Vertically aligned N-doped carbon nanotubes by spray pyrolysis of turpentine oil and pyridine derivative with dissolved ferrocene

Vertically aligned nitrogen-doped carbon nanotubes were synthesized from the pyrolysis of a mixture of turpentine oil, 4-tert-butylpyridine (C₉H₁₃N) and ferrocene on silicon and quartz substrate in nitrogen atmosphere at 700 °C by simple spray pyrolysis technique. SEM, TEM, TGA/DTA, Raman spectroscopy, XPS and electron probe micro analysis (EPMA) techniques were used to characterize the structural analysis and composition of the as-grown N-doped carbon nanotubes. Morphology of the films was greatly affected by the nature of the substrate. From the XPS and EPMA data, it was found that nitrogen content of the nanotubes were 1.6 at.% and 2 at.% on silicon and quartz substrate, respectively. Our studies show that two different types of N atoms can be present in these materials. These are ‘pyridinic’ and ‘graphitic’ nitrogen with binding energies of 398.2 eV and 400.4 eV, respectively. Raman spectroscopy reveals that graphitization of carbon nanotubes grown on silicon is better than nanotubes grown on quartz substrate. Thermogravimetric analysis showed that the thermal stability of as-prepared nanotubes grown on silicon substrate is higher than the nanotubes deposited on quartz substrate.     

Different substrate materials effect on structure of ta-C films by Raman spectroscopy for magnetic recording sliders

Raman spectra, using visible (514 nm) and ultraviolet (244 nm) excitation, of tetrahedral amorphous carbon (ta-C) films of thickness of 5 nm have been studied as a function of different substrates materials. These materials are Fe-Co (Fe: 67 at.%, Co: 33 at.%) alloy, Fe-Ni alloy (Fe: 18 at.%, Ni: 82 at.%), Au and Al₂O₃-TiC (Al₂O₃: 64 at.%, TiC: 36 at.%), which are mainly used in magnetic recording sliders. The spectra show that the films deposited on Al₂O₃-TiC contain the highest sp³ content, with a lower sp³ content observed in films deposited to Fe-Co and Fe-Ni alloys. The lowest sp³ content was observed in films on the Au substrate. The results also indicate that the anti-wear performance of ta-C film on different substrates varies as Al₂O₃-TiC (the best) > Fe-Co and Fe-Ni alloy > Au (the worst). Also mechanisms are proposed to explain the effect of substrate material on these thin film properties.     

Electrical and corrosion properties of the Ti5Si3 thin films coated on glass substrate by APCVD method

Ti₅Si₃ thin films were coated on glass substrate by atmospheric pressure chemical vapor deposition method at different temperatures. Electrical and corrosion properties of the thin films were investigated. The results show that the electrical resistivity of the thin films decreases initially with the increase in deposition temperature. However, it increases with the further increase of the temperature. The lowest electrical resistivity of 107 μΩ⋅cm is obtained at 710 °C. The least corrosion rates of the thin films at 95 °C of 0.10 nm/min and 0.13 nm/min in 1 N and 10 N acid solution and of 0.33 nm/min and 6.55 nm/min in 1 N and 10 N alkali solution, respectively, are obtained by weight-loss measurement method. The corrosion mechanisms of the thin films were also discussed in detail.     

Optical and electrical properties of lithium doped nickel oxide films deposited by spray pyrolysis onto alumina substrates

Non-doped and lithium doped nickel oxide crystalline films have been prepared onto quartz and crystalline alumina substrates at high substrate temperature (600 °C) by the pneumatic spray pyrolysis process using nickel and lithium acetates as source materials. The structure of all the deposited films was the crystalline cubic phase related to NiO, although this crystalline structure was a little bit stressed for the films with higher lithium concentration. The grain size had values between 60 and 70 nm, almost independently of doping concentration. The non-doped and lithium doped films have an energy band gap of the order of 3.6 eV. Hot point probe results show that all deposited films have a p-type semiconductor behavior. From current–voltage measurements it was observed that the electrical resistivity decreases as the lithium concentration increases, indicating that the doping action of lithium is carried out. The electrical resistivity changed from 10⁶ Ω cm for the non-doped films up to 10² Ω cm for the films prepared with the highest doping concentration.     

Characterization of hydrogenated amorphous silicon thin films prepared by magnetron sputtering

Magnetron sputtered hydrogenated amorphous silicon (a-Si:H) thin films have been characterized. Hydrogen (H₂) with argon (Ar) was introduced into the sputtering chamber to create the plasma. A sudden increase in the deposition rate occurred when the hydrogen was added. The maximum hydrogen content of 16 atomic percent (at.%) was achieved and a bandgap of about 2.07 eV was determined from the spectral investigations of the hydrogenated films. The effect of radio frequency (RF) power on the deposition rate, as well as on the hydrogen content was investigated. To change the hydrogen content in the films, the hydrogen flow rate was varied while keeping the argon flow rate constant. The hydrogen content in the films increased with increasing hydrogen flow rate up to the maximum content of 16 at.% and then decreased for further increases in hydrogen flow.     

Surface smoothing of sputter deposited amorphous CNx films by silicon addition

Amorphous carbon nitride (CN_x) films with silicon addition up to 16 at.% are sputter deposited on Si(1 0 0) substrate, and the surface morphology is studied with scaling method based on atomic force microscopy. The surface roughness σ, the roughness exponent α, and the lateral correlation length ξ decrease with silicon content of the films, reaching 0.33 nm, 0.80 and 50 nm, respectively, for the film with [Si] = 16 at.%. The addition of silicon in the films leads to additional Si-N, Si-C-N and CN bonds revealed by Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy. The films undergo a structural transition from columnar to smooth morphology in cross-section with silicon addition demonstrated by field emission scanning electron microscopy. Nano-sized clusters sparsely dispersed in amorphous matrix of the film with [Si] = 16 at.% are observed by high-resolution transmission microscopy. According to the surface growth mechanism in which surface diffusion and geometrical shadowing drive structural and morphological evolution of the sputter deposited films, surface smoothing of the amorphous CN_x films by silicon addition is explained by the formation of Si-N and Si-C-N bonds that impede surface diffusion of the adsorbed species during film growth, which leads to the reduced size of the columnar structures.     

Structural,electrical and optical properties of SnO2 films deposited on Y-stabilized ZrO2 (1 0 0) substrates by MOCVD

SnO₂ films have been deposited on Y-stabilized ZrO₂ (YSZ) (1 0 0) substrates at different substrate temperatures (500–800 °C) by metalorganic chemical vapor deposition (MOCVD). Structural, electrical and optical properties of the films have been investigated. The films deposited at 500 and 600 °C are epitaxial SnO₂ films with orthorhombic columbite structure, and the HRTEM analysis shows a clear epitaxial relationship of columbite SnO₂(1 0 0)||YSZ(1 0 0). The films deposited at 700 and 800 °C have mixed-phase structures of rutile and columbite SnO₂. The carrier concentration of the films is in the range from 1.15×10¹⁹ to 2.68×10¹⁹ cm⁻³, and the resistivity is from 2.48×10⁻² to 1.16×10⁻² Ω cm. The absolute average transmittance of the films in the visible range exceeds 90%. The band gap of the obtained SnO₂ films is about 3.75–3.87 eV.     

Influence of annealing on the physical properties of filtered vacuum arc deposited tin oxide thin films

Tin oxide (SnO₂) thin films were deposited on UV fused silica (UVFS) substrates using filtered vacuum arc deposition (FVAD). During deposition, the substrates were at room temperature (RT). As-deposited films were annealed at 400 and 600 °C in Ar for 30 min. The film structure, composition, and surface morphology were determined as function of the annealing temperature using X-ray diffraction (XRD), atomic force microscopy (AFM), and X-ray photoelectron spectroscopy (XPS). The XRD patterns of the SnO₂ thin films deposited on substrates at RT indicated that the films were amorphous, however, after the annealing the film structure became polycrystalline. The grain size of the annealed films, obtained from the XRD analysis, increased with the annealing temperature, and it was in the range 8-34 nm. The AFM analysis of the surface revealed an increase in the film surface average grain size from 15 nm to 46 nm, and the surface roughness from 0.2 to 1.8 nm, as function of the annealing temperature. The average optical transmission of the films in the visible spectrum was >80%, and increased by the annealing ∼10%. The films’ optical constants in the 250-989 nm wavelength range were determined by variable angle spectroscopic ellipsometry (VASE). The refractive indexes of as-deposited and annealed films were in the range 1.83-2.23 and 1.85-2.3, respectively. The extinction coefficients, k(λ), of as-deposited and annealed films were in the range same range ∼0-0.5. The optical energy band gap (E_g), as determined by the dependence of the absorption coefficient on the photon energy at short wavelengths, increased with the annealing temperature from 3.90 to 4.35 eV. The lowest electrical resistivity of the as-deposited tin oxide films was 7.8 × 10⁻³ Ω cm, however, film annealing resulted in highly resistive films.     

Electrical properties of a-Ge-Se-In thin films

Steady state and transient photoconductivity has been measured on Ge₂₀Se_80−xIn_x (x = 0, 5, 10, 15, 20) vacuum evaporated thin films. Study of temperature dependent dark conductivity σ_d and photoconductivity σ_ph measurements in the temperature range 303-375 K, shows that the conduction in this glass is through an activated process having single activation energy. The activation energy value of photoconduction is smaller in comparison to activation energy in dark. The photosensitivity shows a maximum value at 10 at.% of In concentration. This is attributed to the decrease in the density of defect states of Ge-Se alloy with increase of In content. The results of intensity dependent steady state photoconductivity σ_ph follow a power law with intensity (F), i.e. σ_ph α F^γ where the value of power γ lies between 0.5 and 1.0, suggesting bimolecular recombination. Rise and decay of photocurrent for different concentration of In shows that photocurrent rises monotonically to the steady state value and the decay of photocurrent is also very fast. An attempt has been made to explain the results on the basis of defects and density of states.     

Influence of deposition conditions on nanocrystalline InN layers synthesized on Si(1 1 1) and GaN templates by RF sputtering

We present a detailed investigation on the influence of deposition conditions on morphological, structural and optical properties of InN films deposited on Si(1 1 1) and GaN-on-sapphire templates by reactive radio-frequency (RF) sputtering. The deposition parameters under study are nitrogen content in the sputtering gas, substrate–target distance, substrate temperature and RF power. X-ray diffraction measurements confirm the (0 0 0 1) preferred growth orientation and the wurtzite crystallographic structure of the material. For optimized deposition conditions, InN on Si(1 1 1) substrates presents smooth surface with root-mean-square roughness ∼1 nm. Surface quality of the InN films can be further improved by deposition on GaN-on-sapphire templates, achieving root-mean-square roughness as low as ∼0.4 nm, comparable to that of the underlying substrate. The room-temperature absorption edge is located at 1.70 eV. Intense low-temperature photoluminescence peaking at 1.60 eV is observed.     

SIMS and Raman characterizations of ZnO:N thin films grown by MOCVD

Nitrogen was incorporated into ZnO films grown by metalorganic chemical vapour deposition (MOCVD) on ZnO substrates using DMZn-TEN, tert-butanol and diallylamine, respectively, as zinc, oxygen and doping sources. The carrier gas was either hydrogen or nitrogen and the partial pressure ratio (R_VI/II) was varied in order to favor the nitrogen incorporation and/or reduce carbon related defects. The ZnO films have been characterized by Micro-Raman scattering and SIMS measurements. SIMS measurements confirm the nitrogen incorporation with concentrations extending from ∼10¹⁹ cm⁻³ to ∼4×10²⁰ cm⁻³. Raman spectra show nitrogen local vibration modes in films grown at low R_VI/II ratio and using H₂ as carrier gas. However, a vibration band attributed to carbon clusters dominates the Raman spectra for films grown with N₂ carrier. The contribution of N complexes was discussed. The strain was calculated for the as-grown and annealed films and it changes from tensile to compressive after annealing.     

Influence of the deposition parameters on the microstructure and opto-electrical properties of hydrogenated nanocrystalline silicon films by HW-CVD

Hydrogenated nanocrystalline silicon (nc-Si:H) films were prepared at high deposition rates (> 13 Å/s) from pure silane without hydrogen dilution by hot wire deposition method by varying filament-to-substrate distance (d_s-f). In this study we have systematically and carefully investigated the effect of filament-to-substrate distance on structural, optical and electrical properties of the Si:H films. A variety of characterization techniques, including Raman spectroscopy, low angle X-ray diffraction (XRD), Fourier transform infrared (FTIR) spectroscopy, Atomic Force Microscopy (AFM), Field Emission Scanning Electron Microscopy (FE-SEM), UV-Visible-NIR spectroscopy and electrical dark and photoconductivity measurement were used to characterize these films. Films deposited at d_s-f > 5 cm are amorphous while those deposited at d_s-f < 5 cm are biphasic; a crystalline phase and an amorphous phase with nano-sized crystallites embedded in it. Low angle X-ray diffraction analysis showed that the crystallites in the films have preferential orientation along (111) directions. Decrease in d_s-f, the crystallinity and crystalline size increases whereas hydrogen bonding shifts from mono-hydride (SiH) to di-hydride (SiH₂) and poly-hydride (SiH₂)_n complexes. The band gaps of nc-Si:H films (~ 1.9-2.0 eV) are high compared to the a-Si:H films, while hydrogen content remains < 10 at.%. We attribute the high band gap to the quantum size effect. A correlation between electrical and structural properties has been established. Finally, from the present study it has been concluded that the filament-to-substrate distance is a key process parameter to induce the crystallinity in the films by hot wire method. The ease of depositing films with variable crystallite size and its volume fraction, and tunable band gap is useful for fabrication of tandem/micro-morph solar cells.     

Spectroscopic ellipsometry studies of reactively sputtered nitrogen-rich GaAsN films

Nitrogen-rich GaAsN thin films have been deposited at 500 °C by reactive rf sputtering of GaAs target in argon-nitrogen atmosphere. The arsenic content of the films was varied by changing the nitrogen percentage in the sputtering atmosphere and the As/Ga ratio in the films was estimated by X-ray fluorescence measurements. Spectroscopic ellipsometry measurements have been carried out on these films and the measured ellispometric spectra were fitted with theoretical spectra generated by using suitable model sample structures. From the best fit parameters of the dispersion model, band-gap values and variation of refractive index and extinction coefficient as a function of wavelength have been obtained for films deposited with different percentages of nitrogen in the sputtering atmosphere. The films deposited with 12% to 100% nitrogen in the sputtering atmosphere, which are of hexagonal GaN, exhibit GaN-like optical properties, though effects due to excess arsenic in amorphous phase are seen in the films deposited with less than 40% nitrogen. The films deposited with 5% to 12% nitrogen in sputtering atmosphere are dominantly polycrystalline GaAs_xN_1−x (x ≈ 0.01 to 0.08) and exhibit variations in optical parameters, which are consistent with their structure and composition. The films deposited with less than 5% nitrogen in sputtering atmosphere are arsenic-rich and amorphous.     

1H-1,2,3-triazole,a promising precursor for chemical vapor deposition of hydrogenated carbon nitride

Well-crystallized hydrogenated carbon nitride thin films have been prepared by microwave plasma enhanced chemical vapor deposition (MWPECVD). 1H-1,2,3-triazole+N₂ and Si (1 0 0) were used as precursor and substrate, respectively. Substrate temperature during the deposition was recorded to be 850 °C. The synthesized samples were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), and X-ray photo-electron spectroscopy (XPS) analyses. The plasma compositions were checked by optical emission spectroscopy (OES). XRD observation strongly suggests that the films contain polycrystalline carbon nitride with graphitic structure of (1 0 0), (0 0 2), (2 0 0) and (0 0 4). XPS peak quantification reveals that the atomic ratio of the materials C:N:O:Si is 32:41:18:9. X-ray photo-electron peak deconvolution shows that the most dominant peak of C (1s) and N (1s) narrow scans correspond to sp² hybrid structure of C₃N₄. These observations indicate that 1H-1,2,3-triazole favors the formation of hydrogenated carbon nitride with graphitic phase by CVD method and thus is in good agreement with XRD results. SEM of surface and OES of plasma also support the formation of polycrystalline carbon nitride films from 1H-1,2,3-triazole+N₂ by CVD.     

Electrical conductivity of NbN-SiO2 films obtained by ammonolysis of Nb2O5-SiO2 sol-gel derived coatings

The studies of electrical conductivity of NbN-SiO₂ films are reported. To obtain these films, sol-gel derived xNb₂O₅-(100 − x)SiO₂ (where x = 100, 90, 80, 70, 60, 50 mol%) coatings were nitrided at 1200 °C. The nitridation process leads to the formation of some disordered structures, with NbN metallic grains dispersed in insulating SiO₂ matrix. The structure of the samples was studied using X-ray diffraction (XRD) and atomic force microscopy (AFM). The electrical conductivity was measured with the conventional four-terminal method in the temperature range from 5 to 280 K. The superconducting transition was not observed even for the sample that does not contain silica. All the samples exhibit negative temperature coefficient of resistivity. The results of conductivity versus temperature may be described on the grounds of a model proposed for a weakly disordered system.     

MOVPE growth of InN films using 1,1-dimethylhydrazine as a nitrogen precursor

InN films have been successfully grown on sapphire substrates by MOVPE using trimethylindium (TMIn) and 1,1-dimethylhydrazine (DMHy) with N₂ carrier. DMHy is an advantageous precursor of N as it decomposes efficiently at relatively low temperature (T₅₀=420 °C) compatible with the InN growth. The reactor is specially designed so as to avoid parasitic reaction between TMIn and DMHy occurring at room temperature. The growth feature was studied by varying growth temperature, V/III ratio, TMIn flow and reactor pressure. The InN films were obtained at 500–570 °C and 60–200 Torr with a V/III ratio optimized to 100–200. The In droplets are seen on the grown surfaces, indicating an excess supply of TMIn. It is demonstrated that the InN films grows on the sapphire substrate in a single domain with an epitaxial relationship, [1 01¯ 0]_InN//[1 1 2¯ 0]_sapphire.     

Growth of cubic InN films with high phase purity by pulsed laser deposition

Cubic InN films have been grown on MgO (1 0 0) substrates with cubic GaN buffer layers by pulsed laser deposition (PLD). It has been found that cubic InN (1 0 0) films grow on the GaN (1 0 0)/MgO (1 0 0) structure with an in-plane epitaxial relationship of [0 0 1]_InN∥[0 0 1]_GaN∥[0 0 1]MgO. The phase purity of a cubic InN film grown at 440 °C was as high as 99% that can probably be attributed to the enhanced surface migration of film precursors in case of PLD. These results indicate that PLD is a suitable technique for the growth of high-quality cubic InN films, and will makes it possible to fabricate optical and electron devices based on cubic InN films.     

Dependence of RF power on the phase transformation for boron nitride films deposited on graphite at room temperature

Cubic boron nitride (cBN) thick films deposited on mainly c-axis-oriented graphite substrate at room temperature and zero bias by radio frequency (RF) magnetron sputtering were studied. In the growth process, RF power plays a key role in determining the content of cubic phase in films, while the conventional substrate heating and biasing have been neglected. With increase in RF power, the dominated content of films converts from explosion boron nitride (eBN) to cBN. The transformation mechanism has been discussed. The unique structural properties of the “soft” graphite are favorable to propose simple conditions for growing “hard” cBN films. Furthermore, the optical band gap of BN films having ∼90% cubic phase is of ∼5.8 eV obtained from ultraviolet–visible optical transmission measurement. The electron field emission examination shows that cBN film on graphite has a high emission current density of 2.8×10⁻⁵ A/cm² at an applied field of ∼30 V/μm.     

Effect of N2/CH4 flow ratio on microstructure and composition of hydrogenated carbon nitride films prepared by a dual DC-RF plasma system

Hydrogenated carbon nitride (a-CN:H) films were deposited on n-type (1 0 0) silicon substrates making use of direct current radio frequency plasma enhanced chemical vapor deposition (DC-RF-PECVD), using a gas mixture of CH₄ and N₂ as the source gas in range of N₂/CH₄ flow ratio from 1/3 to 3/1 (sccm). The deposition rate, composition and bonding structure of the a-CN:H films were characterized by means of X-ray photoelectron spectroscopy (XPS) and Fourier-transform infrared spectrometry (FTIR). The mechanical properties of the deposited films were evaluated using nano-indentation test. It was found that the parameter for the DC-RF-PECVD process had significant effects on the growth rate, structure and properties of the deposited films. The deposition rate of the films decreased clearly, while the N/C ratio in the films increased with increasing N₂/CH₄ flow ratio. CN radicals were remarkably formed in the deposited films at different N₂/CH₄ flow ratio, and their contents are related to the nitrogen concentrations in the deposited films. Moreover, the hardness and Young’s modulus of the a-CN:H films sharply increased at first with increasing N₂/CH₄ flow ratio, then dramatically decreased with further increase of the N₂/CH₄ flow ratio, and the a-CN:H film deposited at 1/1 had the maximum hardness and Young’s modulus. In addition, the structural transformation from sp³-like to sp²-like carbon-nitrogen network in the deposited films also was revealed.     

Growth of GaN films on PLD-deposited TaC substrates

GaN films were grown by metal organic chemical vapor deposition on TaC substrates that were created by pulsed laser deposition of TaC onto (0 0 0 1) SiC substrates at ∼1000 °C. This was done to determine if good quality TaC films could be grown, and if good quality GaN films could be grown on this closely lattice matched to GaN, conductive material. This was done by depositing the TaC on on-axis and 3° or 8° off-axis (0 0 0 1) SiC at temperatures ranging from 950 to 1200 °C, and examining them using X-ray diffraction, scanning electron microscopy, atomic force microscopy, and transmission electron microscopy. The GaN films were grown on as-deposited TaC films, and films annealed at 1200, 1400, or 1600 °C, and examined using the same techniques. The TaC films were polycrystalline with a slight (1 1 1) texture, and the grains were ∼200 nm in diameter. Films grown on-axis were found to be of higher quality than those grown on off-axis substrates, but the latter could be improved to a comparable quality by annealing them at 1200–1600 °C for 30 min. TaC films deposited at temperatures above 1000 °C were found to react with the SiC. GaN films could be deposited onto the TaC when the surface was nitrided with NH₃ for 3 min at 1100 °C and the low temperature buffer layer was AlN. However, the GaN did not nucleate easily on the TaC film, and the crystallites did not have the desired (0 0 0 1) preferred orientation. They were ∼10 times larger than those typically seen in films grown on SiC or sapphire. Also the etch pit concentration in the GaN films grown on the TaC was more than 2 orders of magnitude less than it was for growth on the SiC.