Characteristics improvement of HfO2/Ge gate stack structure by fluorine treatment of germanium surface

Chemical reactivity of fluorine molecule (F₂)-germanium (Ge) surface and dissociation of fluorine (F)-Ge bonding have been simulated by semi-empirical molecular orbital method theoretically, which shows that F on Ge surface is more stable compared to hydrogen. Ge MIS (metal insulator semiconductor) capacitor has been fabricated by using F₂-treated Ge(1 0 0) substrate and HfO₂ film deposited by photo-assisted MOCVD. Interface state density observed as a hump in the C-V curve of HfO₂/Ge gate stack and its C-V hysteresis were decreased by F₂-treatment of Ge surface. XPS (X-ray photoelectron spectroscopy) depth profiling reveals that interfacial layer between HfO₂ and Ge is sub-oxide layer (GeO_x or HfGeO_x), which is believed to be origin of interface state density.F was incorporated into interfacial layer easily by using F₂-treated Ge substrate. These results suggest that interface defect of HfO₂/Ge gate stack structure could be passivated by F effectively.     

Effects of heavy-ion irradiation on the electrical properties of rf-sputtered HfO2 thin films for advanced CMOS devices

HfO₂-based metal-oxide semiconductor (MOS) capacitors were irradiated with high-energy ion beam to study the irradiation effects in these films. HfO₂ thin films deposited by radio frequency (rf)-sputtering were irradiated with 80 MeV O⁶⁺ ions. The samples were irradiated and characterized at room temperature. Devices were characterized via 1 MHz capacitance–voltage (C?V) measurements using the midgap method. The irradiation induced dispersion in accumulation and depletion regions with increasing fluence is observed. After irradiation, the midgap voltage shift (Δ V _mg) of?0.61 to?1.92 V, flat band voltage shift (Δ V _fb) of?0.48 to?2.88 V and threshold voltage shift (Δ V _th) of?0.966 to?1.96 V were observed. The change in interface trap charge and oxide trap charge densities after 80 MeV O⁶⁺ ions irradiation with fluences were determined from the midgap to flat band stretch out of C?V curves. The results are reported and explained in terms of changes in microstructure and dielectric properties of the HfO₂ thin films after irradiation.     

Light emission from a-Si:C:O:H films fabricated by C2F6 and O2/C2F6 plasma treating silicone oil liquid

Amorphous Si:C:O:H films were fabricated at low temperature by C₂F₆ and O₂/C₂F₆ plasma treating silicone oil liquid. The a-Si:C:O:H films fabricated by C₂F₆ plasma treatment exhibited white photoluminescence at room temperature, while that by O₂/C₂F₆ plasma treatment exhibited blue photoluminescence. Fourier transformed infrared spectroscopy and Raman spectroscopy studies showed that the sp³ and sp² hybridized carbons, SiC bond, SiO bond and carbon-related defects in a-Si:C:O:H films correlated with photoluminescence. It is suggested that the blue emission at 469 nm was related to the sp³ and sp² hybridized carbons, SiC bond, carbon dangling bonds as well as SiO short chains and small clusters, while the light emitting at 554 nm was related to the carbon-related defects.     

Carbon-13 enrichment by IR laser chemistry of CHF3-Cl2

IR laser chemistry of CHF₃ is investigated in both neat form and in the presence of Cl₂ for carbon-13 enrichment. Infrared multiple-photon dissociation of CHF₃ is an order of magnitude more efficient in the scavenged system compared to the neat case. The photolysis of CHF₃/Cl₂ mixture results in two products, viz., CF₂Cl₂ and C₂F₄Cl₂ but with different enrichment factors. The parametric studies show that C₂F₄Cl₂ arises due to MPD of CF₂Cl₂ in secondary photolysis.     

The effects of plasma treatment on the thermal stability of HfO2 thin films

The thermal stability of pure HfO₂ thin films is not high enough to withstand thermal processes, such as S/D activation or post-metal annealing, in modern industrial CMOS production. In addition, plasma nitridation technology has been employed for increasing the dielectric constant of silicon dioxide and preventing boron penetration. In this experiment, atomic layer deposition (ALD) technology was used to deposit HfO₂ thin films and inductively coupled plasma (ICP) technology was used to perform plasma nitridation process. The C-V and J-V characteristics of the nitrided samples were observed to estimate the effect of the nitridation process. According to this study, plasma nitridation process would be an effective method to improve the thermal stability of HfO₂ thin films.     

Microstructure and interfacial properties of HfO2-Al2O3 nanolaminate films

High-k HfO₂-Al₂O₃ composite gate dielectric thin films on Si(1 0 0) have been deposited by means of magnetron sputtering. The microstructure and interfacial characteristics of the HfO₂-Al₂O₃ films have been investigated by using X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FTIR) and spectroscopic ellipsometry (SE). Analysis by XRD has confirmed that an amorphous structure of the HfO₂-Al₂O₃ composite films is maintained up to an annealing temperature of 800 °C, which is much higher than that of pure HfO₂ thin films. FTIR characterization indicates that the growth of the interfacial SiO₂ layer is effectively suppressed when the annealing temperature is as low as 800 °C, which is also confirmed by spectroscopy ellipsometry measurement. These results clearly show that the crystallization temperature of the nanolaminate HfO₂-Al₂O₃ composite films has been increased compared to pure HfO₂ films. Al₂O₃ as a passivation barrier for HfO₂ high-k dielectrics prevents oxygen diffusion and the interfacial layer growth effectively.     

Influence of the ion energy on the structure of Bi and Fe2O3 thin films

Compounds containing bismuth, iron and oxygen (BFO) can result in materials with important magnetic and electrical properties for high-technology applications. We plan to prepare such compounds using the simultaneous ablation of bismuth and iron oxide targets. For that reason in the first part of this work we study the plasmas and the materials produced by ablation of bismuth or Fe₂O₃ targets, and then the two plasmas are combined in order to deposit the BFO compounds. The individual plasmas were characterized using a Langmuir probe, in order to measure the mean kinetic ion energy (E _p) and plasma density (N _p). Bismuth and magnetite-Fe₃O₄ thin films were obtained in high vacuum (2.7×10^?4 Pa). Meanwhile for the deposition of α-Fe₂O₃ (hematite) or amorphous bismuth oxide thin films a reactive atmosphere (Ar/O₂=80/20) was used. All depositions were made at room temperature. The bismuth thin films crystallized in the rhombohedral metallic system with preferential orientations that depended on the Bi-ion energy used. Bismuth oxide phases were only obtained after annealing of the Bi thin films at different temperatures. Iron oxide thin films reproducing the target stoichiometry were obtained at a certain value of iron-ion energy. Preliminary structural results of the BFO thin films obtained by the combination of the individual plasmas are presented.     

Partial Cross Sections for Dissoziative Ionization of Fluorinated Compounds by Electron Impact

Ionization cross sections of fragment ions of CF₄, C₂F₆, C₃F₈, n-C₄F₁₀, C₂F₄, 1-C₄F₈, SiF₄, COF₂. CHF₃ were determined in dependence on electron energy up to 125 eV by means of a quadrupol mass spectrometer. Tails at the low energy part of the characteristics are interpreted as a result of kinetic energy depending on molecular weight of fragments. Parent ions are only detected for chemically unsaturated compounds showing characteristic curves of ionization efficiency. Total cross sections obey the additive rule.     

电子回旋共振等离子体增强沉积氟化非晶碳薄膜的光学性质

用紫外可见光透射光谱(UV-VIS)并结合键结构的X射线光电子能谱(XPS)和红外谱(FTIR)分析,研究了电子回旋共振等离子体增强化学气相沉积法制备的氟化非晶碳薄膜的光吸收和光学带隙性质.在微波功率为140—700W、源气体CHF₃∶C₆H₆比例为1∶1—10∶1条件下沉积的薄膜,光学带隙在1.76—2.85eV之间.薄膜中氟的引入对吸收边和光学带隙产生较大的影响,吸收边随氟含量的提高而增大,光学带隙则主要取决于CF键的含量,是由于强电负 关键词： 氟化非晶碳薄膜 光吸收与光学带隙 电子回旋共振等离子体     

CHF3 Dual-Frequency Capacitively Coupled Plasma by Optical Emission Spectroscopy

We investigate the intermediate gas phase in the CHFs 13.56 MHz/2 MHz dual-frequency capacitively couple plasma （CCP） for the SiCOH low dielectric constant （low-k） film etching, and the effect of 2MHz power on radicals concentration. The major dissociation reactions of CHF3 in 13.56MHz CCP are the low dissociation bond energy reactions, which lead to the low F and high CF2 concentrations. The addition of 2MHz power can raise the probability of high dissociation bond energy reactions and lead to the increase of F concentration while keeping the CF2 concentration almost a constant, which is of advantage to the SiCOH low-k films etching. The radical spatial uniformity is dependent on the power coupling of two sources. The increase of 2 MHz power leads to a poor uniformity, however, the uniformity can be improved by increasing 13.56 MHz power.     

Photoluminescence of silicone oil treated by fluorocarbon plasma

We investigated photoluminescence characteristics of silicone oils treated by C2F6 and CHF3 plasma. The silicone oil treated by the C2F6 plasma emitted a white light mainly composed of 415 nm, 469 nm, and 554 nm emissions, while that treated by the CHF3 plasma emitted a pink light (415 nm). Fourier transformed infrared spectroscopy and Raman spectroscopy studies showed that the photoluminescence was correlated with the Si-C bond, the carbon-related defects and the oxygen vacancies. It was suggested that the light emitting at 554 nm was related to the Si-C bond and the carbon-related defects, while the pink emission at 415 nm was related to the oxygen vacancies.     

Investigation of the chemical state of ultrathin Hf-Al-O films during high temperature annealing

Al₂O₃ incorporated HfO₂ films grown by atomic layer deposition (ALD) were investigated by high-resolution X-ray photoelectron spectroscopy (HRXPS). The core level energy state of a 15 Å thick film showed a shift to higher binding energy, as the result of a silicate formation and Al₂O₃ incorporation. The incorporation of Al₂O₃ into the HfO₂ film had no effect on silicate formation at the interface between the film and Si, while the ionic bonding characteristics and hybridization effects were enhanced compared to a pure HfO₂ film. The dissociation of the film in an ultrahigh vacuum (UHV) is effectively suppressed compared to a pure HfO₂ film, indicating an enhanced thermal stability of Hf-Al-O. Any dissociated Al₂O₃ on the film surface was completely removed into the vacuum by vacuum annealing treatment over 850 °C, while HfO₂ contributed to Hf silicide formation on the film surface.     

Characteristics of SiO2 etching by using pulse-time modulation in 60 MHz/2 MHz dual-frequency capacitive coupled plasma

60 MHz pulsed radio frequency (rf) source power and 2 MHz continuous wave rf bias power, were used for SiO₂ etching masked with an amorphous carbon layer (ACL) in an Ar/C₄F₈/O₂ gas mixture, and the effects of the frequency and duty ratio of the 60 MHz pulse rf power on the SiO₂ etch characteristics were investigated. With decreasing duty ratio of the 60 MHz pulse rf power, not only the etch rate of SiO₂ but also the etch rate of ACL was decreased, however, the etch selectivity of SiO₂ over ACL was improved with decreasing the duty ratio. On the other hand, when the pulse frequency was varied at a constant duty ratio, no significant change in the etch rate and etch selectivity of both materials could be observed. The variation of the etch characteristics was believed to be related to the change in the gas dissociation characteristics caused by the change in the average electron temperature for different pulsing conditions. The improvement in the etch selectivity with the decrease of duty ratio, therefore, was related to the decreased gas dissociation of C₄F₈ by the decrease of average electron temperature and, which resulted in a change in composition of the fluorocarbon polymer on the etched materials surface from C–C rich to CF₂ rich. With decreasing the duty ratio, not only the etch selectivity but also the improvement in the SiO₂ etch profile could be observed.     

Gas by-products of CF3I under AC partial discharge

This paper presents the decomposition by-products of trifluro-iodo-methane and their relative proportions in the gas phase under the occurrence of partial discharge. The experiment was performed in the presence of water vapor from 250 to 400 ppm under a non-uniform electric field configuration. The experimental results reveal that the by-products of C₂F₆, C₂F₄, C₂F₅I with the amount of 1300, 200, and 55 (CH₃I) ppm, respectively, were produced for a cumulative charge of 161 mC. Other by-products, such as C₃F₈, CHF₃, C₃F₆ CH₃I were obtained at less than 30 ppm C₂F₆ was the dominant gas by-product of trifluro-iodo-methane suffering partial discharge.     

Fabrication and characterization of La-doped HfO2 gate dielectrics by metal-organic chemical vapor deposition

La-doped HfO₂ gate dielectric thin films have been deposited on Si substrates using La(acac)₃ and Hf(acac)₄ (acac = 2,4-pentanedionate) mixing sources by low-pressure metal-organic chemical vapor deposition (MOCVD). The structure, thermal stability, and electrical properties of La-doped HfO₂ films have been investigated. Inductive coupled plasma analyses confirm that the La content ranging from 1 to 5 mol% is involved in the films. The films show smaller roughness of ∼0.5 nm and improved thermal stability up to 750 °C. The La-doped HfO₂ films on Pt-coated Si and fused quartz substrates have an intrinsic dielectric constant of ∼28 at 1 MHz and a band gap of 5.6 eV, respectively. X-ray photoelectron spectroscopy analyses reveal that the interfacial layer is Hf-based silicate. The reliable value of equivalent oxide thickness (EOT) around 1.2 nm has been obtained, but with a large leakage current density of 3 A/cm² at V_g = 1V + V_fb. MOCVD-derived La-doped HfO₂ is demonstrated to be a potential high-k gate dielectric film for next generation metal oxide semiconductor field effect transistor applications.     

Evidence of GeO volatilization and its effect on the characteristics of HfO2 grown on Ge substrate

HfO₂ films are deposited by atomic layer deposition (ALD) using tetrakis ethylmethylamino hafnium (TEMAH) as the hafnium precursor, while O₃ or H₂O is used as the oxygen precursor. After annealing at 500℃ in nitrogen, the thickness of Ge oxide's interfacial layer decreases, and the presence of GeO is observed at the H₂O-based HfO₂ interface due to GeO volatilization, while it is not observed for the O₃-based HfO₂. The difference is attributed to the residue hydroxyl groups or H₂O molecules in H₂O-based HfO₂ hydrolyzing GeO₂ and forming GeO, whereas GeO is only formed by the typical reaction mechanism between GeO₂ and the Ge substrate for O₃-based HfO₂ after annealing. The volatilization of GeO deteriorates the characteristics of the high-κ films after annealing, which has effects on the variation of valence band offset and the C–V characteristics of HfO₂/Ge after annealing. The results are confirmed by X-ray photoelectron spectroscopy (XPS) and electrical measurements.     

Use of a two-sequential radical reaction scheme to rationalise the high-oxidation-state carbene species detected under confinement conditions for the interactions Fe(5D) + CH4−n Fn (n = 2−4)

Results obtained from CASSCF–MRMP2 calculations are used to explain the carbene products observed under matrix conditions for the interactions Fe(⁵D) + CH_4–nF_n (n = 2–4) in terms of two sequential reactions involving the radical species ·FeF + CH_4–nF_n–1. For the CH₂F₂ and CHF₃ molecules, the first reaction leads to the radical fragments ·FeF + CH₂F (or ·CHF₂). As these species remain trapped in the matrix, they can recombine themselves to form the inserted complex CH₂F–Fe–F (or CHF₂–Fe–F). The carbene H₂C = FeF₂ (or HFC = FeF₂) is reached from the inserted structure by α-migration of an additional fluorine atom to the metal centre. The rebounding reactions can take place along both the quintuplet and triplet asymptotes varying only in the spin of the non-metal fragment. This model explains the triplet compound H₂C=FeF₂ detected for the interaction Fe + CH₂F₂ and allows theoretically assigning as quintuplet the complex HFC=FeF₂ observed for the reaction Fe + CHF₃.     

Interfaces analysis of the HfO2/SiO2/Si structure

The physical and chemical properties of the HfO₂/SiO₂/Si stack have been analyzed using cross-section HR TEM, XPS, IR-spectroscopy and ellipsometry. HfO₂ films were deposited by the MO CVD method using as precursors the tetrakis 2,2,6,6 tetramethyl-3,5 heptanedionate hafnium—Hf(dpm)₄ and dicyclopentadienil-hafnium-bis-diethylamide—Сp₂Hf(N(C₂H₅)₂)₂.The amorphous interface layer (IL) between HfO₂ and silicon native oxide has been observed by the HRTEM method. The interface layer comprises hafnium silicate with a smooth varying of chemical composition through the IL thickness. The interface layer formation occurs both during HfO₂ synthesis, and at the annealing of the HfO₂/SiO₂/Si stack. It was concluded from the XPS, and the IR-spectroscopy that the hafnium silicate formation occurs via a solid-state reaction at the HfO₂/SiO₂ interface, and its chemical structure depends on the thickness of the SiO₂ underlayer.     

F2 laser induced oxidation of inorganic material

Transparent SiO₂ thin films were selectively fabricated on Si wafer by 157 nm F₂ laser in N₂/O₂ gas atmosphere. The F₂ laser photochemically produced active O(¹D) atoms from O₂ molecules in the gas atmosphere; strong oxidation reaction could be induced to fabricate SiO₂ thin films only on the irradiated areas of Si wafer. The oxidation reaction was sensitive to the single pulse fluence of F₂ laser. The irradiated areas were swelled and the height was approximately 500-1000 nm at the 205-mJ/cm² single pulse fluence for 60 min laser irradiation. The fabricated thin films were analytically identified to be SiO₂ by the Fourier-transform IR spectroscopy. The SiO₂ thin films could be also removed by subsequent chemical etching to fabricate micro-holes 50 nm in depth on Si wafer for microfabrication.     

The effects of surface terminal bonds and microstructure of SiO2 aerogel films on dry etching

The effects of microstructure and surface terminal bonds of SiO₂ aerogel films on dry etching were investigated using Ar, SF₆, and C₂F₆ plasma gases. With Ar plasma etching, physical effect of ion bombardment on porous film was found. In residue-free SF₆ plasma etching, reactive etchant transport and high-mass ion bombardment were observed. With C₂F₆ plasma etching, fluorocarbon residue layer was revealed to maintain surface morphology as acting a barrier to radical transport and ion bombardment. An etching of 450°C-annealed SiO₂ aerogel showed that a dense surface induced the decrease in reaction area, inhibition of etchant transport, and then uniform etching.