Thermal conductivity and interface thermal resistance of Si film on Si substrate determined by photothermal displacement interferometry

An in situ, noncontact, photothermal displacement interferometer for performing thermal diffusivity measurements on bulk and thin-film materials has been developed. Localized transient surface motion is generated through photothermoelastic coupling of a pulsed, heating laser beam to the sample under investigation. The maximum surface displacement is found to be linearly dependent on the laser power while the proportionality is a function of the thermal diffusivity. Both thin-film conductivity and film/substrate interface thermal resistance are derived from the measured, effective thermal conductivity by employing simple heat-flow analysis. Wedge-shaped Si films, vacuum deposited on single crystal Si wafers are studied with this technique. A sample with oxide layer removed by ion bombardment of the wafer surface prior to film deposition shows the same film conductivity as a sample film deposited on an as-cast wafer, while the uncleaned sample exhibits higher interface thermal resistance. It is found that the thin-film thermal conductivity is somewhat smaller than the bulk value. However, the existence of an interface thermal resistance, when combined with film thermal conductivity, can result in an effective thermal conductivity as low as two orders of magnitude lower than the bulk value.Currently supported by the LLE fellowship     

Structure and thermophysical properties of single-wall Si nanotubes

In this work, molecular dynamics (MD) simulation based on the environment-dependent interatomic potential is carried out to explore the structure, atomic energy distribution, and thermophysical properties of single-wall Si nanotubes (SWSNTs). The unique structure of SWSNTs leads to a wider range energy distribution than crystal Si (c-Si), and results in a bond order in the range of 4.8–5. The thermal conductivity of SWSNTs is much smaller than that of bulk Si, and shows significantly slower change with their characteristic size than that of Si films. Out of the three types of SWSNTs studied in this work, pentagonal SWSNTs have the highest thermal conductivity while hexagonal SWSNTs have the lowest one. The specific heat of SWSNTs is a little larger than that of bulk c-Si. Pentagonal and hexagonal SWSNTs have close specific heats, which are a little larger than that of rectangular SWSNTs.     

Electrical behaviors of ZnO/graphene/Si and ZnO/graphene/PS composite structures obtained by spraying different volumes of graphene solution

In this paper, a novel ZnO/graphene/porous silicon hybrid device is fabricated and its electrical behaviors are studied along with a ZnO/graphene/silicon device. Graphene (G) is prepared by exfoliation of graphite foil in aqueous solution of inorganic salt. Porous silicon (PS) is fabricated by electrochemical etching of p-type silicon (Si). Graphene is deposited on the surface of Si and PS substrates by thermal spray pyrolysis method. ZnO rods are grown on the samples by using catalyst-free chemical vapor transport and condensation method. The current–voltage relationships of ZnO/G/Si and ZnO/G/PS devices are studied under different volumes of graphene solution. The results reveal the distinctive features of the I–V characteristics of the two devices for different volumes of graphene solution under room light as well as UV illumination.     

Thermal conductivity of symmetrically strained Si/Ge superlattices

This paper reports temperature-dependent thermal conductivity measurements in the cross-plane direction of symmetrically strained Si/Ge superlattices, and the effect of doping, period thickness and dislocations on the thermal conductivity reduction of Si/Ge superlattices. The Si/Ge superlattices are grown by molecular beam epitaxy on silicon and silicon-on-insulator substrates with a graded buffer layer. A differential 3 ω method is used to measure the thermal conductivity of the buffer and the superlattices between 80 and 300 K. The thermal conductivity measurement is carried out in conjunction with X-ray and TEM sample characterization. The measured thermal conductivity values of the superlattices are lower than those of their equivalent composition bulk alloys.     

Role of a‐Si:H bulk in surface passivation of c‐Si wafers

The low thermal stability of hydrogenated amorphous silicon (a‐Si:H) thin films limits their widespread use for surface passivation of c‐Si wafers on the rear side of solar cells. We show that the thermal stability of a‐Si:H surface passivation is increased significantly by a hydrogen rich a‐Si:H bulk, which acts as a hydrogen reservoir for the a‐Si:H/c‐Si interface. Based on this mechanism, an excellent lifetime of 5.1 ms (at injection level of 10¹⁵ cm^–3) is achieved after annealing at 450 °C for 10 min. (© 2010 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Morphological properties of AlN and GaN grown by MOVPE on porous Si(111) and Si(111) substrates

Metal Organic Vapour Phase Epitaxy (MOVPE) of AlN and GaN layers at a temperature of 1080 C were performed on porous Si(111) and Si(111) substrates. The thermal stability of porous silicon (PS) is studied versus growth time under AlN and GaN growth conditions. The surface morphology evolution of the annealed PS is revealed by scanning electron microscopy (SEM). Porous Si(111) with low porosity (40%) is more thermally stable than porous Si(100) with relatively high porosity (60%).AlN layers with various thicknesses were grown under the same conditions on the two substrates. Morphological properties of AlN were studied by atomic force microscopy (AFM) and compared taking into account the two different surfaces of the substrates. The two growth kinetics of AlN were found to be different due to the initial surface roughness of the PS substrate. The effect of AlN buffer morphology on the qualities of subsequent GaN layers is discussed. Morphological qualities of GaN layers grown on PS are improved compared to those obtained on porous Si(100) but are still less than those grown on Si substrate.     

Room temperature magnetoresistance anisotropies in p-type (001) Si on sapphire

Magnetoresistance anisotropies, differing from those of bulk p-type Si, have been observed on p-type Si film on sapphire (SOS). They may arise from the valence band split and deformed by a large compressive strain due to thermal expansion coefficient difference between Si and sapphire.     

单轴应变硅N沟道金属氧化物半导体场效应晶体管电容特性模型

电容特性模型是单轴应变硅金属氧化物半导体场效应晶体管(Si MOSFET)和电路进行瞬态分析、交流小信号分析、噪声分析等的重要基础. 本文首先建立了单轴应变Si NMOSFET 的16 个微分电容模型, 并将微分电容的仿真结果与实验结果进行了比较, 验证了所建模型的正确性. 同时对其中的关键性栅电容C_gg 与应力强度、偏置电压、沟道长度、栅极掺杂浓度等的关系进行了分析研究. 结果表明, 与体硅器件相比, 应变的引入使得单轴应变Si NMOSFET器件的栅电容增大, 随偏置电压、沟道长度、栅极掺杂浓度的变化趋势保持不变.     

小尺寸应变Si金属氧化物半导体场效应晶体管栅隧穿电流预测模型

小尺寸金属氧化物半导体场效应晶体管(MOSFET)器件由于具有超薄的氧化层、关态栅隧穿漏电流的存在严重地影响了器件的性能,应变硅MOSFET器件也存在同样的问题.为了说明漏电流对新型应变硅器件性能的影响,文中利用积分方法从准二维表面势分析开始,提出了小尺寸应变硅MOSFET栅隧穿电流的理论预测模型,并在此基础上使用二维器件仿真软件ISE进行了仔细的比对研究,定量分析了在不同栅压、栅氧化层厚度下MOSFET器件的性能.仿真结果很好地与理论分析相符合,为超大规模集成电路的设计提供了有价值的参考. 关键词： 应变硅 准二维表面势 栅隧穿电流 预测模型     

Phonon considerations in the reduction of thermal conductivity in phononic crystals

Periodic porous structures offer unique material solutions to thermoelectric applications. With recent interest in phonon band gap engineering, these periodic structures can result in reduction of the phonon thermal conductivity due to coherent destruction of phonon modes characteristic in phononic crystals. In this paper, we numerically study phonon transport in periodic porous silicon phononic crystal structures. We develop a model for the thermal conductivity of phononic crystal that accounts for both coherent and incoherent phonon effects, and show that the phonon thermal conductivity is reduced to less than 4% of the bulk value for Si at room temperature. This has substantial impact on thermoelectric applications, where the efficiency of thermoelectric materials is inversely proportional to the thermal conductivity.     

The (29)Si T(1) and T(2) NMR relaxation in porous paramagnetic material SiO(2)-MnO-Al(2)O(3)

The (29)Si spin-lattice relaxation in porous silica-based material 1, doped by ions Mn(2+) at a Si/Mn ratio of 3.5, is non-exponential, independent of magic-angle spinning (MAS) rates and governed by direct dipolar coupling between electron and nucleus where an electron relaxation time is estimated to be about 10(-8)s. In the absence of mutual energy-conserving spin flips (spin diffusion) in 1, the (29)Si T(2) time increases linearly with spinning rates. None was observed in diamagnetic porous system 2. The unexpected (29)Si T(2) dependence has been interpreted in terms of the large bulk magnetic susceptibility (BMS) effects. It has been shown that editing the (29)Si Hahn-echo MAS NMR spectra eliminates wide lines, belonging to (29)Si nuclei in the proximity of paramagnetic centers, and reduces the BMS broadenings in sideband patterns for nuclei remote from these centers.     

Self-catalytic growth of horizontal and straight Si nanowires on Si substrates using a sputter deposition technique

We report on the growth of horizontal and straight Si nanowires (NWs) on Si substrate using sputter deposition of the Si layer followed by thermal annealing at 1000 °C and above. The growth of horizontal NWs was achieved without the use of any metal catalyst. Uniform cylindrical shaped Si NWs with a diameter in the range of 50–60 nm and a length of up to 8 μm were synthesized. The as-synthesized Si NWs have a Si core covered with a thin amorphous native oxide layer, as revealed by high resolution transmission electron microscopy. The aspect ratio of these Si NWs is in the range of 100–160. Micro-Raman studies on the NWs reveal a tensile strain on the Si NW core due to presence of a thin oxide layer. From the Raman shift, we calculate a strain of 1.0% for the catalyst free Si NW. FTIR analysis indicates the presence of interstitial oxygen atoms in the Si NWs, as expected from oxidation of Si NWs. For comparison, metal catalyst (Au) assisted Si NWs have also been grown on Si(100) substrate by a similar process. These NWs have a similar diameter and a marginally higher aspect ratio. A model for the growth mechanism of horizontal NWs is presented. This represents one of the first examples of direct horizontal growth of straight Si NWs on commonly used Si substrates suitable for nanoelectronic device fabrication.     

Surface texturing of Si, porous Si and TiO2 by laser ablation

Excimer laser ablation at 308 nm has been used to texture the surfaces of a variety of materials of interest for optoelectronic and biotechnological applications. Using a range of pre- and post-processing methods, we are able to produce nano-, micro- and meso-scale features over large areas rapidly in materials such as crystalline Si, porous silicon and TiO₂. Texturing of porous silicon leads to the growth of crystalline dendritic structures, which distinguishes them dramatically from the conical pillars formed from crystalline silicon. Regular arrays of Si microdots are formed by irradiating a Si surface pre-covered with a Cr thin film grating. Nano-crystalline porous TiO₂ films are easily ablated or compacted with laser irradiation. However, at low enough laser fluence, surface roughening without complete loss of porosity is possible.     

Optical second harmonic spectroscopy of boron-reconstructed Si(001)

Optical second harmonic generation (SHG) spectroscopy is used to probe Si(001) following thermal decomposition of diborane at the surface. Incorporation of boron (B) at second layer substitutional sites at H-free Si(001) intensifies and redshifts the E1 SHG spectral peak, while subsequent H termination further intensifies and blueshifts E1, in sharp contrast to the effect of bulk B doping or nonsubstitutional B. Ab initio pseudopotential and semiempirical tight binding calculations independently reproduce these unique trends, and attribute them to the surface electric field associated with charge transfer to electrically active B acceptors, and rehybridization of atomic bonds.     

快速退火后重掺硼的分子束外延层的电学特性

对快速退火后用共蒸发Ｂ_２Ｏ₃方法实现重掺杂硼的硅分子束外延层的电学特性进行了研究．１１００℃退火可以使得外延层中载流子浓度提高４倍，空穴的霍耳迁移率与相同浓度下硅体材料的水平相当；外延层与衬底之间载流子浓度转变陡峭，获得了晶体质量良好的外延层． 关键词：     

High-resolution electron microscopy of Si cones formed on Ar+-bombarded Si wafers

Conical Si projections generated on Si wafers bombarded with obliquely incident Ar⁺ ions were studied by high-resolution transmission electron microscopy. The cones were composed of an [111]-oriented bulk phase covered with a disordered thin layer, but the bulk phase was not perfectly ordered, containing an amorphous domain underneath the outermost area. Such a multi-phase structure is inexplicable in terms of ion erosion, suggesting interplay of the redeposition of sputtered Si atoms on the bombarded area with the ion-erosion process so as to promote cone evolution. The cones were also characterized by the development of web-like platelets at their acute angles, an indication of a crystal growth process involved in the surface phenomenon observed.     

Thermoelectric properties of porous silicon

We have studied the thermoelectric properties of porous silicon, a nanostructured, yet single-crystalline form of silicon. Using electrochemical etching, liquid-phase doping, and high-temperature passivation, we show that porous Si can be fabricated such that it has thermoelectric properties superior to bulk Si, for both n- and p-type doping. Hall measurements reveal that the charge carrier mobility is reduced compared to the bulk material which presently limits the increase in thermoelectric efficiency.     

用硅离子注入方法制备的纳米硅的拉曼散射研究

在直角散射配置下测量了纳米硅样品的拉曼散射谱及其退火温度的关系。结果表明,在８００℃以下退火的样品只观察到单晶硅衬底的光学声子模,在９００℃以上退火,才观察到纳米硅的特征拉曼散射峰。在１２００℃下退火后,纳米硅的特征拉曼散射峰消失,观察到类似于非晶硅的光学声子特征峰,可能表示纳米硅不能承受这样的高温热退火。这些结果进一步证实了光致发光谱的结果。     

Temperature-dependent photoluminescence and Raman spectra from porous GeSi/Si heterostructures

Porous GeSi/Si heterostructures were fabricated by laterally anodization in HF-based solutions. Photoluminescence spectra have been investigated as a function of temperature (77–300 K), showing that porous GeSi has a quite different temperature dependence from that of porous silicon. Raman spectra indicated that the sample structure changed after anodization. Phonon participation and direct recombination of excitons are proposed to be responsible in the light emission processes of porous GeSi and Si, respectively.     

形变Si,Ge中的深能级

对生长在合金衬底上的形变Si或Ge中由替位原子或空位缺陷产生的深能级进行了研究。其中形变体材料的电子结构用经验的紧束缚方法进行计算,缺陷能级采用格林函数法进行计算出。结果表明,晶格中的形变使原来类p的T₂能级发生分裂,其数值随形变的增加而增大。形变还造成Si和Ge的价带顶有较大的上升,从而使某些杂质的缺陷能级由深能级变为共振能级。 关键词：