3D dynamic stress intensity factors around two parallel square cracks in an infinite elastic medium under impact load

Summary  Transient stresses around two parallel cracks in an infinite elastic medium are investigated in the present paper. The shape of the cracks is assumed to be square. Incoming shock stress waves impinge upon the two cracks normal to tzheir surfaces. The mixed boundary value equations with respect to stresses and displacements are reduced to two sets of dual integral equations in the Laplace transform domain using the Fourier transform technique. These equations are solved by expanding the differences in the crack surface displacements in a double series of a function that is equal to zero outside the cracks. Unknown coefficients in the series are calculated using the Schmidt method. Stress intensity factors defined in the Laplace transform domain are inverted numerically to the physical space. Numerical calculations are carried out for transient dynamic stress intensity factors under the assumption that the shape of the upper crack is identical to that of the lower crack. Received 2 February 2000; accepted for publication 10 May 2000     

DYNAMIC STRESS INTENSITY FACTORS AROUND TWO CRACKS NEAR AN INTERFACE OF TWO DISSIMILAR ELASTIC HALF－PLANES UNDER IN－PLANE SHEAR IMPACT LOAD

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The stress intensity factors near the tips of two collinear cracks in composite under in-plane shear

In this paper, the stress-intensity factors for two collinear cracks in a composite bonded by an isotropic and an anisotropic half-plane were calculated. The cracks are paralell to the interface, and the crack surfaces are loaded by uniform shear stresses. By using Fourier transform, the mixed boundary value problem is reduced to a set of singular integral equations. For solving the integral equations, the crack surface displacements are expanded in triangular series and the unknown coefficients in the series are determined by the Schmidt method. The stress intensity factors for the cracks in the boron-fibre plastics and aluminium joined composite and in carbon-fibre reinforced plastics were calculated numerically.     

复合材料承受剪切时双裂纹周围的应力强度因子

本文研究了由各向同性和各向异性半无限接合而成的复合材料中的应力强度因子问题，在复合材料的接合面附近处具有与接合面平行且共线的两个Ｇｒｉｆｆｉｔｈ裂纹，裂纹面上作用有剪应力，本文利用付利叶变换将混合边值问题归毕为求解奇异积分方程问题，为求解这些方程，将裂纹面上，下的位移差展成级数，并满足理解纹面外侧边界条件，级数中的待定系数利用裂纹面内的边界条件和施密特方法求得，本文对硼纤维塑料和铝板接合的复合材料     

Thermal stresses around a crack in the nonhomogeneous interfacial layer between two dissimilar elastic half-planes

Thermal stresses around a crack in the interfacial layer between two dissimilar elastic half-planes are solved. The surfaces of the crack are assumed to be insulated. The material constants of the interfacial layer are assumed to vary continuously from those of the upper half-plane to those of the lower half-plane. Uniform heat flows perpendicular the crack. Stress intensity factors are calculated numerically for several thicknesses of the interfacial layer.     

Dynamic stress intensity factors of two collinear mode-III cracks perpendicular to and on the two sides of a bi-FGM weak-discontinuous interface

The mechanical model was established for the anti-plane dynamic fracture problem for two collinear cracks on the two sides of and perpendicular to a weak-discontinuous interface between two materials with smoothly graded elastic properties, as opposed to a sharp interface with discontinuously changing elastic properties. The problem was reduced as a system of Cauchy singular integral equations of the first kind by Laplace and Fourier integral transforms. The integral equations were solved by Erdogan's collocation method and the dynamic stress intensity factors in the time domain were obtained through Laplace numerical inversion proposed by Miller and Guy. The influences of geometrical and physical parameters on the dynamic stress intensity factors were illustrated and discussed, based on which some conclusions were drawn: (a) to increase the thickness of the FGM strip on either side of the interface will be beneficial to reducing the DSIF of a crack perpendicular to a bi-FGM interface and embedded at the center of one of the FGM strips; (b) To increase the rigidity of the FGM strip where the crack is located will increase the DSIF. However, when the material in one side of the interface is more rigid, the DSIF of the interface-perpendicular embedded crack in the other side will be reduced; (c) To decrease the weak-discontinuity of a bi-FGM interface will not necessarily reduce the stress intensity factor of a crack perpendicular to it, which is different from the case of interfacial crack; (d) For two collinear cracks with equal half-length, when the distance between the two inner tips is less than about three times of the half-length, the interaction of them is intensified, however, when the distance is greater than this the interaction becomes weak.     

动态载荷下功能梯度复合材料的圆币形裂纹问题

研究了动态载荷下功能梯度材料中的圆币形裂纹问题．假设材料为横观各向同性,并且含有多个垂直于厚度方向的裂纹,材料参数沿轴向（与裂纹面垂直的方向）为变化的,沿该方向将材料划分为许多单层,各单层材料参数为常数,利用Hankel变换祛,在Laplace域内推导出了控制问题的对偶积分方程组．利用Laplace数值反演,得出了裂纹尖端的动态应力强度因子和能量释放率．研究了含两个裂纹的功能梯度接头结构,分析了材料非均匀性参数对应力强度因子和能量释放率的影响．     

Thermal stresses around two parallel cracks in two bonded dissimilar elastic half-planes

Summary Thermal stresses around two parallel cracks in two bonded dissimilar elastic half-planes are determined. One of the cracks lies in the upper half-plane, while the other is in the lower half-plane. Uniform heat flow is assumed to be at right angles to the interface. Application of the Fourier transform technique reduces the problem to that of solving dual integral equations. To solve the equations, the difference of the crack surface temperature and those of the crack surface displacements are expanded in a series of functions which are automatically zero outside the cracks. The unknown coefficients in the series are solved by the Schmidt method. The stress intensity factors are calculated numerially for composite materials featuring a ceramic upper half-plane and a steel lower half-plane.

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Wärmespannungen um zwei parallele Risse in zwei verbundenen, verschiedenen, elastischen Halbunendlichplatten

Übersicht Es werden die Wärmespannungen um zwei parallele Risse in zwei verbundenen, verschiedenen, elastischen Halbunendlichplatten bestimmt. Einer der beiden Risse liegt in der oberen Halbunendlichplatte, der andere in der unteren. Es wird angenommen, daß ein gleichmäßiger Wärmefluß senkrecht zur Grenzfläche erfolgt. Die Anwendung der Fourier-Transformation reduziert das Problem auf die Lösung dualer Integralgleichungen. Zur Lösung der Gleichungen werden die Temperatur-sowie die Verschiebungsdifferenzen an der Rißoberfläche in eine Reihe von Funktionen entwickelt, die außerhalb der Risse automatisch zu Null werden. Die unbekannten Koeffizienten dieser Reihe werden dann über das Schmidt-Verfahren bestimmt. Anschließend werden für Verbundmaterialien, bei denen die obere Halbunendlichplatte aus Keramik und die untere aus Stahl besteht, die Spannungsintensitätsfaktoren numerisch berechnet.

     

The mixed mode crack problem in an FGM layer bonded to a homogeneous half-plane

In this paper, the plane elasticity problem of an arbitrarily oriented crack in a FGM layer bonded to a homogeneous half-plane is considered. The problem is modeled by assuming that the elastic properties of the FGM layer are exponential functions of the thickness coordinate and are continuous at the interface of the FGM layer and the half-plane.The Fourier transform technique is used to reduce the problem to the solution of a system of Cauchy-type singular integral equations, which are solved numerically. The stress intensity factors are computed for various crack orientations, crack locations and material parameters. The results show that crack length, crack orientation and the non-homogeneity parameter of the strip material have significant effect on the fracture of the FGM layer.     

Dynamic response for functionally graded materials with penny-shaped cracks

This paper provides a method for studying the penny-shaped cracks configuration in functionally graded material(FGM) structures subjected to dynamic or steady loading. It is assumed that the FGMs are transversely isotropic and all the material properties only depend on the axial coordinatez. In the analysis, the elastic region is treated as a number of layers. The material properties are taken to be constants for each layer. By utilizing the Laplace transform and Hankel transform technique, the general solutions for the layers are derived. The dual integral equations are then obtained by introducing the mechanical boundary and layer interface conditions via the flexibility/stiffness matrix approach. The stress intensity factors are computed by solving dual integral equations numerically in Laplace transform domain. The solution in time domain is obtained by utilizing numerical Laplace inverse. The main advantage of the present model is its ability for treating multiple crack configurations in FGMs with arbitrarily distributed and continuously varied material properties by dividing the FGMs into a number of layers with the properties of each layer slightly different from one another. This work was supported by Failure Mechanics Laboratory of State Education Commission and the Post-doctor Research Fund of China.     

Dynamic stress intensity factors of multiple cracks in a functionally graded orthotropic half-plane

In the present paper dynamic stress intensity factor and strain energy density factor of multiple cracks in the functionally graded orthotropic half-plane under time-harmonic loading are investigated. By utilizing the Fourier transformation technique the stress fields are obtained for a functionally graded orthotropic half-plane containing a Volterra screw dislocation. The variations of the material properties are assumed to be exponential forms which the equilibrium has an analytical solution. The dislocation solution is utilized to formulate integral equation for the half-plane weakened by multiple smooth cracks under anti-plane deformation. The integral equations are of Cauchy singular type at the location of dislocation which are solved numerically to obtain the dislocation density on the faces of the cracks. The dislocation densities are employed to determined stress intensity factor and strain energy density factors (SEDFs) for multiple smooth cracks under anti-plane deformation. Numerical examples are provided to show the effects of material properties and the crack configuration on the dynamic stress intensity factors and SEDFs of the functionally graded orthotropic half-plane with multiple curved cracks.     

Dynamic stress intensity factors around a cylindrical crack in an infinite elastic medium subject to impact load

This paper investigates transient stresses around a cylindrical crack in an infinite elastic medium subject to impact loads. Incoming stress waves resulting from the impact load impinge on the crack in a direction perpendicular to the crack axis. In the Laplace transform domain, by means of the Fourier transform technique, the mixed boundary value equations with respect to stresses and displacements were reduced to two sets of dual integral equations. To solve the equations, the differences in the crack surface displacements were expanded in a series of functions that are zero outside the crack. The boundary conditions for the crack were satisfied by means of the Schmidt method. Stress intensity factors were defined in the Laplace transform domain and were numerically inverted to physical space. Numerical calculations were carried out for the dynamic stress intensity factors corresponding to some typical shapes assumed for the cylindrical crack.     

Dynamic behavior of two unequal parallel permeable interface cracks in a piezoelectric layer bonded to two half piezoelectric materials planes

IntroductionDuetotheintrinsicelectro_mechanicalcouplingbehavior,piezoelectricmaterialsareveryusefulinelectronicdevices.However,mostpiezoelectricmaterialsarebrittlesuchasceramicsandcrystals.Therefore ,piezoelectricmaterialshaveatendencytodevelopcriticalcracksduringthemanufacturingandthepolingprocesses.So ,itisimportanttostudytheelectro_elasticinteractionandfracturebehaviorsofpiezoelectricmaterials.Theincreasingattentiontothestudyofcrackproblemsinpiezoelectricmaterialshasledtoalotofsignificantw…     

Transient response of a magnetoelectroelastic solid with two collinear dielectric cracks under impacts

Dynamic analysis of two collinear electro-magnetically dielectric cracks in a piezoelectromagnetic material is made under in-plane magneto-electro-mechanical impacts. Generalized semi-permeable crack-face boundary conditions are proposed to simulate realistic opening cracks with dielectric. Ideal boundary conditions of a combination of electrically permeable or impermeable and magnetically permeable or impermeable assumptions are several limiting cases of the semi-permeable dielectric crack. Utilizing the Laplace and Fourier transforms, the mixed initial-boundary-value problem is reduced to solving singular integral equations with Cauchy kernel. Dynamic intensity factors of stress, electric displacement, magnetic induction and crack opening displacement (COD) near the inner and outer crack tips are determined in the Laplace transform domain. Numerical results for a special magnetoelectroelastic solid are calculated to show the influences of the dielectric permittivity and magnetic permeability inside the cracks on the crack-face electric displacement and magnetic induction. By means of a numerical inversion of the Laplace transform, the variations of the normalized intensity factors of stress and COD are discussed against applied magnetoelectric impact loadings and the geometry of the cracks for fully impermeable, vacuum, fully permeable cracks and shown in graphics.     

Two mode III internal cracks located within two bonded functionally graded piezoelectric half planes respectively

This paper studies the mode III crack problem of two bonded functionally graded piezoelectric half planes which contain a crack respectively. These two cracks are located normal to the interface. All the material properties are assumed to vary along the direction of the crack line. A system of singular integral equations for electrically impermeable and permeable cracks is derived and solved numerically by using the Gauss–Chebyshev integration formula. The influence of the nonhomogeneous parameters and the dependence of the crack interactions on the stress and electric displacement intensity factors are investigated.     

Mode III fracture problem of two arbitrarily oriented cracks located within two bonded functionally graded material strips

This paper shows the anti-plane crack problem of two bonded functionally graded material (FGM) strips. Each strip contains an arbitrarily oriented crack. The material properties of the strips are assumed in exponential forms varied in the direction normal to the interface. After employing the Fourier transforms, the unknowns are solved from the interface conditions, boundary conditions and the condition on the crack surfaces. The problem can then be reduced to a system of singular integral equations, which are solved numerically by applying the Gauss-Chebyshev integration formula to obtain the stress intensity factors at the crack tips. In the discussions, several degenerated problems are considered to demonstrate the influence of the non-homogeneous parameters, crack orientations, edge effects and the crack interactions on the normalized intensity factors. In general, the factors are larger when crack tips are located in stronger material. Also, the factors increase as the crack is oriented in the direction normal to the interface. The conclusions made in this research can be used to evaluate the safety of two bonded strips once the cracks exist inside the structure.     

Dislocation technique to obtain the dynamic stress intensity factors for multiple cracks in a half-plane under impact load

In this study, the transient response of multiple cracks subjected to shear impact load in a half-plane is investigated. At first, exact analytical solution for the transient response of Volterra-type dislocation in a half-plane is obtained by using the Cagniard-de Hoop method of Laplace inversion and is expressed in explicit forms. The distributed dislocation technique is used to construct integral equations for a half-plane weakened by multiple arbitrary cracks. These equations are of Cauchy singular type at the location of dislocation solved numerically to obtain the dislocation density on the cracks faces. The dislocation densities are employed to determine dynamic stress intensity factors history for multiple smooth cracks. Finally, several examples are presented to demonstrate the applicability of the proposed solution.     

Transient response of a piezoelectric ceramic with two coplanar cracks under electromechanical impact

The transient response of two coplanar cracks in a piezoelectric ceramic under antiplane mechanical and inplane electric impacting loads is investigated in the present paper. Laplace and Fourier transforms are used to reduce the mixed boundary value problems to Cauchy-type singular integral equations in Laplace transform domain, which are solved numerically. The dynamic stress and electric displacement factors are obtained as the functions of time and geometry parameters. The present study shows that the presence of the dynamic electric field will impede or enhance the propagation of the crack in piezoelectric ceramics at different stages of the dynamic electromechanical load. Moreover, the electromechanical response is greatly affected by the ratio of the space of the cracks and the crack length.     

Antiplane mechanical and inplane electric time-dependent load applied to two coplanar cracks in piezoelectric ceramic material

This work is concerned with the dynamic response of two coplanar cracks in a piezoelectric ceramic under antiplane mechanical and inplane electric time-dependent load. The cracks are assumed to act either as an insulator or as a conductor. Laplace and Fourier transforms are used to reduce the mixed boundary value problems to Cauchy-type singular integral equations in Laplace transform domain. A numerical Laplace inversion algorithm is used to determine the dynamic stress and electric displacement factors that depend on time and geometry. A normalized equivalent parameter describing the ratio of the equivalent magnitude of electric load to that of mechanical load is introduced in the numerical computation of the dynamic stress intensity factor (DSIF) which has a similar trend as that for the pure elastic material. The results show that the dynamic electric field will impede or enhance crack propagation in a piezoelectric ceramic material at different stages of the dynamic electromechanical load. Moreover, the electromechanical response is greatly affected by the ratio of the crack length to the ligament between the cracks. The stress and electric displacement intensity factor can be combined by the energy density factor or function to address the fracture of piezoelectric materials under the combined influence of electromechanical loading.     

Dynamic stress intensity factors around two rectangular cracks in an infinite elastic plate under impact load

A dynamic problem for two equal rectangular cracks in an infinite elastic plate is considered. The two cracks are placed perpendicular to the plane surfaces of the plate. An incoming shock tensile stress is returned by the cracks. In the Laplace transform domain, the boundary conditions at the two sides of the plate are satisfied using the Fourier transform technique. The mixed boundary conditions are reduced to dual integral equations. Crack displacement is expanded in a series of functions which are zero outside of the cracks. The unknown coefficients in the series are determined by the Schmidt method. The stress intensity factors are defined in the Laplace transform domain and these are inverted using a numerical method.