Synthesis and properties of two novel silicon‐containing cycloaliphatic epoxy resins for electronic packaging application

In this paper, two silicon‐containing cycloaliphatic olefins were synthesized through the nucleophilic substitution reactions of cyclohex‐3‐enyl‐1‐methanol with di‐ or tri‐chlorosilane compounds. Then, after epoxidation, two new cycloaliphatic epoxy resins with different epoxy groups were successfully prepared. Their chemical structures were confirmed by ²⁹Si NMR, ¹H NMR, and Fourier‐transform infrared spectra (FTIR). The properties of cured products, including viscoelasticity, glass transition temperature (T_g), coefficient of thermal expansion, thermal stability and water absorption, were investigated. Compared to the difunctional epoxy resin, the trifunctional one exhibited a remarkably increased cross‐linking density from 0.82 to 4.08 × 10^?3 mol/cm³ and T_g from 157 to 228°C. More importantly, prior to curing, they had viscosities of only 240–290 mPa sec at 25°C, which were much lower than that of ERL‐4221 (409 mPa sec), providing the possibility of easy processing. The high glass transition temperatures, good thermal stabilities, and mechanical properties as well as excellent flowability endow the silicon‐containing epoxy resins with promising potential in microelectronic packaging application. Copyright © 2011 John Wiley & Sons, Ltd.     

Preparation and properties of modified bismaleimide resins by novel bismaleimide containing 1,3,4‐oxadiazole

Bismaleimide (BMI) resin is a high‐performance thermosetting polymer, but its inherent brittleness hinder a broader range of application. Therefore, it has aroused wide concern to improve the toughness of BMI resins without scarification of their thermal stability. This paper reported some studies on modified BMI resins based on diallyl bisphenol A, novel BMI monomers, e.g. 2‐[3‐(4‐maleimidophenoxy)phenyl]‐5‐(4‐maleimidophenyl)‐1,3,4‐oxadiazole (m‐Mioxd) or 2‐[4‐(4‐maleimidophenoxy)phenyl]‐5‐(4‐maleimidophenyl)‐1,3,4‐ oxadiazole (p‐Mioxd) in different proportions (0.87:1, 1:1, 1.2:1; mol/mol). The curing mechanism and kinetics of the copolymerized systems were investigated by differential scanning calorimetry and Fourier transform infrared spectroscopy. Thermogravimetric analysis was applied to study the thermal properties of the cured resins, and the results indicated that the modified resins had excellent thermal stability with high residual weight percentage at 700°C (>50%), temperatures for 5% weight loss around 400°C. Besides, N,N′‐4,4′‐bismaleimidodiphenylmethylene and O,O′‐diallyl bisphenol A resin blends were modified by m‐Mioxd and p‐Mioxd, respectively. We investigated the effects of mole concentration of m‐Mioxd or p‐Mioxd on the curing process, mechanical properties, fracture toughness, and heat resistance of the modified resins. The results revealed that the introduction of m‐Mioxd and p‐Mioxd could improve the impact property of the modified BMI resins. When their proportion was 0.07, the impact strength increased 123.8% and 108.3%, respectively. The novel chain‐extended BMIs could reduce the crosslink density of cured resins and improve the brittleness effectively. Copyright © 2015 John Wiley & Sons, Ltd.     

Miscibility of poly(styrene‐co‐butyl acrylate) with poly(ethyl methacrylate): Existence of both UCST and LCST

A miscible homopolymer–copolymer pair viz., poly(ethyl methacrylate) (PEMA)–poly(styrene‐co‐butyl acrylate) (SBA) is reported. The miscibility has been studied using differential scanning calorimetry. While 1 : 1 (w/w) blends with SBA containing 23 and 34 wt % styrene (ST) become miscible only above 225 and 185 °C respectively indicating existence of UCST, those with SBA containing 63 wt % ST is miscible at the lowest mixing temperature (i.e., T_g's) but become immiscible when heated at ca 250 °C indicating the existence of LCST. Miscibility for blends with SBA of still higher ST content could not be determined by this method because of the closeness of the T_g's of the components. The miscibility window at 230 °C refers to the two copolymer compositions of which one with the lower ST content is near the UCST, while the other with the higher ST content is near the LCST. Using these compositions and the mean field theory binary interaction parameters between the monomer residues have been calculated. The values are χ_ST‐BA = 0.087 and χ_EMA‐BA = 0.013 at 230 °C. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 369–375, 2000     

Structure and property relationships in model diglycidyl ether of bisphenol‐a and diglycidyl ether of tetramethyl bisphenol‐a epoxy systems. I. Mechanical property characterizations

Model epoxy networks, with variations in crosslink density and in epoxy monomer rigidity, were prepared to study how the network structure affects modulus, T_g, and toughness/toughenability of epoxy resins. Diglycidyl ether of bisphenol‐A and diglycidyl ether of tetramethyl‐bisphenol‐A, along with the corresponding chain extenders, were chosen to study how monomer backbone rigidity and crosslink density affect physical and mechanical properties of epoxies. The present study indicates that, as expected, the backbone rigidity of the epoxy network, not the crosslink density alone, will strongly influence modulus and T_g of epoxy resins. Upon rubber toughening, it is found that the rigidity of the epoxy backbone and/or the nature of the crosslinking agent utilized are most critical to the toughenability of the epoxy. That is, the well‐known correlation between toughenability and the average molecular weight between crosslinks (M_c) does not necessarily hold true when the nature of epoxy backbone molecular mobility is altered. The potential significance of the present findings for a better design of toughened thermosets for structural applications is discussed. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 2137–2149, 1999     

Flame‐retardant epoxy resins with high glass‐transition temperatures. II. Using a novel hexafunctional curing agent: 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane

We synthesized a novel phosphorus‐containing triamine [9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane (dopo‐ta)] from the nucleophilic addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and pararosaniline chloride, using triethylamine as an acid receiver. We confirmed the structure of dopo‐ta by IR, mass, and NMR spectra and elemental analysis. dopo‐ta served as a curing agent for diglycidyl ether of bisphenol A (DGEBA) and dicyclopentadiene epoxy (hp7200). Properties such as the glass‐transition temperature (T_g), thermal decomposition temperature, flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The T_g's of cured DGEBA/dopo‐ta and hp7200/dopo‐ta were 171 and 190 °C, respectively. This high T_g phenomenon is rarely seen in the literature after the introduction of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.80 wt % for DGEBA/dopo‐ta/diamino diphenylmethane (DDM) systems and 1.46 wt % for hp7200/dopo‐ta/DDM systems. The dielectric constants for DGEBA/dopo‐ta and hp7200/dopo‐ta were 2.91 and 2.82, respectively, implying that the dopo‐ta curing systems exhibited low dielectric properties. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5971–5986, 2005     

POLYESTERIMIDE-MODIFIED BISMALEIMIDE RESINS. I. EFFECT OF POLYESTERIMI DE CONTENT

ABSTRACT

A novel polyesterimide (PEsI-M) was used to improve toughness of bismaleimide (BMI) resin composed of bis(4-maleimidediphenyl) methane (BDM) and O,O′-diallyl bisphenol A (DBA). Morphologies of modified resins changed from spherical particles to inverted phase structures, depending on PEsI-M's content based on the observation of scanning electronic microscopy (SEM). PEsI-M was an effective morphology modifier so that loading of 12 pbw resulted in a diverted phase structure. Dynamic mechanical analysis (DMA), rheometrics mechanical spectroscopy (RMS) and differential scanning calorimetry (DSC) were respectively used to investigate the dynamic mechanical behavior, and the gelation time and the curing extent of unmodified and modified BMI resins. The fairly uniform morphology in 15 pbw PEsI-M modified system cured at 180°C suggests that the phase separation might take place via a spinodal decomposition mechanism. The fracture energy (G _IC ) increased with the increase of PEsI-M content in the modified system. G _IC of 15 pbw PEsI-M modified system was 0.63 times larger than that of the unmodified BMI resin.     

Thermal properties and toughness performance of hyperbranched‐polyimide‐modified epoxy resins

An amine‐terminated hyperbranched polyimide (HBPI) was prepared by the condensation polymerization of a commercially available triamine monomer with a dianhydride monomer. The effects of the HBPI content on the thermal and mechanical interfacial properties of diglycidyl ether of bisphenol A (DGEBA) epoxy resins were investigated with several techniques. The thermogravimetric analysis results showed that the thermal stability of the DGEBA/HBPI blends did not obviously change as the HBPI content increased. The glass‐transition temperature (T_g) of the DGEBA/HBPI blends increased with the addition of HBPI. Improvements in the critical stress intensity factor (K_IC) and impact strength of the blends were observed with the addition of HBPI. The K_IC value and impact strength were 2.5 and 2 times the values of the neat epoxy resins with only 4 wt % HBPI. The fractured surfaces were studied with scanning electron microscopy to investigate the morphology of the blends, and they showed that shear deformation occurred to prevent the propagation of cracks in the DGEBA/HBPI blends. These results indicated that a toughness improvement was achieved without a decrease in the thermal stability or T_g. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 3348–3356, 2006     

Synergism and multiple mechanical relaxations observed in ternary systems based on benzoxazine,epoxy, and phenolic resins

The synergism in the glass‐transition temperature (T_g) of ternary systems based on benzoxazine (B), epoxy (E), and phenolic (P) resins is reported. The systems show the maximum T_g up to about 180 °C in BEP541 (B/E/P = 5/4/1). Adding a small fraction of phenolic resin enhances the crosslink density and, therefore, the T_g in the copolymers of benzoxazine and epoxy resins. To obtain the ultimate T_g in the ternary systems, 6–10 wt % phenolic resin is needed. The molecular rigidity from benzoxazine and the improved crosslink density from epoxy contribute to the synergistic behavior. The mechanical relaxation spectra of the fully cured ternary systems in a temperature range of −140 to 350 °C show four types of relaxation transitions: γ transition at −80 to −60 °C, β transition at 60–80 °C, α₁ transition at 135–190 °C, and α₂ transition at 290–300 °C. The partially cured specimens show an additional loss peak that is frequency‐independent as a result of the further curing process of the materials. The ternary systems have a potential use as electronic packaging molding compounds as well as other highly filled systems. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 1687–1698, 2000     

Fracture toughness and fracture mechanism of liquid‐crystalline epoxy resins with different polydomain structures

Liquid‐crystalline (LC) epoxy resins were cured at different temperatures to obtain polydomain LC phase–cured resins. The cured resins had polydomain structures with a nematic LC phase and their domain diameters differed depending on the curing temperatures. The relationship between the domain diameter and fracture toughness of the diglycidyl ether of terephthalylidene‐bis‐(4‐amino‐3‐methylphenol) (DGETAM)/m‐phenylenediamine (m‐PDA) systems with the nematic phase and the previously reported smectic LC phase structures was investigated. It was clarified that the highly ordered LC structure (smectic phase) in each domain could improve the fracture toughness. In addition, the changes in the network orientation of the DGETAM/m‐PDA systems were evaluated by a mapping of the microscopic infrared dichroism in the fracture process and their toughening mechanism was suggested. © 2010 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2010     

Pd(OAc)2@SBA‐15/PrEn nanoreactor: a highly active,reusable and selective phosphine‐free catalyst for Suzuki–Miyaura cross‐coupling reaction in aqueous media

A series of ordered mesoporous organic–inorganic hybrid material was designed by using the amine‐functionalized SBA‐15 (PdX₂@SBA‐15/N_Y, Y = 1, 2) as solid support for palladium complexes. Among them, the Pd(OAc)₂/ethylenediamine complex encapsulated into SBA‐15 (Pd(OAc)₂@SBA‐15/PrEn or Pd(OAc)₂@SBA‐15/PrNHEtNH₂) exhibits higher activity and selectivity toward Suzuki cross‐coupling reaction under aerobic conditions and water solvent mixture. The SBA‐15/PrEn supported palladium pre‐catalyst could be separated easily from reaction products and used repetitively several times, showing its superiority over homogeneous catalysts for industrial and chemical applications. Copyright © 2013 John Wiley & Sons, Ltd.     

利用多酸在SBA-15孔道中制备组分可调的氧化钼-五氧化二钒纳米线

A new approach was developed to fabricate nanowires of mixed oxides MoO3-V2O5 inside the channels of mesoporous silica SBA-15. The method involves functionalization of the channel surface of SBA-15 with aminosilane groups, immobilization of Keggin-type molybdovanadophosphoric acids through an acid-base interaction, and heat treatment. The immobilization of the heteropolyacid containing mixed addenda makes the molar ratio of the loaded components controllable. The formation of the MoO3-V2O5 nanowires inside the channels was monitored by variable temperature in situ XRD. The materials obtained by heat treatment at 400℃ for 5 h were characterized by TEM, N2-sorption measurements, laser Raman spectra and UV-Vis diffuse reflectance spectra. Further heat treatment of the MoO3-V2O5 nanowires inside the SBA-15 channels at higher temperature (700℃) destroys the framework integrity of SBA-15 by complete sublimation of MoO3 through the SBA-15 channel walls.     

Synthesis of hydroxyl‐terminated poly(ether ether ketone) with pendent tert‐butyl groups and its use as a toughener for epoxy resins

Hydroxyl‐terminated poly(ether ether ketone) with pendent tert‐butyl groups (PEEKTOH) was synthesized by the nucleophilic substitution reaction of 4,4′‐difluorobenzophenone with tert‐butyl hydroquinone with potassium carbonate as a catalyst and N‐methyl‐2‐pyrrolidone as a solvent. Diglycidyl ether of bisphenol A epoxy resin was toughened with PEEKTOHs having different molecular weights. The melt‐mixed binary blends were homogeneous and showed a single composition‐dependent glass‐transition temperature (T_g). Kelley–Bueche and Gordon–Taylor equations gave good correlation with the experimental T_g. Scanning electron microscopy studies of the cured blends revealed a two‐phase morphology. A sea‐island morphology in which the thermoplastic was dispersed in a continuous matrix of epoxy resin was observed. Phase separation occurred by a nucleation and growth mechanism. The dynamic mechanical spectrum of the blends gave two peaks corresponding to epoxy‐rich and thermoplastic‐rich phases. The T_g of the epoxy‐rich phase was lower than that of the unmodified epoxy resin, indicating the presence of dissolved PEEKTOH in the epoxy matrix. There was an increase in the tensile strength with the addition of PEEKTOH. The fracture toughness increased by 135% with the addition of high‐molecular‐weight PEEKTOH. The improvement in the fracture toughness was dependent on the molecular weight and concentration of the oligomers present in the blend. Fracture mechanisms such as crack path deflection, ductile tearing of the thermoplastic, and local plastic deformation of the matrix occurred in the blends. The thermal stability of the blends was not affected by blending with PEEKTOH. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 541–556, 2006     

Bio‐based high‐performance waterborne hyperbranched polyurethane thermoset

Tannic‐acid‐based low volatile organic compound‐containing waterborne hyperbranched polyurethane was prepared. In order to improve the performance, it was modified in an aqueous medium using a glycerol‐based hyperbranched epoxy and vegetable‐oil‐based poly(amido amine) at different wt%. The combined system was cross‐linked by heating at 100°C for 45 min. Fourier transform infrared spectroscopy and swelling study were used to confirm the curing. A dose‐dependent improvement of properties was witnessed for the thermoset. Thermoset with 30 wt% epoxy showed excellent improvements in mechanical properties like tensile strength (~3.4 fold), scratch hardness (~2 fold), impact resistance (~1.3 fold), and toughness (~1.7 fold). Thermogravimetric analysis revealed enhancement of thermal properties (maximum 70°C increment of degradation temperature and 8°C increment of T_g). The modified system showed better chemical and water resistance compared with the neat polyurethane. Biodegradation study was carried out by broth culture method using Pseudomonas aeruginosa as the test organism. An adequate biodegradation was witnessed, as evidenced by weight loss profile, bacterial growth curve, and scanning electron microscope images. The work showed the way to develop environmentally benign waterborne polyurethane as a high‐performance material by incorporating a reactive modifier into the polymer network. Use of benign solvent and bio‐based materials as well as profound biodegradability justified eco‐friendliness and sustainability of the modified system. Copyright © 2015 John Wiley & Sons, Ltd.     

Approach to improving the toughness of TGMDA/DDS epoxy resin by blending with thermoplastic polymer powders

A series of hot-melt processable thermosetting compositions was prepared by blending N,N,N′,N′-tetraglycidyl-4,4′ -diaminodiphenyl-methane/4,4′-diaminodiphenylsulfone (TGMDA/DDS) epoxy resin and thermoplastic polymer powders with average particle size below 30 μm. The basic thermoplastic polymers were either a high T_g amorphous cardo polyimide (T_g=350°C) or commercial semicrystalline PA6 and PA12 polyamides. The resulting heterogeneous mixtures showed viscosity values below 5000 cps suitable for prepregging process. After cure, phase-separated morphologies were maintained with a rather limited interphase miscibility as demonstrated by thermomechanical analysis. Scanning electron microscope examination of fracture surfaces pointed out a strong adhesion between the powder particles and the surrounding polyepoxy network, particularly for the potentially reactive polyamide structures. Moreover, as shown by differential scanning calorimeter analysis, the crystallinity ratio of the PA6 and PA12 powders was lowered due to melting during thermal polymerization. The fracture toughness properties of the powder-containing materials were compared with those of a fully miscible cardo polyimide–TGMDA/DDS blend coming from an homogeneous resin composition. The best improvement in fracture energy was obtained for the powder-modified resins. The most effective composition filled with 16 wt% of powdered polyimide exhibited a fourfold increase in G_IC (388 J/m² versus 100 J/m²) without compromising the epoxy thermomechanical stability (T_g=227°C versus 223°C).     

Dehydrogenation of Isobutane to Isobutene with Carbon Dioxide over SBA‐15‐Supported Chromia‐Ceria Catalysts

A series of SBA‐15‐supported chromia‐ceria catalysts with 3% Cr and 1%–5% Ce (3Cr‐Ce/SBA) were prepared using an incipient wetness impregnation method. The catalysts were characterized by XRD, N₂ adsorption, SEM, TEM‐EDX, Raman spectroscopy, UV–vis spectroscopy, XPS and H₂‐TPR, and their catalytic performance for isobutane dehydrogenation with CO₂ was tested. The addition of ceria to SBA‐15‐supported chromia improves the dispersion of chromium species. 3Cr‐Ce/SBA catalysts are more active than SBA‐15‐supported chromia (3Cr/SBA), which is due to a higher concentration of Cr⁶⁺ species present on the former catalysts. The 3Cr‐3Ce/SBA catalyst shows the highest activity, which gives 35.4% isobutane conversion and 89.6% isobutene selectivity at 570 °C after 10 min of the reaction.     

High resolution solid‐state 13C‐NMR study of as‐cured and irradiated epoxy resins

This article presents the effects of strong ionizing radiations on the physico‐chemical modifications of aliphatic or aromatic amine‐cured epoxy resins based on diglycidyl ether of bisphenol A (DGEBA). Such epoxy resins have a considerable number of applications in the nuclear industrial field and are known to be very stable under moderate irradiation conditions. Using extensively high resolution solid‐state ¹³C‐NMR spectroscopy we show that the aliphatic amine‐cured resin (DGEBA‐TETA) appears much more sensitive to gamma rays than the aromatic amine‐cured one (DGEBA‐DDM). On the one hand, qualitative analyses of the high resolution solid‐state ¹³C‐NMR spectra of both epoxy resins, irradiated under similar conditions (8.5 MGy), reveal almost no change in the aromatic amine‐cured resin whereas new resonances are observed for the aliphatic amine‐cured resin. These new peaks were interpreted as the formation of new functional groups such as amides, acids and/or esters and to alkene groups probably formed in the aliphatic amine skeleton. On the other hand, molecular dynamics of these polymers are investigated by measuring the relaxation times, T_CH, T_1ρH and T_1C , before and after irradiation. The study of relaxation data shows the formation, under irradiation, of a more rigid network, especially for the aliphatic amine‐cured system and confirms that aromatic amine‐cured resin [DGEBA‐4,4′‐diaminodiphenylmethane(DDM)] is much less affected by ionizing radiations than the aliphatic amine‐cured resin [DGEBA‐triethylenetetramine(TETA)]. Moreover, it has been shown that the molecular modifications generated by irradiation on the powder of the aliphatic‐amine‐cured resin appear to be homogeneously distributed inside the polymers as no phase separations can be deduced from the above analyses. Copyright © 2001 John Wiley & Sons, Ltd.     

Thermal cured epoxy resins using certain calixarenes and their esterified derivatives as curing agents

The acetyl esterified calixarene (CA) derivatives were prepared from calix[4]resorcinarene (CRA), and p‐tert‐butylcalixarene (BCA[n], n = 4, 6, 8), respectively. Using these CA derivatives as curing agents, the thermal curing reactions of two multifunctional epoxy resins (jER 828, 186 g/equiv., and ESCN, 193.7 g/equiv.) were investigated. The temperatures of glass transition (T_g) and decomposition (T) were measured by DSC and TGA, respectively. Based on the yields, T_gs, and T_ds of the thermal cured jER 828 epoxy resin with CRA‐E100, the curing conditions were optimized to be tetrabutylphosphonium bromide (TBPB) as catalyst in NMP at 160 °C for 15 h. Under this curing condition, the cured materials of jER 828 or ESCN using various CA derivatives as curing agents were prepared. Except for BCA4 derivatives, the yields of thermal curing reaction were higher than 90%. T_gs and Ts of the resultant cured materials were in the range of 113–248 °C and 363–404 °C, respectively. These results mean that the cured epoxy resins with excellent T_gs were successfully formed by using CA derivatives as curing agents. It was also found that the T_gs of cured epoxy resins were strongly affected by the degree of esterification of CA derivatives. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 1931–1942, 2010     

Influence of carboxyl‐terminated (butadiene‐co‐acrylonitrile) loading on the mechanical and thermal properties of cured epoxy blends

A mixture of epoxy with liquid nitrile rubber, carboxyl‐terminated (butadiene‐co‐acrylonitrile) (CTBN) was cured under various temperatures. The cured resin was a two‐phase system, where spherical rubber domains were dispersed in the matrix of epoxy. The morphology development during cure was investigated by scanning electron microscope (SEM). There was slight reduction in the glass transition temperature of the epoxy matrix (T_g) on the addition of CTBN. It was observed that, for a particular CTBN content, T_g was found to be unaffected by the cure temperature. Bimodal distribution of particles was noted by SEM analysis. The increase in the size of rubber domains with CTBN content is due probably to the coalescence of the rubber particles. The mechanical properties of the cured resin were thoroughly investigated. Although there was a slight reduction in tensile strength and young's modulus, appreciable improvements in impact strength, fracture energy, and fracture toughness were observed. Addition of nitrile rubber above 20 parts per hundred parts of resin (phr) made the epoxy network more flexible. The volume fraction of dispersed rubbery phase and interfacial area were increased with the addition of more CTBN. A two‐phase morphology was further established by dynamic mechanical analysis (DMA). © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 2531–2544, 2004     

Enhancing the glass‐transition temperature of polyimide copolymers containing 2,2′‐bipyridine units by the coordination of nickel malenonitriledithiolate

Polyimide copolymers containing 2,2′‐bipyridine were synthesized and characterized. The glass‐transition temperatures (T_g's) of the polymers ranged from 260 to 300 °C. In contrast to most known organic chromophore‐containing polyimides, the polyimide copolymers in this study showed elevated T_g's (270–320 °C) after coordination with nickel malenonitriledithiolate inorganic chromophores. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 498–503, 2000     

The effects of monoepoxide chain termination and their derived soluble fractions on the structure‐property relationships of controlled epoxy networks

A new series of monoepoxide terminated controlled epoxy networks (CENs) and a corresponding soluble fraction polymer (SFP) were prepared to further investigate the effects of chain termination on epoxy thermoset structure‐property relationships. CENs having an initial molecular weight between crosslinks (M_c,i) of ～3000 g/mol using phenylglycidyl ether (PGE) as the chain terminator have thermal and mechanical properties consistent with previously studied monophenol terminated CENs. Glass transition temperature (T_g) decreases monotonically with PGE concentration (ε), whereas fracture toughness decreases sharply at a critical PGE concentration (ε_c). A PGE terminated SFP was prepared corresponding to the soluble fraction expected for the CEN composition at ε_c. The SFP behaves as a weak antiplasticizer in these epoxy thermosets; T_g is reduced and follows the inverse rule of mixtures, and fracture toughness is slightly reduced. By difference it is inferred that most of the deterioration of epoxy thermoset properties resulting from incorporation of chain terminators above ε_c is a result of the presence of nonelastically active pendant chains and by the increase in M_c. © 2008 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 47: 72–79, 2009