Synthesis and morphology of silicon oxide nanowires from a free jet activated by electron-beam plasma

Silicon oxide nanowires were synthesized from monosilane–argon–hydrogen mixture by the gas-jet electron-beam plasma chemical deposition method with simultaneous oxygen injection into the vacuum chamber. The synthesis was performed on monocrystalline silicon substrates covered with micron and nanometer tin catalyst particles. The nanowires are formed the via vapor–liquid–solid mechanism in the “catalyst-on-bottom” mode, in which many nanowires grow from one catalyst particle. The process of synthesizing nanowires on a substrate with catalyst consists of three stages: heating to synthesis temperature, hydrogen plasma treatment, and nanowire growth. In the substrate region corresponding to the jet axis, different structures are formed depending on the catalyst particle size. For catalyst particles under 100 nm, there are formed structures of chaotically oriented and interlaced bundles of silica nanowires. For catalyst particles of 0.3–1 micron, there are formed oriented arrays of cylindrically shaped nanowire bundles (“microropes”). Cocoon-like structures are formed for catalyst particles of more than 1 micron.We propose a model of nanowire growth by this method, which is based on nonuniform heating of a catalyst particle by a directed plasma flow. It was found that for synthesis of oriented microrope arrays the initial tin film thickness should be less than 100 nm and the synthesis process should include a hydrogen plasma treatment stage.     

Preparation of silicon carbide film by a plasma focus device

Silicon carbide (SiC) films were grown on the silicon (100) substrate by a 20 kJ Mather-type dense plasma focus device. The preparation method and characterization data are presented. X-ray diffractometer (XRD), Fourier transform infrared spectroscopy (FTIR), field-emission scanning electron microscopy (SEM) and nano-indentor were employed for the characterization of the samples obtained at different axial position of 50 mm, 90 mm, 130 mm and 170 mm, respectively. Polycrystalline 3CSiC were obtained at the position of 90 mm and 130 mm from XRD and FTIR spectra. SEM image showed that the silicon carbide films obtained at the position of 90 mm are porous on surface layer. Nano-indentor indicates that the film obtained at the position of 130 mm has the highest mechanical hardness.     

Production of nanocrystalline silicon layers using the plasma enhanced chemical vapor deposition from the gas phase of silicon tetrafluoride

The production of silicon layers using plasma enhanced chemical vapor deposition in the mixture of silicon tetrafluoride and hydrogen is reported. The samples have been analyzed by X-ray diffraction, Raman spectroscopy, and secondary ion mass spectrometry. The phase composition of the layers is nanocrystalline silicon with the crystalline-domain sizes from 3 to 9 nm in dependence of the conditions of the process. The samples are characterized by intense photoluminescence at room temperature.     

Characterization of an atmospheric pressure plasma jet for surface modification and thin film deposition

In this paper, an experimental study is presented to characterize a commercially available atmospheric pressure plasma jet (APPJ) kINPen which can be used for local surface modification, e.g. changing the wettability as well as for thin film deposition with silicon-organic and metal-organic precursors to enhance scratch resistance or to lower the gas permeability. Characterization of the jet discharge has been carried out by three methods: (i) measurement of the energy influx from the jet plasma to a substrate by a calorimetric probe, (ii) spatial resolved investigation of the plasma beam by optical emission spectroscopy (OES) and (iii) observation of the plasma jet by video imaging. The deposited SiO _x and AlO _x films were analyzed by XPS measurements.     

分步法高速沉积微晶硅薄膜

为提高微晶硅薄膜的纵向结晶性能, 在甚高频等离子体增强化学气相沉积技术的基础上, 采用过渡参数缓变和两步法相结合的方法在普通玻璃衬底上高速沉积薄膜. 当功率密度为2.1 W/cm², 硅烷浓度在6%和9.6%之间变化时, 从薄膜方向和玻璃方向测算的Raman晶化率的差异维持在2%以内. 硅烷浓度为9.6%时, 薄膜沉积速率可达3.43 nm/s, 从薄膜方向和玻璃方向测算的Raman晶化率分别为50%和48%, 差异的相对值仅为4.0%. 合理控制过渡阶段的参数变化, 可使两个方向的Raman晶化率差值下降到一个百分点. 表明采用新方法制备薄膜, 不仅可以抑制非晶孵化层的形成, 改善微晶硅薄膜的纵向结构, 还为制备优质薄膜提供了较宽的参数变化空间. 关键词： 微晶硅薄膜 非晶孵化层 高速沉积 甚高频等离子体增强化学气相沉积     

Level population by recombination in a pulsed plasma jet in an He-Xe mixture

Measurements have been made on the spatial and time characteristics of the radiation from an He-Xe plasma jet emerging from a discharge channel through a nozzle with a speed of about 10⁵ cm/sec. A recombination mechanism is indicated for the line excitation by the delay between the current pulse and the production of the radiation, as well as by the substantial differences in time course for the intensities of the atomic and ionic lines and by the increase in intensity with pressure. Measurements have been made of the electron temperature and concentration, and estimates have been made of the recombination coefficients, which reflect the performance of the collisional-radiative recombination in a decaying He-Xe plasma jet.Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 3, pp. 12–17, March, 1984.     

大气压等离子体辅助多晶硅薄膜化学气相沉积参数诊断

本文采用发射光谱法诊断了大气压下Ar气、SiCl₄及H₂气混合气体（Ar/SiCl₄/H₂）射频放电等离子体射流特性.利用Si原子谱线强度计算了电子激发温度并以此估算了Si原子数密度,研究了射频功率及气体流量对电子激发温度和Si原子数密度以及SiCl₄解离率的作用. 关键词： 大气压等离子体射流 发射光谱 电子激发温度 多晶硅薄膜沉积     

大气压等离子体辅助多晶硅薄膜化学气相沉积参数诊断

本文采用发射光谱法诊断了大气压下Ar气、SiCl₄及H₂气混合气体（Ar/SiCl₄/H₂）射频放电等离子体射流特性.利用Si原子谱线强度计算了电子激发温度并以此估算了Si原子数密度,研究了射频功率及气体流量对电子激发温度和Si原子数密度以及SiCl₄解离率的作用.     

Effect of hydrogen dilution on the silicon cluster volume fraction of a hydrogenated amorphous silicon film prepared using plasma-enhanced chemical vapor deposition

We investigated the effect of hydrogen dilution on the Si cluster volume fraction of hydrogenated amorphous films by varying the hydrogen dilution ratio at 0.5 Torr and compared it to that obtained at pure silane discharge at 0.3, 0.4, and 0.5 Torr. The correlation between the plasma emission characteristic, deposition rate, and cluster volume fraction in the hydrogen dilution plasma was described. The cluster volume fractions of films under hydrogen dilution conditions were similar to those of the pure silane but showed a higher deposition rate. The results suggest that under hydrogen dilution conditions, it is possible to maintain a higher deposition rate with a lower cluster incorporation rate.     

The high deposition of microcrystalline silicon thin film by very high frequency plasma enhanced chemical vapour deposition and the fabrication of solar cells

This paper reports that the intrinsic microcrystalline silicon ($\mu $c-Si:H) films are prepared with plasma enhanced chemical vapour deposition from silane/hydrogen mixtures at 200\du\ with the aim to increase the deposition rate. An increase of the deposition rate to 0.88\,nm/s is obtained by using a plasma excitation frequency of 75\,MHz. This increase is obtained by the combination of a higher deposition pressure, an increased silane concentration, and higher discharge powers. In addition, the transient behaviour, which can decrease the film crystallinity, could be prevented by filling the background gas with Hchemical vapour deposition, plasma deposition, solar cells, crystallinityProgram supported by the State Key Development Program for Basic Research of China (Grant No 2006CB202601), and Basic Research Project of Henan Province in China (Grant No 072300410140).7280N, 7830G, 8115HThis paper reports that the intrinsic microcrystalline silicon ($\mu $c-Si:H) films are prepared with plasma enhanced chemical vapour deposition from silane/hydrogen mixtures at 200\du\ with the aim to increase the deposition rate. An increase of the deposition rate to 0.88\,nm/s is obtained by using a plasma excitation frequency of 75\,MHz. This increase is obtained by the combination of a higher deposition pressure, an increased silane concentration, and higher discharge powers. In addition, the transient behaviour, which can decrease the film crystallinity, could be prevented by filling the background gas with Hchemical vapour deposition, plasma deposition, solar cells, crystallinityProgram supported by the State Key Development Program for Basic Research of China (Grant No 2006CB202601), and Basic Research Project of Henan Province in China (Grant No 072300410140).7280N, 7830G, 8115HThis paper reports that the intrinsic microcrystalline silicon ($\mu $c-Si:H) films are prepared with plasma enhanced chemical vapour deposition from silane/hydrogen mixtures at 200\du\ with the aim to increase the deposition rate. An increase of the deposition rate to 0.88\,nm/s is obtained by using a plasma excitation frequency of 75\,MHz. This increase is obtained by the combination of a higher deposition pressure, an increased silane concentration, and higher discharge powers. In addition, the transient behaviour, which can decrease the film crystallinity, could be prevented by filling the background gas with Hchemical vapour deposition, plasma deposition, solar cells, crystallinityProgram supported by the State Key Development Program for Basic Research of China (Grant No 2006CB202601), and Basic Research Project of Henan Province in China (Grant No 072300410140).7280N, 7830G, 8115HThis paper reports that the intrinsic microcrystalline silicon ($\mu $c-Si:H) films are prepared with plasma enhanced chemical vapour deposition from silane/hydrogen mixtures at 200\du\ with the aim to increase the deposition rate. An increase of the deposition rate to 0.88\,nm/s is obtained by using a plasma excitation frequency of 75\,MHz. This increase is obtained by the combination of a higher deposition pressure, an increased silane concentration, and higher discharge powers. In addition, the transient behaviour, which can decrease the film crystallinity, could be prevented by filling the background gas with Hchemical vapour deposition, plasma deposition, solar cells, crystallinityProgram supported by the State Key Development Program for Basic Research of China (Grant No 2006CB202601), and Basic Research Project of Henan Province in China (Grant No 072300410140).7280N, 7830G, 8115HThis paper reports that the intrinsic microcrystalline silicon ($\mu $c-Si:H) films are prepared with plasma enhanced chemical vapour deposition from silane/hydrogen mixtures at 200\du\ with the aim to increase the deposition rate. An increase of the deposition rate to 0.88\,nm/s is obtained by using a plasma excitation frequency of 75\,MHz. This increase is obtained by the combination of a higher deposition pressure, an increased silane concentration, and higher discharge powers. In addition, the transient behaviour, which can decrease the film crystallinity, could be prevented by filling the background gas with H$_{2}$ prior to plasma ignition, and selecting proper discharging time after silane flow injection. Material prepared under these conditions at a deposition rate of 0.78\,nm/s maintains higher crystallinity and fine electronic properties. By H-plasma treatment before i-layer deposition, single junction $\mu $c-Si:H solar cells with 5.5{\%} efficiency are fabricated.     

Fabrication of spatial walk-off polarizing film exhibiting a large split angle by oblique silicon deposition

A spatial walk-off polarizing film with a large split angle was fabricated by use of the oblique deposition method. The film is composed of slanted needlelike microcolumns of a-Si that are separated by resultant fine voids. The polarization-splitting characteristics of the film were clearly observed. The maximum split angle at a wavelength of 1.55mum was as large as 20 degrees , more than three times greater than those of existing polarizers such as those constructed of rutile and calcite.     

等离子体表面梯度硅沉积对环氧树脂电气性能的影响

环氧树脂作为常见的绝缘材料,在高压直流电场作用下易在其表面积累电荷,发生电场畸变,导致材料绝缘性能下降,影响电力系统运行可靠性。为改善气固界面的电荷特性和绝缘性能,在大气压等离子体射流技术的基础上,对环氧树脂表面进行等离子体梯度硅沉积处理。对改性前后环氧树脂表面理化特性、表面电导率、表面电荷消散和沿面耐压特性进行了多参数测量。实验结果表明,梯度改性对材料表面的物理形貌和化学组分均有明显影响,不同区域的电导率实现了梯度分布,加快了表面电荷消散速度,表面陷阱能级变浅;梯度改性后的样品沿面闪络电压提升幅度可达30.16%。通过等离子体表面梯度硅沉积处理能够改善环氧树脂表面电气性能,在高压直流设备的绝缘设计方面具有广阔的应用前景。     

Fabricating a reactive surface on the fibroin film by a room-temperature plasma jet array for biomolecule immobilization

A simple dielectric barrier discharge(DBD) jet array was designed with a liquid electrode and helium gas.The characteristics of the jet array discharge and the preliminary polymerization with acrylic acid(AA) monomer were presented.The plasma reactor can produce a cold jet array with a gas temperature lower than 315 K,using an applied discharge power between 6 W and 30 W(V dis × I dis).A silk fibroin film(SFF) was modified using the jet array and AA monomer,and the treated SFF samples were characterized by atomic force microscopy(AFM),scanning electron microscopy(SEM),Fourier transform infrared spectroscopy(FTIR),and contact angle(CA).The deposition rate of the poly acrylic acid(PAA) was able to reach 300 nm/min,and the surface roughness and energy increased with the AA flow rate.The FTIR results indicate that the modified SFF had more carboxyl groups(-COOH) than the original SFF.This latter characteristic allowed the modified SFF to immobilize more quantities of antimicrobial peptide(AP,LL-37) which inhibited the Escherichia coli(E.Coli) effectively.     

发射光谱研究大气压等离子体射流的气体温度

采用介质阻挡放电等离子体喷枪装置,在大气压下流动氩气中产生了射流等离子体。利用光电倍增管,对射流等离子体进行了时空分辨测量,分析了等离子体喷枪内介质阻挡放电和外部等离子体羽的放电特性。利用高分辨率光谱仪采集等离子体羽处的发射光谱,通过对发射光谱中OH(A2Σ+→X2Π,307.7～308.9nm)及N2+的第一负系(B2Σ+u→X2Π+g,390～391.6nm)谱线拟合得到了射流等离子体的转动温度,拟合得到的转动温度分别为443和450K。在5%的误差范围内,这2种方法得到的结果是一致的。由于在大气压下,转动温度近似等于产生气体放电的气体温度,所以可以确定大气压射流等离子体气体温度。利用该方法研究了不同电压下的气体温度,发现气体温度随着外加电压增加而增大。     

Influence of the gas mixture temperature on the efficiency of synthesis gas production from ethanol in a nonequilibrium plasma

The mechanism behind the plasma conversion of a mixture of ethanol vapor, water vapor, air, and carbon dioxide CO₂ in the nonequilibrium plasma of a tornado discharge is studied. The influence of the CO₂ flow rate, the current through the discharge, and the gas temperature in the discharge on the concentrations of molecular hydrogen and carbon monoxide CO is studied. Comparison between the concentrations of the gaseous mixture’s main components at the output from the reactor obtained experimentally and by numerical simulation shows that the adopted kinetic mechanism adequately describes the plasma kinetics in the mixture.     

Influence of SiNx:H film properties according to gas mixture ratios for crystalline silicon solar cells

The Hydrogenated silicon nitride (SiN_x:H) using plasma enhanced chemical vapor deposition is widely used in photovoltaic industry as an antireflection coating and passivation layer. In the high temperature firing process, the SiN_x:H film should not change the properties for its use as high quality surface layer in crystalline silicon solar cells. For optimizing surface layer in crystalline silicon solar cells, by varying gas mixture ratios (SiH₄ + NH₃ + N₂, SiH₄ + NH₃, SiH₄ + N₂), the hydrogenated silicon nitride films were analyzed for its antireflection and surface passivation (electrical and chemical) properties. The film deposited with the gas mixture of SiH₄ + NH₃ + N₂ showed the best properties in before and after firing process conditions.The single crystalline silicon solar cells fabricated according to optimized gas mixture condition (SiH₄ + NH₃ + N₂) on large area substrate of size 156 mm × 156 mm (Pseudo square) was found to have the conversion efficiency as high as 17.2%. The reason for the high efficiency using SiH₄ + NH₃ + N₂ is because of the good optical transmittance and passivation properties. Optimized hydrogenated silicon nitride surface layer and high efficiency crystalline silicon solar cells fabrication sequence has also been explained in this study.     

Magnetron discharge in an argon-oxygen mixture for deposition of a titanium oxide film

A discharge in a planar magnetron with a titanium target is studied. It is found that a pressure rise from 2 to 6 mTorr in argon at a constant current increases the intensity of excited argon ion lines by almost 20%. The excitation of neutral titanium atoms is independent of the argon pressure: it depends on only the discharge current. The current-voltage characteristic of the magnetron in an argon-oxygen mixture completely reflects processes proceeding on the target of the magnetron.     

Conformal dielectric films on silicon nanowire arrays by plasma enhanced chemical vapor deposition

In this article, we describe the coating of silicon nanowire arrays with thin dielectric layers using Plasma Enhanced Chemical Vapor Deposition (PECVD). The impact of deposition pressure, temperature, and nanowire array density on the silicon oxide coating thickness uniformity was assessed using a detailed electron microscopy observations of the nanowire arrays. Deposition rates were found to vary along the nanowire length as a function of the above process parameters, and ranged from 0 to 35 nm/min. The coating thickness was found to be most uniform at higher pressures and temperatures, and high-density nanowire arrays with smaller nanowire diameters and larger lengths led to the deposition of coating with a smaller thickness gradient along the wire length.     

沉积温度对微晶硅薄膜结构特性的影响

采用PECVD技术，在玻璃衬底上沉积μc-Si:H薄膜. 用拉曼光谱、SEM和UV分光光度计对不同沉积温度下沉积的薄膜的结构特性进行分析. 研究发现：沉积温度较低时，随着沉积温度的升高，薄膜的晶化率增加；当沉积温度超过某一温度值时，随着温度的进一步升高，薄膜的晶化率降低. 这时，表面反应由表面扩散限制转变为流量控制. 该温度值随着硅烷含量的降低而降低. 关键词： 氢化微晶硅薄膜 拉曼散射谱 晶化率 UV分光光度计     

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建立一维自洽流体模型,对低压甚高频等离子体放电中产生的主要粒子建立连续性方程、动量方程和电流平衡方程。分析了甚高频对纳米粒子的种子离子SiH3-及电子和正离子SiH3+的影响,给出了种子离子、电子以及正离子密度随频率变化的时空演化过程。结果表明改变频率可以改变SiH3-的密度,从而控制粒子的成核及生长。同时甚高频放电也改变了等离子体中电子和正离子密度以及电场的强度,从而加快等离子体中的化学反应速度和纳米粒子的沉积速度。