Thermal stress intensity factors for a crack in an anisotropic half plane

On the basis of the two-dimensional theory of anisotropic thermoelasticity, a solution is given for the thermal stress intensity factors due to the obstruction of a uniform heat flux by an insulated line crack in a generally anisotropic half plane. The crack is replaced by continuous distributions of sources of temperature discontinuity and dislocations. First, the particular thermoelastic dislocation solutions for the half plane are obtained; then the corresponding isothermal solutions are superposed to satisfy the traction-free conditions on the crack surfaces. The dislocation solutions are applied to calculate the thermal stress intensity factors, which are validated by the exact solutions. The effects of the uniform heat flux, the ply angle and the crack length are investigated.     

Thermoelastic state of a half-space having a thermally active crack parallel to its boundary

Using the boundary integral equation method, the problem of stationary heat conduction and thermoelasticity for a semi-infinite body with a crack parallel to its boundary is solved. Temperature or heat flow on the crack is prescribed. The body boundary is heat-insulated or is at zero temperature. The dependence of the stress intensity factor on the depth of occurrence of a circular crack at a constant temperature or under a constant heat flow is studied. In contrast to mechanical loading, thermal loading shows less SIF values than in an infinite body __________ Translated from Prikladnaya Mekhanika, Vol. 43, No. 4, pp. 46–54, April 2007.     

Thermo-electro-structural coupled analyses of crack arrest by Joule heating

Using the finite element method, thermo-electro-structural coupled analyses of the cracked conducting plate under high electric current have been solved. The crack contact condition and temperature-dependent material properties are considered in this analysis. The crack tip temperature, electric current density factor, stress intensity factor and strain energy density factor are obtained for discussions. Due to high electric current density and Joule heating at the crack tip, a circular melting area may exist around the tip. After cooling, a circular void or hole may occur at the crack tip and the crack arrest is achieved. The crack tip temperature decreases when the crack contact area increases. The proper tensile load is necessary for making the crack open enough and causing high current density at the crack tip and associated crack arrest. On the other hand, the crack tip temperature increases with time by the increasing external current and Joule heating. The values of mode-I stress intensity factor and strain energy density factor decrease with time due to the thermal deformation around the crack tip. Because of the temperature-dependent resistivity, the variation of the electric current density factor is complicated. In addition, it is not easy to create a crack-arrest condition when the crack length relative to the plate width is too small.     

Axially symmetric thermal stress of an external circular crack under general thermal conditions

Summary The paper presents a solution for the linear thermoelastic problem of determining axisymmetric stress and displacement fields in an isotropic elastic solid of infinite extent weakened by an external circular crack under general mechanical loadings and general thermal conditions. The mechanical loadings and thermal conditions applied on the crack faces are axisymmetric, being non-symmetric about the crack plane. In similar lines of [7], equations of equilibrium of an elastic solid conducting heat have been solved using Hankel transforms and Abel operators of the first kind. Expressions for stress, displacement, temperature and heat flux functions are obtained in terms of Abel transforms of the first kind of the jumps of stress, displacement, temperature and heat flux at the crack plane. Two types of thermal conditions, that is, general surface temperatures and general heat flux on faces of the crack are considered. In both the cases, closed form solutions have been obtained for the unknown functions solving Abel type of integral equations. Explicit expressions for stresses, displacements, temperature fields, stress intensity factors have been obtained. Two special cases of thermal conditions in which: (i) crack faces are subjected to constant non-symmetric temperatures over a circular ring area, (ii) crack faces are subjected to constant non-symmetric heat flux over a circular ring area, have been considered. In some special cases, results have been compared with those from the literature.     

Thermostressed state of a piezoelectric bodywith a plane crack under symmetric thermal load

The paper addresses a thermoelectroelastic problem for a piezoelectric body with an arbitrarily shaped plane crack in a plane perpendicular to the polarization axis under a symmetric thermal load. A relationship between the intensity factors for stress (SIF) and electric displacement (EDIF) in an infinite piezoceramic body with a crack under a thermal load and the SIF for a purely elastic body with a crack of the same shape under a mechanical load is established. This makes it possible to find the SIF and EDIF for an electroelastic material from the elastic solution without the need to solve specific problems of thermoelasticity. The SIF and EDIF for a piezoceramic body with an elliptic crack and linear distribution of temperature over the crack surface are found as an example __________ Translated from Prikladnaya Mekhanika, Vol. 44, No. 3, pp. 96–108, March 2008.     

Thermoelastic problem of steady-state heat flows disturbed by a crack at an arbitrary angle to the graded interfacial zone in bonded materials

Plane thermoelasticity solutions are presented for the problem of a crack in bonded materials with a graded interfacial zone. The interfacial zone is treated as a nonhomogeneous interlayer having spatially varying thermoelastic moduli between dissimilar, homogeneous half-planes. The crack is assumed to exist in one of the half-planes at an arbitrary angle to the graded interfacial zone, disturbing uniform steady-state heat flows. The Fourier integral transform method is employed in conjunction with the coordinate transformations of field variables in the basic thermoelasticity equations. Formulation of the current nonisothermal crack problem lends itself to the derivation of two sets of Cauchy-type singular integral equations for heat conduction and thermal stress analyses. The heat-flux intensity factors and the thermal-stress intensity factors are defined and evaluated in order to quantify the singular characters of temperature gradients and thermal stresses, respectively, in the near-tip region. Numerical results include the variations of such crack-tip field intensity factors versus the crack orientation angle for various combinations of material and geometric parameters of the dissimilar media bonded through the thermoelastically graded interfacial zone. The dependence of the near-tip thermoelastic singular field on the degree of crack-surface partial insulation is also addressed.     

Thermal stress intensity factors for an interface crack in a functionally graded layered structures

The fracture behavior of a functionally graded layered structure (FGLS) with an interface crack under thermal loading is investigated. Considering new boundary conditions, it is assumed that interface crack is partly insulated, and the temperature drop across the crack surfaces is the result of the thermal resistance due to the heat conduction through the crack region. The problem is formulated in terms of a system of singular integral equations. Numerical results are presented to show the influence of the material nonhomogeneity parameters and the dimensionless thermal resistance on the thermal stress intensity factors (TSIFs).     

A partially insulated interface crack between a graded orthotropic coating and a homogeneous orthotropic substrate under heat flux supply

In this paper, thermal response of an orthotropic functionally graded coating-substrate structure with a partially insulated interface crack under heat flux supply is considered. It is assumed that there exists thermal resistance to heat conduction through the crack region. The mixed boundary value problems are reduced to a system of singular integral equations and solved numerically. Higher order asymptotic terms for the singular integral kernels are considered to improve the accuracy and the convergence efficiency of the numerical integrals. Numerical results are presented to show the effects of the orthotropy parameters, thermo-elastic nonhomogeneity parameters, and dimensionless thermal resistance on the temperature distribution and the thermal stress intensity factors (SIFs).     

热电材料孔边周期裂纹问题的热电弹分析

论文研究了均匀电流密度和能量流作用下,热电材料中带4k个周期径向裂纹的圆形孔口问题.考虑非渗透型电和热边界条件,运用复变函数理论和保形映射方法,得到了热电材料中电流密度、能量密度和应力场的精确解.依据断裂力学理论,运用Cauchy积分公式得到了周期裂纹的电流、能量和应力强度因子.数值结果分析了场强度因子随各个参数的变化...     

载流薄板中裂纹形成瞬间尖端附近的应力场

利用电磁场的热效应对带有裂纹的载流导体进行裂纹止裂,是为了达到延长其工作寿命,提高安全性、可靠性的一种行之有效的方法。本文在文献[1]的基础上,以导电弹性体的麦克斯威尔方程为出发点,借助于边界条件和初始条件,推得了载流无限大薄板在形成裂纹的瞬间,裂纹尖端附近电流密度、温度和应力的具体表达式。通过算例分析证实了：在给定参数的情况下,通入适当强度的电流时,在电流所产生的焦耳热源的作用下,裂尖区域处的温度将瞬时升高,同时伴有压应力的产生,从而可达到阻止裂纹扩展的目的。     

Mode III fracture of an arbitrary oriented crack in two dimensional functionally graded material

In this paper, a two dimensional functionally graded material (2D-FGM) under an anti-plane load with an internal crack is considered. The crack is oriented in an arbitrary direction. The material properties are assumed to vary exponentially in two planar directions. The problem is analyzed and solved by two different methods namely Fourier integral transforms with singular integral equation technique, and then by the finite element method. The effects of crack orientation, material non-homogeneity, and other parameters on the value of stress intensity factor (SIF) are studied. Finally, the obtained results for Mode III stress intensity factor of different methods are compared.     

Thermal response of a partially insulated interface crack in a graded coating-substrate structure under thermo-mechanical disturbance: Energy release and density

Consider the thermal fracture problem of a functionally graded coating-substrate structure of finite thickness with a partially insulated interface crack subjected to thermal-mechanical supply. A new model is proposed that the heat conduction through the crack region occurs and the temperature drop across the crack surfaces is the result of the thermal resistance. For the first time, real fundamental solutions are derived for the fracture analysis of functionally graded materials. The complicated mixed boundary problems of equations of heat conduction and elasticity are converted analytically into singular integral equations, which are solved numerically. The asymptotic expressions with higher order terms for the singular integral kernels are considered to improve the accuracy and efficiency of the numerical integration. Explicit expressions of various failure modes including stress intensity factors, energy release rate and strain energy density, are provided. Numerical results are presented to illustrate the effects of non-homogeneity parameters and the dimensionless thermal resistance on the temperature distribution along the crack surfaces and extended crack line, the thermal stress intensity factors and minimum strain energy density.     

INTERFACE CRACK IN BIPIEZOTHERMOELASTIC MEDIA

By using the extended version of Eshelby-Stroh's formulation and the method of analyt-ical continuation,the problems of interface cracks are reduced to a Hilbert problem of vector form.Ageneral explicit closed form solution for the piezothermoelastic interface crack problem is then ob-tained,the whole field solutions of temperature,heat flux,displacements,electric field,stress andelectric induction are given,the explicit expressions for the crack opening displacements and electricpotential are also provided.     

Interface crack with a contact zone in an isotropic bimaterial under thermomechanical loading

A plane problem for a thermally insulated interface crack with a contact zone in an isotropic bimaterial under tension–shear mechanical loading and a temperature flux is considered. The expressions for the stresses and the electrical flux as well as for the derivatives of the displacement and the temperature jumps at the material interfaces via sectionally holomorphic mechanical and thermal potential functions are given. After the solution of the thermal problem the inhomogeneous combined Dirichlet–Riemann boundary value problem is formulated and solved exactly. The stresses at the interface and the stress intensity factors at the singular points are presented in a clear analytical form. Special attention is devoted to the case of a small contact zone when the stress intensity factors can be presented in form similar to the associated presentation for an “open” crack model. A transcendental equation and an asymptotic analytic formula for the determination of the real contact zone length are derived. It is shown that for a certain bimaterial this length as well as the correspondent stress intensity factor are defined by a single parameter which depends on the normal-shear loading and the heat flux.     

Limited permeable crack moving along the interface of a piezoelectric bi-material

A plane problem for a crack moving with a subsonic speed along the interface of two piezoelectric semi-infinite spaces is considered. The crack is assumed to be free from mechanical loading. The limited permeable electric condition with an account of electric traction is adopted at its faces. A uniformly distributed mixed mode mechanical loading and an electric flux are prescribed at infinity. The problem is reduced to the Riemann–Hilbert problem by means of introducing a moving coordinate system and assuming that the electric flux is uniformly distributed along the crack region. An exact solution of this problem is proposed. It permits to find in closed form all necessary electromechanical characteristics at the interface and to formulate the equation for the determination of the electric flux. Analysis of this equation confirms the correctness of the assumption concerning the uniform distribution of the electric flux in the crack region. The values of the electric flux are determined by solving the obtained equation. Thereafter, the stress and electric intensity factors as well as their asymptotic fields at the crack tip are also found. The particular case of a crack moving in a homogeneous piezoelectric material is considered. The values of the electric flux and the fracture parameters are found exactly in a simple form for this case. Also, a numerical analysis is performed for a crack propagating with a subsonic speed between PZT4 and PZT5 materials and for a crack moving in PZT4 material. The electric flux in the crack region, stress and electric intensity factors, crack opening and the energy release rate (ERR) are found as functions of the crack speed, loading and electric permeability of the crack medium. The influence of the electric traction on the crack faces upon the mentioned parameters is demonstrated.     

热释电材料问题的通解与界面裂纹

该文讨论了热释电材料中的热弹性问题的一般解，进而求解了共线界面裂纹问题．利用Ｓｔｒｏｈ方法，把热释电材料的热弹性界面裂纹问题化为一向量形式的Ｈｉｌｂｅｒｔ问题，求出这一Ｈｉｌｂｅｒｔ问题的通解，进而求得了热释电材料热弹性界面裂纹的闭合解，得到了温度、热流、位移、电势、应力和电位移的全场解，得到了裂纹张开位移及电势差的精确表达式．在此基础上，还求得了均匀热释电体中单个热弹性裂纹裂尖场，单个界面裂纹裂尖场以及点热源与界面裂纹的作用．此外，该文还对界面裂纹顶点附近的端部场作了渐近分析．     

Interaction between a rigid inclusion and a line crack under uniform heat flux

The thermoelastic displacement boundary value problem for a rigid inclusion interacting with a line crack in an infinite plane subjected to a uniform heat flux is studied, in which the rigid body rotation of the inclusion is considered. To solve the prescribed problem, we use the principle of superposition to decompose it into two groups of problems, which are further reduced to several basic subproblems including Green’s functions of edge dislocation and heat source couple, as well as the problem of a plane containing the inclusion under uniform heat flux and the problem of the inclusion subjected to a small rotation. The problems are solved using the complex variable method along with the rational mapping function technique. The variations of the stress intensity factors at the crack tips and the rigid body rotation angles with various crack lengths and heat flux angles are shown. The effects of the inclusion shape and size are also investigated.     

Transient thermal cracking associated with non-classical heat conduction in cylindrical coordinate system

This paper studies the fracture behavior of a thermoelastic cylinder subjected to a sudden temperature change on its outer surface within the framework of non-classical heat conduction.The heat conduction equation is solved by separation of variable technique.Closed form solution for the temperature field and the associated thermal stress are established.The critical parameter governing the level of the transient thermal stress is identified.Exact expression for the transient stress intensity factor is obtained for a crack in the cylinder.The difference between the non-classical solutions and the classical solution are discussed.It is found that the traditional classical heat conduction considerably underestimates the transient thermal stress and thermal stress intensity factor.     

Griffith crack moving in a piezoelectric strip

Summary  The dynamic problem of an impermeable crack of constant length 2a propagating along a piezoelectric ceramic strip is considered under the action of uniform anti-plane shear stress and uniform electric field. The integral transform technique is employed to reduce the mixed-boundary-value problem to a singular integral equation. For the case of a crack moving in the mid-plane, explicit analytic expressions for the electroelastic field and the field intensity factors are obtained, while for an eccentric crack moving along a piezoelectric strip, numerical results are determined via the Lobatto–Chebyshev collocation method for solving a resulting singular integral equation. The results reveal that the electric-displacement intensity factor is independent of the crack velocity, while other field intensity factors depend on the crack velocity when referred to the moving coordinate system. If the crack velocity vanishes, the present results reduce to those for a stationary crack in a piezoelectric strip. In contrast to the results for a stationary crack, applied stress gives rise to a singular electric field and applied electric field results in a singular stress for a moving crack in a piezoelectric strip. Received 14 August 2001; accepted for publication 24 September 2002 The author is indebted to the AAM Reviewers for their helpful suggestions for improving this paper. The work was supported by the National Natural Science Foundation of China under Grant 70272043.