Observations on X‐ray enhanced sputter rates in argon cluster ion sputter depth profiling of polymers

Traditionally polymer depth profiling by X‐ray photoelectron spectroscopy (XPS) has been dominated by the damage introduced by the ion beam rather than the X‐rays. With the introduction of polyatomic and especially argon gas cluster ion‐beam (GCIB) sources for XPS instruments, this is no longer the case, and either source of damage may be important (or dominate) under particular conditions. Importantly, while ion‐beam damage is a near‐surface effect, X‐ray damage may extend micrometres into the bulk of the sample, so that the accumulation of X‐ray damage during long depth profiles may be very significant. We have observed craters of similar dimensions to the X‐ray spot well within the perimeter of sputter craters, indicating that X‐rays can assist GCIB sputtering very significantly. We have measured experimentally sputter craters in 13 different polymers. The results show that X‐ray exposure can introduce much more topography than might previously have been expected, through both thermal and direct X‐ray degradation. This can increase the depth of a crater by a remarkable factor, up to three in the case of poly‐L‐lactic acid and polychlorotrifluorothylene under reasonably normal XPS conditions. This may be a major source of the loss of depth resolution in sputter depth profiles of polymers. Copyright © 2012 John Wiley & Sons, Ltd.     

Enhanced surface sensitivity in secondary ion mass spectrometric analysis of organic thin films using size‐selected Ar gas‐cluster ion projectiles

A size‐selected argon (Ar) gas‐cluster ion beam (GCIB) was applied to the secondary ion mass spectrometry (SIMS) of a 1,4‐didodecylbenzene (DDB) thin film. The samples were also analyzed by SIMS using an atomic Ar⁺ ion projectile and X‐ray photoelectron spectroscopy (XPS). Compared with those in the atomic‐Ar⁺ SIMS spectrum, the fragment species, including siloxane contaminants present on the sample surface, were enhanced several hundred times in the Ar gas‐cluster SIMS spectrum. XPS spectra during beam irradiation indicate that the Ar GCIB sputters contaminants on the surface more effectively than the atomic Ar⁺ ion beam. These results indicate that a large gas‐cluster projectile can sputter a much shallower volume of organic material than small projectiles, resulting in an extremely surface‐sensitive analysis of organic thin films. Copyright © 2010 John Wiley & Sons, Ltd.     

Status monitoring of ion sputter relevant parameters of an XPS depth profiling instrument

An X-ray photoelectron spectroscopy (XPS) instrument is utilized for sputter depth profiling of thin films. Relevant instrumental parameters are the ion gun sputter rate, the contamination level of the sputter ion gun, and the purity of the sputter ion gun gas supply as well as the vacuum quality of the instrument at the sample position. A long-term recording of these instrumental parameters ensures the reliability of the measured depth profile data. The ion gun sputter rate was estimated using the standard ISO conform depth profiling of a SiO₂ reference layer of known thickness. Two new procedures are developed to determine the other relevant parameters. Gases that are emitted by the ion sputter gun get implanted into a Si target. An analysis of the implanted gases allows judging on the contamination level of the sputter gun and the purity of the sputter gun gas supply. The vacuum condition of an XPS microprobe at the sample position is monitored by the recontamination of a sputtered Ti surface by adsorbed residual gas particles.     

Development of B‐doped Si multiple delta‐layer reference materials for SIMS profiling

B‐doped Si multiple delta‐layers (MDL) were developed as certified reference materials (CRM) for secondary ion mass spectrometry (SIMS) depth profiling analysis. Two CRMs with different delta‐layer spacing were grown by ion beam sputter deposition (IBSD). The nominal spacing of the MDL for shallow junction analysis is 10 nm and that for high energy SIMS is 50 nm. The total thickness of the film was certified by high resolution transmission electron microscopy (HR‐TEM). The B‐doped Si MDLs can be used to evaluate SIMS depth resolution and to calibrate the depth scale. A consistency check of the calibration of stylus profilometers for measurement of sputter depth is another possible application. The crater depths measured by a stylus profilometer showed a good linear relationship with the thickness measured from SIMS profiling using the calibrated film thickness for depth scale calibration. The sputtering rate of the amorphous Si thin film grown by sputter deposition was found to be the same as that of the crystalline Si substrate, which means that the sputtering rate measured with these CRMs can be applied to a real analysis of crystalline Si. Copyright © 2005 John Wiley & Sons, Ltd.     

Ion beam sputtering techniques for high-resolution concentration depth profiling with glancing-incidence X-ray fluorescence spectrometry

The application of ion beam sputtering in combination with glancing-incidence X-ray fluorescence spectrometry for high-resolution concentration depth profiling is presented. Two new techniques are described: first, in the “bevel-etching technique”, the sample depth profile is uncovered on the sample surface either by sputter etching with a gradient of the ion beam intensity or by varying the sputtering time by moving a shutter in front of the sample; second, in the “deposition technique”, samples are etched uniformly and the sputtered material is deposited on a moving substrate. The bevelled sample and also the material deposited on the substrate are characterized (laterally resolved) by glancing incidence X-ray fluorescence spectrometry. The apparatus and techniques are described in detail. Typical experiments showing the advantages of and problems with the two techniques are discussed. The achievable depth resolutions, 1.5 nm with the bevel-etching technique and 1.4 nm with the deposition technique, are comparable with the best results from other depth profiling methods.     

Removal of Ar+ beam‐induced damaged layers from polyimide surfaces with argon gas cluster ion beams

An Ar Gas Cluster Ion Beam (GCIB) has been shown to remove previous Ar⁺ ion beam‐induced surface damage to a bulk polyimide (PI) film. After removal of the damaged layer with a GCIB sputter source, XPS measurements show minor changes to the carbon, nitrogen and oxygen atomic concentrations relative to the original elemental bulk concentrations. The GCIB sputter depth profiles showed that there is a linear relationship between the Ar⁺ ion beam voltage within the range from 0.5 to 4.0 keV and the dose of argon cluster ions required to remove the damaged layer. The rate of recovery of the original PI atomic composition as a function of GCIB sputtering is similar for carbon, nitrogen and oxygen, indicating that there was no preferential sputtering for these elements. The XPS chemical state analysis of the N 1s spectra after GCIB sputtering revealed a 17% damage ratio of altered nitrogen chemical state species. Further optimization of the GCIB sputtering conditions should lead to lower nitrogen damage ratios with the elemental concentrations closer to those of bulk PI. Copyright © 2010 John Wiley & Sons, Ltd.     

Quantitative surface analysis of Fe?Ni alloy films by XPS,AES and SIMS

A comparison of quantitative surface analyses of Fe? Ni alloy thin films by various methods has been proposed as a pilot study by the Surface Analysis Working Group of the Consultative Committee for Amount of Substance (CCQM). To test the suitability of Fe? Ni for this purpose, alloy films with different compositions were grown on Si(100) wafers by ion‐beam sputter deposition and the compositions were certified by an isotope dilution method using inductively coupled plasma‐mass spectrometry. The alloy compositions measured with X‐ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES) using sensitivity factors determined from pure Fe and Ni metal films agreed with the certified mean values to better than 2%. The alloy compositions quantified by secondary ion mass spectrometry (SIMS) with a C₆₀ ion source agreed to better than 4% with the certified compositions if one of the alloys was used to establish the relative sensitivity factors (RSFs). These results indicate that the quantification of the Fe? Ni alloy is a good method for a CCQM pilot study because matrix effects and ion‐sputtering effects are small for these analytical methods. Copyright © 2007 John Wiley & Sons, Ltd.     

Accurate measurement of sputtered depth for ion sputtering rates and yields: the mesh replica method

For the accurate measurements of crater depths, ion sputtering rates and ion sputtering yields in studies of sputter‐depth profiling using Auger electron spectroscopy (AES) or X‐ray photoelectron spectroscopy (XPS), a proposed mesh replica method has been evaluated. In this method, during ion sputtering, grids of between 50 and 400 mesh (per inch) are placed on the sample to retain unsputtered regions of the original surface to be used as reference. This enables a more accurate measurement of the depth to be made using a stylus profilometer close to the analytical region. The closer‐pitch meshes were thought to offer the prospect of measurements of higher accuracy. Calculations show that sputter deposits from the mesh sides may limit the mesh numbers used to 100 or those of a wider pitch for both stationary and rotated samples. A correlation with published data for stationary samples and new data for rotated samples confirms the calculations. In practice, it is difficult, without a special holder, to have intimate contact between the grid and sample. Such a holder is described. Further calculations concerning the shadowed profiles at the grid bar regions show that the grids may lift off the sample surface by 4–16 µm. This leads to non‐vertical crater walls in each mesh aperture. This effect, however, does not change the above conclusion on the mesh sizes to be used. In this range, the spurious appearance of Auger electrons emitted from the grid material is calculated to be less than 1%. This conclusion applies to the meshes evaluated here, which range in thickness from 13 to 29 µm. Thinner meshes may lead to the applicability of proportionately closer meshed grids in sputter‐profiling applications. Copyright © 2006 John Wiley & Sons, Ltd. The contribution of Martin P. Seah of the National Physical Laboratory is published with the permission of the Controller of HMSO and the Queen's Printer for Scotland.     

Influence of target surface degradation on the properties of r.f. magnetron‐sputtered calcium phosphate coatings

This paper reports a detailed study of how repeated r.f. magnetron sputtering from a hydroxyapatite (HA) powder target affects the nature and reproducibility of a sequential series of thin‐film coatings deposited onto Ti6Al4V substrates. An evaluation of the effective lifespan of the HA sputter targets and the reproducibility of the calcium phosphate (CaP) coatings produced from them has been made from Fourier transform infrared spectroscopy, XPS and, as appropriate, atomic force microscopy and SEM/energy dispersive x‐ray analyses. The annulus region of the target surface, from which sputtering under r.f. magnetron conditions normally occurs, showed severe surface degradation after only one deposition run, as indicated by significant PO₄^3? and OH^? depletion. This deterioration continued after each subsequent deposition cycle but to a much lesser extent than that observed in the initial sputtering period. The layers produced from all of the sputter runs contained the expected Ca²⁺ and PO₄^3? species characteristic of a CaP system but were OH^? deficient in the as‐deposited state. However, the chemical and morphological properties of the coatings did not change significantly until after the third consecutive sputter cycle. Hence, these data indicate that, even though a significant level of degradation of the HA target occurs at the outset of the sputtering procedure, the general plasma conditions employed here have a dominant influence on the coating properties until a critical degradation condition is met. As such, the compacted HA powder targets of interest can have a life‐cycle greater than single usage without detriment to the chemistry and morphology of the coatings produced from them. Copyright © 2003 John Wiley & Sons, Ltd.     

Improved efficiency of the sputtering technique for pyrite surface and its effect on reduction of electron beam damage

A quick and highly efficient method is described for the preparation of clean and well‐characterised (100) pyrite surfaces on natural crystals based on a sputter/annealing procedure in an ultra‐high vacuum (UHV) chamber. The improvement has been achieved by controlling the ingress of the key contaminants water and oxygen and restricting the annealing temperature to 560 K, which is below the SO₂ dissociation temperature. Low‐energy electron diffraction (LEED) and X‐ray photoelectron spectroscopy (XPS) data were used to study the surface. As well as improving the efficiency of the sputtering technique for this surface, a further major benefit is its high stability against electron beam damage as investigated by a quantitative LEED study. Copyright © 2008 John Wiley & Sons, Ltd.     

New horizons in sputter depth profiling inorganics with giant gas cluster sources: Niobium oxide thin films

X‐ray photoelectron spectroscopy is used to study a wide variety of material systems as a function of depth (“depth profiling”). Historically, Ar⁺ has been the primary ion of choice, but even at low kinetic energies, Ar⁺ ion beams can damage materials by creating, for example, nonstoichiometric oxides. Here, we show that the depth profiles of inorganic oxides can be greatly improved using Ar giant gas cluster beams. For NbO_x thin films, we demonstrate that using Ar_x⁺ (x = 1000‐2500) gas cluster beams with kinetic energies per projectile atom from 5 to 20 eV, there is significantly less preferential oxygen sputtering than 500 eV Ar⁺ sputtering leading to improvements in the measured steady state O/Nb ratio. However, there is significant sputter‐induced sample roughness. Depending on the experimental conditions, the surface roughness is up to 20× that of the initial NbO_x surface. In general, higher kinetic energies per rojectile atom (E/n) lead to higher sputter yields (Y/n) and less sputter‐induced roughness and consequently better quality depth profiles. We demonstrate that the best‐quality depth profiles are obtained by increasing the sample temperature; the chemical damage and the crater rms roughness is reduced. The best experimental conditions for depth profiling were found to be using a 20 keV Ar₂₅₀₀⁺ primary ion beam at a sample temperature of 44°C. At this temperature, there is no, or very little, reduction of the niobium oxide layer and the crater rms roughness is close to that of the original surface.     

Ultra thin films of nanocrystalline Ge studied by AFM and interference enhanced Raman scattering

Initial growth stages of the ultra thin films of germanium (Ge) prepared by ion beam sputter deposition have been studied using atomic force microscope (AFM) and interference enhanced Raman scattering. The growth of the films follows Volmer-Weber growth mechanism. Analysis of the AFM images shows that Ostwald ripening of the grains occurs as the thickness of the film increases. Raman spectra of the Ge films reveal phonon confinement along the growth direction and show that the misfit strain is relieved for film thickness greater than 4 nm. Dedicated to Professor C N R Rao on his 70th birthday     

Improved sputter depth resolution in Auger composition‐depth profiling of polycrystalline thin film systems using single grain depth profiling

Today in‐depth profiling of microelectronics thin film systems is one of the important applications of Auger electron spectroscopy. It is used to monitor the elemental in‐depth composition after different manufacturing processes to control the quality of these processes. For instance, the layer interdiffusion and reactions with various process gases are analyzed. In addition, interface contaminations have to be controlled, because they strongly influence the properties of the whole thin film system. For polycrystalline layers, the depth resolution of sputter depth profiling is limited by the sputter yield differences attributed to grains having different crystalline orientations relative to the incoming ion beam. If depth profiling can be performed on single grains only, the poor depth resolution caused by these sputter yield differences can be avoided. Unfortunately, the approach works only on a few samples because single grains must be identified and have to have grain sizes that are in the dimensions of the layer thickness. Using methods of in situ sample preparation, however, allows application of single grain depth profiling to an extended range of thin film systems. Copyright © 2006 John Wiley & Sons, Ltd.     

Depth resolution and inhomogeneity of the sputtering dose with sample rotation and ion beam rastering

Sample rotation during sputter depth profiling can improve the measured depth resolution. We examine some of the practical issues of particular relevance to rotation conditions in SIMS. There are many ways of arranging the rotation for sputtering and, to illustrate the issues, one configuration is studied. Through simulations of the spatial distribution of ion dose using a rastered ion beam and sample rotation, we demonstrate that significant variations in the distribution of ion dose across the surface can occur during the profile. With rotational frequencies much lower than raster frequencies, as used for Auger and XPS, these variations are typically small and have the same periodicity as the rotation. If rotational frequencies are similar to, or larger than the raster frequency, then large spatial variations in dose can occur. In this case, extreme care must be taken to ensure that the two frequencies are not related by a simple rational number and that the sputtering ion beam size should be significantly broader than the line spacing of the raster, but significantly smaller than the raster size. Specific recommendations are provided for setting both the rotation frequency and the size of the sputtering ion beam in order to ensure that the relative standard deviation of the ion dose across the analysis area remains lower than 1%. However, the best method may be a stepwise rotation of 90° after each analysis and sputtering cycle. © Crown copyright 2011. Reproduced with the permission of Her Majesty's Stationery Office. Published by John Wiley & Sons, Ltd.     

Sputter-induced cross-contamination in analytical AES and XPS instrumentation: utilization of the effect for the in situ deposition of ultrathin functional layers

Cross-contamination is observed on sample surfaces by Auger electron spectroscopy and X-ray photoelectron spectroscopy if multiple samples are mounted on one sample holder and a neighbouring sample was sputter depth profiling. During sputter depth profiling, sputtered material is deposited on inner surfaces of the instrument. In a secondary sputter process, which is due to species leaving the primary sputter target with higher kinetic energy, the previously deposited material is transported from the inner surfaces to the other samples mounted on the sample holder. This reflective sputtering is utilized to deposit ultrathin layers on sample surfaces for X-ray photoelectron spectroscopy binding energy referencing purposes and to build up ultrathin conductive layers to make possible Auger electron spectroscopy measurements on insulating samples.     

Measurement of lithium diffusion coefficient in thin metallic multilayer by neutron depth profiling

Diffusion of Li ions in thin sandwich films with copper or lead encompassing layers (obtained by ion beam sputtering deposition technique) has been studied. These metals are promising candidates for electrodes in lithium-ion batteries. It is because they exhibit an ability to store and release Li ions during charging and discharging processes. Lithium diffusion was induced in samples by thermal annealing cycles. The lithium depth profile was measured using a nondestructive neutron depth profiling technique after each thermal annealing step. The analysis of experimental data allowed to evaluate the lithium depth profiles and directly calculate the diffusion coefficients.     

Evaluation of the sputtering rate variation in SIMS ultra‐shallow depth profiling using multiple short‐period delta layers

We have developed multiple short‐period delta layers as a reference material for SIMS ultra‐shallow depth profiling. Boron nitride delta layers and silicon spacer layers were sputter‐deposited alternately, with a silicon spacer thickness of 1–5 nm. These delta‐doped layers were used to measure the sputtering rate change in the initial stage of oxygen ion bombardment. A significant variation of sputtering rate was observed in the initial 3 nm or less. The sputtering rate in the initial 3 nm was estimated to be about four times larger than the steady‐state value for 1000 eV oxygen ions. Copyright © 2003 John Wiley & Sons, Ltd.     

Charge referencing issues in XPS of insulators as evidenced in the case of Al‐Si‐N thin films

Accurate charge referencing in XPS of insulating specimens is a delicate issue. This difficulty is illustrated in the case of Al‐Si‐N composite thin films deposited by reactive magnetron sputtering with variable composition from pure aluminum nitride to pure silicon nitride. The samples were mounted with Au‐coated metallic clamps. Argon sputter cleaning was required to remove a surface native oxide before analysis. For charge referencing implanted argon atoms from the sputter gas and a small amount of gold re‐deposited from the metallic clamps onto the specimen surface during sputter cleaning were evaluated. For the argon atoms, a surprisingly large chemical shift (～1 eV) and a significant peak broadening (0.6 eV) of the Ar 2p_3/2 photoelectron line were found with varying the Si content of the films. This could be related to chemical and structural changes of the Al‐Si‐N films. Hence implanted argon could not be used for charge referencing of Al‐Si‐N samples. In contrast to the implanted argon, the Au 4f_7/2 line width of the gold re‐deposited onto the sample surface did not depend on the Si content of Al‐Si‐N films. A constant energy shift (～1.2 eV) of the Au 4f_7/2 line as compared with bulk gold was, however, found, which was related to the size of gold particles formed on the insulating films. Therefore gold could be reliably used to study chemical shifts of sample‐relevant species in Al‐Si‐N films, but the absolute binding energies of Al 2p, Si 2p and N 1s photoelectrons could not be determined. Copyright © 2011 John Wiley & Sons, Ltd.     

Depth profiling organic/inorganic interfaces by argon gas cluster ion beams: sputter yield data for biomaterials,in‐vitro diagnostic and implant applications

Argon gas cluster ion beam sources are likely to become much more widely available on XPS and SIMS instruments in the next few years. Much attention has been devoted to their ability to depth profile organic materials with minimum damage. What has not been the focus of attention (possibly because it has been very difficult to measure) is the large ratio of sputter yield for organic materials compared with inorganic materials using these sources and the special opportunities this presents for studies of organic/inorganic interfaces. Traditional depth profiling by monatomic argon ions introduces significant damage into the organic overlayer, and because sputter rates in both organic and inorganic are similar for monatomic ions the interface is often ‘blurred’ due to knock‐on and other damage mechanisms. We have used a quartz crystal technique to measure the total sputter yield for argon cluster ions in a number of materials important in medical implants, biomaterials and diagnostic devices, including polymethyl methacrylate, collagen, hydroxyapatite, borosilicate glass, soda lime glass, silicon dioxide and the native oxides on titanium and stainless steel. These data fit a simple semi‐empirical equation very well, so that the total sputter yield can now be estimated for any of them for the entire range of cluster ion energy typical in XPS or SIMS. On the basis of our total sputter yield measurements, we discuss three useful ‘figures‐of‐merit’ for choosing the optimum cluster ion energy to use in depth profiling organic/inorganic samples. For highest selectivity in removing the organic but not the inorganic material the energy‐per‐atom in the cluster should be below 6 eV. A practical balance between selectivity and reasonably rapid depth profiling is achieved by choosing a cluster ion energy having between around 3 and 9 eV energy‐per‐atom. Copyright © 2013 John Wiley & Sons, Ltd.     

SIMS depth profiling of ‘frozen’ samples: in search of ultimate depth resolution regime

We have performed secondary ion mass spectrometry depth profiling analysis of III–V based hetero‐structures at different target temperatures and found that both the surface segregation and surface roughness caused by ion sputtering can be radically reduced if the sample temperature is lowered to ?150 °C. The depth profiling of ‘frozen’ samples can be a good alternative to sample rotation and oxygen flooding used for ultra‐low‐energy depth profiling of compound semiconductors. Copyright © 2016 John Wiley & Sons, Ltd.