Preparation of crosslinked epoxy microparticles via phase inversion

Differential scanning calorimetry (DSC) and scanning electron microscopy (SEM) studies have been performed to reveal a crosslinked epoxy nature of the spherical particles formed in cured epoxy/DDS/PMMA blends. An interesting phase inversion phenomenon was observed in cured DGEBA/DDS/PMMA blends, which occurred at a relatively low thermoplastic composition of 20 phr PMMA in blends. A unique method of preparing crosslinked epoxy spheres of controlled sizes based on cure-induced phase inversion is described in this report. Several factors have been found to affect the geometry of the formed epoxy spheres. The volume fraction of PMMA in the blends strongly dominates the influence. With the increase of PMMA volume fraction in the blends, the spheres not only become smaller in sizes, but also more regular in the spherical geometry due to less impingement. The crosslinking density (DDS phr in the blends) has been found to influence the average sizes of the spheres. The cure temperature has relatively limited effects only when the PMMA loadings in the blends are relatively small. Various potential applications for the epoxy microspheres may be investigated in future studies. © 1996 John Wiley & Sons, Inc.     

Cure behavior of diglycidylether of bisphenol A/trimethylolpropane triglycidylether epoxy blends initiated by thermal latent catalyst

Cure behaviors of diglycidylether of bisphenol A (DGEBA)/trimethylolpropane triglycidylether (TMP) epoxy blends initiated by 1 wt % N‐benzylpyrazinium hexafluoroantimonate (BPH) as a cationic latent catalyst were investigated using DSC and rheometer. This system showed more than one type of reaction and BPH could be excellent thermal latent catalyst without any co‐initiator. The cure activation energy (E_a) obtained from Kissinger method using dynamic DSC data was higher in DGEBA/TMP mixtures than in pure DGEBA. Rheological properties of the blend system were investigated under isothermal condition using a rheometer. The gel time was obtained from the analysis of storage modulus (G′), loss modulus (G″) and damping factor (tanδ). The crosslinking activation energy (E_c) was also determined from the Arrhenius equation based on the gel time and curing temperature. As a result, the crosslinking activation energy showed a similar behavior with that obtained from Kissinger method. And the gel time decreased with increasing TMP content, which could be resulted from increasing the activated sites by trifunctional epoxide groups and decreasing the viscosity of DGEBA/TMP epoxy blend in the presence of TMP. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2114–2123, 2000     

Curing kinetics and thermal stability of diglycidyl ether of bisphenol

Curing kinetics of diglycidyl ether of bisphenol-A (DGEBA) in the presence of varying molar ratios of aromatic imide-amines and 4,4′-diaminodiphenylsulfone (DDS) were investigated by the dynamic differential scanning calorimetry. The imide-amines were prepared by reacting 1 mole of benzophenone 3,3′,4,4′-tetracarboxylic acid dianhydride (B) with 2.5 moles of 4,4′-diaminodiphenyl ether (E)/ or 4,4′-diaminodiphenyl methane (M)/ or 4,4′-diaminodiphenylsulfone (S) and designated as BE/ or BM/ or BS. The mixture of imide-amines and DDS at ratio of 0:1, 0.25:0.75, 0.5:0.5, 0.75:0.25 and 1:0 were used to investigate the curing behaviour of DGEBA. The multiple heating rate method (5, 10, 15 and 20°C min⁻¹) was used to study the curing kinetics of epoxy resins. The peak exotherm temperature was found to be dependent on the heating rate, structure of imide-amines as well as on the ratio of imide-amine: DDS used. A broad exotherm was observed in the temperature range of 180–230°C on curing with mixture of imide-amines and DDS. Curing of DGEBA with mixture of imide-amines and/or DDS resulted in a decrease in characteristic curing temperatures. Activation energy of curing reaction as determined in accordance to the Ozawa’s method was found to be dependent on the structure of amine. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere. The char yield was highest in case of resins cured using mixture of DDS: BS (0.25:0.75; EBS-3), DDS: BM (0.5: 0.5; EBM-2) and DDS: BE (0.5: 0.5; EBE-2).     

Preparation and characterization of graphite nano-platelet (GNP)/epoxy nano-composite: Mechanical,electrical and thermal properties

Epoxy based polymer nano-composite was prepared by dispersing graphite nano-platelets (GNPs) using two different techniques: three-roll mill (3RM) and sonication combined with high speed shear mixing (Soni_hsm). The influence of addition of GNPs on the electrical and thermal conductivity, fracture toughness and storage modulus of the nano-composite was investigated. The GNP/epoxy prepared by 3RM technique showed a maximum electrical conductivity of 1.8 × 10⁻⁰³ S/m for 1.0 wt% which is 3 orders of magnitude higher than those prepared by Soni_hsm. The percentage of increase in thermal conductivity was only 11% for 1.0 wt% and 14% for 2.0 wt% filler loading. Dynamic mechanical analysis results showed 16% increase in storage modulus for 0.5 wt%, although the Tg did not show any significant increase. Single edge notch bending (SENB) fracture toughens (K_IC) measurements were carried out for different weight percentage of the filler content. The toughening effect of GNP was most significant at 1.0 wt% loading, where a 43% increase in K_IC was observed. Among the two different dispersion techniques, 3RM process gives the optimum dispersion where both electrical and mechanical properties are better.     

Cationic cure of epoxy resin initiated by methylanilinium salts as a latent thermal initiator

The effect of the novel N‐crotyl‐N,N‐dimethyl‐4‐methylanilinium hexafluroantimonate (CMH) initiator on cure kinetics and rheological properties of diglycidylether of bisphenol A (DGEBA) epoxy cationic system was investigated. From DSC measurements of the DGEBA/CMH system, it was found that this system exhibited excellent thermal latent characteristics at a given temperature and revealed complex cure behavior as indicated by multiple exotherms. The conversion and conversion rate of the DGEBA/CMH system increased with increasing the concentration of initiator, attributed to the high activity of CMH. Viscoelastic properties during gel formation of DGEBA initiated by CMH were investigated by rheological techniques under isothermal conditions. The gel time obtained from the modulus crossover point t(G′) = G″ was affected by a high curing temperature and the concentration of CMH, resulting in a high degree of network formation in cationic polymerization. © 2001 John Wiley & Sons, Inc. J Polym Sci Part B: Polym Phys 39: 2397–2406, 2001     

Mechanistic study of thermal behavior and combustion performance of epoxy resins: I homopolymerized TGDDM

Tetraglycidyl 4,4′-diaminodiphenylmethane (TGDDM) undergoes homopolymerization on heating. Intramolecular reactions which compete with crosslinking favor the formation of cyclic structures with increasing thermal and fire resistance of the resin, whereas physical mechanical properties tend to decrease. The mechanism of thermal decomposition of TGDDM is studied by thermogravimetry, differential scanning calorimetry and thermal volatilization analysis with characterization of volatiles evolved and residue left. Thermal degradation of poly-(TGDDM) starts at 260°C with elimination of water from secondary alcoholic groups which is a typical pathway for epoxy resin degradation. Resulting unsaturations weaken bonds in the β-position and provoke the first chain breaking at allyl–amine and allyl–either bonds. With increasing temperature, saturated alkyl–ether bonds and alkyl carbon–carbon bonds are broken first, followed by the most stable alkyl–aryl bonds at T>365°C. The combustion performance of TGDDM is discussed on the basis of the thermal degradation behavior.     

Global kinetics of thermal degradation of flame-retarded epoxy resin formulations

A predictive mathematical model to describe mass loss profiles of flame-retardant (FR) containing epoxy resin formulations is proposed. Mass loss is due to thermal degradation of the constituent components and can be described by a generic kinetic scheme with a given set of thermokinetic constants in the form of ordinary differential equations. The scope of this work is to determine the kinetic parameters of the thermal degradation of a known flame-retarded epoxy resin composition by using thermogravimetric analysis and using the acquired data to predict the degradation profiles for other formulations. The mass loss profiles of Visil and intumescent epoxy resin containing formulations were predicted by solving coupled systems of ordinary differential equations and then using Powell minimisation to find the optimal Arrhenius parameters, taking into account the mass ratio of the components in the mixture. The calculated kinetic constants for one formulation (85% resin-15% FR additives) are used to predict the mass loss profiles for other formulations (80% resin-20% FR additives and 90% resin-10% FR additives) with the assumption that the degradation mechanism does not change. The predicted thermal degradation profiles are compared with experimental data acquired using standard laboratory equipment in order to validate the proposed mechanisms. The kinetic parameters obtained adequately describe mass loss history of composite materials studied, even when extremely simplified kinetic schemes have been used.     

Comparative studies on the curing kinetics and thermal stability of tetrafunctional epoxy resins using various amines as curing agents

The curing reactions of the epoxy resins tetraglycidyl diaminodiphenyl methane (TGDDM) and tetraglycidyl methylenebis (o-toluidine) (TGMBT) using diaminodiphenyl sulfone (DDS), diaminodiphenyl methane (DDM) and diethylenetriamine (DETA) as curing agents were studied kinetically by differential scanning calorimetry. The dynamic scans in the temperature range 20°–300°C were analyzed to estimate the activation energy and the order of reaction for the curing process using some empirical relations. The activation energy for the various epoxy systems is observed in the range 71.9–110.2 kJ·mol^–1. The cured epoxy resins were studied for kinetics of thermal degradation by thermogravimetry in a static air atmosphere at a heating rate of 10 deg·min^–1. The thermal degradation reactions were found to proceed in a single step having an activation energy in the range 27.6–51.4 kJ·mol^–1.

---

Zusammenfassung Die Vernetzungsreaktionen der Epoxidharze Tetraglycidyl-diamino-diphenyl-methan (TGDDM) und Tetraglycidyl-methylen-bis(o-toluidin) (TGMBT) unter Verwendung von Diaminodiphenylsulfon (DDS), Diaminodiphenylmethan (DDM) und Diethylentriamin (DETA) als Vernetzungsmittel wurden kinetisch mittels DSC untersucht. Die dynamischen Scans im Temperaturbereich 20°–300°C wurden analysiert, um unter Anwendung einiger empirischer Gleichungen die Aktivierungsenergie und die Reaktionsordnung des Vernetzungsprozesses zu ermitteln. Die Aktivierungsenergie der einzelnen Epoxy-Systeme liegt im Bereich 71.9–110.2 kJ·mol^–1. An der ausgehärteten Harze wurde mittels TG in einer statischen Luftatmosphäre un deiner Aufheizgeschwindigkeit von 10 Grad/min die Kinetik des termischen Abbaues untersucht. Man fand, daß die thermiscehn Abbaureaktionen in einem Schritt ablaufen und ihre Aktivierungsenergie im Intervall 27.6–51.4 kJ·mol^–1 liegt.

     

Synthesis and thermal characterization of phosphorus containing siliconized epoxy resins

Siliconized epoxy matrix resin was developed by reacting diglycidyl ethers of bisphenol A (DGEBA) type epoxy resin with hydroxyl terminated polydimethylsiloxane (silicone) modifier, using γ-aminopropyltriethoxysilane crosslinker and dibutyltindilaurate catalyst. The siliconized epoxy resin was cured with 4, 4-diaminodiphenylmethane (DDM), 1,6-hexanediamine (HDA), and bis (4-aminophenyl) phenylphosphate (BAPP). The BAPP cured epoxy and siliconized epoxy resins exhibit better flame-retardant behaviour than DDM and HDA cured resins. The thermal stability and flame-retardant property of the cured epoxy resins were studied by thermal gravimetric analysis (TGA) and limiting oxygen index (LOI). The glass transition temperatures (T_g) were measured by differential scanning calorimetry (DSC) and the surface morphology was studied by scanning electron microscopy (SEM). The heat deflection temperature (HDT) and moisture absorption studies were carried out as per standard testing procedure. The thermal stability and flame-retardant properties of the cured epoxy resins were improved by the incorporation of both silicone and phosphorus moieties. The synergistic effect of silicone and phosphorus enhanced the limiting oxygen index values, which was observed for siliconized epoxy resins cured with phosphorus containing diamine compound.     

Preparation, thermal decomposition and lifetime of Eu(III)-phenanthroline complex doped xerogel

The main purpose of this work is proposing a new method of using non-isothermal formal kinetics analysis to predict the lifetime of luminescent complex materials. The Eu(III)-phenanthroline complex doped xerogel has been in situ synthesized by a catalyst-free sol-gel method. The photoluminescence spectra and TG curves of the xerogel verify the formation and decomposition of Eu(III)-phenanthroline complex in xerogel. The decomposition of the xerogel formally occurs in three steps. The Friedman and FWO isoconversional methods and multivariate non-linear regression method are used for formal kinetic analysis. The overall decomposition process below 800 °C is fitted by three-step consecutive reaction. The best fitted model for each step is F_n (n order reaction, the corresponding function f(α) is (1 − α)ⁿ). Correlation coefficient is 0.99956. The lifetime values of xerogel at different temperatures are predicted based on non-isothermal kinetic models by the 5% decomposition of europium organic complex.     

Mechanical and thermal properties of epoxy/silicon carbide nanofiber composites

The silicon carbide (SiC) nanofibers (0.1, 0.25, and 0.5 phr), produced by self‐propagating high‐temperature synthesis (SHS), are used to reinforce the epoxy matrix cured with an anhydride hardener. Morphological studies reveal a better dispersion of SiC nanofibers and a good level of adhesion between nanofiber and the matrix in composites with lower (0.1 and 0.25 phr) nanofiber loading. The flexural studies show that a maximum increase in flexural properties is obtained for composites with 0.25 phr SiC nanofiber. The fracture toughness of epoxy is found to increase with the incorporation of SiC nanofibers, and 0.25 phr SiC nanofiber loading shows maximum fracture toughness value. The possible fracture mechanisms that exist in epoxy/SiC nanofiber composites have been investigated in detail. Thermogravimetric analysis reveals that SiC nanofibers are effective fillers to improve the thermal stability of epoxy matrix. Copyright © 2014 John Wiley & Sons, Ltd.     

溴化环氧树脂印刷线路板热分解机理实验研究

印刷线路板广泛应用于电子电器产品中,随着大量电子废弃物的产生,印刷线路板的回收处理得到了广泛关注.     

Effect of structure on thermal behaviour of epoxy resins

The paper deals with the curing behaviour of diglycidyl ether of bisphenol-A (DGEBA) using three novel multifunctional aromatic amines having phosphine oxide and amide-acid linkages. The amines were prepared by reacting tris(3-aminophenyl)phosphine oxide (TAP) with 1,2,4,5-benzenetetracarboxylic acid anhydride (P)/4,4^′-(hexafluoroisopropylidene)diphthalic acid anhydride (F)/3,3^′,4,4^′-benzophenonetetracarboxylic acid dianhydride (B). Amide-acid linkage in these amines is converted to thermally stable imide linkage during curing reaction. Curing temperatures of DGEBA were higher with phosphorylated amines than the conventional amine 4,4^′-diamino diphenyl sulphone (D). A decrease in initial decomposition temperature and higher char yields were observed when phosphorus containing amide-acid amines were used as curing agents for DGEBA.     

Synthesis and thermal properties of azo-peroxyesters

Abstract  New azo-perester derivatives of tert-butyl and tert-amyl hydroperoxides were obtained in reactions of azo acid chlorides with hydroperoxides in the presence of an inorganic base. Obtained azo-peresters possess two kinds of the labile functional groups: the azo group and also the perester group. The data from DSC experiments indicate that in the case of azo-perester derivatives of tert-amyl hydroperoxide, the perester group decomposes at a somewhat lower temperature than in the case of tert-butyl derivatives, whereas azo groups decompose at somewhat higher temperature in the case of derivatives with tert-amyl substituent. Graphical abstract        

Synthesis and thermal decomposition of GAP-Poly(BAMO) copolymer

An energetic copolymer of glycidyl azide polymer (GAP) and poly(bis(azidomethyl)oxetane (Poly(BAMO)) was synthesized using the Borontrifluoride-dimethyl ether complex/diol initiator system. The synthesized copolymer exhibited the characteristics of an energetic thermoplastic elastomer (ETPE). Thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC) were used to study the thermal decomposition behavior and the results were compared with that of the constituent homopolymers. The main weight loss step in all the polymers coincides with the exothermic dissociation of the azido groups in the side chain. In contrast with the behavior of the homopolymers, the copolymer shows a broad exothermic shoulder peak at 298 °C after the main exothermic decomposition peak at 228 °C. Kinetic analysis was performed by Vyazovkin's model-free method, which suggests that the activation energy of the main decomposition step is around 145 kJ/mol and for the second shoulder it is around 220 kJ/mol. Fourier transform infra red (FTIR) spectra of the degradation residues show that the azido groups in the copolymer decompose in two stages at different temperatures which is responsible for the double decomposition behavior.     

Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis

Curing reactions of three cycloaliphatic epoxy resins with methyltetrahydrophthalic anhydride (MTHPA) was investigated by differential scanning calorimetry at different heating rates. Activation energy was calculated based on Kissinger method and varied in the range of 67-72 kJ/mol depending on sample. The curing kinetic behavior was well described by Sestak-Berggren (SB) model and the order of the curing reaction is observed to be from 0.02 to 2.11 according to sample.     

The POSS side chain epoxy nanocomposite: Synthesis and thermal properties

The IPI‐POSS‐modified epoxy resin (IPEP) was prepared from isocyanato‐propyldinethylsilyl‐isobutyl‐POSS (IPI‐POSS) and diglycidyl ether of bisphenol A epoxy resin. The steric hindrance of the IPEP bulky POSS side chain improved the curing activation energies. The POSS particles sizes were about 2–3 nm and dispersed uniformly. At lower IPEP concentration (POSS < 12 wt %), the glass transition temperatures (T_gs) of the IPEP nanocomposites increased from 118 to 170 °C. The char yield increased from 15 to 20 wt %, and the LOI values increased from 22 to 28. © 2010 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 48: 643–652, 2010     

Kinetics and thermal properties of epoxy resins based on bisphenol fluorene structure

The fluorene-containing epoxy, diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) was synthesized by a two-step reaction procedure. In order to investigate the relationship between fluorene structure and material properties, DGEBF and a commonly used diglycidyl ether of bisphenol A (DGEBA) were cured with 4,4-diaminodiphenyl methane (DDM) and 4,4-(9-fluorenylidene)-dianiline (FDA). The curing kinetics, thermal properties and decomposition kinetics of these four systems (DGEBA/DDM, DGEBF/DDM, DGEBA/FDA, and DGEBF/FDA) were studied in detail. The curing reactivity of fluorene epoxy resins was lower, but the thermal stability was higher than bisphenol A resins. The onset decomposition temperature of cured epoxy resins was not significantly affected by fluorene structure, but the char yield and T_g value were increased with that of fluorene content. Our results indicated that the addition of fluorene structure to epoxy resin is an effective method to improve the thermal properties of resins, but excess fluorene ring in the chain backbone can depress the curing efficiency of the resin.