铝纳米晶的正电子湮没研究

采用自悬浮定向流-真空热压法,在不同压强下制得铝纳米晶材料,并利用X射线衍射(XRD)和正电子湮没寿命谱(PALS)分析手段对铝纳米晶的结构和微观缺陷进行表征.XRD分析表明:所制备的铝纳米晶的晶粒度为48 nm.PALS分析表明:铝纳米晶的微观缺陷主要为类空位以及空位团,而微孔洞很少;短寿命τ1,中间寿命τ2以及其对应的强度I1,I2随压强变化而呈现阶段性变化;压制压强(P)低于0.39 GPa时制得的纳米晶空位团随压强的增加而逐渐转变为类空位;0.39 GPa P 0.72 GPa时,各类缺陷发生消除;P 0.72 GPa时,各类缺陷进一步发生消除.随压强的提高,铝纳米晶的密度增加,其显微硬度也明显增高.     

GaN/SiC异质结的慢正电子研究

通过对不同生长厚度GaN/SiC(n-n)的慢正电子研究,发现在GaN/SiC的界面中存在大量各种缺陷并在界面两端形成两个不同方向的电场. 这些缺陷的产生和SiC衬底表面制备以及GaN和SiC不同的热膨胀系数有关. 而缺陷中大量的带状缺陷在界面中形成一个费米能级钉扎(Fermi level pinning),它的存在使界面中存在一定高度的势垒,导致在界面两端的一定区域内形成两个不同方向的电场. 用VEPFIT模拟该电场的存在,分四层(GaN/Interface/SiC1/SiC2)进行拟合,得到了很好的拟 关键词： 正电子湮没 缺陷 半导体     

Defect structure studies using positron annihilation spectroscopy

The positron annihilation method is a new addition to the range of sensitive complementary nuclear techniques available for materials’ research. The preferential sensitivity of positrons towards micro-defect domains which are not assessable by other techniques makes it an attractive tool for many materials science problems. The present paper is intended as a brief introduction on the principle of measurements and its potential is exemplified with the help of results on some metallic and ceramic systems.     

Irradiation-induced atomic defects in SiC studied by positron annihilation

The present paper reports on positron lifetime measurements on atomic defects in SiC after low-temperature (80 K) electron irradiation of low (0.47 MeV) and high (2.5 MeV) electron energies and doses from 1.8×10¹⁷ to 1.9×10¹⁹ e/cm² as well as after subsequent isochronal annealing up to 1900 K. For these studies the single crystals of nitrogen doped (2–3×10¹⁸ cm^–3) SiC grown by a modified Lely technique with hexagonal structure (6H polytype) were used.According to the positron lifetime measurements, very different types of vacancy-like positron traps are introducted after irradiation with electrons of either low or high energy. The formation of defect agglomerates and their decay at high temperatures is studied during isochronal annealing and related to earlier studies.Paper presented at the 132nd WE-Heraeus-Seminar on Positron Studies of Semiconductor Defects, Halle, Germany, 29 August to 2 September 1994     

Positronium annihilation in silica aerogel studied by a positron age-momentum correlation technique

A high-performance positron age-momentum correlation (AMOC) spectrometer was newly developed.The counting rate is increased up to 200 cps much larger than the value 20 cps reported by other international groups.And at the same time,the time resolution still keeps at the international level of 220 ps.Furthermore,positronium (Ps) annihilation in silica aerogel was investigated by AMOC,which indicates:(1) Ps annihilation between the grains dominantly undergoes pick-off process and spin conversion from o-Ps to p-Ps;(2) Annealing below 400 ℃ changes the grain surface conditions,i.e.the desorption of hydrogen and the decrease of the defect centers concentration.     

Positronium annihilation in silica aerogel studied by a positron age-momentum correlation technique

A high-performance positron age-momentum correlation (AMOC) spectrometer was newly developed. The counting rate is increased up to 200 cps much larger than the value 20~cps reported by other international groups. And at the same time, the time resolution still keeps at the international level of 220 ps. Furthermore, positronium (Ps) annihilation in silica aerogel was investigated by AMOC, which indicates: (1) Ps annihilation between the grains dominantly undergoes pick-off process and spin conversion from o-Ps to p-Ps; (2) Annealing below 400 ℃ changes the grain surface conditions, i. e. the desorption of hydrogen and the decrease of the defect centers concentration.     

Structural and optical characterization of GaN heteroepitaxial films on SiC substrates

We have estimated the threading dislocation density and type via X-ray diffraction and Williamson-Hall analysis to elicit qualitative information directly related to the electrical and optical quality of GaN epitaxial layers grown by PAMBE on 4H- and 6H-SiC substrates. The substrate surface preparation and buffer choice, specifically: Ga flashing for SiC oxide removal, controlled nitridation of SiC, and use of AlN buffer layers all impact the resultant screw dislocation density, but do not significantly influence the edge dislocation density. We show that modification of the substrate surface strongly affects the screw dislocation density, presumably due to impact on nucleation during the initial stages of heteroepitaxy.     

正电子湮没谱和光致发光谱研究掺锌GaSb质子辐照缺陷

用正电子湮没谱和光致发光谱研究了质子辐照后掺锌GaSb中的缺陷.通过分析正电子的缺陷寿命τ₂及强度I₂的变化发现,在高能质子的辐照下产生了双空位缺陷V_GaV_Sb,可能同时产生了小的空位团.正电子平均寿命τ_av和S参数随着质子辐照剂量的变化也证明了这一结论.通过分析不同质子辐照剂量下掺锌GaS     

Hydrogen-induced buckling of Pd films studied by positron annihilation

Hydrogen loading of thin films introduces very high compressive stresses which grow in magnitude with increasing hydrogen concentration. When the hydrogen-induced stresses exceed a certain critical in-plane stress value, the loaded film starts to detach from the substrate. This results in the formation of buckles of various morphologies in the film layer. Defect studies of a hydrogen loaded Pd film which undergoes a buckling process are presented, using slow positron implantation spectroscopy, in situ acoustic emission, and direct observations of the film structure by transmission electron and optical microscopies. It is found that buckling of the film occurs at hydrogen concentrations x_H ≥ 0.1 and causes a significant increase of the dislocation density in the film.     

Novel attributes of AlGaN/AlN/GaN/SiC HEMTs with the multiple indented channel

In this paper, a high performance AlGaN/AlN/GaN/SiC High Electron Mobility Transistor (HEMT) with the multiple indented channel (MIC-HEMT) is proposed. The main focus of the proposed structure is based on reduction of the space around the gate, stop of the spread of the depletion region around the source–drain, and decrement of the thickness of the channel between the gate and drain. Therefore, the breakdown voltage increases, meanwhile the elimination of the gate depletion layer extension to source/drain decreases the gate–source and gate–drain capacitances. The optimized results reveal that the breakdown voltage and the drain saturation current increase about 178% and 46% compared with a conventional HEMT (C-HEMT), respectively. Therefore, the maximum output power density is improved by factor 4.1 in comparison with conventional one. Also, the cut-off frequency of 25.2 GHz and the maximum oscillation frequency of 92.1 GHz for the MIC-HEMT are obtained compared to 13 GHz and 43 GHz for that of the C-HEMT and the minimum figure noise decreased consequently of reducing the gate–drain and gate–source capacitances by about 42% and 40%, respectively. The proposed MIC-HEMT shows a maximum stable gain (MSG) exceeding 24.1 dB at 3.1 GHz which the greatest gain is yet reported for HEMTs, showing the potential of this device for high power RF applications.     

Enhancement-mode AlGaN/GaN high electronic mobility transistors with thin barrier

An enhancement-mode (E-mode) AlGaN/GaN high electron mobility transistor (HEMTs) was fabricated with 15-nm AlGaN barrier layer. E-mode operation was achieved by using fluorine plasma treatment and post-gate rapid thermal annealing. The thin barrier depletion-HEMTs with a threshold voltage typically around --1.7 V, which is higher than that of the 22-nm barrier depletion-mode HEMTs (--3.5 V). Therefore, the thin barrier is emerging as an excellent candidate to realize the enhancement-mode operation. With 0.6-μ m gate length, the devices treated by fluorine plasma for 150-W RF power at 150 s exhibited a threshold voltage of 1.3 V. The maximum drain current and maximum transconductance are 300 mA/mm, and 177 mS/mm, respectively. Compared with the 22-nm barrier E-mode devices, V_T of the thin barrier HEMTs is much more stable under the gate step-stress.     

国产SiC衬底上利用AIN缓冲层生长高质量GaN外延薄膜

采用高温AlN作为缓冲层在国产SiC衬底上利用金属有机物化学气相外延技术生长GaN外延薄膜.通过优化AlN缓冲层的生长参数得到了高质量的GaN外延薄膜,其对称(0002)面和非对称(1012)面X射线衍射摇摆曲线的半峰宽分别达到130 arcsec和252 arcsec,这是目前报道的在国产SiC衬底上生长GaN最好的...     

用正电子研究NaCl在NaY沸石上的固溶过程

用正电子湮没谱学研究NaCl与NaY沸石机械混合后, NaCl在NaY中的固溶扩散过程.分别测量不同质量比的NaCl/NaY［(1—20)%］经500℃烘烤1h，NaCl/NaY(15%)经不同温度烘烤1h,以及NaCl/NaY(15%)经500℃烘烤不同时间后的正电子寿命谱.所有寿命谱都出现了5个寿命分量, 其中第3，4，5寿命分别与β笼、超笼及沸石微粒界面空洞的大小和数量相关.实验表明正电子湮没谱学能敏感地表征NaCl在NaY中的固溶扩散过程. 关键词： 正电子湮没谱学 氯化钠 沸石     

Free-volume changes at nanoscale in doped polyacrylic acid studied by positron annihilation spectroscopy

Polyacrylic acid (PAA) doped with carbon black (CB), chromium oxide (Cr₂O₃) and cupferron with different wt% (0.25%, 0.50%, 0.75%, and 1%) was studied using positron annihilation lifetime (PAL) technique and Doppler broadening of annihilation radiation (DBAR). Ortho-positronium lifetime components (τ₃ and I₃) were used to estimate the nanoscale free-volume hole sizes (V_f) and its fractions (f). It was found that the hole size V_f and its fractions f as well as S-parameters decreased at high value of doping concentration due to dopants-polymer formation. These results are supported by a significant narrowing in the nanoscale free-volume hole size distributions.

The correlation between positron annihilation parameters and electric conductivity are discussed.     

Polydimethylsiloxane rubber gamma radiation effect studies by positron annihilation lifetime spectroscopy

Polydimethylsiloxane rubber was irradiated at various radiation doses up to 800 kGy in air. The lifetime and intensity of the long component τ₃ were obtained by positron annihilation lifetime spectroscopy (PALS). The crystallization property and the molecular flexibility were estimated using the differential scanning calorimetry and dynamic thermomechanic analysis. Thermal volatile property was determined by thermogravimetry analysis. It was proved that the cross-linking reaction made the chain flexibility of the rubber to reduce gradually during gamma radiation, which resulted in the reduction of the o-Ps intensity observed by PALS. Although the degradation effect existed during gamma radiation, it was still less significant than the cross-linking effect when the radiation dose was up to 800 kGy.     

Simulation study of InAlN/GaN high-electron mobility transistor with AlInN back barrier

In this work, we use a 3-nm-thick Al_(0.64)In_(0.36)N back-barrier layer in In_(0.17)Al_(0.83) N/Ga N high-electron mobility transistor(HEMT) to enhance electron confinement. Based on two-dimensional device simulations, the influences of Al_(0.64)In_(0.36) N back-barrier on the direct-current(DC) and radio-frequency(RF) characteristics of In AlN/GaN HEMT are investigated, theoretically. It is shown that an effective conduction band discontinuity of approximately 0.5 eV is created by the 3-nm-thick Al_(0.64)In_(0.36) N back-barrier and no parasitic electron channel is formed. Comparing with the conventional In AlN/GaN HEMT, the electron confinement of the back-barrier HEMT is significantly improved, which allows a good immunity to short-channel effect(SCE) for gate length decreasing down to 60 nm(9-nm top barrier). For a 70-nm gate length, the peak current gain cut-off frequency( f_T) and power gain cut-off frequency( f_(max)) of the back-barrier HEMT are172 GHz and 217 GHz, respectively, which are higher than those of the conventional HEMT with the same gate length.     

Operational improvement of AlGaN/GaN HEMT on SiC substrate with the amended depletion region

In this paper, a high performance AlGaN/GaN High Electron Mobility Transistor (HEMT) on SiC substrates is presented to improve the electrical operation with the amended depletion region using a multiple recessed gate (MRG–HEMT). The basic idea is to change the gate depletion region and a better distribution of the electric field in the channel and improve the device breakdown voltage. The proposed gate consists of lower and upper gate to control the channel thickness. Also, the charge of the depletion region will change due to the optimized gate. In addition, a metal between the gate and drain including the horizontal and vertical parts is used to better control the thickness of the channel. The breakdown voltage, maximum output power density, cut-off frequency, maximum oscillation frequency, minimum noise figure, maximum available gain (MAG), and maximum stable gain (MSG) are some parameters for designers which are considered and are improved in this paper.     

Helium bubbles in neutron-irradiated copper-boron studied by positron annihilation

The influence of helium, introduced by the ¹⁰B(n, α)⁷Li reaction, on the evolution of defect structure in copper containing a few hundred ppm boron has been studied by detailed positron lifetime and two-photon angular correlation measurements, supplemented by TEM studies. In the as-irradiated state of Cu-B, two lifetime components have been resolved. The shorter lifetime, τ₁, = 167 ps of 97% intensity, has been understood as due to positron trapping at small helium-vacancy complexes, while the longer lifetime τ₂ = 450 ps of 3% intensity is explained as due to helium-free voids. Marked changes in the annihilation characteristics observed at 670 K are interpreted in terms of the nucleation of microbubbles, controlled by thermally activated helium migration to vacancy traps. Corroborative evidence for the onset of helium clustering is obtained from the change in the average size of positron traps as deduced from the smearing of the measured angular correlation spectra. Helium bubbles and helium-free voids coexisting in the system have been distinguished by a three-component analysis of the lifetime spectra. Bubbles are found to be stable beyond the temperature of dissociation of voids. The size and concentration of bubbles, determined independently by TEM measurements, are in accordance with the positron annihilation results in the growth stage. The observed positron lifetime at higher annealing temperatures has been analysed by relating the annihilation rate to helium atom density and helium pressures in bubbles evaluated. These pressures are in satisfactory agreement with the estimates of equilibrium pressures, leading to the conclusion that bubble relaxation occurs by the mechanism of thermal vacancy condensation.     

Interface defects in GaN/sapphire studied using Rutherford backscattering spectroscopy and channeling

GaN on sapphire was grown by MOCVD technique. Rutherford backscattering spectra together with channeling along [0 0 0 1] axis were recorded to study the defects at the interface. Detailed calculation shows that the defects at GaN/sapphire interface are due to dislocations which are distributed into the whole thickness of the film and are mainly aligned on the growth direction.