Investigation of the recoil fluxes in a SiO2/Si target by means of monte carlo simulation

Abstract

In order to study the effect of an interface on the recoil flux distribution we investigated the angular and energy distribution of Si and O recoil fluxes in a SiO₂/Si target implanted with 50 keV Sb⁺ by Monte Carlo simulation. At the interface the calculations show steps in the recoil fluxes, currents and average energies of the Si and O recoils. Relatively large backflow of Si recoils was found at the interface, but 0.3 nm in front of and behind the interface the net flow was positive. The energy-angle distributions contain a low energy near isotropic and a high energy forward directed part. Behind the interface the high energy part of the O recoil distribution is present. The effect of the interface on the Si recoils is to decrease the average recoil energy and to steepen the energy distribution.     

Ablation process of silica glass induced by laser plasma soft X-ray irradiation

Silica glass can be machined by irradiation with laser plasma soft X-rays on nano- and micrometer scale. We have investigated the ablation process of silica glass induced by laser plasma soft X-ray irradiation. We observed ionic and neutral species emitted from silica surfaces after irradiation. Dominant ions and neutrals are O⁺ and Si⁺ ions and Si, O, SiO and Si₂ neutrals, respectively. The ions have kinetic energies of 13 and 25 eV, which are much higher than those of particles emitted by evaporation. The energy of laser plasma soft X-rays absorbed to silica glass at a fluence of 1.4 J/cm² is estimated to be 380 kJ/cm³, which is higher than the binding energy of SiO₂ of 76 kJ/cm³. These results suggest that the most of the bonds in silica glass are broken by absorption of laser plasma soft X-rays, that several percent of the atoms are ionized, and that neutral atoms are emitted together with repulsive ions. The process possibly enables us to fabricate nano structures.     

Energieverteilungen bei der Festkörperzerstäubung durch Ionenbeschuß

The energy distributions of the neutral particles sputtered from polycrystalline targets of Al, Ti, Ni, Cu and Ag by normally incident Ar⁺-ions in the 1 keV region have been determined for ejection energies below 20 eV in a direction close to the normal to the target surface. The experimental method employed is strongly connected to the characteristic properties of a low pressure electrodeless hf plasma used as an effective ion source as well as an ionizing medium for the ejected target atoms. The resulting curves always show a maximum at most probable ejection energies between 1 and 5 eV, being approximately half of the surface binding energy. These curves are converted to the corresponding energy distributions for the recoil atoms within the target by an energy dependent factor. It is found that the energy distribution within the bombarded solid decreases monotonically with the inverse square of the energy of the recoils.     

Point-defect properties of,and sputtering events in,the {001} surfaces of Ni3Al. II. Sputtering events at and near surfaces

Atomic recoil events at and near {001} surfaces of Ni₃Al due to elastic collisions between electrons and atoms have been simulated by molecular dynamics to obtain the sputtering threshold energy as a function of atomic species, recoil direction and atomic layer of the primary recoil atom. The minimum sputtering energy occurs for adatoms and is 3.5 and 4.5?eV for Al and Ni adatoms on the Ni–Al surface (denoted ‘M’), respectively, and 4.5?eV for both species on the pure Ni surface (denoted ‘N’). For atoms within the surface plane, the minimum sputtering energy is 6.0?eV for Al and Ni atoms in the M plane and for Ni atoms in the N surface. The sputtering threshold energy increases with increasing angle, θ, between the recoil direction and surface normal, and is almost independent of azimuthal angle, ?, if θ<60°; it varies strongly with ? when θ>60°, with a maximum at ??=?45° due to ?{110}? close-packed atomic chains in the surface. The sputtering threshold energy increases significantly for subsurface recoils, except for those that generate efficient energy transfer to a surface atom by a replacement collision sequence. The implications of the results for the prediction of the mass loss due to sputtering during microanalysis in a FEG STEM are discussed.     

Si 2p and O 1s photoemission from oxidized Si(0 0 1) surfaces depending on translational kinetic energy of incident O2 molecules

The influence of translational kinetic energy of incident O₂ molecules for the passive oxidation of the partially oxidized Si(0 0 1) surface has been studied by photoemission spectroscopy. The incident energy of O₂ molecules was controlled up to 3 eV by a supersonic molecular beam technique. Two incident energy thresholds (1.0 and 2.6 eV) were found out in accordance with the first-principle calculations. Si 2p and O 1s photoemission spectra measured at representative incident energies showed the incident energy induced oxidation at the backbonds of the dimer and the second layer (subsurface) Si atoms. Moreover, the difference of oxygen chemical bonds was found out to be as the low and the high binding energy components in the O 1s photoemission spectra. They were assigned to bridge sites oxygen and dangling bond sites oxygen, respectively.     

Measurement of the transverse kinetic energies of argon recoil ions produced in 120 MeV -Ar collisions

Measurements were carried out to deduce the transverse kinetic energies of highly charged argon recoil ions produced in single collisions of 120 MeV ions with argon atoms in which the post collision charge states of the projectiles were not determined. A time of flight spectrometer was designed and fabricated to detect the charge states of recoils. Experimental procedures for optimizing the spectrometer for extraction, transmission and detection of recoils are described. A simple approach for determining the transverse kinetic energy of the recoil ions from FWHM of the peaks is reported. This method is shown to be independent of the choice of collision partners and requires only the knowledge of the physical values of “optimized parameters” of time-of-flight spectrometer used in the experiment. The transverse kinetic energy of the recoil ions determined from the present approach is found to vary from 0.03 eV for to 4.02 eV for Ar¹⁰⁺. These values are compared with the results reported by earlier workers and are shown to follow a q²-behaviour up to a charge state q =8+ of the recoil ions. Received: 5 February 1998 / Revised: 8 June 1998 / Accepted: 11 June 1998     

Atomic-scale studies of native point defect and nonstoichiometry in silicon oxynitride

The native point defects and mechanism of accommodating deviations from stoichiometry of Si₂N₂O crystal have been investigated using atomistic simulation techniques. This work firstly provides a reliable classical interatomic potential model derived from density functional theory calculations. The force-field parameters well reproduce the crystal structure, elastic stiffness, and dielectric constants of Si₂N₂O. It is expected that the force-field parameters are useful in future investigations on Si₂N₂O by molecular dynamic simulation. The calculated formation energies for native defects suggest that intrinsic disorder in stoichiometric Si₂N₂O is dominated by antisites and a degree of oxygen Frenkel defect may also exist in this system. In nonstoichiometric Si₂N₂O, the calculated reaction energies indicate that excess SiO₂ or Si₃N₄ is most likely accommodated by the formation of antisite in the lattice. And we also find that SiO₂ excess is energetically more favorable than Si₃N₄ surplus in Si₂N₂O.     

GEANT4SPE质子屏蔽和半导体材料辐射效应模拟

利用蒙特卡罗软件GEANT4模拟太阳宇宙射线中能量为1 MeV~10 GeV质子对航天飞行器的影响,透射质子对半导体材料的损伤效应,计算外壳铝层对质子能谱的屏蔽效应.模拟结果表明,质子在介质中的线性能量转移、射程等和参考数据吻合较好;沿质子轨迹纵向能量沉积出现Bragg峰,且非弹性作用是影响能量沉积Bragg曲线的重要因素;对于半导体Si材料,反冲原子主要分布在质子轨迹线周围,并沿轨迹线横向‘扩散’,浓度降低;Al层屏蔽使入射质子能谱硬化,当Al层厚度超过10 mm时,厚度增加对屏蔽效果的改善不明显,反而次级粒子辐射增强效应变大.     

High resolution core and valence band XPS spectra of non-conductor pyroxenes

High resolution core level and valence band (VB) X-ray photoelectron spectra (XPS) of the non-conductor pyroxene minerals, bronzite ((Mg_0.8,Fe_0.2)₂Si₂O₆) and diopside (Ca(Mg_0.8Fe_0.2)Si₂O₆) have been obtained with the Kratos magnetic confinement charge compensation which minimizes differential charge broadening. Observed Si 2p, O 1s, Mg 2p and Ca 2p total linewidths are all about 1.3 eV, very similar to those observed previously with the same instrument for SiO₂ and olivines ((Mg,Fe)₂SiO₄); and we consider that these widths are within 0.05 eV of the minimum room temperature linewidths for these samples with the experimental resolution of this instrument of 0.35 eV. These linewidths are all determined by vibrational broadening due to the M-O symmetric stretch in the ion states. The Si 2p binding energies (BE) are intermediate between the quartz and olivine Si 2p binding energies; but the O 1s spectra resolve the bridging oxygen (BO) and non-bridging oxygen (NBO) in the unit, with the NBO O 1s very close in BE to the O in olivine, and the BO very close to the BO in SiO_2. Indeed in both diopside and bronzite, it is possible to separate the three structurally inequivalent O atoms in the O 1s spectra: the BO at a BE of about 532.6 eV, a NBO peak from the MgOSi moiety (Mg in the M1 site) at about 531.3 eV, and a NBO peak at 531 eV from the CaOSi or the FeOSi moieties (Ca and Fe in the M2 site). The O 1s BE increases with the increase in the electronegativity Ca < Mg < Fe < Si. Moreover, the linewidths of these peaks increase when Fe and Mg are both present in either M1 (diopside) or M2 (bronzite) sites.The valence band spectra for the two pyroxenes are rather similar, and quite different from the VB spectra of quartz and olivines. The dispersion of the pyroxene VB spectra is intermediate between the VB spectra of quartz and olivines; the valence band spectrum of pyroxenes are more dispersed than in olivines by about 1.5 eV but less dispersed than quartz by about 1.5 eV. These VB spectra can be assigned using the previous olivine VB spectra and high quality pseudopotential density functional theoretical calculations in the generalized gradient (GGA) approximation. As for the olivine VB spectra, the Fe 3d t_2g and e_g orbitals in M1 and M2 sites of the pyroxene are located at the top of the pyroxene valence band, and the BE of the Fe 3d peaks from M1 are about 0.7 eV smaller than the Fe 3d peaks in M2. The theoretical XPS valence band spectra using the theoretical density of states and the Gelius intensity approximation are is in good semi-quantitative agreement with the experimental spectra. This intermediate dispersion of pyroxenes is due to the partial polymerization of the Si-O units in pyroxenes, and the intermediate charge on the Si atoms as indicated by the Si 2p BE.     

CF interaction with Si(1 0 0)-(2 × 1): Molecular dynamics simulation

In this study, the interaction of CF with the clean Si(1 0 0)-(2 × 1) surface at normal incidence and room temperature was investigated using molecular dynamics simulation. Incident energies of 2, 12 and 50 eV were simulated. C atoms, arising from dissociation, preferentially react with Si to form Si-C bonds. A Si_xC_yF_z interfacial layer is formed, but no etching is observed. The interfacial layer thickness increases with increasing incident energy, mainly through enhanced penetration of the silicon lattice. Silicon carbide and fluorosilyl species are formed at 50 eV, which is in good agreement with available experimental data. The level of agreement between the simulated and experimental results is discussed.     

Suppression of boron segregation by interface Ge atoms at SiGe/SiO2 interface

We investigate the migration pathway and barrier for B diffusion at SiGe/SiO₂ interface through first-principles density functional calculations. Similar to the diffusion mechanism reported for Si/SiO₂ interface, a substitutional B, which initially forms a B-self-interstitial complex in SiGe, diffuses to the interface and then to the oxide in form of an interstitial B. At the defect-free interface, where bridging O atoms are inserted to remove interface dangling bonds, it is energetically more favorable for the interstitial B to intervene in the Ge–O bridge bond rather than the Si–O bridge bond at the interface. As a result of the B intervention, interface Ge atoms significantly enhance the stability of B-related defects in the interface region and thereby act as traps for B dopants. At the interface with the Ge–O bridge bond, the overall migration barrier for B diffusion from SiGe to SiO₂ is estimated to be about 3.7 eV, much higher than the reported value of about 2.1 eV at Si/SiO₂ interface. Our results provide a clue to understanding the experimental observation that B segregation toward the oxide is suppressed in SiGe/SiO₂ interface.     

Mixing of Au in Si induced by secondary and high-order recoil implantation

The mixing of Au in Si induced by secondary and high-order recoil implantation was investigated using 350 keV Ar⁺ and 350 keV Kr⁺ ions to fluences from 1?×?10¹⁶ to 3?×?10¹⁶ ions/cm² at room temperature. The thickness of the Au layer evaporated on Si substrate was ～2400 Å.The ranges of the Ar and Kr ions were chosen to be lower than the thickness of the Au layer in order to avoid the ballistic mixing produced by the primary knock-on atoms. Rutherford backscattering spectrometry (RBS) experiments were carried out to study the effects induced by Ar and Kr irradiation at the interface of Au–Si system. We observed that in the case of the irradiation with Ar⁺ ions, a broadening of the Au–Si interface occurred only at the fluence of 3?×?10¹⁶ Ar⁺/cm² and it is attributed to the surface roughening induced by ion bombardment. In contrast, the RBS analysis of a sample irradiated with 2?×?10¹⁶ Kr⁺/cm² clearly showed, in addition to the broadening effect, the formation of a mixed zone of Au and Si atoms at the interface. The mixing of Au in Si atoms can be explained by the secondary and high-order recoil implantation followed by subsequent collision cascades.     

Properties of the SiO2/SiC interface investigated by angle resolved studies of the Si 2p and Si 1s levels and the Si KLL Auger transitions

Angle resolved photoemission studies of the Si 2p and Si 1s core levels and the Si KL_2,3L_2,3 Auger transitions from SiO₂/SiC samples are reported. Most samples investigated were grown in situ on initially clean and well ordered √3×√3 reconstructed 4H-SiC(0 0 0 1) surfaces but some samples were grown ex situ using a standard dry oxidation procedure. The results presented cover samples with total oxide thicknesses from about 5 to 118 Å. The angle resolved data show that two oxidation states only, Si⁺¹ and Si⁺⁴, are required to explain and model recorded Si 2p, Si 1s and Si KLL spectra.The intensity variations observed in the core level components versus electron emission angle are found to be well described by a layer attenuation model for all samples when assuming a sub-oxide (Si₂O) at the interface with a thickness ranging from 2.5 to 4 Å. We conclude that the sub-oxide is located at the interface and that the thickness of this layer does not increase much when the total oxide thickness is increased from about 5 to 118 Å.The SiO₂ chemical shift is found to be larger in the Si 1s level than in the Si 2p level and to depend on the thickness of the oxide layer. The SiO₂ shift is found to be fairly constant for oxides less than about 10 Å thick, to increase by 0.5 eV when increasing the oxide thickness to around 25 Å and then to be fairly constant for thicker oxides. An even more pronounced dependence is observed in the Si KLL transitions where a relative energy shift of 0.9 eV is determined.The relative final state relaxation energy ΔR(2p) is determined from the modified Auger parameter. This yields a value of ΔR(2p)=−1.7 eV and implies, for SiO₂/SiC, a “true” chemical shift in the Si 2p level of only ≈0.4 eV for oxide layers of up to 10 Å thick.     

Mechanisms of ion-beam-enhanced diffusion in amorphous silicon

We have investigated ion-beam-enhanced diffusion of Au in undoped and B doped amorphous Si. The diffusion coefficients depend linearly on ion flux and exibit an Arrhenius-like temperature dependence with an activation energy of 0.37 eV in the temperature range 200–350° C. Moreover the diffusivity is enhanced by a factor of 5 by B-doping at a concentration of 1×10²⁰ atoms/cm³. A similar enhancement is observed in thermal diffusion of Au which has an activation energy of 1.5 eV. On the basis of these results a model for the ion-beam-enhanced diffusion of Au is proposed where the high density of defects present in amorphous Si act as traps for the fast moving interstitial Au atoms. The effectiveness of this trapping process can be changed by the high concentration of mobile defects generated by the beam and also by a change in the charge state of the traps induced by the presence of B.     

Simulation of the structure of oxygen hole centers in Mg2SiO4 and Mg2SiO4: Cr forsterite crystals by the interatomic potential method

The structure of oxygen hole centers in forsterite crystals has been simulated using the interatomic potential method. The energies of isolated oxygen hole centers, as well as the energies of their clusters with intrinsic and extrinsic defects of the crystal, have been estimated for different arrangements of point defects in the structure. It has been shown that the most energetically favorable position for isolated oxygen hole centers is the O3 position, in which the gain in the formation energy is equal to 0.17 eV as compared to the O2 position and 1.66 eV as compared to the O1 position. The maximum energy gain due to the association energy can be achieved when the oxygen hole centers are located at the vertices of the tetrahedron with a silicon vacancy. The presence of chromium in the forsterite crystal can increase the probability of the formation of silicon vacancies. The obtained results have been discussed in terms of the experimental investigations of the color centers generated in the Mg₂SiO₄ and Mg₂SiO₄: Cr crystals under ionizing radiation.     

Athermal migration of vacancies in iron and copper induced by electron irradiation

Abstract

Irradiation with high-energy particles induces athermal migration of point defects, which affects defect reactions at low temperatures where thermal migration is negligible. We conducted molecular dynamics simulations of vacancy migration in iron and copper driven by recoil energies under electron irradiation in a high-voltage electron microscope. Minimum kinetic energy required for migration was about 0.8 and 1.0 eV in iron and copper at 20 K, which was slightly higher than the activation energy for vacancy migration. Around the minimum energy, the migration succeeded only when a first nearest neighbour (1NN) atom received the kinetic energy towards the vacancy. The migration was induced by higher kinetic energies even with larger deflection angles. Above several electron-volts and a few 10s of electron-volts, vacancies migrated directly to 2NN and 3NN sites, respectively. Vacancy migration had complicated directional dependence at higher kinetic energies through multiple collisions and replacement of atoms. The probability of vacancy migration increased with the kinetic energy and remained around 0.3–0.5 jumps per recoil event for 20–100 eV. At higher temperatures, thermal energies slightly increased the probability for kinetic energies less than 1.5 eV. The cross section of vacancy migration was 3040 and 2940 barns for 1NN atoms in iron and copper under irradiation with 1.25 MV electrons at 20 K: the previous result was overestimated by about five times.     

Etching of SiC by energetic F2: Molecular dynamics simulation

Molecular dynamics (MD) simulations were performed to investigate F₂ continuously bombarding silicon carbide (SiC) surfaces with energies in the range of 50-200 eV at normal incidence and room temperature. The Tersoff-Brenner form potential was used. The simulation results show that the uptake of F atoms, the etch yields of C and Si from the initial substrate, and the surface structure profile are sensitive to the incident energy. Like occurrence in Si etching, steady-state etching is observed and an F-containing reaction layer is formed through which Si and C atoms are removed. A carbon-rich surface layer after bombarding by F₂ is observed which is in good agreement with experiments. In the reaction layer, SiF in SiF₂ species are dominant; with increasing incident energy, the total fraction of SiF and SiF₂ increases, while the amount of SiF₃ and SiF₄ decreases. Finally, etching mechanisms are discussed.     

Photoelectron spectra of F3SiC2H4Si(CH3)3 molecule using monochromatized synchrotron radiation

A variety of photoelectron spectra for gas phase F₃SiC₂H₄Si(CH₃)₃ molecule have been measured using monochromatized undulator radiation and a hemispherical electrostatic analyzer. Valence photoelectron spectrum shows many peaks for ionization from shallow and deep molecular orbitals in the binding energy region of 9–40 eV. A calculation of ionization energies using the outer valence Green's function method indicates energies in agreement with experimental results below 17.5 eV. Spectra for Si L-shell electron emission show chemical shifts of Si atoms induced from different chemical environments around two Si atoms and also exhibit spin–orbit splitting for 2p photoelectrons. Further photoelectron spectra for C K-shell and F K-shell are discussed in comparison with those of related molecules.     

Band bending and band alignment at HfO2/HfSixOy/Si interfaces

Band bending and band alignment at HfO₂/SiO₂/Si and HfO₂/Hf/SiO₂/Si interfaces were investigated using X-ray photoelectron spectroscopy. After Hf-metal pre-deposition, a 0.55 eV band bending in Si and a 1.80 eV binding energy decrease for Hf 4f and O 1s of HfO₂ were observed. This was attributed to the introduction of negative space charges at interface by Hf pre-deposition. Band bending decrease and synchronous binding energy increases of O 1s and Hf 4f for HfO₂ were observed during initial Ar⁺ sputtering of the Hf pre-deposited sample. This was interpreted through the neutralization of negative space charges by sputtering-induced oxygen vacancies.     

Resonant photoemission at the oxygen K edge as a tool to study the electronic properties of defects at SiO2 /Si and SiO2 /SiC interfaces

Silicon is by far the most important material used in microelectronics, partly due to the excellent electronic properties of its native oxide (SiO₂), but substitute semiconductors are constantly the matter of research. SiC is one of the most promising candidates, also because of the formation of SiO₂ as native oxide. However, the SiO₂/SiC interface has very poor electrical properties due to a very high density of interface states which reduce its functionality in MIS devices. We have studied the electronic properties of defects in the SiO₂/Si and SiO₂/SiC interfaces by means of XAS, XPS and resonant photoemission at the O 1s and the Si 2p edges, using silicon dioxide thermally grown with thicknesses below 10 nm. Our XAS data are in perfect agreement with literature; in addition, resonant photoemission reveals the resonant contributions of the individual valence states. For the main peaks in the valence band we find accordance between the resonant behaviour and the absorption spectra, except for the peaks at −15 eV binding energy, whose resonant photoemission spectra have extra features. One of them is present in both interfaces and is due to similar defects, while another one at lower photon energy is present only for the SiO₂/SiC interface. This is related to a defect state which is not present at the SiO₂/Si interface.