Measurement of thermal expansion coefficient of nonuniform temperature specimen

A new technique is developed to measure the longitudinal thermal expansion coefficient of C/C composite material at high temperature. The measuring principle and components of the apparatus are described in detail. The calculation method is derived from the temperature dependence of the thermal expansion coefficient. The apparatus mainly consists of a high temperature environmental chamber, a power circuit of heating, two high-speed pyrometers, and a laser scanning system. A long solid specimen is resistively heated to a steady high-temperature state by a steady electrical current. The temperature profile of the specimen surface is not uniform because of the thermal conduction and radiation. The temperature profile and the total expansion are measured with a high-speed scanning pyrometer and a laser slit scanning measuring system, respectively. The thermal expansion coefficient in a wide temperature range (1000 - 3800 K) of the specimen can therefore be obtained. The perfect consistency between the present and previous results justifies the validity of this technique.     

On the use of the photoacoustic technique for the measurement of the thermomechanical properties of semiconductor two-layer systems

The photoacoustic technique is used in semiconductor two-layer systems for the determination of thermal properties and thermal expansion coefficient. The two-layer systems studied were amorphous silicon-glass and Al_0.2Ga_0.8As---GaAs. Our results show that the proposed method is a reliable technique for the characterization of other semiconductor two-layers systems.     

The heat transfer coefficient during the solidification of aluminum

The heat transfer coefficient was measured during the solidification of molten aluminum (minimum purity 99.7 wt.% Al). Heat transfer coefficients were obtained with solidification proceeding vertically downward. Heat transfer during solidification is shown to be a complex process controlled by the macroscale of the thermal expansion and contraction of the mold. The experimental technique applied to determine the heat transfer coefficient is based on the assumption of one-dimensional heat transfer.     

基于原子间相互作用的低温硅单晶负热膨胀机制的研究

运用晶格热膨胀的微扰理论,推导了硅晶体的热膨胀系数与原子间两体作用和三体作用的三阶力常数之间的关系公式,在此基础上对热膨胀系数的实验数据进行拟合,计算了硅晶体内的原子间两体和三体的三阶力常数,发现三体作用的三阶力常数为正数,是硅晶体在低温下具有负热膨胀性质的根本原因。计算与分析的结果表明,运用Stillinger-Weber模型得到的三阶力常数为负数,据此不可能计算得到低温下的负热膨胀系数,因此应该对该模型进行修正。     

碱金属卤化物键长、德拜温度和热膨胀系数的温度效应

以碱金属卤化物为研究对象,根据局域键平均近似方法,从热膨胀系数的定义出发,建立热膨胀系数和键长的温度效应函数表达式。定量获取碱金属卤化物的键长、刚性因子、德拜温度和热膨胀系数。结果表明：①碱金属卤化物的热膨胀系数与结合能成反比;②同类碱金属卤化物中,从氟碱化物到碘碱化物德拜温度逐渐减小而热膨胀系数逐渐增大;③碱金属卤化物的键长在其德拜温度的三分之一处,由非线性转变为线性热伸长。     

基于原子间相互作用的低温硅单晶负热膨胀机制的研究

运用晶格热膨胀的微扰理论,推导了硅晶体的热膨胀系数与原子间两体作用和三体作用的三阶力常数之间的关系公式,在此基础上对热膨胀系数的实验数据进行拟合,计算了硅晶体内的原子间两体和三体的三阶力常数,发现三体作用的三阶力常数为正数,是硅晶体在低温下具有负热膨胀性质的根本原因。计算与分析的结果表明,运用Stillinger-Weber模型得到的三阶力常数为负数,据此不可能计算得到低温下的负热膨胀系数,因此应该对该模型进行修正。     

Thermal expansion of nanostructured PbS films and anharmonicity of atomic vibrations

The dependences of the coherent scattering region size and thermal expansion coefficient α of a PbS nanofilm on the annealing temperature in the range of 293–473 K and on the duration of annealing at a constant temperature of 423 K have been measured. It has been found that the thermal expansion coefficient α of the PbS nanofilm is almost twice as much as the coefficient α of coarse-grained lead sulfide. It has been shown that the large difference in the coefficients α is associated with the small size of particles in the film, which leads to an increase in the anharmonicity of atomic vibrations. The contribution from the small size of particles to the thermal expansion coefficient of the PbS nanofilm has been evaluated theoretically.     

Thermal expansion and compressibility of β-As4S3

Temperature and pressure variation of the lattice constants and unit cell volume have been studied with the help of low temperature Guinier-Simon film technique and energy dispersive high pressure X-ray diffraction. Volume thermal expansion coefficient at room temperature and its derivative have been obtained by fitting the experimental data with volume-temperature equation obtained from purely thermodynamic considerations. Similarly bulk modulus at ambient pressure and its derivative with respect to pressure have been obtained by fitting volume-pressure data with the Murnaghan equation of state. The anisotropy of thermal expansion coefficient and the compressibility have been discussed.     

传感器电解质材料热膨胀性能和热稳定性变化规律研究

以ZrO2固体电解质材料为例,研究氧传感器电解质材料原子振动特点和热膨胀系数及其热稳定性随温度和时间的变化规律,探讨原子非简谐振动的影响。结果表明：原子振动的频率、阻尼系数,在简谐近似下为常数,在考虑到非简谐效应后随温度升高而增大;原子平均位移和热膨胀系数在简谐近似下为零,在考虑到非简谐效应后随温度升高而增大,随的时间的增长而减小;热膨胀性能稳定性温度系数随温度的升高而减小,随时间的增长而增大,即使用时间越长,材料的热膨胀性能稳定性越低;温度越高,热膨胀性能越稳定;非简谐情况下的原子振动的频率、阻尼系数和热膨胀系数与简谐近似下的差值随温度的升高而增大,即温度越高,非简谐效应越显著。     

Thermal expansivity and bulk modulus of ZnO with NaCl-type cubic structure at high pressures and temperatures

The thermal expansivity and bulk modulus of ZnO with NaCl-type cubic structure were estimated by using the constant temperature and pressure molecular dynamics technique with effective pair potentials which consist of the Coulomb, dispersion, and repulsion interaction at high pressures and temperatures. It is shown that the calculated thermodynamic parameters including linear thermal expansion coefficient, isothermal bulk modulus and its pressure derivative are in good agreement with the available experimental data and the latest theoretical results. At an extended pressure and temperature ranges, linear thermal expansion coefficient and isothermal bulk modus have also been predicted. The thermodynamic properties of ZnO with NaCl-type cubic structure are summarized in the pressure 0–150 GPa ranges and the temperature up to 3000 K.     

硅纳米晶体薄膜热膨胀性质的分子动力学研究

基于Stillinger-Weber势对硅纳米晶体薄膜的热膨胀性质进行了分子动力学模拟。研究表明,硅纳米晶体薄膜表面层原子的二聚现象引起薄膜收缩,而原子之间的非和谐势能引起薄膜膨胀;在约400K以下的低温段,由于硅纳米晶体薄膜表面层原子发生二聚的原子数目随温度的升高而明显增多,而原子间非和谐势能很小,故此时二聚主导热膨胀性质,热膨胀系数为负;在高温段（约400K以上）,由于发生二聚的原子数目随温度升高不再显著地增加并渐趋于稳定,而原子间非和谐势能逐渐显著并主导热膨胀性质,故热膨胀系数为正。     

Calculating the melting curves by the thermodynamic data matching method: Platinum-group refractory metals (Ru,Os, and Ir)

A technique for reconstructing thermal properties, including the melting curve, of refractory metals based on the use of experimental data on caloric properties available up to the melting point and some regularities of the Debye–Grüneisen theory has been proposed. The calculation result is the consistent system of high-temperature thermal data, including the thermal expansion coefficient, solid-phase density, and volume jump upon melting. This technique was tried-out on refractory platinum-group metals based on experimental data on the enthalpy of the metals and confirmed by consistency with a thermodynamic calculation using shock-wave experiments and results obtained by the quantum molecular dynamics method.     

折射率与电声子相互作用的关系

从微观出发研究电声子相互作用对折射率的影响。用半经典方法导出一个适用于晶态和无序度小的介质折射率公式和折射率温度系数公式。首次指出电声子相互作用引起的折射率温度系数,高温时为一常数,低温时与T~3成正比。并与实验作了对比,理论曲线与实验符合得很好。用得到的公式计算了好几种材料的温度系数。计算值与实验值相符合。     

纳米单原子链的热膨胀性质

根据戴逊方程,推导了纳米单原子链的位移-位移Green函数,并得到了声子占有数表象中原子位移与哈密顿的表达式.在这些结果的基础上,应用微扰理论,推导了热膨胀和热膨胀系数的计算公式,并进行了数值计算.研究结果表明,在有限温度下,纳米单原子链中靠近两端的原子间距的热膨胀大于内部的原子间距的热膨胀,而原子链中靠近两端的原子间距的热膨胀系数小于内部的原子间距热膨胀系数.原子链的长度越短,则所有原子间距热膨胀的平均值越大,而原子链的热膨胀系数越小.     

非简谐振动对SiC的热膨胀系数数和介电性能的影响

利用抛物型电子能谱模型,考虑到原子的非简谐振动,求出了SiC中原子振动的简谐系数与非简谐系数,用固体物理理论和方法,得到了SiC的热膨胀系数和格林乃森参量以及介电常数随温度变化的解析式,探讨了原子非简谐振动对的影响。结果表明：的格林乃森参量和热膨胀系数均随温度升高而非线性增大,而介电常数随温度升高而非线性减小;原子振动的非简谐项（特别是第二非简谐项）对的热膨胀等热学性质和介电性能有重要影响,温度愈高,非简谐振动项的影响愈大。     

金属橡胶热物理性能理论与试验研究

针对金属橡胶材料在高温环境下的热稳定性能和热传导性能, 基于金属橡胶的内部基本组分以及特殊的编织制作工艺, 构建了两种典型排列微元体结构, 并以此描述微元体在三种接触状态下的热膨胀特性, 提出了金属橡胶热膨胀Schapery分析模型, 从理论上解释了金属橡胶热膨胀的产生机理.根据金属橡胶基本组成单元的传热模式, 研究了金属橡胶的传热过程.利用热电比拟法和有限元法, 分析微元体的导热性能, 结合微元体的分布形式, 提出了金属橡胶的导热分析模型.试验测试了不同相对密度金属橡胶的热膨胀和热传导性能, 验证了金属橡胶热膨胀和导热特性分析理论模型的适用性.所得到的金属橡胶的热膨胀和热传导性能理论模型和试验结果, 为金属橡胶材料在高温环境下的热物理特性分析提供了理论基础和计算分析依据. 关键词： 金属橡胶 热膨胀 热传导 金属丝螺旋卷     

Linear dependence of the phonon thermal resistance of nonmetallic crystals on the isobaric thermal strain

This paper reports on the results of investigations into the thermal resistance W and thermal expansion coefficient β for single-crystal samples of Si, SiO₂, Al₂O₃, and NaCl. The available experimental data on the thermal resistance and thermal expansion coefficient for materials with different types of interatomic bonding and different Landau criteria for convection are analyzed. It is demonstrated that the reduced phonon thermal resistance is equal to the isobaric thermal strain at any temperature.     

一种新颖的光纤光栅温度调谐装置的原理与实验研究

提出了一种新颖的光纤光栅温度调谐方案，并将按此方案制作的调谐装置命名为双肩梁，详细分析了其原理.设计制作了一套双肩梁调谐装置，并对其进行了实验研究.实验中得到了0.436nm/℃的温度调谐效率，把所用光纤光栅的温度灵敏度提高了50倍之多.调谐具有很好的线性和可重复性.该装置最大的优点在于它突破了以往热调谐方法中驱动材料热膨胀系数的限制，使得温度调谐效率可以根据实际需要进行灵活设计，从而具有很大的灵活性.该装置在激光器调谐、高灵敏度温度传感以及传感解调等领域有着很大的潜在应用价值. 关键词： 光纤光栅 调谐 双肩梁 温度调谐     

光波导覆层热膨胀系数对应力双折射影响的分析

用有限元方法计算了硅基光波导器件的应力，得到由应力引起的双折射，从理论上分析了内应力对器件偏振特性的影响。得出结论：硅基与其它层材料热膨胀系数的不同，是引起芯区双折射的主要因素，通过掺杂、调整覆层的热膨胀系数，可以得到双折射系数较小的光波导。     

Investigation of mixed rare-earth element—alkaline-earth element chromites

Electrical conductivity and the coefficient of thermal expansion of mixed rare-earth element-alkaline-earth element chromites as a function of rare-earth element's ordinal number are investigated. It is shown that the electrical conductivity and the coefficient of thermal expansion are a function of the rare-earth element's ordinal number. Explanations of these dependences are given.