负偏压对磁控溅射Ti膜沉积速率和表面形貌的影响

 采用直流磁控溅射加负偏压的方法制备了Ti膜,研究了不同偏压条件对Ti膜沉积速率、密度、生长方式及表面形貌的影响。随着偏压逐渐增大,Ti膜沉积速率分三个阶段变化:0~ -40 V之间沉积速率基本不变; -40~ -80 V之间沉积速率迅速降低;超过-80 V后沉积速率随偏压的下降速度又放缓。Ti膜密度随偏压增加而增大,负偏压为-119.1 V时开始饱和并趋于块体Ti材密度。加负偏压能够抑制Ti膜的柱状生长方式;偏压可以改善Ti膜的表面形貌,对于40 W和100 W的溅射功率,负偏压分别在-100 V和-80 V左右时制备出表面光洁性能较佳的Ti膜。     

RF磁控溅射条件对ZnO薄膜结构的影响

采用RF磁控溅射法在Si（001）衬底上制备ZnO薄膜。研究发现了工作中溅射频率、氧气和氩气流量比对样品结构的影响。样品的XRD图谱显示了强的（002）ZnO衍射峰，表明ZnO薄膜为c轴高取向生长。比较不同条件下制备的ZnO薄膜，研究发现当氧气和氩气的流量比相同时，随着溅射功率的增加，样品的（002）衍射峰增强，半高全宽变小。而当溅射功率相同时，随着氧气和氩气的流量比增加，样品的（002）衍射峰也增强，半高全宽同样变小。此外，本文还分析了溅射工艺和薄膜晶体质量之间关系，发现在相同的功率条件下，溅射率低时晶粒尺寸更大且薄膜的结晶性更好。     

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利用在线椭偏仪对非晶碳氢膜进行了光学常数、沉积率和刻蚀率的测量。在无直流负偏压或偏压较小时,薄膜呈现聚合物结构,折射率和消光系数较小;当增加直流负偏压时,薄膜的折射率和消光系数显著提高,所成膜为硬质非晶碳氢膜。在以CH4作为气源进行沉积时,随着偏压的增加,沉积率先升高再降低,在偏压为-100V时,沉积率为最大。H2/N2(30%N2)的混合气体的刻蚀率要比单独用H2作为刻蚀气体的刻蚀率要大。对于CH4/N2(30%N2),在偏压从0V增加到300V过程中,在大约50V时,基底上的薄膜有一个从沉积到刻蚀的转化过程。     

射频、直流磁控溅射和多弧离子镀沉积类金刚石薄膜的拉曼光谱分析

用射频、直流磁控溅射和多弧离子镀制备一系列类金刚石(DLC)薄膜样品,并测量了样品的拉曼光谱.通过数据分析发现三种沉积方式中多弧离子镀沉积得到的薄膜含有更高的sp3含量.采用多弧离子镀设备,在不同的溅射负偏压下沉积了一系列的DLC薄膜样品,对样品进行拉曼光谱测试,通过对比分析发现随着沉积负偏压的提高,薄膜内sp3的含量不断提高.表明可以通过提高多弧离子镀的负偏压来提高DLC薄膜的质量.     

磁控溅射制备氧化硅薄膜生长速率

氧化硅薄膜是半导体工业中常见的薄膜材料,通常采用化学气相沉积方法制备。但是这种制备方法存在缺欠。采用磁控溅射的方法首先在石英衬底上制备了氧化硅薄膜。研究了射频功率、氧气含量和溅射压强对氧化硅薄膜沉积速率的影响。发现沉积速率随着射频功率的增加而增加;随着氧气含量的增加,先减小后增大;当溅射压强在0.4~0.8 Pa之间变化时,沉积速率变化很小,当溅射压强超过0.8 Pa时沉积速率迅速下降。讨论了不同生长条件下造成氧化硅薄膜生长速率变化的原因。     

GaP薄膜的射频磁控溅射沉积及其计算机模拟

以GaP为靶材采用射频磁控溅射法制备GaP红外光学薄膜，通过保持Ar Ⅰ 750nm发射光谱线强度不变获得了不同工艺参数，并对沉积过程进行了计算机模拟.功率较小、气压较大时，Ga和P的溅射率、输运效率及沉积到衬底时的能量均较小，Ga的溅射率及输运效率均大于P的，使薄膜沉积速率较低、薄膜中Ga的含量大于P的，GaP薄膜产生较大吸收.功率较大、气压较小时，Ga和P的溅射率、输运效率及沉积到衬底时的能量均增大，Ga的溅射率大于P的、但其输运效率小于P的，使GaP薄膜的沉积速率增大、薄膜中Ga与P的含量接近化学计量比，GaP薄膜的吸收降低，因此有利于制备厚度较大的GaP薄膜. 关键词： GaP 薄膜 射频磁控溅射 计算机模拟     

溅射工艺参数对硅薄膜微结构影响的Raman分析

为了解决碳化硅难以进行光学加工的问题,该文采用射频磁控溅射方法,在碳化硅反射镜坯体上沉积与碳化硅具有相近热膨胀系数且易于进行光学加工的硅薄膜。利用拉曼光谱(Raman)对衬底温度、射频功率、衬底偏压等溅射工艺条件对硅膜微结构的影响进行了分析。研究发现：随着衬底温度的升高,薄膜的晶化率先增大后减小;衬底偏压的增加不利于薄膜有序结构的形成;射频功率对薄膜微结构的影响比较复杂,随着功率的升高,薄膜晶粒尺寸减小,晶化率降低,当射频功率进一步升高时,薄膜中有序团簇尺寸和晶化率逐渐升高。但过高的射频功率反而不利于薄膜的晶化。     

脉冲高能量密度等离子体法类金刚石膜的制备及分析

利用脉冲高能量密度等离子体法在光学玻璃衬底上、在室温下成功的制备了光滑、致密、均匀的纳米类金刚石膜.工艺研究表明：放电电压和放电距离以及工作气体种类对纳米类金刚石膜的沉积起着关键作用.利用拉曼光谱、扫描电镜以及电子能量损失谱分析薄膜的形态结构表明：薄膜具有典型的类金刚石特征；纳米类金刚石膜的晶粒尺寸小于20nm甚至为非晶态；类金刚石膜中含有一定量的氮原子，随着沉积能量的升高，氮的含量增大.纳米类金刚石膜的薄膜电阻超过109Ω/cm2.对放电溅射过程进行了理论分析，结果与工艺研究的结论吻合.     

不同射频输入功率下制备的氟化类金刚石碳膜疏水性研究

以高纯石墨作靶、氩气（Ar）和三氟甲烷（CHF₃）为源气体,用反应磁控溅射法在不同射频功率下制备了氟化类金刚石碳（F-DLC）膜,并对其疏水性进行研究.双蒸水液滴与膜表面接触角的测试结果表明,所制备薄膜表面的最大水接触角可达115°左右.通过原子力显微镜获得的薄膜表面AFM图谱、拉曼光谱以及傅里叶变换红外光谱探讨了影响薄膜的疏水性的因素.结果表明,薄膜的疏水性与薄膜的表面粗糙度和表面键结构直接相关,表面粗糙度越大,疏水性越好,但与薄膜中的F含量和sp³/sp²的比值并未呈单调增加或减小的对应关系.射频输入功率影响着薄膜的沉积速率,与薄膜表面粗糙度、薄膜中芳香环单核的比例以及薄膜表面的键结构（F的接入方式）直接相关. 关键词： 疏水性 反应磁控溅射 氟化类金刚石膜 射频功率     

类金刚石薄膜的制备、特性及应用

利用射频等离子分裂碳氢气体制备的类金刚石膜,具有硬度高、耐蚀和良好的透红外光等特性.本文研究了类金刚石膜的红外、机械、结构及电学特性,给出该膜应用于红外装置中镀膜元件的光谱性能.并结合文中所用的制备方法,讨论了类金刚石膜在低温低压下的形成机制.     

铜上采用过渡层沉积类金刚石薄膜的研究

将等离子增强非平衡磁控溅射物理气相沉积(PEUMS-PVD)和电子回旋共振-微波等离子体增强化学气相沉积(MW-ECRPECVD)技术相结合，通过制备不同的过渡层，在铜基上成功地制备了类金刚石膜.拉曼光谱分析表明，所制备的碳膜具有典型的类金刚石结构特征.检测结果表明，随着沉积偏压的增大，D峰和G峰均向高波数漂移，I_D/I_G值增大，表面粗糙度减小，而平均硬度和弹性模量呈先增大后减小的趋势. 关键词： 铜基体 类金刚石膜 过渡层 拉曼光谱     

Method for pulsed magnetron deposition of diamondlike films on large-area substrates

The circuit of the pulse power supply of a magnetron sputtering system and the circuit of a high voltage generator used to realize the process of pulsed magnetron deposition of diamondlike films on large-area substrates are described. Measurements of the parameters of the plasma produced on pulsed magnetron sputtering of graphite in the argon medium have been performed. The plasma density (10¹⁷–10¹⁸ cm⁻³) has been shown to be one or two orders of magnitude higher than that in the case of dc magnetron sputtering and approach the plasma density achievable on vacuum arc cathode sputtering and pulsed laser sputtering. Samples of diamondlike films on crystalline silicon, titanium, and stainless steel have been prepared and examined. It has been demonstrated that high voltage bias pulses applied to the substrate promote production of high-quality diamondlike films showing high adherence to the substrate. Institute of High Current Electronics, Siberian Branch of the Russian Academy of Sciences. Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 12, pp. 53–60, December, 1999.     

Studies of diamond-like carbon （DLC） films deposited on stainless steel substrate with Si/SiC intermediate layers

In this work, diamond-like carbon （DLC） films were deposited on stainless steel substrates with Si/SiC intermediate layers by combining plasma enhanced sputtering physical vapour deposition （PEUMS-PVD） and microwave electron cyclotron resonance plasma enhanced chemical vapour deposition （MW-ECRPECVD） techniques. The influence of substrate negative self-bias voltage and Si target power on the structure and nano-mechanical behaviour of the DLC films were investigated by Raman spectroscopy, nano-indentation, and the film structural morphology by atomic force microscopy （AFM）. With the increase of deposition bias voltage, the G band shifted to higher wave-number and the integrated intensity ratio ID/IG increased. We considered these as evidences for the development of graphitization in the films. As the substrate negative self-bias voltage increased, particle bombardment function was enhanced and the sp^3-bond carbon density reducing, resulted in the peak values of hardness （H） and elastic modulus （E）. Silicon addition promoted the formation of sp^3 bonding and reduced the hardness. The incorporated Si atoms substituted sp^2- bond carbon atoms in ring structures, which promoted the formation of sp^3-bond. The structural transition from C-C to C-Si bonds resulted in relaxation of the residual stress which led to the decrease of internal stress and hardness. The results of AFM indicated that the films was dense and homogeneous, the roughness of the films was decreased due to the increase of substrate negative self-bias voltage and the Si target power.     

Deposition and characterization of sputtered ZnO films

Zinc oxide thin films were deposited by radio frequency magnetron sputtering at room temperature using a metallic zinc target in a gas mixture of argon and oxygen. Plasma power, oxygen /argon gas ratio, gas pressure, and substrate temperature were varied, and an experimental design method was used to optimize these deposition parameters by considering their interdependence. Crystalline structures and film stresses were examined. Post-deposition rapid thermal annealing was also carried out to observe its effects on the film properties. Statistical analysis was then used to find the optimal sputtering conditions. Results indicated that plasma power and gas pressure have the largest effects on film crystallization and stress and that postdeposition annealing can be used to improve the quality of the film properties.     

A magnetron sputtering technique to prepare a-C:H films: Effect of substrate bias

Amorphous hydrogenated carbon (a-C:H) films were deposited by magnetron sputtering with a mixture gas of Ar and CH₄. The a-C:H films deposited by this method have relatively low internal stress (<1 GPa) compared to some films deposited by conventional deposition process. The effects of substrate bias voltage on microstructure, surface morphology and mechanical properties of the films were investigated by various techniques. It has been found that the polymer-like structure is dominated at low bias voltage (−100 V), while the diamond-like structure with the highest hardness and internal stress is the main feature of the a-C:H films deposited under high bias voltage (−300 V). With increasing the bias voltage further, the feature of diamond-like structure decreases associating with the increase of graphitization. The frictional test shows that the friction coefficient and wear rate of the a-C:H films are depended strongly on structure and mechanical properties, which were ultimately influenced by the deposition method and bias voltage.     

The effect of bias voltage and working pressure on S/Mo ratio at MoS2-Ti composite films

S/Mo ratio has a crucial effect on the tribological properties of MoS₂-Ti composite films. The deposition parameters as such bias voltage and working pressure play a dominant role on the change of this ratio value. To determine the effect of working pressure and bias voltage on S/Mo ratio, MoS₂-Ti composite films were deposited on glass wafers by pulsed-dc magnetron sputtering (PMS). The deposition process was performed for nine different test conditions at various levels of target current, working pressure, and substrate voltage using the Taguchi L₉(3⁴) experimental method. It was observed that the chemical composition of MoS₂-Ti composite films was significantly affected by sputtering parameters. It was also observed that S/Mo ratio decreased as the bias voltage increased at a constant working pressure and S/Mo ratio increased with increasing working pressure at a constant bias voltage.     

靶压对磁控溅射GeC薄膜折射率的影响

采用磁控溅射技术,以碳氢气体和氩气为工作气体,在Ge基底上制备了GeC薄膜。研究了靶压对薄膜折射率的影响,发现在较高的靶压下制备的GeC薄膜具有较低的折射率,而在较低的靶压下则得到了高折射率的薄膜。通过控制溅射靶压,制备了折射率在2．5～3．8之间可变的GeC薄膜。利用拉曼光谱研究了GeC薄膜的结构。薄膜样品的硬度测试表明,较低折射率的GeC薄膜具有较高的硬度。     

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用射频等离子体增强非平衡磁控溅射在Si100基底上沉积了金属Cu膜。研究了偏压,射频功率和磁场等沉积参数对膜性能的影响。用扫描电子显微镜(SEM)、原子力显微镜(AFM)、X射线衍射(XRD)和电子能谱(EM)检测了膜的表面形貌,结构和成分。结果表明,射频放电有利于表面均匀光滑、电导率高的Cu沉积膜的形成;沉积参数对沉积膜的性能有重要的影响。     

激光加速实验超薄类金刚石碳靶的制备

采用过滤阴极真空弧法,制备了满足激光稳相加速机制要求的超薄自支撑类金刚石碳靶。室温下沉积,基片偏压为-32 V,薄膜沉积速率约为每脉冲0.002 nm。选取NaCl膜作脱膜剂,采用漂浮法进行脱膜。打捞板孔径为1 mm时,自支撑厚度范围为5~50 nm,自支撑成功率约为70%。利用拉曼光谱仪及原子力显微镜等仪器,测量了薄膜的结构、表面粗糙度等关键参数。