Accumulation and annealing of implantation damage in a-Si:H

Hydrogenated amorphous silicon (a-Si:H) films have been irradiated with H⁺, B⁺, P⁺, and Ar⁺ ion beams. The accumulation and the annealing of irradiation-induced defects has been investigated through a series of electronic transport and PDS measurements. We find that for all projectiles damage accumulation is dominated by atomic displacement collisions with the damage saturating for energy transfers in excess of about 10 eV/target atom. Annealing at elevated temperatures causes the conductivity of doped and irradiated a-Si:H films to increase according to stretched exponential decay curves. All annealing parameters derivable from such fits scale with the energy originally dissipated into atomic displacement collisions. For energy transfers up to 10 eV/target atom the activation energy for annealing increases up to a saturation value and, at the same time, an increasing fraction of the irradiation-induced defects becomes stable against annealing at moderate temperatures (T _a<250° C). We discuss these results with respect to damage accumulation data in crystalline silicon (c-Si) and with regard to the annealing of metastable defects in a-Si:H.     

Effect of modifying a methyl siloxane-based dielectric by a polymer thin film for pentacene thin-film transistors

We report on the fabrication of pentacene thin-film transistors (TFTs) utilizing a spun methyl siloxane-based spin-on-glass (SOG) dielectric and show that these devices can give a similar electrical performance as achieved by using pentacene TFTs with a silicon dioxide (SiO₂) dielectric. To improve the electrical performance of pentacene TFTs with the SOG dielectric, we employed a hybrid dielectric of an SOG/cross-linked poly-4-vinylphenol (PVP) polymer. The PVP film was deposited onto the spun SOG dielectric prior to pentacene evaporation, resulting in an improvement of the saturation field effect mobility (μ_sat) from 0.01 cm²/(V s) to 0.76 cm²/(V s). The good surface morphology and the matching surface energy of the SOG dielectric that was modified with the polymer thin film allow the optimized growth of crystalline pentacene domains whose nuclei are embedded in an amorphous phase.     

A thin-film transistor with a very thin a-Si:H layer and its application for an LC panel

One of the disadvantages of applying an a-Si:H thin-film transistor (TFT) to an active matrix-addressed liquid crystal (LC) panel is that a TFT with an a-Si:H has a very large photo-leakage current because of the high photo-conductivity of an a-Si:H itself.We have tried decreasing the photo-leakage current by varying the thickness of an a-Si:H layer (L) in TFTs and investigated the characteristics of TFTs, mainly drain voltage versus drain current containing photo-leakage current (I _ph).As a result, it is shown that lnI _ph is proportional to InL, and its gradient is 1.5–2.0. We assume that the thinner an a-Si:H layer is, the more effective the recombination of carriers at the interface states is forI _ph.We have applied TFT with a very thin a-Si:H layer (30nm) to a full-color active matrix-addressed LC panel for a moving picture display and realized a display of good quality under illuminated condition of 5×10⁴lx without a shading layer in it.     

Design of multiple layered a-Si:H(F)/a-SiGex:H(F) films for enhancement in photoresponse in the near-infrared spectrum

Photo-electric properties of a-Si:H(F)/a-SiGe_x:H(F) multilayer films were investigated by measurements of optical absorption, and photoconductivity in both steady and transient modes with the repetition length and the difference in the optical gap between a-Si:H(F) and a-SiGe_x:H(F) as the variables. Measurements of primary photocurrent clarified that photosensitivity for the multilayer films extended to longer wavelengths of around 725 nm, while high resistivity was maintained despite of lowering the band gap.The drift mobility of electrons was measured by the time-of-flight technique, showing 10^–2-10^–3 cm²/Vs, while the drift mobility-lifetime products of electron was maintained to be 10^–7 cm²/V. On the other hand, the drift mobility of holes was 10^–3 cm²/Vs, which was the similar magnitude to that of a-Si:H(F).     

Influence of exciton-exciton interaction with spin paired charge carriers and exciton-lattice interaction on the surface properties of crystalline solids

Applying tight-binding approximation and spin pairing of like charge carriers in a pair of excitons created in a lattice, the possibility of forming a bound exciton-exciton state is studied. It is found that, provided there exists strong exciton-lattice interaction, such a bound state may be formed and its energy may lie within the valence band deforming the material into a crystalline solid with no energy gap. Lowering of the energy is calculated in naphthalene and anthracene crystals where some experimental results are known. The excess energy released after the formation of such bound state can be adequate, depending on the material, to desorb neutral atoms or eject of electrons from surfaces.     

An improved theoretical model of the dc characteristics of metal-semiconductor field effect transistors

Received: 15 August 1997/Accepted: 13 November 1997     

Electrical switching and thermal studies on Ge22Te78−xIx chalcohalide glasses: The effect of iodine on network-topology

Investigations on the electrical switching behavior and thermal studies using Alternating Differential Scanning Calorimetry have been undertaken on bulk, melt-quenched Ge₂₂Te_78−xI_x (3≤x≤10) chalcohalide glasses. All the glasses studied have been found to exhibit memory-type electrical switching. The threshold voltages of Ge₂₂Te_78−xI_x glasses have been found to increase with the addition of iodine and the composition dependence of threshold voltages of Ge₂₂Te_78−xI_x glasses exhibits a cusp at 5 at.% of iodine. Also, the variation with composition of the glass transition temperature (T_g) of Ge₂₂Te_78−xI_x glasses, exhibits a broad hump around this composition. Based on the present results, the composition x=5 has been identified as the inverse rigidity percolation threshold at which Ge₂₂Te_78−xI_x glassy system exhibits a change from a stressed rigid amorphous solid to a flexible polymeric glass. Further, a sharp minimum is seen in the composition dependence of non-reversing enthalpy () of Ge₂₂Te_78−xI_x glasses at x=5, which is suggestive of a thermally reversing window at this composition.     

利用快速退火法从非晶硅薄膜中生长纳米硅晶粒

报道了一种从非晶硅薄膜中生长纳米硅晶粒的方法。含氢非晶硅薄膜经过快速热退火处理后，用拉曼散射和X射线衍射技术对样品进行分析。实验结果表明：纳米硅晶粒不但能在非晶硅薄膜中形成，而且所形成的纳米硅晶粒的大小随着热退火过程中升温快慢而变化。在升温过程中，若单位时间内温度变化量较大（－100℃/s），则所形成纳米硅粒较小（1．6－15nm）； 若单位时间内温度变化量较低（－1℃/s），则纳米硅粒较大（23－46nm）。根据晶体生长理论和计算机模拟，讨论了升温快慢与所形成的纳米硅颗粒大小的关系。     

The effect of thermal annealing and laser irradiation on the microstructure of vanadium oxide nanotubes

The microstructure of vanadium oxide nanotubes (VONTs) have been characterized using FTIR spectroscopy and Raman spectroscopy. The temperature effects on the VONTs were studies by changing the laser irradiation power and thermal annealing temperature in air. Raman spectroscopy studies showed that the VONTs could be decomposed even at low laser power irradiation. Also, together with scanning electron microscopy, it was found that thermal annealing in air could lead to the collapse of the tubular structure and convert the nanotubes into V₂O₅ nanoparticle. It was found that the thermal stability of VONTs was relatively low and the tubular morphology was destroyed at temperatures higher than 300 °C. The spectroscopic analyses showed that the Raman signature of the VONTs could be established for probing tubular structure.     

Spin asymmetry and s-electron itinerancy in Co/X (X=Co,Cu, V and Ta) multilayers: their dependence on the electronegativity of non-magnetic layers

The electronic structure and magnetic properties of the Co at the Co/X (X=Co, Cu, V and Ta) interfaces have been studied by first-principle discrete variational method. We have found that the spin asymmetry and the s-electron itinerancy of the Co interface layer in the Co/X systems are strongly dependent on the electronegativity of the non-magnetic layers. A large difference in the electronegativity between the non-magnetic and Co layers is unfavorable both for s-electron itinerancy and for the spin exchange split of DOS at the Fermi level. Further study on charge density has revealed that a bond is formed across the Co/V and Co/Ta interfaces.     

Continuous tuning of the threshold voltage of organic thin-film transistors by a chemically reactive interfacial layer

For the design and manufacture of complex integrated circuits, control over the threshold voltage of the transistors is essential. In the present contribution, we present a non-invasive method to tune the threshold voltage of organic thin-film transistors after device assembly over a wide range without any significant degradation of the device characteristics. This is realized by incorporating a thin, chemically reactive siloxane layer bonded to the gate oxide. This results in threshold voltages of around 70 V in the as-prepared devices. By exposing a transistor modified in this way to ammonia at different concentrations, the threshold voltage can be tuned in steps of only a few volts. This treatment affects only the charge density at the semiconductor–dielectric interface, leaving the overall shape of the transistor characteristics and the charge-carrier mobility largely unaltered.     

Ellipsometry,FTIR, Raman and X-Ray Spectroscopy Analysis of PECVD a-Si1-xCx:H Film

Hydrogenated amorphous silicon carbide (a-Si_1-xC_x:H) films were deposited by RF plasma enhanced chemical vapor deposition (PECVD) and subsequently annealed in N₂ atmosphere at different temperatures. Systematic investigations of the deposition temperature and annealing effect on the film's properties, including film thicknesses, optical bandgap, refractive indexes, absorption coefficient (α), chemical bond configurations, stoichiometry and crystalline structures, were performed using ellipsometry, FTIR absorbance spectroscopy, Raman spectroscopy, XPS, and XRD. All of the results indicate that the structural and optical properties of the a-Si_1-xC_x:H film can be effectively engineered by proper annealing conditions. Moreover, molecular vibrational level equation was introduced to explain the peak shift detected by FTIR and Raman spectroscopy.     

Metal-induced solid-phase crystallization of hydrogenated amorphous silicon: dependence on metal type and annealing temperature

We report on metal (Cr, Ni, or Pd)-induced solid-phase crystallization (MISPC) of plasma-enhanced chemical-vapor-deposited hydrogenated amorphous silicon at annealing temperatures ≤600 °C. MISPC is found to significantly reduce the thermal budget of crystallization at annealing temperatures as low as ∼400 °C. The lowest achievable annealing temperature is found to depend on the metal type. The metal type is also found to influence grain size and the conductivity of the polycrystalline silicon. Received: 21 June 1999 / Accepted: 20 October 1999 / Published online: 23 February 2000     

Structural evolution of a-Si:H/SiO2 multilayers upon step by step thermal annealing

a-Si:H/SiO_2 multilayers were prepared by alternatively changing plasma enhanced chemical vapour deposition of a-Si:H layers and in situ plasma oxidation process. Subsequently, as-grown samples were annealed at temperatures from 350℃ to 1100℃ in N_2 ambient with an increment of 100℃. The evolution of bonding configurations and structures with annealing treatments was systematically investigated by Fourier-transform infrared spectroscopy. The peak position of Si－O stretching vibration of SiO_2 layers shift to 1087cm^{-1} after annealing at 1100℃, which demonstrates that the SiO_2 films fabricated by plasma oxidation after high temperature annealing can have similar properties to the thermal grown ones. A Si－O vibration from interfacial SiO_x was identified: the value x was found to increase as increasing the annealing temperature, which is ascribed to the cooperation of hydrogen effusion and reordering of the oxygen bond in SiO_x networks. The H-related bonds were observed in the form of H－Si－O_3 and H－Si－Si_{3-n}O_n (n=1－2) configurations, which are supposed to be present in SiO_2 and interfacial SiO_x layers, respectively. The H atoms bonded in different bonding configurations effuse at different temperatures due to their different desorption energies.     

用H-W-ECR CVD系统实现氢化非晶硅薄膜在氢气环境下同时进行化学热退火和光诱导退火的研究

为了研究氢化非晶硅薄膜的稳定性，我们设计了一个在原子氢气氛中热退火的同时进行光诱导退火的实验(TLAH)。实验装置是由传统的微波电子回旋共振化学气相沉积系统改造而成为热丝辅助微波电子回旋共振化学气相沉积系统。为了对这一退火方法进行比较，对样品还进行了热退火、热退火同时进行光诱导退火。同时，为了定量地分析光电导衰退，我们假设光电导衰退遵循扩展指数规律：1/σph=1/σs-(1/σs-1/σ0)exp[-(t/τ)β]，这里扩展指数参数β 和时间常数 τ 可从与 lnt 的线性关系中截距和斜率得到, 式中光电导饱和值σs可以通过在对数坐标系中表示的光电导和光照时间关系进行高斯拟合得到。实验结果显示：TLAH 方法可以提高氢化非晶硅薄膜的稳定性、改善其微结构和光电特性，同时还发现，光学带隙明显减小、荧光光谱显著地朝着低能方向移动。     

Influence of atomic hydrogen annealing on the optical properties of vacuum-deposited a-Si:H films

The influence of atomic hydrogen annealing on the optical parameters of a-Si:H films was studied using spectrophotometric measurements of the film transmittance and reflectance in the wavelength range 200-3000 nm. In this annealing, the deposition of a thin layer and treatment with atomic hydrogen were repeated alternately, where the thickness of the thin cyclic layer, d_cyc, and the treatment time of each cycle, t_ca, were kept fixed for each sample. A series of different samples with average thickness of 0.5 μm and different d_cyc and t_ca were prepared. It was found that the refractive index, n, and the optical energy gap, E_g, increase as the treatment time, t_ca, increases from 0 to 60 s, while at t_ca=120 s both n and E_g decrease. Also, both the refractive index and the optical energy gap decrease with increasing the relative diffusion length of hydrogen, √t_ca/d_cyc from 0.39 to 0.77. The widening of E_g is due to the structural relaxation resulting from impingement of atomic hydrogen on the growing surface. Thus, a good-quality a-Si:H with Urbach parameter 65 mev and optical energy gap of 1.78 eV was successfully prepared.     

The influence of a HF and an annealing treatment on the barrier height of p- and n-type Si MIS structures

In this paper, the influence of two pre-evaporation surface treatments on the electrical characteristics of n- and p-Si/Au, Cr and Ti MIS diodes are studied. A strong dependence of the barrier height on the pre-evaporation treatment is observed and is found to be independent of the metal work function. In order to explain this, it is suggested that the interfacial charges are strongly affected by the pre-evaporation treatment used.     

Interlayer effect on the characterization of the La-Cr-O coatings with post-sputtering annealing treatment

In this study, the deposition of La-Cr-O coatings on AISI 316 stainless steel was conducted by using a DC magnetron sputtering process. Three types of La-Cr-O coatings were designed, one type without interlayer, and another two types with an interlayer of Cr and CrN film, separately. This study aims to explore the interlayer effect on the properties of La-Cr-O coatings after post-annealing treatment. The coatings were characterized using the X-ray diffractionmeter (XRD), X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM), and thermal gravimetric analysis (TGA)/differential scanning calorimetry (DSC).The results showed that the three as-deposited La-Cr-O coatings had an amorphous structure. After annealing at 800 °C for 1 h in the air, the structure was transformed to the LaCrO₃ perovskite phase. Compared with the coatings without an interlayer, the double-layered coatings did not show the Cr₂O₃ phase in the structure. It implies that the use of the interlayer in the coatings could efficiently prohibit the diffusion of Cr to form oxide on the out-layer. Based on the TGA/DSC analysis and the electrical resistance measurement, it is understood that the annealed La-Cr-O coating with the CrN interlayer turns in the best performance in both chemical stability at high temperature and electrical resistance.     

Effect of thermal annealing on the structure and microstructure of TiO2 thin films

Nanostructured TiO₂ thin films have been prepared through chemical route using sol-gel and spin coating techniques. The deposited films were annealed in the temperature range 400–1000°C for 1 h. The structure and microstructure of the annealed films were characterized by GAXRD, micro-Raman spectroscopy and AFM. The as-deposited TiO₂ thin films are found to be amorphous. Micro-Raman and GAXRD results confirm the presence of the anatase phase and absence of the rutile phase for films annealed up to 700°C. The diffraction pattern of the film annealed at 800 to 1000°C contains peaks of both anatase and rutile reflections. The intensity of all peaks in micro-Raman and GAXRD patterns increased and their width (FWHM) decreased with increasing annealing temperature, demonstrating the improvement in the crystallinity of the annealed films. Phase transformation at higher annealing temperature involves a competition among three events such as: grain growth of anatase phase, conversion of anatase to rutile and grain growth of rutile phase. AFM image of the asdeposited films and annealed films indicated exponential grain growth at higher temperature.      

Enhancement in the photoluminescence of ZnS nanowires by TiO2 coating and thermal annealing

Influences of the TiO₂ coating and thermal annealing on the photoluminescence (PL) properties of ZnS nanowires were investigated. ZnS nanowires were synthesized by thermal evaporation of ZnS powder and then coated with TiO₂ by using the sputtering technique. The PL emission of ZnS nanowires can be significantly enhanced without nearly changing the wavelength of the emission by coating them with a TiO₂ layer with an appropriate thickness and then annealing them in an Ar atmosphere. The optimum TiO₂ coating layer thickness for the highest PL emission enhancement was found to be about 6.5 nm. The PL emission of the ZnS-core/TiO₂-shell coaxial nanowires is degraded by annealing in an oxygen atmosphere whereas it is enhanced by annealing in an argon atmosphere.