Motion of the flat grain boundary in zinc

The motion of the individual flat random grain boundary (GB) in zinc is studied. The results are compared with those obtained earlier by the author while studying the motion of individual flat boundaries of special type. It was shown that the flat segments of the random GBs are the most mobile. The mobility of a GB system with a [10[`1]0][10\bar 10] tilt GB having a shape of a half-loop with a flat moving GB segment (facet) is an order of magnitude lower in the same temperature range.     

Kinetic properties of a first-order boundary ridge in Zn

The motion of a grain-boundary half-loop system with a first-order ridge is investigated and a theory of the steady-state motion of such a system is presented. The pattern of variation in the shape and properties of a moving boundary that contains various structural elements (curved segments, facets, first-order ridges) is presented. Important kinetic parameters (the mobility and the migration activation enthalpy) of a first-order grain-boundary ridge with curved segments are measured.     

The Effect of Triple Junctions on Grain Boundary Motion and Grain Microstructure Evolution

The theory of steady state motion of grain boundary sytems with triple junctions and the main features of such systems are considered. A special technique of in-situ observations and recording of triple junction motion is introduced, and the results of experimental measurements on Zn tricrystals are discussed. It is shown, in particular, that the described method makes it possible to measure the triple junction mobility. It was found that the measured shape of a moving half-loop with a triple junction agrees with theoretical predictions. A transition from triple junction kinetics to grain boundary kinetics was observed. This means that triple junctions can drag boundary motion. It is demonstrated that the microstructural (granular) evolution is slowed down by triple junction drag for any n-sided grain. The second consequence pertains to six-sided grains. For a boundary system with dragging triple junctions there is no unique dividing line between vanishing and growing grains with respect to their topological class anymore, like n = 6 in the Von Neumann-Mullins relation.     

Atomistic Simulation of Curvature Driven Grain Boundary Migration

We present two dimensional molecular dynamics simulations of grain boundary migration using the half-loop bicrystal geometry in the experiments of Shvindlerman et al. We examine the dependence of steady-state grain boundary migration rate on grain boundary curvature by varying the half-loop width at constant temperature. The results confirm the classical result derived by absolute reaction rate theory that grain boundary velocity is proportional to the curvature. We then measure the grain boundary migration rate for fixed half-loop width at varying temperatures. Analysis of this data establishes an Arrhenius relation between the grain boundary mobility and temperature, allowing us to extract the activation energy for grain boundary migration. Since grain boundaries have an excess volume, curvature driven grain boundary migration increases the density of the system during the simulations. In simulations performed at constant pressure, this leads to vacancy generation during the boundary migration, making the whole migration process jerky.     

Atomistic simulation of slow grain boundary motion

Existing atomistic simulation techniques to study grain boundary motion are usually limited to either high velocities or temperatures and are difficult to compare to realistic experimental conditions. Here we introduce an adapted simulation method that can access boundary velocities in the experimental range and extract mobilities in the zero driving force limit at temperatures as low as ～0.2T(m) (T(m) is the melting point). The method reveals three mechanistic regimes of boundary mobility at zero net velocity depending on the system temperature.     

Grain Boundary Dynamics: A Novel Tool for Microstructure Control

The reaction of grain boundaries to a wide spectrum of forces is reviewed. Curvature, volume energy and mechanical forces are considered. The boundary mobility is strongly dependent on misorientation, which is attributed to both grain boundary structure and segregation. In magnetically anisotropic materials grain boundaries can be moved by magnetic forces. For the first time a directionality of boundary mobility is reported. Flat boundaries can also be moved by mechanical forces, which sheds new light on microstructure evolution during elevated temperature deformation. Curvature driven and mechanically moved boundaries can behave differently. A sharp transition between the small and large angle boundary regime is observed. It is shown that grain boundary triple junctions have a finite mobility and thus, may have a serious impact on grain growth in fine grained materials. The various dependencies can be utilized to influence grain boundary motion and thus, microstructure evolution during recrystallization and grain growth.     

Effects of boundary inclination and boundary type on shear-driven grain boundary migration

A series of molecular dynamics simulations was performed on a bicrystal to which a fixed shear rate was applied parallel to the boundary plane. Under some conditions, grain boundary motion is coupled to the relative tangential motion of the two grains. In order to investigate the generality of this type of coupled shear/boundary motion, simulations were performed for both special (low Σ) and general (non-Σ) [010] tilt boundaries over a wide range of grain boundary inclinations. The data point to the existence of two critical stresses: one for coupled shear/boundary motion and the other for grain boundary sliding. For the non-Σ boundaries, the critical stress for coupled shear/boundary motion is typically smaller than that for sliding; coupled shear/boundary motion occurs for all inclinations. For Σ5 boundaries, for which the critical stress is smaller and depends on boundary inclination, coupled shear/boundary motion occurs for some, but not all inclinations.     

Linear grain growth kinetics and rotation in nanocrystalline Ni

We report three-dimensional atomistic molecular dynamics studies of grain growth kinetics in nanocrystalline Ni. The results show the grain size increasing linearly with time, contrary to the square root of the time kinetics observed in coarse-grained structures. The average grain boundary energy per unit area decreases simultaneously with the decrease in total grain boundary area associated with grain growth. The average mobility of the boundaries increases as the grain size increases. The results can be explained by a model that considers a size effect in the boundary mobility.     

Grain boundary,triple junction and quadruple point mobility controlled normal grain growth

Reduction in stored free energy provides the thermodynamic driving force for grain and bubble growth in polycrystals and foams. Evolution of polycrystalline networks exhibit the additional complication that grain growth may be controlled by several kinetic mechanisms through which the decrease in network energy occurs. Polyhedral boundaries, triple junctions (TJs), and quadruple points (QPs) are the geometrically distinct elements of three dimensional networks that follow Plateau’s rules, provided that grain growth is limited by diffusion through, and motion of, cell boundaries. Shvindlerman and co-workers have long recognized the kinetic influences on polycrystalline grain growth of network TJs and QPs. Moreover, the emergence of interesting polycrystalline nanomaterials underscored that TJs can indeed influence grain growth kinetics. Currently there exist few detailed studies concerned either with network distributions of grain size, number of faces per grain, or with ‘grain trajectories’, when grain growth is limited by the motion of its TJs or QPs. By contrast there exist abundant studies of classical grain growth limited by boundary mobility. This study is focused on a topological/geometrical representation of polycrystals to obtain statistical predictions of the grain size and face number distributions, as well as growth ‘trajectories’ during steady-state grain growth. Three limits to grain growth are considered, with grain growth kinetics controlled by boundary, TJ, and QP mobilities.     

Effect of grain boundary sliding on the toughness of ultrafine grain structure steel: A molecular dynamics simulation study

Molecular dynamics simulations are carried out to investigate the mechanisms of low-temperature impact toughness of the ultrafine grain structure steel. The simulation results suggest that the sliding of the {001}/{110} type and {110}/{111} type grain boundary can improve the impact toughness. Then, the mechanism of grain boundary sliding is studied and it is found that the motion of dislocations along the grain boundary is the underlying cause of the grain boundary sliding. Finally, the sliding of the grain boundary is analyzed from the standpoint of the energy. We conclude that the measures which can increase the quantity of the {001}/{110} type and {110}/{111} type grain boundary and elongate the free gliding distance of dislocations along these grain boundaries will improve the low-temperature impact toughness of the ultrafine grain structure steel.     

Mobility of low-angle grain boundaries in pure metals

The mobility of low-angle grain boundaries in pure metals is reviewed and several theoretical treatments are provided. The approach that provides the best agreement with the available experimental data is one in which the mobility is controlled by vacancy diffusion through the bulk to (and from) the dislocations that comprise the boundary that are bowing out between pinning points. The pinning points are presumed to be extrinsic dislocations swept into the boundaries or grown in during the prior processing of the material. This approach yields a mobility that is constant with respect to misorientation angle, up to the transition to the high-angle regime. For small misorientations of the order 1°, however, the mobility appears to increase with decreasing misorientation angle.     

Collective effects in grain boundary migration

In situ high-resolution transmission electron microscopy is used to study grain boundary structure and kinetics in bicrystalline Au films at elevated temperature. We report the first direct evidence for the existence of cooperative atomic motion in grain boundary migration. Certain nanoregions at grain boundaries, typically involving up to several hundred atoms, are found to switch back and forth between neighboring grains. Reversible structural fluctuations at temperatures near 0.5T(m) and above have been discovered in [110] and [001] tilt, as well as in general grain boundaries.     

Weakly nonlinear theory of grain boundary motion in patterns with crystalline symmetry

We study the motion of a grain boundary separating two otherwise stationary domains of hexagonal symmetry. Starting from an order parameter equation, a multiple scale analysis leads to an analytical equation of motion for the boundary that shares many properties with that of a crystalline solid. We find that defect motion is generically opposed by a pinning force that arises from nonadiabatic corrections to the standard amplitude equations. The magnitude of this force depends sharply on the misorientation angle between adjacent domains: the most easily pinned grain boundaries are those with a low angle (typically 4 degrees < or =theta;< or =8 degrees ). Although pinning effects may be small, they can be orders of magnitude larger than those present in smectic phases.     

Grain boundary misorientation changes during grain growth in pure aluminium

A new method is described for data-logging large amounts of grain boundary misorientation information from channelling patterns in the scanning electron microscope (SEM). The method relies on producing specimens where the grain size is larger than the specimen thickness and where the grain boundary planes are perpendicular to the specimen plane (the so-called columnar structure). Results for grain growth in pure aluminium at 460 and 500°C are presented. There is an increase in the proportion of low angle boundaries at the expense of high angle boundaries during growth times of up to a few hours. The reasons are thought to be partly connected with lower low angle boundary mobility compared with high angle boundaries. However, the growth kinetics appear to be normal over the entire growth time range.     

Quantitative phase-field approach for simulating grain growth in anisotropic systems with arbitrary inclination and misorientation dependence

A phase-field approach for quantitative simulations of grain growth in anisotropic systems is introduced, together with a new methodology to derive appropriate model parameters that reproduce given misorientation and inclination dependent grain boundary energy and mobility in the simulations. The proposed model formulation and parameter choice guarantee a constant diffuse interface width and consequently give high controllability of the accuracy in grain growth simulations.     

Grain Boundary Migration in Metals: Recent Developments

Current research on grain boundary migration in metals is reviewed. For individual grain boundaries the dependence of grain boundary migration on misorientation and impurity content are addressed. Impurity drag theory, extended to include the interaction of adsorbed impurities in the boundary, reasonably accounts quantitatively for the observed concentration dependence of grain boundary mobility. For the first time an experimental study of triple junction motion is presented. The kinetics are quantitatively discussed in terms of a triple junction mobility. Their impact on the kinetics of microstructure evolution during grain growth is outlined.     

Positron trapping at grain boundaries

A simple model is developed for the trapping of positrons at grain boundaries. It is shown that there is a linear relationship between any linear annihilation parameter and the inverse grain size. An effective grain boundary width is defined, which depends on the positron diffusion length and on the strength of the grain boundary for positrons. The effect of detrapping on this effective width is also considered. The model is tested by using the experimental results available in the literature.     

Strain incompatibility and its influence on grain coarsening during cyclic deformation of ARB copper

It is well known that the characteristic length scale in ultra-fine grained and nanocrystalline metals has a significant effect on the mechanical behaviour. The inhibited ability to accommodate imposed strain with conventional dislocation mechanism has led to the activation of unconventional deformation mechanisms. For one, grain coarsening at shear bands has been observed to occur within metals with sub-micron grain size upon cyclic deformation. Such grain coarsening is often linked to the observed cyclic softening behaviour. The purpose of this study was to investigate the relationship between strain localisation associated with shear banding and the observed deformation-induced grain coarsening in ultra-fine grained metals. The investigation was carried out using ultra-fine grained, oxygen-free high conductivity copper processed by accumulative roll-bonding. A close relationship between strain localisation and deformation-induced grain coarsening was revealed. As strain localisation is not only found at shear bands, but also at other places whereby heterogeneous microstructure or geometric discontinuity is present, hence the present study bears a general significance. Such strain localisation sites may also include a hard constituent embedded in a relatively ductile matrix, micro-crack tips and artificial notches. The stress concentration at these sites provides a high input of strain energy for grain boundary motion leading to grain coarsening. Furthermore, when the grain size is very small, the stress gradient leading away from the stress concentration sites is also believed to increase the driving force for grain boundary migration within the affected regions.