纳米结构碲化铋合金的制备及电热输运特性

采用惰性气体保护蒸发-冷凝法制备了纳米Bi及Te粉末, 结合机械合金化和放电等离子烧结技术, 在不同烧结温度下制备出了单一物相且具有纳米层状结构及孪晶亚结构的n型Bi₂Te₃块体材料, 并系统研究了块体材料的晶粒尺度、微结构及其对电热传输特性的影响. SEM, TEM分析结果表明, 以纳米粉末为原料, 通过有效控制工艺条件, 可以制备出具有纳米层状结构Bi₂Te₃合金块体材料, 同时纳米层状结构中存在孪晶亚结构; 热电性能测试结果表明, 具有纳米层状结构及孪晶亚结构的块体试样与粗晶材料相比, 热导率大幅度降低, 在423 K附近, 热导率由粗晶材料的1.80 W/mK降至1.19 W/mK, 晶格热导率从1.16 W/mK降至0.61 W/mK, 表明纳米层状结构与孪晶亚结构共存, 有利于进一步提高声子散射, 降低晶格热导率. 其中在693 K放电等离子烧结后的试样于423K附近取得最大值的无量纲热电优值(ZT), 达到0.74.     

碲化铋取向纳米柱状薄膜热导率测量

将热电材料制作成纳米柱状薄膜结构是一种理论上能有效降低热导率、从而大幅提升热电优值的操控手段。但是随之而来的问题是纳米柱状薄膜热导率的精确获取困难,因为常规的热物性测试手段已无法适用于该类表面多孔、厚度为微米量级结构热输运特性的表征。本文提出利用3ω方法可实现Bi_2Te_3取向纳米柱状薄膜热导率实验表征的测量结构,并且获得了纳米柱状薄膜的热导率和热扩散率值。该方法有望用于微米厚纳米柱状薄膜结构热输运性能的实验评价。     

Bi2Te3 基花状纳米片粉体的制备及热电性能研究

本文通过选用不同乙二胺四乙酸(EDTA) 的用量采用水热法制备出了具有花状纳米片形貌的碲化铋(Bi2Te3 ) 纳米粉体, 研究了不同 EDTA 的用量对 Bi2Te3 纳米粉体花状纳米片形貌的影响, 结果表明 EDTA 的用量对粉体的成相和形貌有很大的影响. EDTA 用量为0.2 g 是最佳值, 有助于形成纯相的 Bi2Te3 花状纳米片. 并以 Y元素掺杂为例, 研究了 EDTA 用量对元素掺杂 Bi2Te3 纳米粉体花状形貌的影响, 研究发现元素掺杂后对 Bi2Te3粉体的微观形貌有一定的影响. 为了保持元素掺杂 Bi2Te3 纳米粉体的花状形貌,EDTA 合适的用量至关重要. 以Y0 .2Bi1 .8Te3 为例, 研究了 EDTA 用量对样品的热电性能的影响. 结果表明, 花状纳米片形貌有利于在降低样品电阻率的同时有效降低样品的热导率, 从而大大增加了样品的ZT 值.     

TeI4掺杂量对n型Bi2Te3基烧结材料热电性能的影响

采用区熔法结合放电等离子体快速烧结(SPS)技术制备了n型Bi2Te3基热电材料.在300-500K的温度范围内测量了各热电性能参数,包括电导率(σ)、塞贝克系数(α)和热导率(κ),研究了掺杂剂TeI4的含量(质量百分比分别为0,0.05,0.08,0.10,0.13和0.15wt%)对热电性能的影响.结果表明:试样的载流子浓度(n)随TeI4含量增加而增大,使电导率增大、塞贝克系数的绝对值先增大而后减小,从而导致品质因子(α2σ)呈先增加后降低的变化趋势;同时,由于异质离子(I-)以及载流子对声子的散射作用增强,可显著降低其晶格热导率.烧结材料的性能优值(ZT=α2σT/κ)对应于TeI4含量为0.08wt%有其最大值,约为0.92.此外,烧结材料的抗弯强度增加至80MPa左右,从而可以显著改善材料的可加工性以及元器件的使用可靠性.     

Cu1.8-xSbxS热电材料的相结构与电热输运性能

Cu1.8S基热电材料因其丰富的原料储备、低毒性及优良的电学和热学性能而成为具有应用潜力的热电材料.本文采用机械合金化(mechanical alloying,MA)结合放电等离子烧结(spark plasma sintering,SPS)工艺制备了一系列Cu1.8-xSbxS(x=0,0.005,0.02,0.03,...     

TeI4掺杂量对n型Bi2Te3基烧结材料热电性能的影响

采用区熔法结合放电等离子体快速烧结(SPS)技术制备了n型Bi₂Te₃基热电材料.在300—500K的温度范围内测量了各热电性能参数，包括电导率(σ)、塞贝克系数(α)和热导率(κ)，研究了掺杂剂TeI₄的含量(质量百分比分别为0，0.05，0.08，0.10，0.13和0.15wt%)对热电性能的影响.结果表明：试样的载流子浓度(n)随TeI₄含量增加而增大，使电导率增大、塞贝克系数的绝对值先增大而后减小，从而导致品质因子(α²σ)呈先增加后降低的变化趋势；同时，由于异质离子(I^-)以及载流子对声子的散射作用增强，可显著降低其晶格热导率.烧结材料的性能优值(ZT=α²σT/κ)对应于TeI₄含量为0.08wt%有其最大值，约为0.92.此外，烧结材料的抗弯强度增加至80MPa左右，从而可以显著改善材料的可加工性以及元器件的使用可靠性. 关键词： 2Te₃')" href="#">Bi₂Te₃ 放电等离子体快速烧结 热电性能     

碲化铋薄膜载能粒子相互作用的超快研究

碲化铋禁带宽度非常窄而具有高电导率和塞贝克系数,同时具有低热导率,成为已知室温下优值系数最高的热电材料。已有研究表明,纳米薄膜和超晶格是进一步提高材料热电性能的可行途径。因此超快研究碲化铋纳米薄膜中载能子间的相互作用过程对开发高性能热电材料有重要意义。本文采用飞秒激光泵浦-探测技术,实验研究了沉积在硅基底上厚度为100 nm碲化铋薄膜中各载能粒子的相互作用过程。通过改变延迟时间步长,分别观察到价带电子被光子激发跃迁至导带,激发电子在导带内与声子的能量弛豫及导带电子与空穴复合跃迁至价带,并将能量传递给声子导致声子温度升高的过程。此外,还观察到热应力产生的声波,并据此得到了碲化铋薄膜中纵波声速为2649 m s^-1。     

Sn离子注入PbTe的热电性能和结构

对碲化铅(PbTe)在室温下进行了Sn离子注入(200keV,6×10¹⁶和1×10¹⁷ion/cm²).应用电学和热学测量、X射线衍射技术(XRD)和X射线光电子能谱(XPS)研究了Sn离子注入PbTe的热电性能和注入层结构. 关键词：     

熔体旋甩工艺对n型InSb化合物的微结构及热电性能的影响

采用新颖的熔体旋甩结合放电等离子烧结技术制备了单相InSb化合物,研究了熔体旋甩工艺对其微结构以及热电性能的影响. 结果表明,熔体旋甩得到的薄带自由面主要由300 nm—2 μm的小柱状晶组成,薄带接触面为非晶或精细纳米晶,薄带经烧结后得到了具有大量层状精细纳米结构的致密块体,尺寸约为40 nm. 与熔融+放电等离子体烧结制备样品相比,在测试温度范围内（300—700 K）,试样的电导率略有下降,但Seebeck系数显著增加,热导率和晶格热导率显著降低,室温下晶格热导率降低幅度约为106%,700 K下晶格热导率的降低幅度达1664%,熔融+熔体旋甩+放电等离子体烧结制备的InSb化合物试样在700 K时其最大ZT值达到049,与熔融+放电等离子体烧结试样相比提高了29%. 关键词： 熔体旋甩 n型InSb化合物 微结构 热电性能     

熔体旋甩工艺对n型InSb化合物的微结构及热电性能的影响

采用新颖的熔体旋甩结合放电等离子烧结技术制备了单相InSb化合物,研究了熔体旋甩工艺对其微结构以及热电性能的影响. 结果表明,熔体旋甩得到的薄带自由面主要由300 nm—2 μm的小柱状晶组成,薄带接触面为非晶或精细纳米晶,薄带经烧结后得到了具有大量层状精细纳米结构的致密块体,尺寸约为40 nm. 与熔融+放电等离子体烧结制备样品相比,在测试温度范围内（300—700 K）,试样的电导率略有下降,但Seebeck系数显著增加,热导率和晶格热导率显著降低,室温下晶格热导率降低幅度约为106%,700 K下晶格热导率的降低幅度达1664%,熔融+熔体旋甩+放电等离子体烧结制备的InSb化合物试样在700 K时其最大ZT值达到049,与熔融+放电等离子体烧结试样相比提高了29%.     

Pulsed laser deposition of Bi2Te3 thermoelectric films

Bi₂Te₃ is one of the most used materials for thermoelectric applications at ambient temperature. An improvement of thermoelectric performances through a suitable modification of electron and phonon transport mechanisms is predicted for low dimensional or nanostructured systems, but this requires a control of the material structure down to the nanoscale. We show that pulsed laser deposition provides control on film composition, phase and structure, necessary for a comprehension of the relationship between structure and thermoelectric properties. We have explored the role of deposition temperature, background inert gas type and pressure, laser fluence and target-to-substrate distance and we found the experimental condition ranges to obtain crystalline films containing the Bi₂Te₃ phase only, by comparing energy dispersive X-ray spectroscopy, Raman spectroscopy and X-ray diffraction analysis. Variations of substrate temperature and deposition gas pressure prove to be crucial also for the control of film morphology and crystallinity. Substrate type has no influence on film stoichiometry and crystallinity, but highly oriented growth can be achieved on mica due to van der Waals epitaxy.     

机械合金化过程对硫化铋块体热电性能的影响机理

以机械合金化法(MA)结合放电等离子烧结技术(SPS)制备了Bi₂S₃多晶块体热电材料. 研究了MA过程中干磨转速、湿磨时间和湿磨介质对Bi₂S₃多晶热电材料电传输性能的影响. 分析了样品的物相, 观察了显微组织, 测试了电传输性能和热传输性能. 研究表明, 以无水乙醇为湿磨介质时, 随着湿磨时间的延长, 出现了微量Bi₂O₃第二相, 样品的晶粒尺寸减小, 电阻率大幅增加, 功率因子下降. 以丙酮为湿磨介质时, 虽然不存在微氧化反应, 但是由于样品中存在大量孔洞, 导致功率因子降低. 425 r/min 干磨15 h后未湿磨的样品在573 K取得最大的ZT值0.25, 是目前文献报道的最高值.     

Fabrication and characterization of Bi2Te3 nanoplates via a simple solvothermal process

Bi₂Te₃ nanoplates have been successfully obtained by a novel solvothermal method in the presence of hexadecyltrimethylammonium bromide (CTAB). Various techniques such as X-ray diffraction (XRD), field-emission scanning electron microscope (FESEM), transmission electron microscope (TEM), selected area electron diffraction (SAED), and Fourier transform infrared spectrometry (FT-IR) have been used to characterize the obtained products. The results show that the as-synthesized samples are rhombohedral-structured Bi₂Te₃ single-crystal nanoplates about 70–200 nm in diagonal and 30 nm in thickness, and the growth direction is perpendicular to c-axis. The existence of CTAB is vital to the formation of the plate-like morphology. In addition, the reaction solvents also have important influence on the shape-control of final products.     

Bi2Te3/Sb超晶格纳米线的外延生长和热电测量

通过脉冲电沉积,外延生长出小单元长度的Bi₂Te₃/Sb超晶格纳米线.借助哈曼方法,测量了超晶格纳米线阵列的热电性能,330 K时的ZT值可达0.15.研究了Bi₂Te₃/Sb超晶格纳米线阵列器件的制冷或者加热能力,发现器件的上下表面的最大温差可以达到6.6 K.     

热压工艺参数对n型和p型Bi2Te3基赝三元热电材料电学性能的影响

通过熔炼/研磨/热压方法制备了n型和p型赝三元Bi₂Te₃基的热压合 金样品，测量了由不同工艺参数(热压温度、热压压力)制备的样品Seebeck系数和电导率.分析了热压参数对热电性能产生的影响.特别是发现了增加热压压力和热压温度会使n型和p型热压样品的Seebeck系数和电导率都有所提高，这与单晶和取向晶体材料的Seebeck系数和电导率变化趋势相反的规律显然不同，其结果对热压样品的电学性能提高有积极的影响. 关键词： 热电材料 热压 Seebeck系数 工艺参数     

Effects of Li2CO3 on the sintering behavior and piezoelectric properties of Bi2O3-excess (Bi0.5Na0.5)0.94Ba0.06TiO3 ceramics

(Bi_0.5Na_0.5)_0.94Ba_0.06TiO₃ ceramics doped with Li₂CO₃ and Bi₂O₃ as sintering aids were manufactured, and their micro structural, dielectric and piezoelectric properties were investigated. All specimens could be well sintered at a low-temperature of 1080 °C. The bulk density of the specimens doped with a small amount of Li₂CO₃ was enhanced. The dielectric and piezoelectric properties of ceramics were investigated with different amounts of Li₂CO₃ substitutions. High electrical properties of d₃₃ = 167 pC/N, k_p = 0.34, P_r = 40 μC/cm² and E_c = 38 kV/cm were obtained from the specimen containing 0.1 mol% of Li₂CO₃ sintered at 1080 °C.     

Effect of microstructure on thermoelectric properties of CSD-grown Bi2Sr2Co2Oy thin films

Three Bi₂Sr₂Co₂O_y thin films with different microstructures have been prepared by chemical solution deposition on LaAlO₃(001) through varying the annealing temperature. With the decrease in the annealing temperature, both the size and c-axis alignment degree of grains in the film decrease as well, leading to an increase in the film resistivity. In addition, the decrease in the annealing temperature also results in a slight increase in the seebeck coefficient due to the enhanced energy filtering effect of small-grain film. The nanostructured Bi₂Sr₂Co₂O_y film with the average grain size of about 100 nm shows a power factor comparable to that of the films with larger grains. Since the thermal conductivity of the nanostrcutured films can be depressed due to the enhanced phonon scattering by grain boundary, a higher figure of merit is expected in Bi₂Sr₂Co₂O_y thin film with grains in nanometer size.     

Annealing effects on the structural and electrical transport properties of n-type Bi2Te2.7Se0.3 thin films deposited by flash evaporation

N-type Bi₂Te_2.7Se_0.3 thermoelectric thin films with thickness 800 nm have been deposited on glass substrates by flash evaporation method at 473 K. Annealing effects on the thermoelectric properties of Bi₂Te_2.7Se_0.3 thin films were examined in the temperature range 373-573 K. The structures, morphology and chemical composition of the thin films were characterized by X-ray diffraction, field emission scanning electron microscope and energy dispersive X-ray spectroscopy, respectively. Thermoelectric properties of the thin films have been evaluated by measurements of the electrical resistivity and Seebeck coefficient at 300 K. The Hall coefficients were measured at room temperature by the Van der Pauw method. The carrier concentration and mobility were calculated from the Hall coefficient. The films thickness of the annealed samples was measured by ellipsometer. When annealed at 473 K, the electrical resistivity and Seebeck coefficient are 2.7 mΩ cm and −180 μV/K, respectively. The maximum of thermoelectric power factor is enhanced to 12 μW/cm K².