Thermo-mechanical solution of film/substrate systems under local thermal load and application to laser lift-off of GaN/sapphire structures

Film/substrate structures may undergo a localized thermal load, which can induce stresses, deformation and defects. In this paper, we present the solutions of temperature and stresses in a film/substrate structure under a local thermal load on the film surface. Then, the generalized Stoney formula, which connects the curvature of deformation and the stress field is obtained. The present solution takes into account the non-uniformity of the temperature field both in the width and thickness directions of the film. The thermo-mechanical solution is applied to the analysis of the temperature distribution, stresses, and damage of a GaN/sapphire system during the laser lift-off (LLO) process. It is shown that the laser with the Gaussian distribution of energy density causes much smaller tensile stresses at the edge of the heated area in the film than the laser with the uniform distribution of energy density, and thus can avoid damage to the GaN films separated from the substrate.     

On the spin coating of viscoplastic fluids

The spin coating of a viscoplastic material is studied using a continuous viscosity function. Thus, the transient model requires the calculation of only velocity, pressure and the moving-free surface of the liquid film, but not the calculation of the yield surface within the liquid. A Finite Element/Newton-Raphson method is presented for solving this moving boundary problem after mapping the deforming domain onto a fixed one. Assuming axial symmetry, the effect of the Bingham, Reynolds, Capillary and gravitational Bond numbers is examined. The magnitude of the first two parameters affects significantly the flow field and the shape of the film as well as the required spinning time in order to produce a film of uniform thickness. Depending on their values, large departures from the corresponding Newtonian solution may be obtained. In these cases the film does not thin out uniformly, but a maximum in its profile is created at the center of the disk. Then, the magnitude of the Capillary number also affects the size of this maximum. The gravitational Bond number affects the film thickness and its profile to a lesser extent.Dedicated to the memory of Professor Tasos C. Papanastasiou     

Thin film/substrate systems featuring arbitrary film thickness and misfit strain distributions. Part I: Analysis for obtaining film stress from non-local curvature information

Current methodologies used for the inference of thin film stress through curvature measurements are strictly restricted to stress and curvature states which are assumed to remain uniform over the entire film/substrate system. Recently Huang, Rosakis and co-workers [Huang, Y., Ngo, D., Rosakis, A.J., 2005. Non-uniform, axisymmetric misfit strain: in thin films bonded on plate substrates/substrate systems: the relation between non-uniform film stresses and system curvatures. Acta Mech. Sin. 21, 362–370; Huang, Y., Rosakis A.J., 2005. Extension of Stoney’s Formula to non-uniform temperature distributions in thin film/substrate systems. The case of radial symmetry. J. Mech. Phys. Solids 53, 2483–2500; Ngo, D., Huang, Y., Rosakis, A. J., Feng, X. 2006. Spatially non-uniform, isotropic misfit strain in thin films bonded on plate substrates: the relation between non-uniform film stresses and system curvatures. Thin Solid Films (in press)] established methods for film/substrate system subject to non-uniform misfit strain and temperature changes. The film stresses were found to depend non-locally on system curvatures (i.e., depend on the full-field curvatures). The existing methods, however, all assume uniform film thickness which is often violated in the thin film/substrate system. We extend these methods to arbitrarily non-uniform film thickness for the thin film/substrate system subject to non-uniform misfit strain. Remarkably the stress-curvature relation for uniform film thickness still holds if the film thickness is replaced by its local value at the point where the stress is evaluated. This result has been experimentally validated in Part II of this paper.     

Stress analysis of thin polyimide films using holographic interferometry

It is proposed that the residual stresses due to curing in a spin-coated polyimide film can be determined using the solution to the problem of a vibrating membrane. The membrane is biaxially constrained and supported on a metal washer or copper substrate. A piezoelectric transducer is used to excite the sample. The membrane vibrates uniformly in response to its resonant frequencies. The vibration pattern is recorded using time-average holographic interferometry. The pattern produced is indicative of the mode of vibration. The biaxial stress in the film can be calculated from measuring the characteristic frequency, the density of the material, and the mode of vibration. The effect of mass loading of air on the apparent stress in these membranes is also investigated. Measurements made in vacuum appear to resolve this problem. The stresses calculated are on the order of 10 MPa.     

Mechanics of indentation for piezoelectric thin films on elastic substrate

Frictionless normal indentation problem of rigid flat-ended cylindrical, conical and spherical indenters on piezoelectric film, which is either in frictionless contact with or perfectly bonded to an elastic half-space (substrate), is investigated. Both conducting and insulating indenters are considered. With Hankel transform, the general solutions of the homogeneous governing equations for the piezoelectric layer and the elastic half-space are presented. Using the boundary conditions for a vertical point force or a point electric charge, and the boundary conditions on the film/substrate interface, the Green’s functions can be obtained by solving sets of simultaneous linear algebraic equations. The solution of the indentation problem is obtained by integrating these Green’s functions over the contact area with unknown surface tractions or electric charge distribution, which will be determined from the boundary conditions on the contact surface between the indenter and the film. The solution is expressed in terms of dual integral equations that are converted to a Fredholm integral equation of the second kind and solved numerically. Numerical examples are also presented. The comparison between two film/substrate bonding conditions is made. It shows that the indentation rigidity of the film/substrate system is lower when the film is in frictionless contact with the substrate. The effects of the Young’s modulus and Poisson’s ratio of the elastic substrate, indenter electrical condition and indenter prescribed electric potential on the indentation responses are presented.     

Nonlinear analyses of wrinkles in a film bonded to a compliant substrate

Subject to a compressive membrane force, a film bonded to a compliant substrate often forms a pattern of wrinkles. This paper studies such wrinkles in a layered structure used in several recent experiments. The structure comprises a stiff film bonded to a compliant substrate, which in turn is bonded to a rigid support. Two types of analyses are performed. First, for sinusoidal wrinkles, by minimizing energy, we obtain the wavelength and the amplitude of the wrinkles for substrates of various moduli and thicknesses. Second, we develop a method to simultaneously evolve the two-dimensional pattern in the film and the three-dimensional elastic field in the substrate. The simulations show that the wrinkles can evolve into stripes, labyrinths, or herringbones, depending on the anisotropy of the membrane forces. Statistical averages of the amplitude and wavelength of wrinkles of various patterns correlate well with the analytical solution of the sinusoidal wrinkles.     

Determining the Elastic Modulus of Compliant Thin Films Supported on Substrates from Flat Punch Indentation Measurements

Instrumented indentation is a technique that can be used to measure the elastic properties of soft thin films supported on stiffer substrates, including polymer films, cellulosic sheets, and thin layers of biological materials. When measuring thin film properties using indentation, the effect of the substrate must be considered. Most existing models for determining the properties of thin films from indentation measurements were developed for metal and dielectric films bonded to semiconductor substrates and have been applied to systems with film-substrate modulus ratios between 0.1 and 10. In the present work, flat punch indentation of a thin film either bonded to or in contact with a substrate is examined using finite element modeling. A broad range of film-substrate modulus ratios from 0.0001 to 1 are investigated. As the substrate is effectively rigid compared to the film when the film-substrate modulus ratio is less than 0.0001, the results are also useful for understanding systems with lower film-substrate modulus ratios. The effects of the contact radius, film thickness, elastic properties, and friction between the film and the substrate on the measured stiffness were quantified using finite element modeling in order to understand how the elastic properties of the film can be extracted from indentation measurements. A semi-analytical model was developed to describe the finite element modeling results and facilitate the use of the results to analyze experimental measurements. The model was validated through analysis of indentation measurements of thin polyethylene sheets that were supported on substrates of various stiffness.     

Progressive Frictional Delamination of an Infinite Elastic Film on a Rigid Substrate Due to In-Plane Point Loading

The paper presents a solution to a delamination problem of an infinite elastic film resting on a rigid substrate and loaded by a monotonically increasing in-plane point force. A?rigid-slip contact is assumed between the film and the substrate, leading to the development of two regions at the interface: a damaged zone with a relative slip between the materials, and a region where the interface remains intact. Both film natural and essential boundary conditions are zero on the boundary between these two interfacial zones with the shape of the boundary being a part of the solution. Problem??s self-similarity enables us to obtain an approximate distribution of interfacial traction within the delaminated zone and a shape of the zone itself. For film??s Poisson??s ratio ??=?1 the approximate solution becomes exact. It is argued that this can be treated as a special case of a rigid film sliding on a rigid substrate. The presented approach can be used to obtain approximate closed-form solutions to similar delamination problems.     

Elastic study on singularities interacting with interfaces using alternating technique: Part II. Isotropic trimaterial

Singularity problems in an isotropic trimaterial are analyzed by the same procedure as in an anisotropic trimaterial of Part I [Int. J. Solids Struct. 39, 943–957]. `Trimaterial' denotes an infinite body composed of three dissimilar materials bonded along two parallel interfaces. Linear elastic isotropic materials under plane deformations are assumed, in which the plane of deformation is perpendicular to the two parallel interface planes, and thus Muskhelishvili's complex potentials are used. The method of analytic continuation is alternatively applied across the two parallel interfaces in order to derive the trimaterial solution in a series form from the corresponding homogeneous solution. A variety of problems, e.g. a bimaterial (including a half-plane problem), a finite thin film on semi-infinite substrate, and a finite strip of thin film, etc, can be analyzed as special cases of the present study. A film/substrate structure with a dislocation is exemplified to verify the usefulness of the solutions obtained.     

磁场力及膜曲率对磁敏感薄膜-基底界面黏附性能的影响与调控

界面黏附和脱黏的可调控在攀爬装置、黏附开关、机械抓手等方面具有重要的应用需求. 针对磁敏感薄膜-基底界面, 开展了薄膜初始曲率及外加磁场对界面黏附性能影响机制的研究. 首先实验制备了具有初始曲率的磁敏感薄膜, 分别开展了具有初始曲率的磁敏感薄膜-基底界面撕脱实验及理论研究, 研究了薄膜初始曲率、弯曲刚度和外加磁场强度对界面黏附性能的影响规律. 实验和理论结果一致表明: 具有初始曲率的磁敏感薄膜-基底界面黏附力随薄膜初始曲率的增大而减小, 而外加磁场能够有效提高界面黏附力;相比于初始零曲率薄膜-基底界面稳态撕脱力与薄膜弯曲刚度无关, 薄膜弯曲刚度减弱了具有初始曲率薄膜-基底界面的稳态撕脱力. 进一步从能量角度分析了界面等效黏附性能, 揭示了薄膜弯曲能、磁场势能、界面黏附能的相互竞争机制. 最后, 基于本文的实验及理论结果, 提出了一种磁场和薄膜初始曲率协同调控的简易机械抓手, 可连续实现物体的拾取、搬运和释放功能. 本文结果不仅有助于理解多场调控的界面可逆黏附机制, 对界面黏附可控的功能器件设计亦提供了一种新方法.      

Characterization of Elasticity-Tensor Symmetries Using SU(2)

A symmetry class of an elasticity tensor, c, is determined by the variance of this tensor with respect to a subgroup of the special orthogonal group, SO(3). Using the double covering of SO(3) by the special unitary group, SU(2), we determine the subgroups of SU(2) that correspond to each of the eight symmetry classes. A family of maps between C² and R³ that preserve the action of the two groups is constructed. Using one of these maps and three associated polynomials, we derive new methods for characterizing the symmetry classes of elasticity tensors. Mathematics Subject Classifications (2000) 74B05, 74E10.     

微纳米尺度膜/基结构界面性能的实验研究

为了研究铜膜/有机玻璃结构的界面性能,首先对沉积在有机玻璃基底上300nm厚的铜膜进行了单轴压缩实验,部分区域的薄膜因屈曲而脱离基底。选择在膜/基粘接良好区域、膜/基脱粘区域分别进行等位移纳米压痕实验。利用膜/基粘接良好区域处硬度/弹性模量与压痕位移的关系来确定膜/基结构的临界脱粘位移。基于宏观力学中表征界面性能的能量法,利用两个区域等位移的塑性功差值来确定界面能量释放率。研究结果表明:当压痕位移约450nm时,膜/基结构开始出现界面脱粘,实验测得铜膜/有机玻璃结构的界面能量释放率值在6.81~10.32J/m2之间。     

Gravity-driven laminar film flow of power-law fluids along vertical walls

A theoretical analysis is presented which brings steady laminar film flow of power-law fluids within the framework of classical boundary layer theory. The upper part of the film, which consists of a developing viscous boundary layer and an external inviscid freestream, is treated separately from the viscous dominated part of the flow, thereby taking advantage of the distinguishing features of each flow region. It is demonstrated that the film boundary layer developing along a vertical wall can be described by a generalized Falkner-Skan type equation originally developed for wedge flow. An exact similarity solution for the velocity field in the film boundary layer is thus made available.Downstream of the boundary layer flow regime the fluid flow is completely dominated by the action of viscous shear, and fairly accurate solutions are obtained by the Von Karman integral method approach. A new form of the velocity profile is assumed, which reduces to the exact analytic solution for the fully-developed film. By matching the downstream integral method solution to the upstream generalized Falkner-Skan similarity solution, accurate estimates for the hydrodynamic entrance length are obtained. It is also shown that the flow development in the upstream region predicted by the approximate integral method closely corresponds to the exact similarity solution for that flow regime. An analytical solution of the resulting integral equation for the Newtonian case is compared with previously published results.     

Some properties of multi-fluid stokes flows

The solution of Stokes' equations for a rotating axisymmetric body which possesses reflection symmetry about a planar interface between two infinite immiscible quiescent viscous fluids is shown to be independent of the viscosities of the fluids and identical with the solution when the fluids have the same viscosity. The result is generalized to a rotating axisymmetric system of bodies which possesses reflection symmetry about each interface of a plane stratified system of fluids. An analogous result for two-fluid systems with a nonplanar static interface is also derived. The effect on torque reduction produced by the presence of a second fluid layer adjacent to a rotating axisymmetric body is considered and explicit calculations are given for the case of a sphere. A proof of uniqueness for unbounded multi-fluid Stokes' flow is given and the asymptotic far field structure of the velocity field is determined for axisymmetric flow caused by the rotation of axisymmetric bodies.     

Nonlinear far field in the case of transonic flow past a nonlifting profile

A new analytic solution is constructed for the nonlinear transonic equations describing the irrotational far flow field (with two symmetry axes) in the case of transonic flow past a nonlifting profile. With increasing distance from the profile, the nonlinear field goes over continuously into the field of the linear theory. The solution is expressed in terms of an elliptic Weierstrass function.Translated from Izvestiya Akademii Nauk SSSR, Mekhanika Zhidkosti i Gaza, No. 6, pp. 171–173, Novembe–December,1982.     

A piezoelectric field-effect strain gage

A new and highly sensitive strain transducer has been developed using a thin-film semiconductor deposited on a polished piezoelectric ceramic substrate. Field-effect coupling has been found to exist between the substrate and film in which the number of mobile carriers in the semiconductor is dependent on the electric-displacement vector of the substrate. Therefore, the conductivity of the semiconducting film can be altered by piezoelectric charge due to a strain applied to the substrate material. An effective gage constant has been calculated in terms of the piezoelectric and elastic constants of the substrate and electronic properties of the film. Experimental devices were constructed by depositingp type tellurium on polished lead-zirconate-titanate ceramic resulting in experimentally observed gage factors as high as 5800 compared to 100–200 for conventional semiconductor gages. The semiconductor film exhibits an electronic instability that limits its use, at present, to transient measurements with frequencies above 1 Hz. Data will also be presented to show that the gage constant is continuously variable between a positive and negative maximum value by altering the magnitude and direction of the substrate-polarization vector. It is believed that these gages will be useful in those cases where extremely small strains (～10^?7) are to be measured or when moderate strains (～10^?4) are to be determined in an electrically noisy background.     

高温超导带材超导涂层局部脱黏后的电磁力学行为分析

高温超导带材因其高载流能力、低交流损耗等优点,在超导领域得到了广泛的关注,然而在带材的应用中出现的力学问题严重阻碍了其应用.基于此,本文分析了受外部磁场激励YBCO高温超导带材在超导层局部脱黏后的电磁力学响应.基于超导临界态Bean模型和弹性力学平面应变方法,给出了超导薄膜内正应力与基底界面处切应力相关联的控制方程,基...     

Mechanics of shaft-loaded blister test for thin film suspended on compliant substrate

Based on the von Kármán plate theory, the mechanics of a shaft-loaded blister test for thin film/substrate systems is studied by considering elastic substrate deformations and residual stresses in these films. In testing, films are attached to a substrate provided with a circular hole, through which loading is applied to the film by a flat-ended shaft of circular cross-section. The effect of substrate deformation on the deflection of the loaded film is taken into account by using a line spring model. For small deflections, an analytical solution is derived, while for large deflections a numerical solution is obtained using the shooting method. The resulting load-shaft displacement relation, which is essential in blister tests, compares favorably with finite element analysis.     

Two-Dimensional Magnetoelastic Problem for a Multiply Connected Piezomagnetic Body

A general method based on complex variable theory is proposed to determine the magnetic and elastic fields of a piezomagnetic body. This method is used to derive the basic relations for complex potentials in the two-dimensional problem of magnetoelasticity, their general representations for a multiply connected domain, expressions for stresses, displacements, vectors of magnetic field intensity and magnetic flux density, and magnetic field potential. A closed-form solution is obtained for a body with an elliptic (circular) hole or crack subjected at infinity to the action of a constant magnetoelastic field. Numerical results for a piezomagnetic plate with a circular hole are presented __________ Translated from Prikladnaya Mekhanika, Vol. 41, No. 10, pp. 64–74, October 2005.