Synthesis and characterization of novel fluorinated polyimides derived from 4,4′‐[2,2,2‐trifluoro‐1‐(3‐trifluoromethylphenyl)ethylidene]diphthalic anhydride and aromatic diamines

A novel fluorinated aromatic dianhydride, 4,4′‐[2,2,2‐trifluoro‐1‐(3‐trifluoromethyl‐phenyl)ethylidene]diphthalic anhydride (TFDA) was synthesized by coupling of 3′‐trifluoromethyl‐2,2,2‐trifluoroacetophenone with o‐xylene under the catalysis of trifluoromethanesulfonic acid, followed by oxidation of KMnO₄ and dehydration. A series of fluorinated aromatic polyimides derived from the novel fluorinated aromatic dianhydride TFDA with various aromatic diamines, such as p‐phenylenediamine (p‐PDA), 4,4′‐oxydianiline (ODA), 1,4‐bis(4‐aminophenoxy)benzene (p‐APB), 1,3‐bis(4‐amino‐phenoxy)benzene (m‐APB), 4‐(4‐aminophenoxy)‐3‐trifluoromethylphenylamine (3FODA) and 1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)benzene (6FAPB), were prepared by polycondensation procedure. All the fluorinated polyimides were soluble in many polar organic solvents such as NMP, DMAc, DMF, and m‐cresol, as well as some of low boiling point organic solvents such as CHCl₃, THF, and acetone. Homogeneous and stable polyimide solutions with solid content as high as 35–40 wt % could be achieved, which were prepared by strong and flexible polyimide films or coatings. The polymer films have good thermal stability with the glass transition temperature of 232–322 °C, the temperature at 5% weight loss of 500–530 °C in nitrogen, and have outstanding mechanical properties with the tensile strengths of 80.5–133.2 MPa as well as elongations at breakage of 7.1–12.6%. It was also found that the polyimide films derived from TFDA and fluorinated aromatic diamines possess low dielectric constants of 2.75–3.02, a low dissipation factor in the range of 1.27–4.50 × 10^?3, and low moisture absorptions <1.3%. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 4143–4152, 2004     

Synthesis and characterization of novel fluorinated aromatic polyimides derived from 1,1‐bis(4‐amino‐3,5‐dimethylphenyl)‐1‐(3,5‐ditrifluoromethylphenyl)‐2,2,2‐trifluoroethane and various aromatic dianhydrides

A novel fluorinated aromatic diamine, 1,1‐bis(4‐amino‐3,5‐dimethylphenyl)‐1‐(3,5‐ditrifluoromethylphenyl)‐2,2,2‐trifluoroethane (9FMA), was synthesized by the coupling reaction of 3′,5′‐ditrifluoromethyl‐2,2,2‐trifluoroacetophenone with 2,6‐dimethylaniline under the catalysis of 2,6‐dimethylaniline hydrochloride. A series of fluorinated aromatic polyimides were synthesized from 9FMA and various aromatic dianhydrides, including pyromellitic dianhydride, 3,3′4,4′‐biphenyl tetracarboxylic dianhydride, 4,4′‐oxydiphthalic anhydride, 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA), and 4,4′‐hexafluoroisopropylidene diphthalic anhydride, via a high‐temperature, one‐stage imidization process. The inherent viscosities of the polyimides ranged from 0.37 to 0.74 dL/g. All the polyimides were quickly soluble in many low‐boiling‐point organic solvents such as tetrahydrofuran, chloroform, and acetone as well as some polar organic solvents such as N‐methyl‐2‐pyrrolidinone, N,N′‐dimethylacetamide, and N,N′‐dimethylformamide. Freestanding fluorinated polyimide films could be prepared and exhibited good thermal stability with glass‐transition temperatures of 298–334 °C and outstanding mechanical properties with tensile strengths of 69–102 MPa and elongations at break of 3.3–9.9%. Moreover, the polyimide films possessed low dielectric constants of 2.70–3.09 and low moisture absorption (<0.58%). The films also exhibited good optical transparency with a cutoff wavelength of 303–351 nm. One polyimide (9FMA/BTDA) also exhibited an intrinsic negative photosensitivity, and a fine pattern could be obtained with a resolution of 5 μm after exposure at the i‐line (365‐nm) wavelength. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 2665–2674, 2006     

Structure‐property relationships for a series of amorphous partially aliphatic polyimides

High molecular weight, soluble, amorphous, partially aliphatic polyimides were successfully synthesized using an ester acid high‐temperature solution imidization route, which allows one to control desired glass‐transition (T_g) and processing temperatures. This method involves the prereaction of aromatic dianhydrides with ethanol and a tertiary amine catalyst to form ester acids, followed by the addition of diamines. Subsequent thermal reaction forms fully cyclized polyimides. This reaction pathway eliminates the need for anhydrous solvents and overcomes the problem of salt formation commonly observed for nucleophilic, more‐basic aliphatic amines when utilizing the traditional polyamic acid synthesis route. The molar ratio of aromatic‐to‐aliphatic diamines was varied to generate a series of copolyimides with the chosen dianhydride and tailor the physical properties for specific adhesive applications. This series of copolyimides was characterized by their molecular weight, T_g, thermal stability, coefficient of thermal expansion, refractive index, and dielectric constant. Structure‐property relationships were established. The γ and β sub‐T_g viscoelastic properties were researched to understand their molecular origins. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 40: 1503–1512, 2002     

Novel Non‐Coplanar and Tertbutyl‐Substituted Polyimides: Solubility,Optical, Thermal and Dielectric Properties

A novel aromatic diamine monomer bearing tertbutyl and 4‐tertbutylphenyl groups, 3,3′‐ditertbutyl‐4,4′‐diaminodiphenyl‐4′′‐tertbutylphenylmethane (TADBP), was prepared and characterized. A series of non‐coplanar polyimides (PIs) were synthesized via a conventional one‐step polycondensation from TADBP and various aromatic dianhydrides including pyromellitic dianhydride (PMDA), 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride (OPDA), 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) and 4,4′‐(hexafluoroisopropylidene)dipthalic anhydride (6FDA). All PIs exhibit excellent solubility in common organic solvents such as N,N‐dimethylformamide (DMF), N,N‐dimethylacetamide (DMAc), N‐methyl‐2‐pyrrolidone (NMP), dimethyl sulfoxide (DMSO), chloroform (CHCl₃), tetrahydrofuran (THF), and so on. Furthermore, the obtained transparent, strong and flexible polyimide films present good thermal stability and outstanding optical properties. Their glass transition temperatures (T_gs) are in the range of 298 to 347°C, and 10% weight loss temperatures are in excess of 490°C with more than 53% char yield at 800°C in nitrogen. All the polyimides can be cast into transparent and flexible films with tensile strength of 80.5–101 MPa, elongation at break of 8.4%–10.5%, and Young's modulus of 2.3–2.8 GPa. Meanwhile, the PIs show the cutoff wavelengths of 302–356 nm, as well as low moisture absorption (0.30% –0.55%) and low dielectric constant (2.78–3.12 at 1 MHz).     

Synthesis of diallyl‐containing polyimide and the effect of allyl groups on properties

A diallyl‐containing bisphenol, 1,1‐bis(3‐allyl‐4‐hydroxyphenyl)‐1‐(6‐oxido‐6H ‐dibenzo [c,e][1,2] oxaphosphorin‐6‐yl) ethane ( 1 ), was prepared by a two‐step procedure. Then, a diallyl‐containing diamine, 1,1‐bis(3‐allyl‐4‐(4‐aminophenoxy)‐phenyl)‐1‐(6‐oxido‐6H‐dibenzo [c,e][1,2] oxaphosphorin‐6‐yl)ethane ( 3 ), was prepared from the nucleophilic substitution of ( 1 ) with 4‐fluoronitrobenzene, followed by the reduction by Fe/HCl. A flexible polyimide ( 4 ) with curable diallyl linkages was prepared from the condensation of ( 3 ) and 4,4′‐oxydiphthalic anhydride in m‐cresol in the presence of isoquinoline. Curing polyimide ( 4 ) at 300 °C leads to thermosetting polyimide ( 5 ). We discussed the amounts of allyl group on T_g, coefficient of thermal expansion, and thermal stability of thermosetting polyimides, and found that thermal properties and dimensional stability of thermosetting polyimides increase with the amounts of cured allyl moieties. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2015 , 53, 513–520     

Synthesis and characterization of high nitrile content polyimides as dielectric films for electrical energy storage

Three new isomeric diamines containing three, oxy‐linked benzonitriles (3BCN), one of which is asymmetric (meta, para, or m, p), are synthesized in a 3‐step sequence. Polycondensation of these diamines and four common dianhydrides (6FDA, OPDA, BTDA, and PMDA) in N,N‐dimethylacetamide via poly(amic acid) precursors and thermal curing at temperatures up to 300 °C lead to three series of tough, creasable polyimide (PI) films (tensile moduli = 1.63 ? 2.86 GPa). Among these PIs, two PMDA‐based PIs possess relatively high crystallinity and two OPDA‐based PIs, low crystallinity, whereas all 6FDA‐ and BTDA‐based PIs, and m,m‐3BCN‐OPDA‐PI are amorphous, readily soluble in common polar aprotic solvents. Thermally stable and having high T_g (216 ? 341 °C), these PIs lose 5% weight around 493–503 °C in air and 463–492 °C in nitrogen. Dielectric properties have been evaluated by broadband dielectric spectroscopy (BDS) and electric displacement‐electric‐field (D‐E) loop measurements. D‐E loop results show an increase in high temperature permittivity (at 190 °C/1 kHz) from 2.9 (for parent PI CP2 with no nitrile group) to as high as 4.9 for these PIs, while keeping their dielectric loss relatively low. Thus, an increase in dipole moment density by the presence of three neighboring CN per repeat unit can increase the overall permittivity, which could be further enhanced by sub‐T_g mobility of para‐phenylene linkages (BDS results). Published 2014. J. Polym. Sci., Part A: Polym. Chem. 2014 J. Polym. Sci., Part A: Polym. Chem. 2015 , 53, 422–436     

Hydrolytic stability and high Tg of polyimides derived from the novel 4,9‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]‐diamantane dianhydride

This work reports the synthesis and characterization of diamantane‐based polyimides obtained from 4,9‐bis[4(3,4‐dicarboxyphenoxy)phenyl]diamantane dianhydride and various aromatic diamines. Interestingly, the diamantane‐based polyimides were very stable to hydrolysis. This novel polyimide exhibits a low dielectric constant (2.65–2.77), low moisture absorption (<0.67%), good solubility, high T_g and unusually high thermal stability. Dynamic mechanical analysis (DMA) reveals that the diamantane‐based polyimides have high T_g ranging from 281 to 379 °C. The high‐temperature β₁ subglass transition around 285 °C was observed in polyimide 6a derived from 2,2′‐bis(trifluoromethyl)benzidine. This class of novel diamantane‐based polyimide is very promising for electronic applications, because of its good mechanical properties, good thermal stability, low dielectric constant, excellent hydrolytic resistance, and low moisture absorption. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 1673–1684, 2009     

Preparation of novel,high‐modulus,swollen‐ or jungle‐gym‐type polyimide gels end‐crosslinked with 1,3,5‐tris(4‐aminophenyl)benzene

A novel preparation approach for high‐performance polyimide gels that are swollen or have a jungle‐gym‐type structure is proposed. A new rigid and symmetric trifunctional amine, 1,3,5‐tris(4‐aminophenyl)benzene (TAPB), was synthesized as a crosslinker. Three different kinds of amic acid oligomers derived from pyromellitic dianhydride (PMDA), 4,4′‐oxydiphthalic anhydride (ODPA), p‐phenylenediamine (PDA), and 4,4′‐oxydianiline (ODA) were end‐crosslinked with TAPB at a high temperature to make polyimide networks with different structures. Transparent polyimide gels were obtained from the ODPA–ODA/TAPB series with high compression moduli of about 1 MPa at their equilibrium swollen states in N‐methylpyrrolidone. Microscopic phase separation occurred during the gelation–imidization process when polyimide networks were generated from PMDA–PDA/TAPB and PMDA–ODA/TAPB. After these opaque polyimide networks were dried, a jungle‐gym‐like structure was obtained for the PMDA–PDA/TAPB and PMDA–ODA/TAPB series; that is, there was a high void content inside the networks (up to 70%) and little volume shrinkage. These polyimide networks did not expand but absorbed the solvent and showed moduli as high as those of solids. Therefore, using the highly rigid crosslinker TAPB combined with the flexible monomers ODPA and ODA and the rigid monomers PMDA and PDA, we prepared swollen, high‐performance polyimide gels and jungle‐gym‐type polyimide networks, respectively. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2501–2512, 2002     

Synthesis and characterization of hyperbranched polyimides with good organosolubility and thermal properties based on a new triamine and conventional dianhydrides

A triamine monomer, 1,3,5‐tris(4‐aminophenoxy)benzene (TAPOB), was synthesized from phloroglucinol and 4‐chloronitrobenzene, and it was successfully polymerized into soluble hyperbranched polyimides (HB PIs) with commercially available dianhydrides: 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride (6FDA), 4,4′‐oxydiphthalic anhydride (ODPA), and 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA). Different monomer addition methods and different monomer molar ratios resulted in HB PIs with amino or anhydride end groups. From ¹H NMR spectra, the degrees of branching of the amino‐terminated polymers were estimated to be 0.65, 0.62, and 0.67 for 6FDA–TAPOB, ODPA–TAPOB, and BTDA–TAPOB, respectively. All polymers showed good thermal properties with 10% weight‐loss temperatures (T₁₀'s) above 505 °C and glass‐transition temperatures (T_g's) of 208–282 °C for various dianhydrides. The anhydride‐terminated HB PIs showed lower T₁₀ and T_g values than their amino‐terminated counterparts. The chemical conversion of the terminal amino or anhydride groups of the 6FDA‐based polyimides into an aromatic imido structure improved their thermal stability, decreased their T_g, and improved their solubility. The HB PIs had moderate molecular weights with broad distributions. The 6FDA‐based HB PIs exhibited good solubility even in common low‐boiling‐point solvents such as chloroform, tetrahydrofuran, and acetone. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 3804–3814, 2002     

Syntheses and properties of organosoluble poly(ether imide)s from 1,1‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]cyclohexane dianhydride and aromatic diamines

A bis(ether anhydride) monomer, 1,1‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]cyclohexane dianhydride ( IV‐A ), was synthesized from the nitro displacement of 4‐nitrophthalodinitrile by the phenoxide ion of 1,1‐bis(4‐hydroxyphenyl)cyclohexane ( I‐A ), followed by alkaline hydrolysis of the intermediate bis(ether dinitrile) and dehydration of the resulting bis(ether acid). A novel series of organosoluble poly(ether imide)s ( VI _a–i )(PEIs) bearing cyclohexylidene cardo groups was prepared from the bis(ether anhydride) IV‐A with various aromatic diamines V _a–i via a conventional two‐stage process. The PEIs had inherent viscosities in the range of 0.48–1.02 dL/g and afforded flexible and tough films by solution‐casting because of their good solubilities in organic solvents. Most PEIs showed yield points in the range of 89–102 MPa at stress‐strain curves and had tensile strengths of 78–103 MPa, elongations at breaks of 8–62%, and initial moduli of 1.8–2.2 GPa. The glass‐transition temperatures (T_g's) of these PEIs were recorded between 200–234 °C. Decomposition temperatures of 10% weight loss all occurred above 490 °C in both air and nitrogen atmospheres, and their residues were more than 43% at 800 °C in nitrogen atmosphere. The cyclohexane cardo‐based PEIs exhibited relatively higher T_g's, better solubilities in organic solvents, and better tensile properties as compared with the corresponding Ultem® PEI system. © 2001 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 788–799, 2001     

Synthesis and characterization of highly transparent and hydrophobic fluorinated polyimides derived from perfluorodecylthio substituted diamine monomers

Two new perfluorodecylthio substituted aromatic diamines, namely 2,4‐diamino‐1‐(1H,1H,2H,2H‐perfluorodecathio)benzene (DAPFB) and 2,2'‐Bis((1H,1H,2H,2H‐perfluorodecyl)thio)[1,1'‐biphenyl]4,4'‐diamine (BPFBD) were synthesized and polycondensed with 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride (6FDA) to produce two new perfluorinated polyimides (PI2 and PI4). The chemical structures of these polyimides were confirmed by Fourier transform infrared (FTIR) and nuclear magnetic resonance (NMR) spectroscopy and elemental analysis. Two other polyimides (PI1 and PI3) were also synthesized from 6FDA and analogous perfluorodecylthio unsubstituted diamines to investigate the incorporation effect of perfluorodecylthio group on various physical and chemical properties of the synthesized PIs. Compared with PI1 and PI3, PI2 and PI4 exhibited improved solubility, optical transparency, and hydrophobicity, lower moisture absorption, dielectric constant, and thermo‐mechanical stabilities owing to the presence of the perfluorodecylthio side group in the polymer chain. Even though thermo‐mechanical properties of PI2 and PI4 ( : 413 and 404 °C, T_g: 220 and 209 °C, tensile strength of 101 and 76 MPa, tensile modulus of 1.7 and 1.5 GPa and elongation at break of 8 and 10%, respectively) were reduced in comparison to PI1 and PI3 but still were good enough for most of the practical applications. Most importantly, the presence of the perfluorodecylthio side group in BPFBD considerably reduced the dielectric constant of PI4 to 2.71 which was quite low as aromatic polyimide. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2015 , 53, 479–488     

Novel soluble fluorinated poly(ether imide)s with different pendant groups: Synthesis,thermal, dielectric,and optical properties

Three types of new bis(ether dianhydride) monomers, [4,4′‐(2‐(3′‐methylphenyl)‐1,4‐phenylenedioxy)‐diphthalic anhydride (4a)], [4,4′‐(2‐(3′‐trifluoromethylphenyl)‐1,4‐phenylenedioxy)‐diphthalic anhydride (4b)], and [4,4′‐(2‐(3′,5′‐ditrifluoromethylphenyl)‐1,4‐phenylenedioxy)‐diphthalic anhydride (4c)] were prepared via a multistep reaction sequence. Three series of soluble poly(ether imide)s (PEIs) were prepared from the obtained dianhydrides by a two‐step chemical imidization method. Experimental results indicated that all the PEIs had glass transition temperature in the range of 200–230 °C and the temperature of 5% weight loss in the range of 520–590 °C under nitrogen. The PEIs showed excellent solubility in a variety of organic solvents due to introduction of the bulky pendant groups and were capable of forming tough films. The casting films of PEIs (80–91 μm in thickness) had tensile strengths in the range from 88 to 117 MPa, tensile modulus from 2.14 to 2.47 GPa, and elongation at break from 15 to 27%. The casting films showed UV‐Vis absorption edges at 357–377 nm, low dielectric constants of 2.73–2.82, and water uptakes lower than 0.66 wt %. The spin‐coated films of PEIs presented a minimum birefringence value as low as 0.0122 at 650 nm and low optical absorption at the optical communication wavelengths of 1310 and 1550 nm. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 3281–3289, 2010     

Synthesis and Characterization of Fluorinated Polyimide Derived from 3,3′‐Diisopropyl‐4,4′‐diaminodiphenyl‐3′′,4′′‐difluorophenylmethane

A novel aromatic diamine monomer, 3,3′‐diisopropyl‐4,4′‐diaminodiphenyl‐3′′,4′′‐difluorophenylmethane (PAFM), was successfully synthesized by coupling of 2‐isopropylaniline and 3,4‐difluorobenzaldehyde. The aromatic diamine was adopted to synthesize a series of fluorinated polyimides by polycondensation with various dianhydrides: pyromellitic dianhydride (PMDA), 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride (ODPA) and 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) via the conventional one‐step method. These polyimides presented excellent solubility in common organic solvents, such as N,N‐dimethylformamide (DMF), N,N‐dimethyl acetamide (DMAc), dimethyl sulfoxide (DMSO), N‐methyl‐2‐pyrrolidone (NMP), chloroform (CHCl₃), tetrahydrofuran (THF) and so on. The glass transition temperatures (T_g) of fluorinated polyimides were in the range of 260–306°C and the temperature at 10% weight loss in the range of 474–502°C. Their films showed the cut‐off wavelengths of 330–361 nm and higher than 80% transparency in a wavelength range of 385–463 nm. Moreover, polymer films exhibited low dielectric properties in the range of 2.76–2.96 at 1 MHz, as well as prominent mechanical properties with tensile strengths of 66.7–97.4 MPa, a tensile modulus of 1.7–2.1 GPa and elongation at break of 7.2%–12.9%. The polymer films also showed outstanding hydrophobicity with the contact angle in the range of 91.2°–97.9°.     

Synthesis and properties of cross‐linkable high molecular weight fluorinated copolyimides

A series of novel high molecular weight fluorinated co‐polyimides (Co‐PIs) containing styryl side chain based on 1,3‐bis(2‐trifluoromethyl‐4‐aminophenoxy)‐5‐(2,3,4,5‐tetrafluorophenoxy)benzene (6FTFPB) were successfully synthesized. The weight‐average molecular weights (M_ws) and polydispersities of the co‐polyimides were in the range 8.93–10.81 × 10⁴ and 1.33–1.82, respectively. The co‐polyimide film showed excellent solubility in organic solvents, high tensile properties (tensile strength exceeded 91 MPa), excellent optical transparency (cutoff wavelength at 332–339 nm and light transparencies above 89% at a wavelength of 550 nm), and high thermal stability (5% thermal weight‐loss temperature up to 510 °C). The casting and spinning films could be cross‐linked by thermal curing. The cured films show better combination property (including excellent resistance to solvents) than that of co‐polyimides. For instance, the glass transition temperature of Co‐PI‐1 (the molar weight ratio of 6FTFPB was 30%) increased from 217 to 271 °C, the tensile strength enhanced from 94 to 96 MPa, the 5% thermal weight‐loss temperature improved from 514 to 525 °C. Moreover, after cured, Co‐PI‐1 film also has a coefficient of thermal expansion (CTE) value of 60.3 ppm °C^?1, low root mean square surface roughness (R_q) at 4.130 nm and low dielectric constant of 2.60. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 349–359     

Synthesis and properties of soluble trifluoromethyl‐substituted polyimides containing laterally attached p‐Terphenyls

A new fluorinated diamine monomer, 2′,5′‐bis(4‐amino‐2‐trifluoromethylphenoxy)‐p‐terphenyl, was synthesized from the chloro‐displacement of 2‐chloro‐5‐nitrobenzotrifluoride with the potassium phenolate of 2,5‐diphenylhydroquinone, followed by hydrazine palladium‐catalyzed reduction. A series of trifluoromethyl‐substituted polyimides containing flexible ether linkages and laterally attached side rods were synthesized from the diamine with various aromatic dianhydrides via a conventional two‐step process. The inherent viscosities of the poly(amic acid) precursors were 0.84–1.26 dL/g. All the polyimides afforded flexible and tough films. The use of 4,4′‐oxydiphthalic anhydride and 2,2′‐bis(3,4‐dicarboxyphenyl)hexafluoropropane dianhydride produced essentially colorless polyimide films. Most of the polyimides revealed an excellent solubility in many organic solvents. The glass‐transition temperatures of these polyimides were recorded between 254 and 299 °C by differential scanning calorimetry, and the softening temperatures of the polymer films stayed in the range of 253–300 °C according to thermomechanical analysis. The polyimides did not show significant decomposition before 500 °C in air or under nitrogen. These polyimides also showed low dielectric constants (2.83–3.34 at 1 MHz) and low moisture absorption (0.4–2.2%). For a comparative study, a series of analogous polyimides based on the nonfluorinated diamine 2′,5′‐bis(4‐aminophenoxy)‐p‐terphenyl were also prepared and characterized. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 1255–1271, 2004     

Synthesis and properties of novel triptycene‐based polyimides

Two new triptycene‐containing bis(ether amine)s, 1,4‐bis(4‐aminophenoxy)triptycene ( 4 ) and 1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)triptycene ( 6 ), were synthesized, respectively, from the nucleophilic chloro‐displacement reactions of p‐chloronitrobenzene and 2‐chloro‐5‐nitrobenzotrifluoride with 1,4‐dihydroxytriptycene in the presence of potassium carbonate, followed by palladium‐catalyzed hydrazine reduction of the dinitro intermediates. The bis(ether amine)s were polymerized with six commercially available aromatic tetracarboxylic dianhydrides to obtain two series of novel triptycene‐based polyimides 8a – f and 9a – f by using a conventional two‐step synthetic method via thermal and chemical imidizations. All the resulting polyimides exhibited high enough molecular weights to permit the casting of flexible and strong films with good mechanical properties. Incorporation of trifluoromethyl groups in the polyimide backbones improves their solubility and decreases their dielectric constants. The fluorinated polyimides 9d and 9f derived from diamine 6 with 4,4′‐oxydiphthalic anhydride and 2,2‐bis(3,4‐dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), respectively, could afford almost colorless thin films. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2011     

Synthesis and characterization of new fluorene‐based poly(ether imide)s

A novel bis(ether anhydride) monomer, 9,9‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]fluorene dianhydride (4), was synthesized from the nitrodisplacement of 4‐nitrophthalonitrile by the bisphenoxide ion of 9,9‐bis(4‐hydroxyphenyl)fluorene (1), followed by alkaline hydrolysis of the intermediate tetranitrile and dehydration of the resulting tetracarboxylic acid. A series of poly(ether imide)s bearing the fluorenylidene group were prepared from the bis(ether anhydride) 4 with various aromatic diamines 5a–i via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s 6a–i followed by thermal cyclodehydration to the polyimides 7a–i. The intermediate poly(amic acid)s had inherent viscosities in the range of 0.39–1.57 dL/g and afforded flexible and tough films by solution‐casting. Except for those derived from p‐phenylenediamine, m‐phenylenediamine, and benzidine, all other poly(amic acid) films could be thermally transformed into flexible and tough polyimide films. The glass transition temperatures (T_g) of these poly(ether imide)s were recorded between 238–306°C with the help of differential scanning calorimetry (DSC), and the softening temperatures (T_s) determined by thermomechanical analysis (TMA) stayed in the range of 231–301°C. Decomposition temperatures for 10% weight loss all occurred above 540°C in an air or a nitrogen atmosphere. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1403–1412, 1999     

Preparation and properties of new polyimides and polyamides based on 1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)naphthalene

A novel, trifluoromethyl‐substituted, bis(ether amine) monomer, 1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)naphthalene, was synthesized through the nucleophilic displacement of 2‐chloro‐5‐nitrobenzotrifluoride with 1,4‐dihydroxynaphthalene in the presence of potassium carbonate in dimethyl sulfoxide, followed by catalytic reduction with hydrazine and Pd/C in ethanol. A series of new fluorine‐containing polyimides with inherent viscosities of 0.57–0.91 dL/g were prepared by reacting the diamine with six commercially available aromatic dianhydrides via a conventional, two‐step thermal or chemical imidization method. Most of the resulting polyimides were soluble in strong polar solvents such as N‐methylpyrrolidone and N,N‐dimethylacetamide (DMAc). All the polyimides afforded transparent, flexible, and strong films with good tensile properties. These polyimides exhibited glass‐transition temperatures (T_g's) (by DSC) and softening temperatures (by thermomechanical analysis) in the ranges of 252–315 and 254–301 °C, respectively. Decomposition temperatures for 5% weight loss all occurred above 500 °C in both air and nitrogen atmospheres. The dielectric constants of these polyimides ranged from 3.03 to 3.71 at 1 MHz. In addition, a series of new, fluorinated polyamides with inherent viscosities of 0.32–0.62 dL/g were prepared by the direct polycondensation reaction the diamine with various aromatic dicarboxylic acids by means of triphenyl phosphite and pyridine. All the polyamides were soluble in polar solvents such as DMAc and could be solution‐cast into tough and flexible films. These polyamides had T_g's between 228 and 256 °C and 10% weight‐loss temperatures above 400 °C in nitrogen or air. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 2377–2394, 2004     

Melt‐processable thermosetting polyimide: Synthesis,characterization, fusibility,and property

To obtain a melt‐processable thermosetting polyimide having a high glass‐transition temperature (T_g) and good solvent resistance, the effect of introducing a crosslinkable agent into the polymer chain ends of the melt‐processable polyimide on its physical properties was studied. The polyimide (calculated number‐average molecular weight (M_n) = 11,600 g/mol) capped with the crosslinkable agent exhibited poor melt flowability because its crosslinkable agent reacted at the processing temperature of 360 °C. To reduce the rate of crosslink reaction, two methods were investigated. One was lowering the processing temperature, and the other was decreasing the amount of crosslinkable agent. The low‐molecular‐weight oligomer (calculated M_n = 6300 g/mol) capped with the crosslinkable agent exhibited good melt flowability at the lower processing temperature of 340 °C where the crosslinkable agent did not react. However, the obtained molded part of this oligomer was too brittle to maintain its shape. However, the polyimide (calculated M_n = 11,600 g/mol) partially capped with the crosslinkable agent demonstrated good melt flowability at the processing temperature of 360 °C. Furthermore, the molded part of this resin was strong and tough. In addition, the cured part exhibited high T_g and good solvent resistance. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 2395–2404, 2004     

Synthesis and characterization of highly refractive polyimides from 4,4′‐thiobis[(p‐phenylenesulfanyl)aniline] and various aromatic tetracarboxylic dianhydrides

An aromatic sulfur‐containing diamine 4,4′‐thiobis[(p‐phenylenesulfanyl) aniline] (3SDA) was synthesized and polymerized with a sulfur‐containing dianhydride 4,4′‐[p‐thiobis(phenylenesulfanyl)]diphthalic anhydride (3SDEA) and three nonsulfur aromatic tetracarboxylic dianhydrides, respectively to afford four poly(amic acid)s (PAAs) with the inherent viscosities of 0.54–1.04 dL/g. Flexible and tough polyimide (PI) films obtained from the PAA precursors showed good thermal, mechanical, and optical properties. The glass transition temperatures (T_gs) of the PIs ranged from 179.1–227.2 °C determined by differential scanning calorimetry (DSC), and 173.8–227.3 °C by dynamic mechanical analysis (DMA), depending on the dianhydride used. The 10% weight loss temperatures were in the range of 500–536 °C, showing high intrinsic thermal‐resistant characteristics of the PI films. The PI films also showed good optical transparency above 500 nm, which agreed well with the calculated absorption spectra using the time‐dependent density functional theory. The average refractive indices (n_av) measured at 632.8 nm were 1.7191–1.7482, and the in‐plane/out‐of‐plane birefringences (Δn) were 0.0068–0.0123. The high refractive indices originate from the high sulfur contents, good molecular packing, and the absence of bulky structures. The relatively small birefringence mainly results from the flexible thioether linkages structures of the diamine. © 2007 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 5606–5617, 2007