Ultrasonic soldering in electronics

Ultrasonic (US) soldering of electronic components, as an alternative to flux soldering, is environmentally friendly, improves the quality of soldered connections at the mounting elements after long-term storage, and allows the use of lead-free solders. Methods of US solder melt activation, lead-free solders in US soldering and glass-ceramic capacitor metallization processes have been investigated.     

Laser welding of low carbon steel and thermal stress analysis

Laser welding of mild steel sheets is carried out under nitrogen assisting gas ambient. Temperature and stress fields are computed in the welding region through the finite element method. The residual stress developed in the welding region is measured using the XRD technique and the results are compared with the predictions. Optical microscopy and the SEM are used for the metallurgical examination of the welding sites. It is found that von Mises stress attains high values in the cooling cycle after the solidification of the molten regions. The residual stress predicted agreed well with the XRD results.     

Laser cutting of thick sheet metals: Residual stress analysis

Laser cutting of tailored blanks from a thick mild steel sheet is considered. Temperature and stress field in the cutting sections are modeled using the finite element method. The residual stress developed in the cutting section is determined using the X-ray diffraction (XRD) technique and is compared with the predictions. The structural and morphological changes in the cut section are examined using the optical microscopy and scanning electron microscopy (SEM). It is found that temperature and von Mises stress increase sharply in the cutting section, particularly in the direction normal to the cutting direction. The residual stress remains high in the region close to the cutting section.     

超导芯片铟焊质量试验研究

为考察超导芯片接地钎焊质量,参照电子元器件试验方法相关国家标准,模拟超导器件工作温度和真空环境制作了试验装置,对钎焊后的超导芯片样品进行了温度冲击试验、完整超导器件系列环境试验,并对试验数据和结果进行了分析。     

Laser shock forming of aluminum sheet: Finite element analysis and experimental study

Laser shock forming (LSF) is characterized in non-contact load, high pressure and high strain ratio. This new forming process using laser-induced shock pressure can shape sheet metal without complicated forming equipments. The know-how of the forming process is essential to efficiently and accurately control the deformation of sheet metal. Experiment and numerical simulation are the important approaches for forming analysis. Taken the aluminum sheets with different thickness as the specimen, the finite element (FE) analysis for LSF was performed. In the paper, Q-switch Nd:YAG Laser with a maximum power density of 4.5 GW/cm² was used. The simulation results were in good agreement with the experiment. It showed that the formed aluminum sheets were in the form of concavo-convex. Finally, the transient and static deformations of thin sheet metal under specific operation conditions were also studied.     

Sub-gigahertz laser resonant ultrasound spectroscopy for the evaluation of elastic properties of micrometric fibers

The cross-section eigenmodes of micrometric cylinders were measured in the range of several tens of MHz to about 0.5 GHz. The vibrations were excited using subnanosecond laser pulses. The cross-section eigenmodes were simulated using finite element modeling in a 2D geometry. Using the method of resonant ultrasound spectroscopy, the vibration spectrum of an aluminum wire of diameter 33μm served to determine Young’s modulus and Poisson’s ratio with a precision of 0.7% and 0.3%, respectively. The calculated and measured frequencies of cross-section eigenmodes were fitted with a precision better than 0.5% in the 50–500 MHz range.     

激光经瞳热疗的功率选择

为了避免激光经瞳热疗带来的热损伤或治疗不足,建立了眼底层状模型并采用二维有限元法求解生物传热方程,从理论上分析了激光引起的视网膜和脉络膜的温度变化.在相同光斑条件下最高温升与照射功率成正比、与眼睛透射率成反比,可从任意功率出发计算达到阈值温升所需要的功率.在此基础上提出了照射功率与光斑直径、眼睛透射率和阈值温升的定量关系,根据此关系式得到的功率使得阈值温升在光斑直径变化时保持不变.     

温度对高功率半导体激光器阵列“smile”的影响

用数值模拟与实验测试相结合的方法,研究了温度对"smile"的影响.利用有限元方法分别模拟计算了半导体激光器芯片键合及工作过程中激光器芯片中的热应力,模拟中假设激光器芯片的弯曲仅由热应力引起;计算结果表明,激光器芯片有源区的热应力随工作温度的升高而减小,由热应力导致的芯片的弯曲随温度升高而减小.实验结果表明,对于具有相同芯片、同一封装形式、同批次的器件,"smile"随温度的升高有增大或减小的趋势,这与封装前裸芯片的弯曲形态及封装热应力的综合作用有关;若封装前裸芯片为相对平直的或凸的,则封装后激光器的"smile"将随温度升高而减小;若封装前裸芯片为凹的,封装后的激光器芯片仍为凹的,则"smile"随温度升高而增大.     

Vibration characteristics of aluminum surface subjected to ultrasonic waves and their effect on wetting behavior of solder droplets

The vibration characteristics of an aluminum surface subjected to ultrasonic waves were investigated with a combination of numerical simulation and experimental testing. The wetting behavior of solder droplets on the vibrating aluminum surface was also examined. The results show that the vibration pattern of the aluminum surface is inhomogeneous. The amplitude of the aluminum surface exceeds the excitation amplitude in some zones, while the amplitude decreases nearly to zero in other zones. The distribution of the zero-amplitude zones is much less dependent on the strength of the vibration than on the location of the vibration source. The surface of the liquid solder vibrates at an ultrasonic frequency that is higher than the vibration source, and the amplitude of the liquid solder is almost twice that of the aluminum surface. The vibration of the surface of the base metal (liquid solder) correlates with the oxide film removal effect. Significant removal of the oxide film can be achieved within 2 s when the amplitude of the aluminum surface is higher than 5.4 μm or when the amplitude of the liquid solder surface is higher than 10.2 μm.     

飞秒激光冲击AZ31B镁合金过程的数值模拟

采用有限元分析法对飞秒激光冲击AZ31B镁合金进行数值模拟,研究了激光冲击处理对镁合金变形过程的影响,分析了单脉冲激光冲击下材料内部的位移、动能、应力和应变的分布情况,得到了材料的瞬态速度和应变率变化过程.仿真结果表明,单脉冲飞秒激光冲击镁合金产生的塑性变形,可在材料表面形成微米级凹坑,中心点处最大位移为34μm,最大变形速度390m/s;在冲击初期,材料表面的应力和应变主要分布在冲击区域中心节点和边缘附近,并且得到镁合金的最大应力和最大应变率分别为955 MPa和1.8×106 s-1.研究结果能够为深入分析飞秒激光与镁合金作用时材料变形参量的变化规律提供数值理论依据.     

Laser ablation of multilayers of ink from a paper substrate for tactile printing

This paper reports the effects of laser ablation upon multiple-layered coloured inks which have been printed on an ordinary white paper. The aim of this work is to examine the feasibility of generating a fully tactile three-coloured image by selectively removing ink layers to reveal underlying layers of a different colour. In this paper laser ablation has been carried out upon four layered ink samples consisting of white/cyan/white/black layers. Ablation was carried out using a Q-switched Nd : YAG laser. The results show that it is possible to selectively remove the inks to expose both the top white and the cyan layers, although charring occurs with deeper ablation. An evaporation/decomposition mechanism is proposed to describe process of ink ablation.     

打印技术制备表面增强拉曼散射活性基底的研究进展

表面增强拉曼散射(SERS)是一种先进的表面分析技术,可以极大提高吸附在金属表面或附近分子的拉曼散射信号。SERS技术由于其快速准确、灵敏度高、选择性好、样品制备要求低等特点,成为当前的研究热点,在化学、食品、生物、医疗等领域展现出重要的应用前景。而利用SERS技术作为一种常规分析和诊断工具面临的一个主要挑战是如何制备均匀、可重复、稳定的活性基底。打印技术操作简单、效率高、成本低,有助于设计等离激元纳米结构。通过优化“热点”增强电磁场,获得重复性好、稳定性高、增强能力强的SERS活性基底。近年来,印刷技术逐渐被应用于SERS基底的制备。主要综述了制备SERS基底的几种常用印刷技术,包括喷墨印刷、凹版印刷、丝网印刷等。分析了衬底表面润湿性、干燥温度、油墨粘度、表面张力、溶剂等因素对SERS性能的影响。总结了印刷技术制备SERS基底的研究进展,并对其潜在应用和未来发展作了展望。     

Finite element modeling of the mechanical effects of the UV laser ablation of polymer coatings

Laser ablation constitutes the basis of a number of techniques aiming at the processing and diagnosis of polymeric coatings on a variety of substrates. In all these applications, however, the issue is raised about the mechanical effects of the procedure on the substrate integrity. To this end, we employ finite element modeling for simulating the mechanical effects of UV laser ablation on a polymer specimen, with particular emphasis on the structural modifications that may be induced at areas away from the ablation spot. The cylindrical specimen consists of a poly(methylmethacrylate) (PMMA) film on a silica substrate. The analysis shows that stresses of high enough amplitude may propagate to distances far away from the irradiated spot and may induce deleterious mechanical deformations (e.g., cracks or delaminations). The dependence of the distribution of the tensile stresses on the thickness of the two components, as well as on size of the ablation spot area, is examined. Finally, the possibility of growth of pre-existing defects is shown. The results are overall in very good agreement with experimental observations.     

激光二极管端面泵浦多段复合板条激光器热效应

针对激光二极管端面泵浦的多段渐变浓度复合板条激光增益介质,提出了两种选取掺杂浓度的方法,并分别计算了多段渐变浓度复合板条增益介质的热量、温度及应力分布.结果表明,与单一掺杂浓度板条增益介质相比,采用多段渐变浓度复合增益介质可显著降低增益介质内部的温度梯度及最大热应力,从而提高了激光器整体的损伤极限泵浦功率,有利于激光器的功率升级.     

激光二极管端面泵浦多段复合板条激光器热效应

针对激光二极管端面泵浦的多段渐变浓度复合板条激光增益介质,提出了两种选取掺杂浓度的方法,并分别计算了多段渐变浓度复合板条增益介质的热量、温度及应力分布.结果表明,与单一掺杂浓度板条增益介质相比,采用多段渐变浓度复合增益介质可显著降低增益介质内部的温度梯度及最大热应力,从而提高了激光器整体的损伤极限泵浦功率,有利于激光器的功率升级.     

激光辐照下非稳腔镜变形对激光模式的影响

 分析了正支虚共焦非稳腔中腔镜变形对激光模式的影响,采用时间离散化、快速傅里叶变换（FFT）和有限元分析(FEA)方法解决腔镜变形和激光模式两者之间的耦合问题。计算结果表明,随着激光器工作时间的增加,腔镜温升和变形相应增大,谐振腔模式变差,输出光场相位均匀性变差,呈现散焦现象,输出光束质量下降。实验验证了激光器输出光束质量随出光时间的延长而逐渐变坏。     

传导冷却单巴高功率半导体激光器热应力和smile研究

利用有限元模型分别研究了回流过程和工作过程中传导冷却高功率半导体激光器的正应力、切应力和形变,并借助理论公式分析了热应力和smile的产生原因和分布规律.分析表明,在回流过程中热膨胀系数不匹配造成的切应力是正应力和变形的根源,而在工作过程中,热膨胀系数不匹配和温度梯度共同影响着热应力和变形.在此基础上,将回流导致的剩余应力和变形作为初始条件施加在有限元模型上,对工作状态器件的热应力和smile进行模拟,以获得更精确的模拟结果.最后,通过有限元模型和实验手段研究了不同热沉温度对smile的影响.结果表明,工作过程会导致器件的smile增大,热沉温度的升高也会造成smile进一步增大.     

表面垂直裂痕诱发瑞利波散射的数值分析

激光激发的声表面波为材料表面缺陷的检测提供了有力的工具.针对含缺陷材料在模型边界上的复杂性,建立了基于平面应变的有限元模型并选取了相同厚度但含有不同深度的表面裂痕的单层铝板进行了对比计算,得到了声表面波经过不同深度的表面裂痕时产生的反射及透射信号波形的时域特征.进而引入了基于Wigner-Ville分布理论的时-频分析方法计算裂痕前、后散射的瞬态表面波的能量在时间-频率平面内分布的情形.结果显示：声表面波接近中心频率的某一频率成分在经过深度小于其中心波长的表面缺陷时,随着裂痕深度的增加,对应于该频率的反射系数呈现单调递增的趋势;而透射系数呈现递减的特征,这一结果可以为激光超声检测表面缺陷提供一种定量的表征手段.     

无颗粒型银导电墨水的制备及其印刷成膜研究

以柠檬酸银为导电金属前驱体化合物,仲丁胺为络合剂,并添加乙醇调节粘度和表面张力等物性参数,制备了无颗粒型银导电墨水。该导电墨水可以采用凹版印刷方式印刷在PET片基上,并且在较低的热处理温度下即可获得导电性较好的银导电膜。利用X射线光电子能谱仪、同步热分析仪、红外光谱仪、X射线衍射仪、扫描电子显微镜和四探针测试仪对柠檬酸银、导电墨水以及银导电膜进行表征。结果表明导电墨水在132 ℃时残留质量即达到恒重,远低于柠檬酸银的210 ℃;经150 ℃热处理之后,银导电膜由均匀致密、纯度高的纳米银颗粒组成;经150 ℃热处理50 min后得到的银导电膜的方块电阻值为1.83 Ω·□-1。     

Optimization and improvement of TIPS–pentacene transistors (OTFT) with UV–ozone and chemical treatments using an all-step solution process

We fabricated an organic thin-film transistor (OTFT) using an all-step solution process. The printed layers, in which the electrode (silver), dielectric layer (BaTiO₃–PMMA), source–drain layer, and semiconductor 6,13-Bis(triisopropylsilylethynyl)pentacene(TIPS–pentacene), were optimized using roll-to-roll, an inkjet printer, and drop-casting. After coating the source–drain layer, we applied ultraviolet (UV)–ozone and self-assembled monolayer (SAM) treatments to the composite layer. The OTFTs treated with the UV–ozone and SAM treatments were found to exhibit excellent performance and good properties in comparison to silicon-based OTFTs.