Cure behavior of epoxy resin/MMT/DETA nanocomposite

The Flory's gelation theory, non-equilibrium thermodynamic fluctuation theory and Avrami equation have been used to predict the gel time t _g and the cure behavior of epoxy resin/organo-montmorillonite/diethylenetriamine intercalated nanocomposites at various temperatures and organo-montmorillonite loadings. The theoretical prediction is in good agreement with the experimental results obtained by dynamic torsional vibration method, and the results show that the addition of organo-montmorillonite reduces the gelation time t _gand increases the rate of curing reaction, the value of k, and half-time of cure after gelation point t_1/2 decreases with the increasing of cure temperature, and the value of n is ~2 at the lower temperatures (<60°C) and decreases to ~1.5 as the temperature increases, and the addition of organo-montmorillonite decreases the apparent activation energy of the cure reaction before gelation point, but has no apparent effect on the apparent activation energy of the cure reaction after gelation point. There is no special curing process required for the formation of epoxy resin/organo-montmorillonite/diethylenetriamine intercalated nanocomposite. This revised version was published online in July 2006 with corrections to the Cover Date.     

不饱和聚酯/有机蒙脱土复合材料的固化动力学

用动态扭振法研究不饱和聚酯／有机蒙脱土复合材料的固化动力学行为。结果表明该实验体系能够很好地应用Flory理论和Avami方程进行拟合。用非平衡态热力学涨落理论对纳米复合材料的固化作了理论顸估,顸估结果与实验固化曲线有很好的相符性。有机蒙脱土的加入降低了不饱和聚酯的固化反应速率,对固化反应表现活化能和复合材料的形成过程没有很大的影响。根据实验结果分析不饱和聚酯在有机蒙脱土存在下的固化分为定型和熟化两个阶段,在一定的固化温度和填充含量下。从动态扭振曲线上可以明显地观察到这种“二次固化”现象。     

动态扭振法研究聚甲基丙烯酸甲酯/蒙脱土纳米复合材料的本体插层聚合

用动态扭振法研究热塑性塑料聚甲基丙烯酸甲酯(PMMA)/蒙脱土(MMT)复合体系的本体插层聚合.并试用处理交联体系固化的Flory理论、非平衡态热力学涨落理论和Avrami方程研究PMMA/MMT复合体系的本体插层聚合,求取表观活化能Ea.实验发现,PMMA/MMT插层聚合转化率曲线中后期与热固性树脂的固化曲线极为类似,表明剥离后的蒙脱土片层在复合材料中起到交联点的作用.     

环氧树脂/蒙脱土/咪唑纳米复合材料固化行为的研究

运用非平衡态热力学涨落理论预估了环氧树脂 有机蒙脱土 咪唑插层型纳米复合体系在不同温度及不同有机蒙脱土用量时的固化行为 ,理论曲线与动态扭振的实验有良好的符合 .实验表明 ,有机蒙脱土的加入 ,使凝胶化时间tg 缩短 ,固化速率加快 ,但对凝胶点后的固化反活化能ΔH影响不大     

Lanthanide–imidazole complexes as latent curing agents for epoxy resins

Imidazoles have for some time been recognized as curing agents for epoxy resins. Once the resin and the imidazole compound are mixed there is a relatively short time in which the mixture can be used, since the polymerization (curing) reaction occurs to some extent even at room temperature causing the reaction mixture to thicken. In order to circumvent this problem we have found that imidazoles can be complexed with organo-lanthanide compounds thereby tying up the imidazole and retarding its rate of reaction in the cure of epoxy materials at ambient temperatures. When it is desired to enhance the rate of cure the temperature of the mixture is simply raised. This paper concerns studies of the epoxy cure reaction with the M(THD)₃–IM series. M represents the lanthanide metals Eu, Ho, Pr, Dy, Yb, and Gd, and THD is 2,2,6,6-tetramethyl-3,5-heptanedione. Cure reactions were followed by differential scanning calorimetry and in some cases by infrared spectroscopy. We have demonstrated that these organo-lanthanide–imidazole complexes are effective thermally latent curing agents for epoxy resins. At a temperature of 150°C cure is quite rapid. In the course of these studies it has also been determined that there is an inverse correlation between the lanthanide ionic radius in the complex and the temperature at which the cure reaction occurs. Thus the Yb compound, where the imidazole is most strongly bound, cures at the highest temperature and Pr, where imidazole is bound most weakly, at the lowest. Consistent with these facts is the observation that the Yb compound also gives the longest latency period when mixed with epoxy resin.     

基于松香酸酐的环氧树脂体系固化动力学及TTT图绘制

研制了基于松香酸酐固化剂的生物质环氧树脂体系,采用全动态DSC法研究了树脂体系的固化反应动力学,通过半经验的唯象模型拟合得到了固化反应参数,活化能Ea为59.68 kJ/g,指前因子A0为1.28×1015s-1,反应级数n为2.483,由此建立了体系固化温度/时间/固化度间的关系;采用恒温DSC及DMA方法测试玻璃化转变温度,应用DiBenedetto经验方程拟合得到了玻璃化转变温度与固化度间的关系.应用锥板旋转黏度计测试了树脂体系不同温度下的凝胶时间,通过线性回归分析得到了凝胶时间与温度之间的关系.由唯象模型和DiBenedetto方程分别计算得到凝胶时的固化度为0.386,玻璃化转变温度为26.22°C.由上述工作绘制了基于松香酸酐生物质树脂体系的TTT(time-temperature-transition diagram)固化图,可确定树脂体系在不同温度任意时间下的状态.     

Isothermal cure kinetics of epoxy/phenol‐novolac resin blend system initiated by cationic latent thermal catalyst

The investigation of the cure kinetics of a diglycidyl ether of bisphenol A (DGEBA)/phenol‐novolac blend system with different phenolic contents initiated by a cationic latent thermal catalyst [N‐benzylpyrazinium hexafluoroantimonate (BPH)] was performed by means of the analysis of isothermal experiments using a differential scanning calorimetry (DSC). Latent properties were investigated by measuring the conversion as a function of curing temperature using a dynamic DSC method. The results indicated that the BPH in this system for cure is a significant thermal latent initiator and has good latent thermal properties. The cure reaction of the blend system using BPH as a curing agent was strongly dependent on the cure temperature and proceeded through an autocatalytic kinetic mechanism that was accelerated by the hydroxyl group produced through the reaction between DGEBA and BPH. At a specific conversion region, once vitrification took place, the cure reaction of the epoxy/phenol‐novolac/BPH blend system was controlled by a diffusion‐control cure reaction rather than by an autocatalytic reaction. The kinetic constants k₁ and k₂ and the cure activation energies E₁ and E₂ obtained by the Arrhenius temperature dependence equation of the epoxy/phenol‐novolac/BPH blend system were mainly discussed as increasing the content of the phenol‐novolac resin to the epoxy neat resin. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2945–2956, 2000     

Factors affecting H2O absorption of the epoxy tetraglycidyl-4,4′-diaminodiphenyl methane cured with diaminodiphenyl sulfone

It was found that the amount of water absorbed at room temperature in cured tetraglycidyl-4,4′-diaminodiphenyl methane/diaminodiphenyl sulfone epoxy resins increases as the curing time or temperature increases while the amount of tetrahydrofuran-soluble extractables and the room temperature density decreases. These data suggest that the free volume increases with the extent of cure and the resins become more accessible to water. While the driving force for water absorption is the electrostatic attraction between water and the functional groups in the epoxy, the results suggest that equilibrium H₂O absorption is determined primarily by unoccupied volume of the epoxy resin.     

Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120–150°C. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between T_g and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 773–783, 1998     

Relaxations in thermosets. XIX. Dielectric effects during curing of diglycidyl ether of bisphenol-A with a catalyst and the properties of the thermoset

Changes in the dielectric permittivity ε′ and loss epsiv;″ during the curing of DGEBA catalyzed by 10 mole % dimethylbenzylamine have been studied from sol to gel to glass formation regions at different temperatures from 323 to 390 K. The ε′ monotonically decreases with time of cure, and ε″ initially decreases by several orders of magnitude and then increases to reach a peak value before finally decreasing to a low value characteristic of the glassy state. The features shift to shorter times and the peak vanishes as the curing temperature is increased. The decrease of ε″ at the initial stage of cure has been analyzed in terms of dc conductivity σ₀, which follows a power law, σ₀ ∝? (t_g–t)^x, as well as a new singularity equation, σ₀ ∝? exp[–B/(t₀–t)] where t_g, x, B, and t₀ are empirical constants that vary with the curing temperature; t_g is close to the time for gelation; and t₀ ≥ time for vitrification. The dielectric properties of the thermoset formed after different periods of cure have been studied from 77 to 325 K. Similar studies of the thermosets formed at different temperatures have been made. Increase in the curing period decreases the heights of both the γ-and α-relaxation peaks and increases their separation, while a β-relaxation peak emerges. Isothermal curing at high temperatures decreases the height of the γ peak to a vanishingly small value and increases that of the β peak from a vanishingly small value. In both the uncured and fully cured states, there is only one sub-T_g relaxation process named γ for the uncured and β for the cured state. These results are discussed in terms of our general physical concepts of local mode motions in an amorphous matrix. © 1993 John Wiley & Sons, Inc.     

Toughening of a trifunctional epoxy system: IV. Dynamic mechanical relaxational study of the thermoplastic-modified cure process

Dynamic mechanical spectroscopy has been used to investigate the cure of a thermoplastically modified trifunctional epoxy resin. The complex dissolution, curing behavior, and variations in the glass transition of the thermoplastic (PSF) phase were described, as was the T_g behavior of the epoxy phase. Prereaction of the PSF material with the epoxy resin was found to greatly increase the solubility of the PSF in the epoxy phase with little effect on the concentration of the epoxy monomer dissolving in the PSF phase. The curing behavior of the epoxy component in the thermoplastic phase was also investigated, in addition to changes in the mobility of the network at both gelation and vitrification. © 1997 John Wiley & Sons, Inc.     

The chemical and dielectric properties of epoxy/(Ba0.8Sr0.2)(Ti0.9Zr0.1)O3 composites for embedded capacitor application

The characteristics of epoxy/(Ba_0.8Sr_0.2)(Ti_0.9Zr_0.1)O₃ (BSTZ) composites are investigated for the further application in embedded capacitor device. The effects of BSTZ ceramic powder filler ratio on the chemical, physical and dielectric properties of epoxy/BSTZ composites are studied. Differential scanning calorimeter (DSC) thermal analysis is conducted to determine the optimum values of hardener agent, curing temperature, reaction heat, and glass transition temperature (T_g). The hardener reaction process starts at about 115 °C and completes at about 200 °C, for that it is appropriate to process of epoxy/BSTZ composites in the range of temperature. The highest glass transition temperature (T_g) of 155 °C is obtained at one equivalent weight ratio (hardener/epoxy). Only the BSTZ phase can be detected in the XRD patterns of epoxy/BSTZ composites. The more BSTZ ceramic powder is mixed with epoxy, the higher crystalline intensity of tetragonal BSTZ phase are revealed in the XRD patterns. The dielectric constant measured at 1 MHz increases from 5.8 to 23.6 as the content of BSTZ ceramic powder in the epoxy/BSTZ composites increases from 10 to 70 wt%. The loss tangents of the epoxy/BSTZ composites slightly increase with the increase of measurement frequency.     

Effect of Non-Woven Carbon Nanofiber Mat Presence on Cure Kinetics of Epoxy Nanocomposites

Summary : An investigation was carried out into the cure kinetics of carbon nanofiber (CNF) mat-epoxy nanocomposites, composed of bisphenol-A based epoxy resin and diethylene triamine as a curing agent. It was observed that the rate of cure reaction for CNF mat-epoxy nanocomposites was higher than that for neat epoxy resin at low curing temperatures and the presence of the CNF mat produced the maximum influence at a certain curing temperature and time. At high curing temperature and long curing times, the effect of CNF mat on the cure rate was insignificant. The CNF mat-epoxy composite exhibited somewhat lower value of activation energy than that of the neat epoxy system at the beginning of the curing stage. The weight fraction of CNF mat also affected the cure reaction of epoxy nanocomposites at the same curing temperature. As the amount of CNF mat increased, the cure rate was higher at the same cure time. However, at high CNF mat loading, the cure reaction was retarded since the amount of epoxy and hardener decreased dramatically at high CNF contents together with the hindering effect of the CNF mat on the diffusion of epoxy resin and the curing agent, leading to lower crosslinking efficiency. Although the curing efficiency of epoxy nanocomposites dropped at high CNF mat content, the glass transition temperature (T_g) was still high due to the ultra-high strength of the CNF mat. The cure kinetics of CNF mat-epoxy nanocomposites was in good agreement with Kamal's model.     

Thermal characterization of carbonate rocks,Kozani area,North-western Macedonia,Greece

The curing of a thermoreactive alkyd-melamine-formaldehyde resin system was investigated by rheologycal, TG and TMA-analysis, in order to construct the time-temperature-transformation diagram. The points of the gelation curve were determined by measuring the increase in viscosity during isothermal curing at different temperatures. A power-function could be fitted to the gelation curve, which is suitable to estimate gelation at any curing conditions, as well as to establish storage conditions. The reaction in the resin matrix was followed by monitoring the loss of mass during isothermal curing at different temperatures. The final section of the resulted iso-curing temperature (iso-T _cure) diagrams could be fitted with logarithmic functions, which may be used for estimating the conditions needed to a given, desirable mass loss, i.e. conversion. The steepness of the curves increases with temperature suggesting the forthcoming of degradation during cure with increasing temperature. From these data the iso-mass loss curves of the TTT-diagram were constructed. For determining the iso-Tg curves of the TTT-diagram isothermal curing was carried out in a drying oven at different temperatures, followed by TMA measurements. The iso-Tcure diagrams served to determine T _{g ￥}, and to construct the iso-T _g curves of the TTT diagram. Vitrification curve is far beyond conditions of storage, curing and degradation, meaning that the resin matrix is in rubbery physical state before, during and after the cure. Curing conditions resulting degradation can also be estimated from the TTT-diagram. This revised version was published online in August 2006 with corrections to the Cover Date.     

Cure kinetics, dynamic mechanical and morphological properties of epoxy resin-Im6NiBr2 system

The aim of this study was to examine effects of a catalyst of Nickel-imidazole, i.e. Im₆NiBr₂ on the cure reaction and network properties of diglycidyl ether of bisphenol A. DSC and FT-IR measurements are carried out on the epoxy resin loaded with 5, 15, and 30 phr of nickel salt to get some insights into the storage stability. It has been concluded that the storage stability has mainly depended on the epoxy composition and was the lowest for the highest level of curing agent. Kinetics of the cure has been described by applying iso-conversional method of Ozawa to scanning DSC data demonstrating that the studied cure reaction is autocatalytic in nature. The Kamal phenomenological approach has been utilized to fit the experimental isothermal DSC data. The model showed a satisfactory fitting of the experimental results at either early stages or at the final steps of the studied cure reaction. Further, the model did not provide a reasonable fitting in the propagation step of polymerization, 0.3 < α < 0.5, possibly due to existence of the additional reaction/s which did not consider in the used model. DMTA is used to find the optimum cure schedule. It has been shown that the sample with a postcure treatment offers the highest value of glass transition temperature (T_g) in the tan δ peak. SEM and X-ray analyses are employed to investigate the fracture surface morphology and to understand the distribution of nickel in the cured samples exhibiting that the nickel is scattered in the continuous phase homogenously. Flexural properties of the sample cured at optimum conditions are also determined.     

Curing of an epoxy resin modified with poly(methylmethacrylate) monitored by simultaneous dielectric/near infrared spectroscopies

Simultaneous dielectric and near infrared measurements have been performed in “real-time” to follow polymerisation reactions on blends of a diglycidyl ether of bisphenol-A epoxy resin with 4,4^′-diaminodiphenylmethane hardener and different amounts of poly(methylmethacrylate) as modifier. The effect of the modifier amount on the polymerisation reactions has been studied, as well as that of the curing temperature. Epoxy and amine conversions have been followed by near infrared spectroscopy (NIR), while changes in molecular mobility in the reaction mixture have been analysed by dielectric relaxation spectroscopy (DRS). Evolutions of ionic conductivity and α-relaxation have been analysed and vitrification times have been obtained. The relaxational behaviour has been analysed through curing in the frequency domain, being the change of the main relaxation indicative of the cure reaction advancement. DRS data are also presented as complex impedance Z(ω). Vitrification times, obtained by dielectrometry have been compared with those obtained by rheological measurements and gelation times obtained by NIR have been compared with those obtained by solvent extraction.     

Thermal analysis and gelation property of multifunctional epoxy resins used for pultruded composite ropes

Non-isothermal curing reactions of three different multifunctional epoxy resin systems were investigated by differential scanning calorimetry. The Kissinger equation was applied to calculate the apparent activation energy, and the Levenberg–Marquardt algorithm was used to fit the curing kinetic data. It was observed that the two-parameter model was in good match with the curing kinetics. In addition, dynamic mechanical thermal analysis was used to obtain the glass transition temperature (T _g). Furthermore, the thermal stabilities of the systems were studied by thermogravimetric (TG) analysis, the integral procedure decomposition temperature and temperature index T _s were used to characterize the thermal stability. Finally, the gelation time was measured by plate–knife method of a home-made device, and the relationship between gelation time and temperature was established, according to which the pultrusion process parameters were predicted.     

Evaluating a four-directional benzene-centered aliphatic polyamine curing agent for epoxy resins

A four-directional benzene-centered aliphatic polyamine, MXBDP, with high functionality and low volatility, is used to cure epoxy resin (DGEBA). Herein we originally report the isothermal cure kinetics and dynamic mechanical properties of DGEBA/MXBDP. Differential scanning calorimetry confirms that MXDBP is more reactive than commercial linear metaxylenediamine and branched Jeffamine T-403 and the isothermal curing reaction is autocatalytic. The Kamal model is found to be able to well describe the curing rate up to the onset of diffusion control, and the excellent match over the whole conversion range is achieved using the extended Kamal model. Interestingly, the isoconversional kinetic analysis indicates that the effective reaction activation energy (E _α ) changes substantially with conversion, and ultimately decreases to a very small value (<10 kJ mol^?1) because of the diffusion-controlled reaction kinetics. Then, dynamic mechanical analysis reveals that DGEBA/MXBDP exhibits the higher α- and β-relaxation temperatures and the much higher crosslink density than DGEBA/metaxylenediamine. Our experiment results support that MXBDP has the high reactivity and improved thermal resistance in combination with the advantages of the high functionality, low volatility and decreased CO₂ absorption. Therefore, MXBDP may be especially suitable for room temperature-cure epoxy coatings and adhesives.     

Preparation and crystallization behaviour of PP/PP-g-MAH/Org-MMT nanocomposite

The melt-direct intercalation method was employed to prepare polypropylene (PP)/maleic anhydride grafted polypropylene (PP-g-MAH)/organic-montmorillonite (Org-MMT), X-ray diffractometer was used to investigate the intercalation effect and crystallite size in composites and TEM micrograph to observe the dispersion of Org-MMT interlayers in polypropylene. The results showed that by introducing maleated polypropylene in PP/Org-MMT composite, macromolecule segments had intercalated into interlayer space of Org-MMT. As a result, Org-MMT interlayers were dispersed evenly in polypropylene and PP/PP-g-MAH/Org-MMT nanocomposite was synthesized. The crystallite size of nanocomposite perpendicular to the crystalline plane such as (0 4 0), (1 3 0), (1 1 1), (0 4 1) is smaller than that of pristine PP, which indicated that the crystallite size of PP in nanocomposite can be diminished by adding PP-g-MAH and Org-MMT in PP. Moreover, the nonisothermal crystallization kinetics of PP and PP/PP-g-MAH/Org-MMT nanocomposite was investigated by differential scanning calorimetry (DSC) with various cooling rates. The Avrami analysis modified by Jeziorny, Ozawa method and a method developed by Liu were employed to describe the nonisothermal crystallization process of these samples. The difference in the exponent n between PP and nanocomposite, indicated that nonisothermal kinetic crystallization corresponded to tridimensional growth with heterogeneous nucleation. The values of half-time, Z_c, F(T) and K(T) showed that the crystallization rate of composites was faster than that of PP at a given cooling rate.     

Thermal latent curing agent for epoxy resins from neutralization of 2‐methylimidazole with a phosphazene‐containing polyfunctional carboxylic acid

A novel thermal latent curing agent, 2MZS, was obtained through the reaction of 2‐methylimidazole (2MZ) and a symmetrically carboxyl‐functionalized star‐shaped molecule based on cyclotriphosphazene (N₃P₃‐COOH). In the complex, the resonance of N₃P₃‐COOH reduced the activity of lone electron pairs on the pyridine‐type nitrogen atom of imidazole ring, suppressing the nucleophilic attack and crosslinking reaction between 2MZ and epoxy resin. As a result, the storage stability was improved distinctly for the one‐pot epoxy compound, which could be steadily stored at room temperature for nearly 1 month. Nonisothermal DSC revealed a delayed initiation curing mechanism of the prepared one‐pot system, and which could undergo rapid curing reaction upon raising the temperature. Moreover, the introduction of terminally polyfunctional star‐shaped phosphazene derivative could promote the curing process at elevated temperature, as well as improve the chain rigidity of the cured resin by chemical incorporation into the cross‐linked network, thus endowing the cured resin with enhanced glassy storage modulus. The epoxy thermoset exhibited the highest glass transition temperature and thermal degradation temperature when 20 wt% of 2MZS was used. It is suggested that the novel latent curing agent is potential for high‐performance one‐pot epoxy compound, particularly recommended for application in electronic packaging fields.