纳秒激光脉冲诱导硅表面微结构

利用Nd:YAG纳秒激光脉冲,在能量密度为1～10 J/cm2范围内辐照单晶硅,形成了表面锥形微结构,在SF6气氛和空气环境下均形成了锥形尖峰表面微结构。SF6气氛下产生的锥形尖峰顶端都有小球,部分锥形上还有二次尖峰形成,空气中纳秒激光诱导的锥形尖峰微结构顶端和边缘有由液滴固化形成的粒状物质,不同于利用准分子纳秒激光诱导的细长须状结构和飞秒激光辐照下产生的具有表面枝蔓状纳米结构的锥形微结构。实验结果表明,这种尖峰微结构的形成与辐照激光的波长和脉冲持续时间有关。对空气中微构造硅的辐射反射的初步研究表明,在500～2 400 nm范围内的光辐射反射率不高于20%。     

Nd:YAG纳秒激光诱导硅表面微结构的演化

利用Nd:YAG纳秒激光(波长为532和355 nm)对单晶硅在真空中进行了累积脉冲辐照,研究了表面微结构的演化情况.在激光辐照的初始阶段,532和355 nm激光脉冲均在硅表面诱导出了波纹结构,后者辐照硅表面后形成了近似同心但稍显混乱的环形波纹结构.随着脉冲数的增加,波纹结构逐渐演化为一种类似珠形的凹凸结构,最后形成准规则排列的微米量级锥形结构,该微结构的生长依赖于表面张力波和结构自组织.分析发现,形成的交叉环形结构主要是在355 nm激光辐照硅的过程中,表面张力波导致波纹结构部分叠加的结果.     

单脉冲纳秒激光诱导硅表面微结构

利用Nd:YAG纳秒脉冲激光(波长532nm)在空气中对单晶硅表面进行单脉冲辐照,研究了激光能量密度和光斑面积变化对微结构的影响。通过场发射扫描电子显微镜和原子力显微镜(AFM)对样品表征,并对纳秒激光辐照硅的热力学过程进行分析。结果显示:当脉冲激光的能量密度接近硅的熔融阈值且光斑直径小于8μm时,形成尖峰微结构;随着能量密度或光斑面积增大,尖峰结构消失,形成边缘隆起和弹坑微结构。通过流体动力学模型得到微结构形貌的解析解,模拟得到的微结构形貌与实验测得的AFM数据一致。研究表明微结构的形成主要是由于表面张力引起的熔融硅流动。表面张力与表面温度和表面活性剂的质量浓度有关。温度梯度引起的热毛细流作用和表面活性剂浓度引起的毛细作用共同影响下形成尖峰、边缘隆起和弹坑微结构。     

532 nm纳秒激光辐照下的单晶硅表面微结构及荧光特性

采用Nd:YAG纳秒脉冲激光对单晶硅在空气中进行辐照,研究了表面微结构在不同能量密度和扫描速度下的演化情况。扫描电子显微镜测量表明,激光在相对较低能量密度下辐照硅表面诱导出鱼鳞状波纹结构,激光能量密度相对较大时,诱导出絮状多孔的不规则微结构。光致荧光谱（PL）表明,激光扫描区域在710 nm附近有荧光发射。用氢氟酸腐蚀掉样品表面的SiOx后,荧光峰的强度显著降低,说明SiOx在光致发光增强上起重要作用。能量色散X射线谱（EDS）表明氧元素的含量随激光能量密度的增大而增加。研究表明:纳秒激光的能量密度和扫描速度对微结构形成起着决定性作用,改变了硅材料表面微结构尺寸,增大了光吸收面积; 氧元素在光致发光增强上起重要作用,微构造硅和SiOx对光致荧光的发射都有贡献。     

不同气体环境下532nm激光诱导硅表面形貌的研究

研究了在不同气体环境下,利用532 nm Nd∶YAG纳秒脉冲激光累积辐照单晶硅表面形成的微结构,结果表明,在其他条件相同,背景气体不同的情况下,背景气体对硅表面形貌的形成起着重要的作用。具体分析了真空、N2和SF6 3种环境气氛下形成的微结构,结果显示,在SF6中形成的锥形微结构的数密度比在N2和真空中的大,并且锥形具有更大的纵横比;在N2、真空和SF6中形成的微结构尺寸依次减小。SF6气氛下,激光辅助化学刻蚀的效率比在真空和N2气氛中的高。另外,辐照区域边缘有波纹微结构形成,分析认为,该微结构的形成是由表面张力波的冷却导致的。     

不同气体环境下532nm激光诱导硅表面形貌的研究

研究了在不同气体环境下,利用532nmNd：YAG纳秒脉冲激光累积辐照单晶硅表面形成的微结构,结果表明,在其他条件相同,背景气体不同的情况下,背景气体对硅表面形貌的形成起着重要的作用。具体分析了真空、N2和SF6 3种环境气氛下形成的微结构,结果显示,在sF6中形成的锥形微结构的数密度比在N2和真空中的大,并且锥形具有更大的纵横比;在N2、真空和sF6中形成的微结构尺寸依次减小。sF6气氛下,激光辅助化学刻蚀的效率比在真空和N2气氛中的高。另外,辐照区域边缘有波纹微结构形成,分析认为,该微结构的形成是由表面张力波的冷却导致的。     

343 nm飞秒激光制备微孔阵列以增强聚氨酯合成革透湿性

为了提高聚氨酯(PU)合成革透湿性,分别使用343 nm飞秒激光和作为对比的1030 nm飞秒激光及1064 nm纳秒激光制备微孔阵列。采用扫描电镜(SEM)和3D激光扫描显微镜对比研究了微孔形貌。结果表明,343 nm飞秒激光可以制备出效果最佳的微孔。此外,分析了3种激光与PU涂层的作用机理,揭示了343 nm飞秒激光合成革微钻孔过程仅表现为光化学烧蚀,光化学和光热烧蚀同时发生于1030 nm飞秒激光钻孔过程,而1064 nm纳秒激光只显示了光热烧蚀。激光合成革表面钻孔后,测量其透湿性和抗张力。结果显示: 微孔密度越大,皮革透湿性(WVP)越大而抗张力越低,脉冲重叠的增加会导致WVP的增加和抗张力的下降;同时,随着脉冲重叠从91.7%降到50%,微孔直径从45 μm降低到30 μm,而微孔锥度从0.7°增加到12.1°;当脉冲重叠率为91.7%,微孔密度为2550/cm2时,最大的WVP增长率为306%。     

不同气氛下飞秒激光诱导硅表面微结构

利用钛宝石飞秒激光脉冲对单晶硅在SF6、空气和真空环境中进行了累积脉冲辐照,研究了硅表面微结构的演化。在SF6气氛中,在激光辐照的初始阶段,硅表面形成了1维的波纹结构,随着辐照脉冲数的增加,波纹结构演化成了2维凹凸结构。累积600个脉冲后,硅表面产生了准规则排列且具有大纵横比的锥形尖峰结构。该结构呈现高度相对较低、锥形尖端小球不明显的特征,分析认为主要与环境气压的大小有关。对比空气、SF6和真空中的微结构发现,尖峰的数密度依次减小;SF6中形成的尖峰高度最大,其次为真空,再次为空气。研究结果表明,真空、SF6和空气3种环境下微结构的形成及表面形貌主要由激光烧蚀、化学刻蚀和氧化决定。     

激光等离子体效应对硅表面损伤特征的影响

硅材料作为光电探测器的基础材料,研究其在强激光辐照下的损伤问题在激光探测、国防领域很有意义。对高强度纳秒激光作用下硅表面的损伤形貌特征进行了研究,结果表明:激光等离子体的热效应及冲击波效应,使激光作用区域内的物质迅速向外飞溅,形成点坑,并在点坑周围形成辐射状冷却物;散射光与入射激光干涉产生形成周期性分布的热应力使得硅材料表面张力发生变化,冷却后会在坑底表面产生周期性结构;从激光等离子体的光谱中可以发现N,O和Si的特征光谱,在重复激光脉冲作用下会在硅表面上覆盖一层导致色变的SiOx和SiNx复合薄膜,是激光等离子体的喷射产物。     

不同烧蚀条件下飞秒激光脉冲诱导ZnO纳米结构研究

烧蚀条件对飞秒激光脉冲诱导氧化锌纳米结构有重要影响.研究了800 nm,150 fs,250 kHz的飞秒激光脉冲分别在空气中,去离子水中以及无水乙醇中垂直聚焦于氧化锌晶体表面,诱导形成不同形态的纳米结构.实验结果表明,在空气中利用飞秒激光脉冲辐照样品表面,形成了周期为180 nm的纳米线;在去离子水中辐照诱导形成了由氧化锌纳米线聚集而成的"纳米球";在无水乙醇中形成出现分叉结构的纳米线.拉曼光谱分析辐照前后晶体晶相结果表明,形成的纳米结构相对于辐照前特征峰437 cm-1强度有所下降,在570 cm-1处的峰值则显著增强.分析了在各种烧蚀条件下诱导形成纳米结构的演化过程以及物理机理.     

Formation of colorized silicon by femtosecond laser pulses in?different background gases

A single-crystal silicon(111) wafer surface fixed on an x–y translation stage is scanned with a focused femtosecond laser beam at a wavelength of 800 nm under different atmospheres (air, vacuum, and nitrogen). Different colors from different angles on the surface of the silicon then appear. From the result of the experiments, periodic ripple surface structures emerge on the surface of colorized silicon, and the phenomenon is more obvious in vacuum and nitrogen than in air. The periods of the surface structures on silicon are not the same in the different atmospheres. Under vacuum, the period is the longest and is closer to the wavelength of the laser irradiation. Different from metals, the range of energy density is smaller when the colorized silicon appears with femtosecond laser pulses. Through SEM, TEM, and AFM, we observe in detail the microstructures of colorized silicon that forms in air, vacuum, and nitrogen and analyze the possible physical mechanism. Finally, research into the optical reflection of the colorized silicon indicates that the reflectivity is not higher than 30% in the 250–800 nm range.     

Effect of energy above laser-induced damage thresholds in the micromachining of silicon by femtosecond pulse laser

A 400 nm second harmonic Ti : sapphire femtosecond laser was applied to structure silicon base on a direct-write process in air. A series of lines were ablated with pulses of 300-fs duration at varying power densities ranging from 50 to 100 nJ of energy on 2″ silicon (1 1 1) wafers. In this event, we investigate and report extensive laser induced thermal damage and redeposition encompassing the ablated lines at high energy levels above the damage threshold of the silicon. In addition, the effect of polarisation on the direction of micromachining is also observed and discussed. The resolution and quality of these lines were also found to hold a linear relationship to the laser energy up to its thermal threshold limit.     

Femtosecond-laser-induced-crystallization and simultaneous formation of light trapping microstructures in thin a-Si:H films

We report the observation of crystallization and simultaneous formation of surface microstructures in hydrogenated amorphous silicon (a-Si:H) thin films as one step laser processing. Light trapping microstructures of around 300 nm in height were formed on a-Si:H films of thickness in the range of 1.5 μm to 2 μm deposited on soda lime glass after exposure to femtosecond laser pulses. Scanning electron microscope (SEM) images show the formation of spikes that are around 1 μm part and their heights could be controlled by the laser fluences. Atomic force microscope (AFM) images were taken to study the roughness created on the surface. The mean roughness of the textured surface increases with laser fluence at smaller power densities, and for power densities beyond 0.5 J/cm² the film removal deteriorates the texturing. X-ray diffraction results indicate the formation of a nano-crystalline structure with (111) and (311) crystal orientation after the laser treatment. The observed black color and enhanced optical absorption in the near infrared region in laser treated films may be due to a combined effect of light trapping in the micro-structured silicon surface because of multiple total internal reflections, phase change in the film, possible defect sites induced after laser treatment and formation of SiO_x. Demonstration of light trapping microstructures in thin a-Si:H films and simultaneous crystallization could provide new opportunities for optoelectronic devices. PACS 42.55.Px; 42.62.Cf; 81.05.Ge     

Disorders produced during high-current and high-dose phosphorus ion implantation in silicon

Transmission electron microscopy, optical reflection and channeling effect measurements are employed to investigate disorders in 30 keV, high dose (3×10¹⁶ions/cm²) and high current (≦5 mA) phosphorus as-implanted silicon with (111), (100), and (110) orientation as a function of temperature rise (100–850°C) by the beam heating effect during implantation. Temperature rise below 400°C results in continuous amorrphous layer formation. This contrasts with results of the recovery into single crystals for temperature rise samples above 500°C, regardless of wafer orientation. Secondary defects (black-dotted defects, dislocation loops and rodlike defects) are formed in singlecrystal recovery samples, having a deeper distribution in (110) wafers and a shallower distribution in (111) and (100) wafers. Rodlike defects observed in 850°C samples are of “vacancy” type and have the largest density in (110) wafers.     

Influence of Cr<Superscript>+</Superscript> ion implantation and pulsed ion-beam annealing on the formation and optical properties of Si/CrSi<Subscript>2</Subscript>/Si(111) heterostructures

The effect of pulsed ion-beam annealing on the surface morphology, structure, and composition of single-crystal Si(111) wafers implanted by chromium ions with a dose varying from 6 × 10¹⁵ to 6 × 10¹⁶ cm⁻² and on subsequent growth of silicon is investigated for the first time. It is found that pulsed ion-beam annealing causes chromium atom redistribution in the surface layer of the silicon and precipitation of the polycrystalline chromium disilicide (CrSi₂) phase. It is shown that the ultrahigh-vacuum cleaning of the silicon wafers at 850°C upon implantation and pulsed ion-beam annealing provides an atomically clean surface with a developed relief. The growth of silicon by molecular beam epitaxy generates oriented 3D silicon islands, which coalesce at a layer thickness of 100 nm and an implantation dose of 10¹⁶ cm⁻². At higher implantation doses, the silicon layer grows polycrystalline. As follows from Raman scattering data and optical reflectance spectroscopy data, semiconducting CrSi₂ precipitates arise inside the silicon substrate, which diffuse toward its surface during growth.     

Plasmonic laser nanoablation of silicon by the scattering of femtosecond pulses near gold nanospheres

We present the fabrication of nanostructures ablated on silicon(100) by the plasmonic scattering of 780 nm, 220 fs laser pulses in the near-field of gold nanospheres. We take advantage of the enhanced plasmonic scattering of ultrashort laser light in the particle near-field to ablate well-defined nanocraters. Gold nanospheres of 150 nm diameter are deposited onto a silicon surface and irradiated with a single laser pulse. We studied the effect of laser polarization on the morphology of ablated nanostructures and estimated the minimum fluence for plasmonic nanoablation. When the polarization of the incident radiation is directed at a 45° angle into the substrate surface, a near-field enhancement of 23.1±7.6 is measured, reducing the required silicon ablation fluence from 191±14 mJ/cm² to 8.2±2.9 mJ/cm². Enhancements are also measured for laser polarizations parallel to the substrate surface when the substrate is angled 0° and 45° to the incident irradiation, giving enhancements of 6.9±0.6 and 4.1±1.3, respectively. Generated nanocrater morphologies show a direct imprint of the particle dipolar scattering region, as predicted in our theoretical calculations. The measured near-field enhancement values agree well with the maximum field enhancements obtained in our calculations. The agreement between theory and measurements supports that the nanocraters are indeed formed by the enhanced plasmonic scattering in the near-field of the nanoparticles. PACS 42.62.-b; 52.38.Mf; 81.65.Cf; 81.16.-c; 78.67.Bf