图案化TiO2薄膜的制备技术

本文综述了图案化TiO2薄膜的制备技术,按图案的生成方式可分为图案的直接生成,掩膜复制法,硬质模板复制法三大类。可以通过针尖写蚀法、电子书写蚀法、激光写蚀法、自组装法、光电化学法直接制备图案。掩膜复制法包括光刻胶法、自组装膜法、光敏凝胶膜法等。硬质模板法也称软刻蚀技术,分为复制微模塑、转移微模塑、毛细管微模塑、微接触印刷法、光-盖印印刷等技术。对每类方法的优缺点作了适当评述,对今后图案化TiO2薄膜制备的研究方向提出了一些建议。     

反应离子刻蚀和自组装分子膜构建硅基底疏水与超疏水表面

采用反应离子刻蚀技术在Si(100)表面加工微米级圆柱阵列, 采用自组装技术分别制备了3种硅烷自组装分子膜. 结果表明, 采用反应离子刻蚀构建出的4种微米级圆柱阵列结构规整, 其直径为5 μm, 高度为10 μm, 间距为15~45 μm. 沉积自组装分子膜后, 试样表面的水接触角显著增大, 其中沉积1H,1H,2H,2H-全氟癸基三氯硅烷(FDTS)自组装分子膜接触角最大, 1H,1H,2H,2H-全氟辛烷基三氯硅烷(FOTS)次之, 三氯十八硅烷(OTS)最小. 测得的接触角大于150°时接近Cassie方程计算的接触角, 而小于150°时接近Wenzel方程计算的接触角. 改变圆柱阵列的间距和选择不同的自组装分子膜, 可以控制表面接触角的大小. 原子力显微镜(AFM)观测结果显示, 沉积自组装分子膜可以产生纳米级的团簇. 由微米级圆柱阵列和纳米级自组装分子膜构成的表面结构使Si试样表面接触角最大可达156.0°.     

二维平面细胞微图案化技术及其生物学应用

可以控制细胞粘附形状、大小的方法统称为细胞图案化技术.这些方法结合微纳米制备、表面化学、电化学和光化学等手段可以动态控制细胞的粘附、迁移、分化及其相互作用,为细胞生物学研究提供了一个新平台.本文介绍了二维平面细胞图案化的各种方法,并对其优缺点进行了总结,评述了细胞图案化技术在细胞生物学基础研究、组织工程以及基于细胞的生物传感器领域的应用.     

乙二胺改性的玻璃基片上C60自组装薄膜的制备及光致发光

利用Ｃ６０与乙二胺改性的普通玻璃表面进行加成反应,得到一种新的Ｃ６０自组装单层膜;在自组装单层膜的基础上,利用Ｃ６０与乙二胺反应形成自组装双层膜。通过Ｘ光电子能谱、激光解吸电离飞行时间质说等手段证实在乙二胺改性的普通玻璃表面上存在通过化学键合的Ｃ６０自且装单层和双层膜。并对共光致发光性质进行了初步研究,发现在６８０ｎｍ附近存在一个与Ｃ６０不同的宽的光致发光峰。     

聚合物膜与自组装膜法制备电化学DNA传感器的研究进展

介绍了DNA电化学生物传感器的研究现状、原理和结构,对DNA探针固定(尤其是聚合物与自组装膜法固定DNA)以及应用方面的最新研究进展进行了综述。     

图案化自组装膜导向的电沉积

通过图案化自组装膜导向的电沉积制备了聚吡咯(PPy)微结构. 由微接触印刷方法制备图案化自组装膜并作为电沉积的模板. 研究发现, 自组装膜在导向电沉积中在不同的基底上具有不同的作用: 在十二烷基硫醇(DDT)、十八烷基硫醇(ODT)修饰的金基底上和十八烷基三氯硅烷(OTS)修饰的铟锡氧化物玻璃上(ITO), 电沉积主要发生在自组装膜未修饰区, 而在半导体单晶硅表面, PPy沉积在OTS修饰区, 是基底表面的导电性及PPy与基底表面基团相容性共同作用的结果.     

漆酚醛胺聚合物多孔膜的制备

以漆酚醛胺聚合物(UFDP)为成膜材料,利用水辅助自组装的固体基板展开法和水面展开法制备了漆酚醛胺聚合物多孔膜.研究了在静态(即不在聚合物表面吹扫氮气)高湿度环境下聚合物溶液浓度、环境湿度和固体基板等因素对多孔膜形貌的影响.结果表明,水面展开法更有利于形成单层的多孔膜而固体基板展开法得到的是多层的多孔膜.当UFDP聚合物浓度为6.0 mg/mL,环境相对湿度为90%时,用水面展开法制得的单层多孔膜的孔径分布较均匀.     

利用纳米离子组装的方法制备SERS活性基底

A simple method for fabricating SERS-active substrate using Au nanoparticles is reported. HSCH2CH2NH2 was self-assembled on the Au/glass substrate, then nanoparticles of colloidal gold were bound to the surface. The SERS effect of such prepared substrate was studied by using BPE and an azobenzene thiol derivated compound and the SERS enhanced factor was found about 3×103.     

热诱导金属/聚合物膜系图案化控制的研究

近年来 ,在简单体系上形成复杂规则的图案已引起诸多学者的注意 ,其中以聚合物为母体的体系发展了模板、局部紫外照射和激光诱导等一系列技术 ,从而得到可控的表面图案[1～ 6] .本文用激光刻蚀法对溅射在聚合物膜上的金属薄膜进行处理 ,在热诱导情况下使金属 /聚合物膜系表面产生了规则的图案 .薄膜热应力的可控释放作用和激光刻蚀造成的区域局限作用被认为是诱导这种可控图案产生的两种基本要素 .通过控制激光刻蚀区域 ,可控制薄膜表面形貌变化 ,从而实现可控的图案化设计 .1　实验部分1.1　原料及仪器　聚苯乙烯 (PS) :北京燕山石油化工…     

纳米结构聚合物材料的制备和应用

综述了近年来在纳米结构高分子材料如纳米球、孔、管、线等方面的制备方法的研究进展，并对其应用进行了简要的讨论。     

利用去湿现象制备具有SERS活性的银纳米粒子图案

构建了具有表面增强拉曼散射(SERS)活性的二维有序环状与盘状的银纳米粒子结构, 利用CTAB包覆银纳米粒子的氯仿溶液直接在图案化的金基底上进行去湿, 当改变银纳米粒子的浓度时可以得到不同的图案. 利用原子力显微镜(AFM)对其结构进行了表征, 以4-巯基吡啶作为探针分子, 采用表面增强拉曼成像技术研究了这种基底的SERS活性, 这将为SERS的研究开拓新的领域.     

Influence of Solid-liquid Interaction and Temperature on the Dynamic Dewetting of a Thin Polymer Film:A Molecular Dynamics Study

Coarse-grained molecular dynamics simulations were carried out to investigate the dewetting behavior of a polymer thin film on partial wetting solid surface at the early stage of the dewetting process. Spontaneous dewetting is initiated by removing a band of strip from both the ends of the liquid polymer film which has achieved equilibrium. The solid-liquid interaction and temperature were varied to show their influence on the dewetting dynamics during dewetting as well as the shape evolution of the liquid ...     

大晶粒钛硅沸石TS-1晶貌的离子蚀刻改性

钛硅沸石 TS- 1 [1] 的微孔体系由同是十元氧环的直通道和“Z”字形通道相交而成 ,孔径 0 .5 1～ 0 .5 6nm,晶体结构与硅铝 ZSM- 5沸石的 MFI结构相同 .TS- 1能以稀双氧水为氧源 ,使烃类发生选择氧化 ,生成含氧化合物 [2～ 8] .并已在催化苯酚羟基化和环己酮氨氧化方面实现了工     

微接触印刷法构造金属银的二维和准三维微图纹结构

以聚二甲基硅氧烷（PDMS）有机硅橡胶为弹性印章，以十八烷基三氯硅烷（OTS）正已烷溶液为“墨水”，用微接触印刷分别在普通盖玻片表面和直径为20 mm的试管外表面直接盖印，以及在直径为10 mm的玻璃棒表面进行滚动式微接触印刷盖印.将这些盖好印的基材放在化学镀银液中进行选择性镀银沉积，得到金属银在平面上的二维微结构和在曲面上的准三维微结构.这些微结构的显微照片显示，采用微接触印刷法制备的微图纹结构，图纹转移效率高，精细度很好，特别是微接触印刷操作方法灵活多变，适用于多种形态的表面，是一类实用的微制造方法.     

Enzyme Deposition by Polydimethylsiloxane Stamping for Biosensor Fabrication

High‐performance biosensors were fabricated by efficiently transferring enzyme onto Pt electrode surfaces using a polydimethylsiloxane (PDMS) stamp. Polypyrrole and Nafion were coated first on the electrode surface to act as permselective films for exclusion of both anionic and cationic electrooxidizable interfering compounds. A chitosan film then was electrochemically deposited to serve as an adhesive layer for enzyme immobilization. Glucose oxidase (GOx) was selected as a model enzyme for construction of a glucose biosensor, and a mixture of GOx and bovine serum albumin was stamped onto the chitosan‐coated surface and subsequently crosslinked using glutaraldehyde vapor. For the optimized fabrication process, the biosensor exhibited excellent performance characteristics including a linear range up to 2 mM with sensitivity of 29.4±1.3 μA mM⁻¹ cm⁻² and detection limit of 4.3±1.7 μM (S/N=3) as well as a rapid response time of ∼2 s. In comparison to those previously described, this glucose biosensor exhibits an excellent combination of high sensitivity, low detection limit, rapid response time, and good selectivity. Thus, these results support the use of PDMS stamping as an effective enzyme deposition method for electroenzymatic biosensor fabrication, which may prove especially useful for the deposition of enzyme at selected sites on microelectrode array microprobes of the kind used for neuroscience research in vivo .     

Surface‐Initiated Polymerization for Amplification of Self‐Assembled Monolayers Patterned by Microcontact Printing

Patterned polymer brushes can be prepared by a novel strategy that combines surface‐initiated polymerization and microcontact printing (see picture; μCP SAM indicates the self‐assembled monolayer formed by microcontact printing). The living nature of the polymerization process permits the thickness of the polymer brush and its physical properties to be accurately controlled.     

Fabrication of Superhydrophobic Aluminum Plate by Surface Etching and Fluorosilane Modification

Superhydrophobic aluminum surfaces with a high water contact angle and low sliding angle on aluminum plate substrate were fabricated by means of surface etching with sodium hydroxide under ultrasonic bathing and then modification with fluorosilane. Scanning electron microscopy(SEM) showed a honeycomb-like structure on aluminum substrate surface after etching under ultrasonic bathing. And the surface was rendered from superhydrophilicity to superhydrophobicity after further modification with fluorosilane.     

Preparation of Self-Organized Porous Polymer Masks for Si Dry Etching

Summary: Self-organized honeycomb-patterned polymer films were prepared by using condensed water droplet arrays as templates. Porous polymer masks for dry etching were easily prepared on Si substrates by peeling off the honeycomb-patterned films. After dry etching, hexagonally-arranged micro-pores were formed on the surface of Si substrates.     

One-step Fabrication of Nanoporous Black Silicon Surfaces for Solar Cells using Modified Etching Solution

Currently, a conventional two-step method has been used to generate black silicon (BS) surfaces on silicon substrates for solar cell manufacturing. However, the performances of the solar cell made with such surface generation method are poor, because of the high surface recombination caused by deep etching in the conventional surface generation method for BS. In this work, a modified wet chemical etching solution with additives was developed. A homogeneous BS layer with random porous structure was obtained from the modified solution in only one step at room temperature. The BS layer had low reflectivity and shallow etching depth. The additive in the etch solution performs the function of pH-modulation. After 16-min etching, the etching depth in the samples was approximately 200 nm, and the spectrum-weighted-reflectivity in the range from 300 nm to 1200 nm was below 5%. BS solar cells were fabricated in the production line. The decreased etching depth can improve the electrical performance of solar cells because of the decrease in surface recombination. An efficiency of 15.63% for the modified etching BS solar cells was achieved on a large area, p-type single crystalline silicon substrate with a 624.32-mV open circuit voltage and a 77.88% fill factor.