     

Sputtering of tungsten, tungsten oxide, and tungsten-carbon mixed layers by deuterium ions in the threshold energy region

An original experimental method is developed for determining the sputtering coefficients of electrically conducting materials during bombardment by light gas ions at threshold energies. This information is very valuable in both purely scientific and practical terms. The basis of the method is a special field-ion-microscopic analysis regime. The procedure for measuring the sputtering coefficients includes cleaning the surface by field desorption and evaporation, with the subsequent work on an atomically clean and atomically smooth surface. The method permits identification of single vacancies on the irradiated surface, i.e., it is possible to count individual sputtered atoms. The method is tested on commercially pure tungsten, tungsten oxide, and a W-C mixed layer on tungsten under deuterium ion bombardment. The energy dependences of the sputtering coefficients of these materials for sputtering by deuterium ions at energies of 10–500 eV are obtained and analyzed. An important relationship between the energy threshold for sputtering and the conditions for oxidation of tungsten is found. The energy threshold for sputtering of an oxidized tungsten surface is 65 eV. The energy threshold for sputtering of the W-C mixed layer is almost equal to the corresponding value for pure tungsten. Zh. Tekh. Fiz. 69, 137–142 (September 1999)     

Angular distribution of copper atoms sputtered with energetic ions

Measurements of the angular distribution of copper atoms which are sputtered by noble gas ions within the energy range between 0.1 and 1 MeV have been carried out for different angles of ion incidence. The hemisphere over the target surface could be studied with a microphotometer inside the sputtering chamber and the distributions can be plotted in tri-dimensional diagrams. The results are in principle similar to those obtained at lower energies. The angle of maximum emission varies with ion energy and with the angle of incidence and can be related to the sputtering yield.     

MONTE CARLO STUDIES OF RADIATION DAMAGE INDUCED BY FUSION DYNAMIC SIMULATION OF SPUTTERING

In this paper, the sputtering caused by fusion of ⁴He particles in the first wall materials is investigated by using the dynamic Monte Carlo simulation, which is based on the binary collision approximation. The dependences of sputtering yields on the incident energy and angle, as well as the comparisons of results calculated using the Monte Carlo methed with results from experiments, are discussed. Energy spectrum and angular distributions of sputtered species, the depth of origin of the sputtered particles as well as range distributions of incident ions are given. From a comparison between the related experimental data and the calculated results with static and dynamic simulation it has been found that a better agreement is obtained for dynamic simulation.     

Point-defect properties of,and sputtering events in,the {001} surfaces of Ni3Al. II. Sputtering events at and near surfaces

Atomic recoil events at and near {001} surfaces of Ni₃Al due to elastic collisions between electrons and atoms have been simulated by molecular dynamics to obtain the sputtering threshold energy as a function of atomic species, recoil direction and atomic layer of the primary recoil atom. The minimum sputtering energy occurs for adatoms and is 3.5 and 4.5?eV for Al and Ni adatoms on the Ni–Al surface (denoted ‘M’), respectively, and 4.5?eV for both species on the pure Ni surface (denoted ‘N’). For atoms within the surface plane, the minimum sputtering energy is 6.0?eV for Al and Ni atoms in the M plane and for Ni atoms in the N surface. The sputtering threshold energy increases with increasing angle, θ, between the recoil direction and surface normal, and is almost independent of azimuthal angle, ?, if θ<60°; it varies strongly with ? when θ>60°, with a maximum at ??=?45° due to ?{110}? close-packed atomic chains in the surface. The sputtering threshold energy increases significantly for subsurface recoils, except for those that generate efficient energy transfer to a surface atom by a replacement collision sequence. The implications of the results for the prediction of the mass loss due to sputtering during microanalysis in a FEG STEM are discussed.     

Sputtering yields of nickel and chromium

The sputtering yield of polycrystalline nickel and chromium was determined as a function of projectile energy (1–8 keV), projectile mass (N⁺, Ne⁺, Ar⁺, Xe⁺), angle of incidence (0°–75°), and oxygen partial pressure. Where theoretical values exist, the agreement is reasonable.EURATOM Association     

Sputtering of compound semiconductor surfaces. I. Ion-solid interactions and sputtering yields

Several phenomena occur on the surface of a solid when being bombarded by energetic ions. A short general review is given of the major ion-solid interactions on compound semiconductor surfaces. An in-depth discussion is presented of the total sputtering yields of component semiconductors. For this discussion, GaAs is assumed to be the prototype compound semiconductor because most experimental measurements exist for GaAs. To exclude any chemical effects in the sputter yields, only the total sputtering yield data for argon ion bombardment of GaAs are compared with the predictions of the major sputtering theories, with particular attention to the Sigmund theory for linear cascade sputtering. Different proposals of each of the parameters in this theory are presented and compared with the GaAs data. These parameters are the surface binding energy, the nuclear stopping power, and the factor α, which represents the fraction of energy available for sputtering. Use of the different parameters results in a large variation in the predictions. Topics also considered are the angle dependence of the sputtering yields, sputter threshold energy, and channeling effects in the sputter yields of compound semiconductors. Spike sputtering effects are evident in the sputtering yields of GaAs by krypton and xenon ions.     

MONTE CARLO STUDIES OF RADIATION DAMAGE INDUCED BY FUSION:DYNAMIC SIMULATION OF SPUTTERING

In this paper, the sputtering caused by fusion of ⁴He particles in the first wall materials is investigated by using the dynamic Monte Carlo simulation, which is based on the binary collision approximation. The dependences of sputtering yields on the incident energy and angle, as well as the comparisons of results calculated using the Monte Carlo methed with results from experiments, are discussed. Energy spectrum and angular distributions of sputtered species, the depth of origin of the sputtered particles as well as range distributions of incident ions are given. From a comparison between the related experimental data and the calculated results with static and dynamic simulation it has been found that a better agreement is obtained for dynamic simulation.