Electrically conductive composites of polyethylene filled with polyamide particles coated with silver

New types of electrically conductive polymeric composites were prepared on a base of high-density polyethylene (HDPE) matrix filled with silver-coated polyamide (PA) particles. The electrical, mechanical and adhesive properties of those composites are reported in this paper. The percolation concentration of the filler within a matrix was found to be 4 vol.%. Composites filled with high filler content were highly electrically conductive; their electrical conductivity reached the value of 6.8 × 10² S cm⁻¹. Mechanical properties and rheology of these composites were discussed. The adhesive properties of the composites to metal sharply increased with an increase in the filler content.     

Use of carbon black as a reinforcing nano-filler in conductivity-reversible elastomer composites

This study presents an innovative approach to the production of reinforced elastomer composites filled with carbon black Printex XE-2B, using the calendering process and ionic liquids (ILs) as dispersing agents. The effect of Printex XE-2B on the mechanical and electrical properties of acrylonitrile-butadiene rubber (NBR) composites was compared to that of conventional carbon black Humex N339. It was found that the highly structured Printex XE-2B significantly enhanced both the mechanical and electrical properties of the NBR composites, in contrast to standard Humex N339. To obtain uniform filler dispersion in the polymer matrix, several different ILs were employed as dispersing agents. The application of ILs had a considerable effect on the properties of the prepared composites, due to the improved dispersion of the filler particles in the composite matrix, which favored the formation of ‘conductive paths.’ Importantly, the prepared NBR/Printex XE-2B/IL composites were found to have reversible and repeatable electrical properties following exposure to chloroform vapors.     

The effect of surface coating of CNTs on the mechanical properties of CF‐filled HDPE composites

Mechanical properties of carbon fiber (CF) and carbon nanotube (CNT)‐filled thermoplastic high‐density polyethylene (HDPE) composites were studied with particular interest on the effects of filler content and fiber surface treatment by coupling agent. Surface‐treated CF‐filled HDPE composites increased their tensile strength and impact strength, which is further increased with the addition of CNT. SEM showed that CNT‐coating‐treated CF‐HDPE composites show better dispersion of the filler into the matrix, which results in better interfacial adhesion between the filler and the matrix. Copyright © 2014 John Wiley & Sons, Ltd.     

多壁碳纳米管/聚乙烯复合材料的制备及其导电行为

多壁碳纳米管/聚乙烯复合材料的制备及其导电行为;碳纳米管;高密度聚乙烯;渗流阈值;导电行为;V-PTC特性     

iPP/HDPE/CB三元导电复合材料的导电与流变行为

利用界面能原理使CB选择性分布于HDPE中成为复合导电相,固定CB在HDPE中的质量分数(20 wt％),控制CB/HDPE导电相在iPP中的含量,制备出一系列三元(iPP/HDPE/CB)导电复合材料,并研究其导电逾渗和流变逾渗行为.结果表明,在复合导电相含量为20 wt％时复合材料内即形成导电网络,在复合导电相含量30 wt％时出现流变网络.只有当复合导电相在材料中形成连续相时(60 wt％),损耗因子在频率扫描中才出现峰值.     

The addition of functionalized graphene oxide to polyetherimide to improve its thermal conductivity and mechanical properties

The thermal and electrical conductivity and mechanical properties of polyetherimide (PEI) containing either alkyl‐aminated (enGO) or phenyl‐aminated graphene (pnGO) oxides were studied. A solution casting method was used to prepare functionalized graphene oxide/PEI composites with different filler contents. The introduction of functionalized graphene oxide to the PEI matrix improved the thermal conductivity, electrical conductivity, and mechanical properties. The thermal conductivities of the enGO 3 wt%/PEI and pnGO 3 wt%/PEI composites were 0.324 W/mK and 0.329 W/mK, respectively, due to the high thermal conductivity of the graphene‐based materials and the strong interface adhesion due to the filler surface treatment between the fillers and the matrix. The electrical conductivities of the functionalized graphene oxide/PEI composites were larger than that of PEI, but the electrical conductivity values were generally low, which is consistent with the magnitude of the insulator. The strong interfacial adhesion between the fillers and the matrix led to improved mechanical properties. Copyright © 2014 John Wiley & Sons, Ltd.     

Fabrication of thermoplastic polyurethane composites with a high dielectric constant and thermal conductivity using a hybrid filler of CNT@BaTiO3

Thermoplastic polyurethane composites with an excellent dielectric constant and high thermal conductivity were obtained using CNT@BaTiO₃ as a filler through a low-speed melt extrusion method. Before preparing the hybrid filler for the composite, the filler particles were surface modified to ensure that the outer surfaces could facilitate the reaction among particles to form the hybrid and ensure complete dispersion in the thermoplastic polyurethane matrix. After confirming the proper surface treatment of the filler particles using infrared spectroscopy, thermal degradation analysis and field emission scanning electron microscopy, they were used to prepare the composite materials at a processing temperature of 200 °C. The thermal stability, thermomechanical properties, mechanical properties, thermal conductivity, and dielectric properties of the composites were investigated. Compared to the neat thermoplastic polyurethane matrix, the prepared composite exhibited a higher thermal stability, approximately 300% higher storage modulus, higher tensile strength and elongation at break values, approximately three times higher thermal conductivity (improved from 0.19 W/(m.K) to 0.38 W/(m.K), and approximately five times larger dielectric constant at high frequencies (at 1 MHz a dielectric constant of 19.2 was obtained).     

Epoxy‐based composite adhesives: Effect of hybrid fillers on thermal conductivity,rheology, and lap shear strength

Thermal management is an important parameter in an electronic packaging application. In this work, three different types of fillers such as natural graphite powder (Gr) of 50‐μm particle size, boron nitride powder (h‐BN) of 1‐μm size, and silver flakes (Ag) of 10‐μm particle size were used for thermal conductivity enhancement of neat epoxy resin. The thermal properties, rheology, and lap shear strength of the neat epoxy and its composite were investigated. The analysis showed that the loading of different wt% of Gr‐based fillers can effectively increase the thermal conductivity of the epoxy resin. It has also been observed that the thermal conductivity of the hybrid filler (Gr/h‐BN/Ag) reinforced epoxy adhesive composite increased six times greater than that of neat epoxy resin composite. Further, the viscosity of hybrid filler reinforced epoxy resin was found to be increased as compared with its virgin counterpart. The adhesive composite with optimized filler content was then subsequently subjected to determine single lap shear strength. The degree of filler dispersion and alignment in the matrix were determined by scanning electron microscopy (SEM) analysis.     

Surface modification of boron nitride via poly (dopamine) coating and preparation of acrylonitrile‐butadiene‐styrene copolymer/boron nitride composites with enhanced thermal conductivity

A biology‐inspired approach was utilized to functionalize hexagonal boron nitride (h‐BN), to enhance the interfacial interactions in acrylonitrile‐butadiene‐styrene copolymer/boron nitride (ABS/BN) composites. The poly (dopamine), poly (DOPA) layer, was formed on the surface of BN platelets via spontaneously oxidative self‐polymerization of DOPA in aqueous solution. The modified BN (named as mBN) coated with poly (DOPA) was mixed with ABS resin by melting. The strong interfacial interactions via π‐π stacking plus Van der Waals, both derived from by poly (DOPA), significantly promoted not only the homogeneous dispersion of h‐BN in the matrix, but also the effective interfacial stress transfer, leading to improve the impact strength of ABS/mBN even at slight mBN loadings. A high thermal conductivity of 0.501 W/(m·K) was obtained at 20 wt% mBN content, reaching 2.63 times of the value for pure ABS (0.176 W/(m·K)). Meanwhile, the ABS/mBN composites also exhibited an excellent electrical insulation property, which can be expected to be applied in the fields of thermal management and electrical enclosure.     

纤维状填料/HDPE复合体系的导电渗流与流变渗流行为的关系

研究了纤维状导电材料不锈钢纤维(SSF)填充高密度聚乙烯(HDPE)导电复合体系的导电渗流与流变渗流行为之间的关系,并与颗粒状导电颗粒炭黑(CB)/HDPE导电复合体系进行了比较.发现当SSF含量极低(0.3vol%)时,SSF/HDPE体系即发生导电渗流现象,且导电渗流转变区域极窄;而仅当SSF含量达到4.8vol%时,该复合体系才表现出流变渗流现象,这一结果与CB/HDPE体系及纳米级导电纤维填充体系截然不同.此外,通过正温度系数效应的研究发现SSF形成的导电通路稳定性高于CB/HDPE体系.我们认为,SSF/HDPE体系呈现的这些特点均与SSF较大的直径及长径比且其导电通路及流变渗流网络的形成机理不同有关.     

超细颗粒填充高密度聚乙烯复合体的导电和流变学性质(英文)

制备了多壁碳纳米管、石墨和碳黑填充高密度聚乙烯(HDPE)复合体,研究了复合体的导电和流变学性质.利用隧道逾渗模型对关键指数分别为4.4、6.4和2.9的三种复合体的"非普适性"导电行为进行了解释.与此同时,考察了颗粒类型和含量,以及剪切速率对复合体流变学性质的影响.结果表明,复合体系的储能模量在低频区出现"第二平台",而复合黏度则表现出强烈的剪切变稀行为,标志着颗粒在聚合物内部发生聚集形成了网络结构.与石墨和碳黑填充复合体相比,具有更高纵横比的多壁碳纳米管填充复合体具有更高的储能模量和复合黏度.基于Guth-Smallwood理论结合有效介近似的G′r分析结果表明,填充HDPE复合体系的流变学逾渗阈值和导电逾渗阈值吻合良好.     

Effect of the melt flow index of an HDPE matrix on the properties of composites with wood particles

Composites of wood waste and high-density polyethylene (HDPE) resins and different melt flow index (MFIs) was development in this work. Therefore, it was possible to assess their effect on the mechanical, thermal, and morphologic properties of these composites. The formulations were prepared using a twin-screw extruder, and the MFI, tensile strength, flexural strength, and impact strength of the composites were analyzed. Additionally, the thermal properties were evaluated by differential scanning calorimetry (DSC). Finally, structural analyses using optical microscopy (OM) and scanning electron microscopy (SEM) were performed to assess the particles’ dispersion, distribution, and adhesion to the polymer matrix. The results indicated that composites from HDPE resins with a lower MFI yielded a better dispersion of the wood waste. During processing was observed, reduce the MFI and better dispersion of the polymer matrix, which positively influenced some of the mechanical properties analyzed in the study.     

粒子填充HDPE复合体系动态流变行为研究

研究了炭黑(CB)和石墨(GP)填充高密度聚乙烯(HDPE)复合体系的动态流变行为.发现高填料含量时出现似固体行为,并认为它归因于无机粒子网络逾渗结构的形成.在相同聚合物基体条件下,粒子种类和粒子几何参数(粒子形状、大小、粒径分布)对低频区域流变行为、流变参数的逾渗行为和逾渗阈值(φ_c)有决定性影响,且种类的影响相比于粒子几何参数更为显著.此外,高表面活性及高比表面积(大径厚比、小尺寸)粒子填充体系具有较低的φ_c.     

Lignosulfonate/silica hybrid nanoparticles as a novel biobased filler in polybenzoxazine matrix

Lignin is an abundant and sustainable resource that exhibits numerous attractive functional properties as a reinforcing agent for benzoxazine-based composites, due to its stiffness, thermal stability, and high carbon content. However, the low quality of lignin particles dispersions associated with the weak particles-matrix interactions reduces the reinforcement capability. In this work, hybrid lignin/silica (NaLS/SiO₂) nanoparticles were obtained from sodium lignosulfonate (NaLS) and tetraethylorthosilicate (TEOS) under basic conditions. The particles were characterized by transmission electron microscopy (TEM) confirming their spherical morphology and narrow nanometric-size distributions. The hybrid particles were incorporated into conventional benzoxazine (BA-a) and a difuran biobased benzoxazine (SA-dfda) to prepare nanocomposites with different mass compositions (3, 5, and 10 wt%). Morphological, mechanical, dynamo-mechanical, and thermal properties of the obtained composites were assessed. All the materials exhibited a homogenous filler dispersion that contributed to improve the reinforcement properties. Hybrid nanoparticles proved to be an interesting alternative as a filler in the benzoxazine matrix to prepare high-performance thermosetting composites.     

电响应聚合物薄膜的表面图案化

研究了炭黑(CB)和石墨(GP)填充高密度聚乙烯(HDPE)复合体系的动态流变行为.发现高填料含量时出现似固体行为,并认为它归因于无机粒子网络逾渗结构的形成.在相同聚合物基体条件下,粒子种类和粒子几何参数(粒子形状、大小、粒径分布)对低频区域流变行为、流变参数的逾渗行为和逾渗阈值(φc)有决定性影响,且种类的影响相比于粒子几何参数更为显著.此外,高表面活性及高比表面积(大径厚比、小尺寸)粒子填充体系具有较低的φc.     

Volume‐exclusion effects in polyethylene blends filled with carbon black,graphite, or carbon fiber

Conductive polymer composites possessing a low percolation‐threshold concentration as a result of double percolation of a conductive filler and its host phase in an immiscible polymer blend afford a desirable alternative to conventional composites. In this work, blends of high‐density polyethylene (HDPE) and ultrahigh molecular weight polyethylene (UHMWPE) were used to produce ternary composites containing either carbon black (CB), graphite (G), or carbon fiber (CF). Blend composition had a synergistic effect on electrical conductivity, with pronounced conductivity maxima observed at about 70–80 wt % UHMWPE in the CB and G composites. A much broader maximum occurred at about 25 wt % UHMWPE in composites prepared with CF. Optical and electron microscopies were used to ascertain the extent to which the polymers, and hence filler particles, are segregated. Differential scanning calorimetry of the composites confirmed that the constituent polymers are indistinguishable in terms of their thermal signatures and virtually unaffected by the presence of any of the fillers examined here. Dynamic mechanical analysis revealed that CF imparts the greatest stiffness and thermal stability to the composites. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 40: 1013–1023, 2002     

Effect of carbon nanofibers on mechanical and electrical behaviors of acrylonitrile‐butadiene rubber composites

Recently, carbon nanofibers have become an innovative reinforcing filler that has drawn increased attention from researchers. In this work, the reinforcement of acrylonitrile butadiene rubber (NBR) with carbon nanofibers (CNFs) was studied to determine the potential of carbon nanofibers as reinforcing filler in rubber technology. Furthermore, the performance of NBR compounds filled with carbon nanofibers was compared with the composites containing carbon black characterized by spherical particle type. Filler dispersion in elastomer matrix plays an essential role in polymer reinforcement, so we also analyzed the influence of dispersing agents on the performance of NBR composites. We applied several types of dispersing agents: anionic, cationic, nonionic, and ionic liquids. The fillers were characterized by dibutylphtalate absorption analysis, aggregate size, and rheological properties of filler suspensions. The vulcanization kinetics of rubber compounds, crosslink density, mechanical properties, hysteresis, and conductive properties of vulcanizates were also investigated. Moreover, scanning electron microscopy images were used to determine the filler dispersion in the elastomer matrix. The incorporation of the carbon nanofibers has a superior influence on the tensile strength of NBR compared with the samples containing carbon black. It was observed that addition of studied dispersing agents affected the performance of NBR/CNF and NBR/carbon black materials. Especially, the application of nonylphenyl poly(ethylene glycol) ether and 1‐butyl‐3‐methylimidazolium tetrafluoroborate contributed to enhanced mechanical properties and electrical conductivity of NBR/CNF composites.     

CaCO3/PEEK复合体系的力学行为和热行为研究

以聚醚醚酮和碳酸钙复合体系为研究对象,考察了偶联剂和填料添加量对复合材料力学行为和热行为的影响.发现磺化聚醚醚酮作为偶联剂能有效地改善材料的力学性能,提高基体树脂的玻璃化转变温度,降低基体树脂的熔点,有助于改善聚醚醚酮的加工条件     

Thermal conductivity epoxy resin composites filled with boron nitride

Boron nitride (BN) micro particles modified by silane coupling agent, γ‐aminopropyl triethoxy silane (KH550), are employed to prepare BN/epoxy resin (EP) thermal conductivity composites. The thermal conductivity coefficient of the composites with 60% mass fraction of modified BN is 1.052 W/mK, five times higher than that of native EP (0.202 W/mK). The mechanical properties of the composites are optimal with 10 wt% BN. The thermal decomposition temperature, dielectric constant, and dielectric loss increase with the addition of BN. For a given BN loading, the surface modification of BN by KH550 exhibits a positive effect on the thermal conductivity and mechanical properties of the BN/EP composites. Copyright © 2011 John Wiley & Sons, Ltd.     

聚乙烯/炭黑复合材料导电体系的结构形态

将导电填料（例如炭黑）加入绝缘的聚合物基体即得到导电复合材料,两组混全物的电阻率随导电填料体积分数的变化而改变,电阻率与导电填料体积分数的关系称为渗流曲线,可分为三个主要区域：低导电填料含量区域,复合材料的电阻率很大,聚合物的电阻率占主导;渗流区域,导电填料含量少量的增加会引起复合材料电阻率很大的提高;高导电填料区域,复合材料电阻率很大的提高;高导电填料区域,复合材料电阻率主要由导电填料的电阻率决定,对于导电复合材料已有大量的实验和理论工作来解释导电复合材料已有大量的实验和理论工作来解释导电填料含量和复合材料各组分的形貌对电性能的影响,其中有效介质普适方程（GEM方程）已经对大量的渗流曲线进行了精确的拟合。聚乙烯／炭黑复合材料中由于炭黑的大量分布很难观测其微观形貌,本文对不同辐照交联程度和不同环境温度下聚乙烯／炭黑复合材料的渗流曲线进行分析,试图找出GEM方程各参数与复合材料各组分形貌的关系,为导电复合材料的设计和制备提供理论基础。