[(Fe/Pt/Fe)/Ag]n多层膜低温合成分离的L10相FePt纳米颗粒

制备了[(Fe/Pt/Fe)/Ag]n多层膜,研究了不同温度退火后的微结构和磁特性.实验结果表明温度高于400℃退火后,样品开始形成L10相的FePt纳米颗粒与Ag基体的复合结构.△M曲线的测量表明FePt颗粒之间不存在交换作用,非常清楚地说明非磁基体Ag有效地隔离了FePt磁性颗粒.有序相的低温合成可能和多层膜结构所造成的界面扩散以及Ag层引入的界面缺陷有关,同时,Ag原子较强的迁移性以及FePt与Ag之间表面自由能的显著差异,使FePt纳米颗粒被Ag隔离.     

利用FePt/Au多层膜结构制备垂直磁记录L10-FePt薄膜

利用磁控溅射方法在100℃的MgO单晶基片上制备了[FePt/Au]10多层膜,并研究了采用FePt/Au多层膜结构对FePt薄膜的有序化温度、矫顽力(HC)、垂直磁各向异性、晶粒尺寸以及颗粒间磁交换耦合作用的影响.磁性测试结果表明:FePt/Au多层膜在退火后具有较高的HC、良好的垂直磁各向异性、较小的晶粒尺寸且无磁交换耦合作用.截面高分辨电镜分析表明:Au可以缓解MgO和FePt之间较大的晶格错配,从而促进薄膜的垂直磁各向异性;同时,采用FePt/Au多层膜结构增加了FePt/Au界面能、应力能以及Au原子在薄膜中的扩散作用,促进了薄膜的有序化,从而有效降低了有序化温度,并且大幅度提高其HC.此外,Au原子部分扩散到FePt相的边界处,起到抑制FePt晶粒生长、隔离FePt颗粒的作用,从而显著降低了FePt晶粒的尺寸和颗粒间磁交换耦合作用.     

利用FePt/Au多层膜结构制备垂直磁记录L10-FePt薄膜

利用磁控溅射方法在100℃的MgO单晶基片上制备了［FePt/Au］₁₀多层膜,并研究了采用FePt/Au多层膜结构对FePt薄膜的有序化温度、矫顽力（H_C）、垂直磁各向异性、晶粒尺寸以及颗粒间磁交换耦合作用的影响.磁性测试结果表明：FePt/Au多层膜在退火后具有较高的H_C、良好的垂直磁各向异性、较小的晶粒尺寸且无磁交换耦合作用.截面高分辨电镜分析表明：Au可以缓解MgO和FePt之间较大的晶格错配,从而促进薄 关键词： 0-FePt薄膜')" href="#">L1₀-FePt薄膜 有序化温度 垂直磁各向异性 磁交换耦合作用     

Ag和Ti底层对[Fe/Pt]n多层膜有序化的影响

利用磁控溅射的方法，在热玻璃基片上制备了以Ag，Ti，Cu，Cr，Pt和Ta为底层的［Fe/Pt］_n多层膜，后经不同温度真空热处理，得到L1₀有序结构的FePt 薄膜（L1₀-FePt）.实验结果表明，以Ag和Ti为底层，通过采用基片加温，同时 利用［Fe/Pt］_n多层膜结构，可以促进FePt薄膜的有序化过程，使FePt-L1_０有序化温度从500℃降低到350℃.在较高的温度下退火，以Ag为底层对薄膜的磁性 能影响较小，而以Ti为底层在高于500℃退火后，矫顽力明显下降.在400℃退火20min后，以 Ag和Ti为底层的样品平行膜面的矫顽力分别达到597kA/m和645kA/m，剩磁比分别达到0.81和 0.94，为将来FePt-L1_０有序相合金薄膜用于未来超高密度磁记录介质打下基础. 关键词： ０-FePt薄膜')" href="#">L1_０-FePt薄膜 有序化温度 底层 多层膜结构     

垂直取向FePt/Ag纳米颗粒薄膜的结构和磁性

用磁控溅射法在单晶MgO(100)基片上制备了［FePt 2 nm/Ag dnm］₁₀多层膜， 经真空热处理后，得到具有高矫顽力的垂直取向L1₀-FePt/Ag颗粒膜.x射线衍射结 果表明，在250 ℃的热基片上溅射，当Ag层厚度d=3—11 nm时，FePt颗粒具有很好的［001］取向，随着Ag层厚度的增加，FePt颗粒尺寸减小.［FePt 2 nm/Ag 9 nm］₁₀经过6 00 ℃真空热处理15 min后，颗粒大小仅约8 nm，垂直矫顽力达到692 kA/m.这种无磁耦合作用的颗粒膜，适合用作超高密度的垂直磁记录介质. 关键词： 磁控溅射 垂直磁记录 纳米颗粒膜 0-FePt/Ag')" href="#">L1₀-FePt/Ag     

利用［Fe/Pt］n多层膜降低L10-FePt有序化温度

采用直流磁控溅射方法制备了Fe/Pt多层膜和FePt单层薄膜，再经不同温度真空热处理得到 了有序相L10₀-FePt薄膜.通过x射线衍射谱和磁性研究表明，FePt单层薄膜需 要在500℃ 以上热处理，才能开始有序化转变，而Fe/Pt多层膜可以降低FePt薄膜有序化温度.［Fe(1 5nm)/Pt(15nm)］13₁₃薄膜在350℃热处理后，有序度已经增加到 06，相应矫 顽力达到了501kA/m.多层膜化促进有序化在较低的温度下进行，这是由于热处理过程中多 关键词： 0-FePt有序相')" href="#">L10₀-FePt有序相 磁控溅射 有序度 Fe/Pt多层膜     

缓冲层Ta对FePt薄膜L10有序相转变及矫顽力的影响

制备了Ta/FePt/C系列多层膜，研究了样品在不同温度退火后的磁特性和微结构.实验结果表明，不同厚度的Ta缓冲层具有不同的微结构特征，显著影响FePt层的L1₀有序相的形成及相应的矫顽力.当Ta缓冲层较薄，Ta层为非晶态，且较为粗糙，由此使FePt在界面处产生较多的缺陷并导致较高密度的晶界，在退火过程中，受束缚相对较弱的非晶态的Ta原子比较容易沿FePt的缺陷和晶界处向FePt层扩散，使FePt在相变过程中产生的应力比较容易释放，同时，Ta在扩散过程中产生的缺陷，降低了FePt有序 关键词： FePt薄膜 0相')" href="#">L1₀相 原子扩散     

Ag/Fe/Ag 纳米颗粒膜磁特性和微结构

"利用对靶磁控溅射法制备了一系列Ag/Fe/Ag纳米薄膜,沉积态样品Fe层厚度固定为35 nm,Ag层厚度为1、2、3、4、5 nm．随后对沉积态样品进行了退火处理,退火温度分别为200、300、400、500、600 ℃ , 退火30 min． 利用VSM测量了样品的磁特性, 利用SPM观察样品表面形貌和磁畴结构,并且利用XRD分析了样品的晶体结构．研究结果表明,沉积态样品随Ag层厚度的变化,垂直和平行膜面矫顽力均先增加后减小．当Ag层厚度为3 nm时,垂直膜面矫顽力最大约为260 Oe,样品颗粒分布均     

CoPt(FePt)-C纳米复合膜的结构与磁性

用磁过滤脉冲真空电弧沉积方法制备了CoPt(FePt) C纳米复合薄膜，并在不同温度下进行了退火处理，研究了薄膜中碳的含量以及退火温度对薄膜结构与磁性能的影响.制备态薄膜经过足够高的温度退火后，x射线衍射和磁力显微镜分析发现，在碳基质中生成了面心四方相的CoPt(FePt)纳米颗粒.对于特定组分为Co24Pt31C45和Fe43Pt35C22的薄膜，矫顽力以及颗粒尺寸都随退火温度的升高而增大，当退火温度为700℃时，Co24Pt31C45薄膜的矫顽力为21×105A/m，晶粒尺寸为17nm;当退火温度为650℃时，Fe43Pt35C22相应值分别为28×105A/m和105nm. 关键词： 磁记录材料 磁性薄膜 CoPt FePt纳米复合薄膜     

纳米FePt颗粒:MgO多层复合薄膜的外延生长、微观结构与磁性研究

采用脉冲激光沉积法,在MgO(100)面上外延生长了FePt:MgO多层纳米复合薄膜,FePt成分为Fe48Pt52.FePt纳米颗粒周期性嵌埋于单晶MgO外延层中.原位反射式高能电子衍射分析结果表明,MgO外延层呈层状生长,而FePt纳米颗粒呈岛状生长.在整个FePt:MgO纳米复合薄膜的生长过程中,成功实现了层状-岛状生长模式的交替控制.高分辨透射电子显微镜分析结果表明,退火热处理后,结晶完整的L10-FePt纳米颗粒粒径约为5 nm,呈扁平六角形状,在MgO基底上形成逐层排列的纳米点阵.磁滞回线结果表明,退火后薄膜矫顽力增大,有序度提高,磁性增强.     

Structure and magnetic properties of magnetron-sputtered [(Fe/Pt/Fe)/Au]n multilayer films

Using dc magnetron sputtering, Fe/Pt/Au multilayer films were prepared, and the effects of Au layer thickness and annealing temperature on structure and magnetic properties of the Fe/Pt/Au multilayer films were investigated. The as-deposited Fe/Pt/Au multilayer films have good periodic structure with composition modulation along the growth direction. The stress stored in the as-deposited films promoted the ordering of the films annealed at 400 °C. When the films were annealed at 500 °C, the thicker Au layer could restrain the order-disorder transformation region volume and lead to the decrease of the ordered volume fraction with Au layer thickness increasing.     

Grain boundary diffusion induced reaction layer formation in Fe/Pt thin films

The solid-state reaction in Pt(15 nm)/Fe(15 nm) and Pt(15 nm)/Ag(10 nm)/Fe(15 nm) thin films after post-annealing at 593 K and 613 K for different annealing times has been studied. The structural properties of these samples were investigated by various methods including depth profiling with secondary neutral mass spectrometry, transmission electron microscopy, and X-ray diffraction. It is shown that after annealing at the above temperatures where the bulk diffusion processes are still frozen, homogeneous reaction layers of FePt and FePt with about 10 at.% Ag, respectively, have been formed. Corresponding depth profiles of the element concentrations revealed strong evidence that the formation mechanism is based on a grain boundary diffusion induced solid-state reaction in which the reaction interfaces sweep perpendicularly to the original grain boundary. Interestingly, X-ray diffraction indicated that in both thin-film systems after the solid-state reaction the ordered L1₀ FePt phase, which is the requested phase for future magnetic data storage applications, is also present.     

The effect of thickness and annealing condition on the microstructure and magnetic properties of Fe/Pt multilayer thin films

[Fe(0.5 nm)/Pt(0.5 nm)]₄₀, [Fe(1 nm)/Pt(1.5 nm)]₂₀ and [Fe(3 nm)/Pt(3 nm)]₁₀ multilayer were prepared by DC magnetron sputtering. By conventional furnace annealing (CA) at 270–600 °C for various time, all of the films still remained the disordered structure with the soft magnetic phase. By rapid thermal annealing (RTA) at 500 °C for various time, we obtained the [Fe(1 nm)/Pt(1.5 nm)]₂₀ and [Fe(3 nm)/Pt(3 nm)]₁₀ films with L1₂ ordered FePt₃ phase which was almost ferromagnetic at room temperature. However, the [Fe(0.5 nm)/Pt(0.5 nm)]₄₀ films was still disordered state even under RTA. Compared with CA, RTA exposed an outstanding effect on accelerating the phase transition when the film thickness is over [Fe(0.5 nm)/Pt(0.5 nm)]₄₀.     

Thermal stability of amorphous SiOC/crystalline Fe composite

We examined the thermal stability of amorphous silicon oxycarbide (SiOC) and crystalline Fe composite by in situ and ex situ annealing. The Fe/SiOC multilayer thin films were grown via magnetron sputtering with controlled length scales on a surface-oxidized Si (100) substrate. These Fe/SiOC multilayers were in situ or ex situ annealed at temperature of 600 °C or lower. The thin multilayer sample (~10 nm) was observed to have a layer breakdown after 600 °C annealing. Diffusion starts from low groove angle triple junctions in Fe layers. In contrast, the thick multilayer structure (~70 nm) was found to be stable and an intermixed layer (Fe_xSi_yO_z) was observed after 600 °C annealing. The thickness of the intermixed layer does not vary as annealing time goes up. The results suggest that the Fe_xSi_yO_z layer can impede further Fe, Si and O diffusion, and assists in maintaining morphological stability.     

Magnetic anisotropy of multilayer [Fe/Pt]n structures

The possibility of controlling the magnetic anisotropy of multilayer [Fe/Pt]n structures grown by magnetron sputtering of Fe and Pt plates by varying number n of layers is studied. Mössbauer spectroscopy data and measured magnetic hysteresis loops demonstrate that the multilayer [Fe/Pt]n structures at n = 16 have a predominantly perpendicular magnetic anisotropy. The results of X-ray photoelectron spectroscopy and micromagnetic simulation point to the presence of intermediate layers enriched in iron ions in the structures. The magnetic anisotropy perpendicular to the surface of the [Fe/Pt]n films at n = 16 is found to be caused by the anisotropy of the intermediate layers.     

Design and fabrication of nanometric ZnS/Ag/MoO3 transparent conductive electrode and investigating the effect of annealing process on its characteristics

In this paper, a ZnS/Ag/MoO₃ (ZAM) nano-multilayer structure is designed theoretically and optimum thicknesses of each layer are calculated. ZnS/Ag/MoO₃ multilayer films with optimized thicknesses have also been fabricated on glass substrates by thermal evaporation method at room temperature. The structural, electrical and optical properties of ZnS/Ag/MoO₃ multilayer are investigated with respect to the variation of annealing temperature. X-ray diffraction patterns show that increase in annealing temperature increases the crystallinity of the structures. High-quality multilayer films with the sheet resistance of 4.5 Ω/sq and the maximum optical transmittance of 85% at 100 °C annealing temperature are obtained. The allowed direct band gap for annealing at different temperatures is estimated to be in the range of 3.37–3.79 eV. The performance of the ZAM multilayer films are evaluated using a predefined figure of merit. These multilayer films can be used as transparent conductive electrodes in optoelectronic devices such as solar cells and organic light emitting diodes.     

Thermally induced changes in magnetic, transport and electronic properties of Fe/Al multilayers

The effect of thermal annealing on the magnetic, transport and electronic properties of electron beam evaporated Fe/Al multilayer samples (MLS), with an overall atomic concentration ratio of Fe/Al 1:1, have been investigated. The grazing incidence X-ray diffraction, resistivity and valance band photoemission measurements indicates the formation of sub-stoichiometric B2 FeAl intermetallic phase at the interface for the MLS annealed at higher temperatures. The corresponding magnetization measurements show large increase in coercivity and drastic reduction in magnetization values. The observed magnetization behaviour in each case is interpreted in terms of their structural and electronic properties changes induced due to the annealing treatment.