Thermal stability and conductivity of hot-pressed Si3N4–graphene composites

This study concerns new Si₃N₄–graphene composites manufactured using the hot-pressing method. Because of future applications of silicon nitride for cutting tools or specific parts of various devices having contact with high temperatures there is a need to find a ceramic composite material with good mechanical and especially thermal properties. Excellent thermal properties in the major directions are characteristic of graphene. In this study, the graphene phase is added to the silicon nitride phase in a quantity of up to 10 mass%, and the materials are sintered under uniaxial pressure. The mixture of AlN and Y₂O₃ is added as sintering activator to the composite matrix. The studies focus on thermal stability of produced composites in argon and air conditions up to the temperature of 1,000 °C. The research also concerns the influence of applied uniaxial pressure during the sintering process on the orientation of graphene nanoparticles in the Si₃N₄ matrix. The study also presents research on anisotropy of thermal diffusivity and following thermal conductivity of ceramic matrix composites versus the increasing graphene quantity. Most of the presented results have not been published in the literature yet.     

高导热氮化硼/芳纶沉析复合薄膜的制备及性能

利用多巴胺(DA)的氧化自聚合特性, 对六方氮化硼(h-BN)进行表面修饰, 并以多巴胺改性后的氮化硼(h-BN@PDA)为导热填料, 对基体芳纶沉析纤维(AF)进行填充, 通过真空辅助抽滤法制备多巴胺改性氮化硼/芳纶沉析(h-BN@PDA/AF)复合薄膜, 并对其微观形貌、 表面官能团、 导热性能、 绝缘性能及力学性能进行研究. 结果表明, 聚多巴胺(PDA)包覆在h-BN表面, 并引入活性基团, 与AF纤维产生氢键, 改善了两者的界面结合, 显著提高了复合薄膜导热性能及绝缘性能. 当h-BN@PDA含量为70%时, h-BN@PDA/AF复合薄膜的导热系数为1.36 W/(m·K), 与纯芳纶沉析薄膜相比, 导热系数的增幅约为697.65%, 体积电阻率为5.96×10 ¹⁴ Ω·m, 拉伸模量高达287.19 MPa.     

Enrichment and desalting of tryptic protein digests and the protein depletion using boron nitride

Sample preparation still remains a great challenge in modern bioanalysis and the interest in new efficient solid phase extraction (SPE) materials still remains high. In this work, hexagonal boron nitride (h-BN) is introduced as a new SPE material for the isolation and enrichment of peptides. The h-BN is isoelectronic and structurally similar to graphite. It has remarkable properties including good thermal conductivity, excellent thermal and chemical stability and a better oxidation resistance than graphite. BN attracts increasing interest because of its wide range of applicability. In the present work, the great potential of h-BN, as a new SPE-material, on the enrichment, preconcentration and desalting of tryptic digest of model proteins is demonstrated. A special attention was dedicated to the efficient enrichment of hydrophilic phosphopeptides. Two elution protocols were developed for the enrichment of peptides compatible for subsequent MALDI-MS and ESI-MS analysis. In addition, the recoveries of 5 peptides and 3 phosphopeptides with wide range of pI values utilizing h-BN materials with different surface areas were investigated. 84–106% recovery rate could be achieved using h-BN materials. The results were compared with those obtained using graphite and silica C18 under the same elution conditions, and lower recoveries were obtained. In addition, h-BN was found to have a capability of protein depletion, which is requisite for the peptide profiling.     

Thermal conductivity anisotropy of expanded graphite/ chlorate salt composites for thermal energy storage

ABSTRACT

Expanded graphite (EG)/LiCl-NaCl phase change composites are prepared by aqueous solution method with different EG amount and forming pressure to enhance heat conduction for high-temperature latent heat thermal energy storage application. Their microstructure and thermal conductivity are characterized. Results indicate that the composites are uniform and the LiCl-NaCl eutectic is well dispersed in the graphite flakes. Thermal conductivity of the LiCl-NaCl can increase to as much as 40.51 W/(m·K), which is 46 times higher than that of pure eutectic salt. With forming pressure, the thermal conductivities of the samples show anisotropy because of a flattened irregular honeycomb network of graphite. Within certain limits, the greater the forming pressure is, the more pronounced the anisotropy performs. In addition, the formulas to calculate the thermal conductivity in the axial direction and the radial direction are given based on the average rotation angle φ of EG basal plane, and experimental data show that the formula in the radial direction is especially useful for calculating the thermal conductivity.     

Thermal conductivity of microPCMs-filled epoxy matrix composites

Microencapsulated phase change materials (microPCMs) have been widely applied in solid matrix as thermal-storage or temperature-controlling functional composites. The thermal conductivity of these microPCMs/matrix composites is an important property need to be considered. In this study, a series of microPCMs have been fabricated using the in situ polymerization with various core/shell ratio and average diameter; the thermal conductivity of microPCMs/epoxy composites were investigated in details. The results show that the microPCMs have smooth surface and regular global shape with compact methanol–melamine–formaldehyde shell. The shell thickness does not greatly influence the phase change behaviors of PCM. Moreover, smaller microPCMs embedded in epoxy can improve the thermal transmission ability of composites. The effect of thermal conductivity of composites can be improved with higher volume fraction (10–30%) of microPCMs; and smaller size microPCMs with the same content of PCM may also enhance the thermal transmission area in matrix. Modeling analysis of relative thermal conductivity indicates that mixing higher thermal conductivity additive in PCM or matrix is an appropriate method to improve the thermal conductivity of microPCMs/matrix composites.     

Influence of Boron Nitride on the Network Structure and Properties of Poly(dimethylsiloxane) Composite Materials

The influence of hexagonal boron nitride (h-BN) on the network structure and properties of poly(dimethylsiloxane) networks was investigated. A silane coupling reaction occurs during the preparation of materials to fix the filler to the network. The composite materials display a reduction in bulk network cross-linking and increase in hydrogen bonding interactions when compared to the unfilled material. Consequently, the tensile modulus is enhanced, the tan-delta decreases and compression set resistance diminishes. The in situ silane coupling reaction does not impact the expected thermal conductivity of the material and the inclusion of h-BN leads to materials with decreased coefficient of thermal expansion.     

Enhanced directional thermal conductivity of polylactic acid/polybutylene adipate terephthalate ternary composite filled with oriented and surface treated boron nitride

A combination of solution casting and melt extrusion technique was used to fabricate Boron nitride (BN)-filled Polylactic acid (PLA)/polybutylene adipate terephthalate (PBAT) blend composites. The BN particles were surface treated with a silane coupling agent and functionalization was confirmed via spectroscopic analysis. Field emission scanning electron microscopy confirmed that the BN surface treatment improved the particle adhesion with the polymer matrices and acted as a compatibilizer for the polymers. Moreover, changes in the particle orientation in the blend composite yielded improved thermal conductivity in different directions. The inclusion of the treated BN particles enhanced the in-plane (~1.1 W m⁻¹K⁻¹) and through-plane (~0.8 W m⁻¹K⁻¹) thermal conductivity of the composites as compared to the neat PLA. In addition, the storage modulus of the composite become more than 3 GPa that is twice that of the PLA/PBAT blend with a reasonable tensile property. In general, compared with the PLA/PBAT blend, the blend composites exhibited superior thermal and mechanical properties.     

Thermal properties of multilayer graphene and hBN reinforced copper matrix composites

The unique properties of graphene make it a very attractive application, although there are still no commercial products in which graphene would play a key role. Good thermal conductivity is undoubtedly one of the attributes which can be easily used both in materials involving large monoatomic layers, that are very difficult to obtain, as well as multilayer graphene flakes, which have been commercially available on the market for several years. The article presents the results of tests on the characteristic thermal properties of composites with the addition of 2–15% of multilayer graphene (MLG) crystals. The motivation of the study was literature reports showing the possibility of increasing the thermal conductivity of composites with MLG participation in the copper matrix. Since the production of composites with increased properties is associated with obtaining a strong orientation of the flakes in the structure, composites with hBN flakes exhibiting significantly worse but also directional thermal properties were produced for comparison. The paper showed a strong influence of flake morphology on the possibility of creating a directional structure. The obtained Cu/MLG composites with the addition of only 2% MLG were characterized by an increase in the thermal conductivity coefficient of about 30% in relation to sinters without the participation of MLG.

     

聚乙二醇/氮化硼复合材料相变导热性能及其结晶行为

本文采用熔融共混浇筑的方法制备了聚乙二醇/氮化硼(PEG/BN)相变复合材料,并研究了不同尺度片状BN对相变复合材料导热性能和结晶行为的影响。 通过扫描电子显微镜(SEM)、热常数分析仪、红外热成像分析仪和差示扫描量热仪(DSC)研究了相变复合材料的微观形貌、导热系数和相变过程,并利用莫志深法对DSC结果进行了非等温结晶动力学分析。 结果表明,较大片状直径(50 μm)的BN可以更有效地提高聚乙二醇的导热系数,当BN填料质量分数为40%时,相变复合材料的导热系数可达到5.04 W/(m·K)。 在快速降温条件下,片径为50 μm的BN填料可以缩短PEG的半结晶时间,提高结晶速率,使相变复合材料具有较大的相变焓。     

Nanosized composites of synthetic zeolites and silver iodide as potentially electrochemically active materials

Zeolitic composite materials made up of silver iodide and potassium form of synthetic zeolites ZSM5 were prepared in different conditions. The composites were characterized by X-ray powder diffraction methods and their electrochemical properties were studied by conductivity measurements. The attention was focused on the composites of synthetic zeolite of ZSM5 and AgI prepared by treating a silver form of synthetic zeolite ZSM5 (Ag-ZSM5) with potassium iodide solution. On the basis of the ac conductivity data it has been inferred that AgI forms a thin conductive crystalline shell on the surface of the K-ZSM5 particles. The sharp conductivity change between 142 and 147 °C is due to AgI undergoing a phase transition from hexagonal to cubic symmetry at 146 °C. The electrochemical properties of the composites depend on the mode of preparation and on the subsequent thermal treatments.     

Effect of aspect ratio of vertically aligned copper nanowires in the presence of cellulose nanofibers on the thermal conductivity of epoxy composites

The composites comprising vertically aligned network of copper nanowires (CuNWs) in the presence of cellulose nanofibers were fabricated by using the freeze‐templating method and the effect of aspect ratio (A/R) of CuNWs on the thermal conductivity of epoxy composites was investigated. The thermal conductivity of epoxy composites increased to 0.79 W m^?1 K^?1 at 1.12 vol% of high A/R CuNWs loading, corresponding to the thermal conductivity enhancement of 365% as compared to the pure epoxy. The thermal conductivity of vertically aligned higher A/R CuNWs/epoxy, which is 38.5% and 51.9% higher than those of the lower A/R CuNWs and the randomly aligned CuNWs, respectively. The application of the epoxy composites in heat dissipation was demonstrated by the temperature changes of composites on a hot plate with the increase of heating time. These results indicate that the thermally conductive composites in this study could be applied for thermal dissipating materials in electronic devices.     

The addition of functionalized graphene oxide to polyetherimide to improve its thermal conductivity and mechanical properties

The thermal and electrical conductivity and mechanical properties of polyetherimide (PEI) containing either alkyl‐aminated (enGO) or phenyl‐aminated graphene (pnGO) oxides were studied. A solution casting method was used to prepare functionalized graphene oxide/PEI composites with different filler contents. The introduction of functionalized graphene oxide to the PEI matrix improved the thermal conductivity, electrical conductivity, and mechanical properties. The thermal conductivities of the enGO 3 wt%/PEI and pnGO 3 wt%/PEI composites were 0.324 W/mK and 0.329 W/mK, respectively, due to the high thermal conductivity of the graphene‐based materials and the strong interface adhesion due to the filler surface treatment between the fillers and the matrix. The electrical conductivities of the functionalized graphene oxide/PEI composites were larger than that of PEI, but the electrical conductivity values were generally low, which is consistent with the magnitude of the insulator. The strong interfacial adhesion between the fillers and the matrix led to improved mechanical properties. Copyright © 2014 John Wiley & Sons, Ltd.     

An elastomeric conducting composite based on polyaniline coated nylon fiber and chloroprene rubber

Chloroprene rubber-polyaniline (PANI) coated nylon fiber composites containing PANI powder were prepared by mechanical mixing on a two-roll mill. PANI was synthesized by chemical polymerization of aniline in presence of hydrochloric acid. PANI coated nylon fiber was prepared by in situ polymerization of aniline on nylon fiber. The cure parameters cure kinetics, filler dispersion, mechanical properties, DC electrical conductivity and thermal degradation parameters of the composites were evaluated. Cure rate index and cure reaction constants indicated that the rate of cure reaction changes on filler addition. Filler addition at higher loadings led to agglomeration. The tensile strength and modulus values increased suggesting a reinforcement effect. The conductivity, thermal characteristics and thermal degradation kinetic parameters are also presented.     

Enhanced thermal conductivity of rheologically percolated carbon nanofiber reinforced polypropylene composites

Three different types of carbon nanofibers (CNF) were incorporated in the same polypropylene (PP) matrix by twin‐screw extrusion. The rheological and thermal properties were investigated. The rheological characterization of CNFs/PP composites as function of their volume fraction shows different microstructures: percolated and non‐percolated behaviors of their CNF's networks. In this work, the laser flash technique is employed in the experimental determination of the thermal diffusivity and conductivity of composites at room temperature. The ultimate aim is to correlate microstructure described by rheological analysis with final thermal properties. The results show that thermal diffusivity and conductivity are clearly higher for rheologically percolated composites suggesting that above certain critical content of nanofibers thermal transport is mainly controlled by percolated structures caused by interconnected CNFs' networks. Finally, thermal conductivity results are described by means of percolation theory from which an intrinsic thermal conductivity for the CNFs' network of approximately 6.5 W/m K, i.e. close to three times lower than some values reported in literature for SWCNTs' networks, was calculated. Copyright © 2015 John Wiley & Sons, Ltd.     

Effect of Different Hybrid Method on Properties of Carbon Nanotubes/Dolomite Hybrid Filled Phenolic Composites

Hybridization of multi wall carbon nanotubes (MWCNTs) with other filler in polymer matrix composites (PMC) is one of the techniques for combining different properties of fillers for making more unique composites. In this work, the hybrid filler (CNTs–dolomite) are prepared via chemical vapour deposition (CVD hybrid) and the milling method (physically hybrid). The effect of different hybrid method on properties of multi wall carbon nanotubes/dolomite hybrid filled phenolic composites were studied. Phenolic/CVD hybrid composites and phenolic/physically hybrid composites with different filler loadings were prepared using hot mounting press. The prepared samples were characterized for their thermal conductivity and hardness. The thermal conductivity was measured using the Transient Plane Source (TPS) method, using a Hot-DiskTM Thermal Constant Analyzer and the hardness was measured using Rockwell micro-hardness. The results showed that at 5% filler loading, the phenolic/CVD hybrid composites were capable of increasing the thermal conductivity and micro-hardness up to 7.22% and 101.6% respectively compared to pure phenolic.     

Monolithic polyimine vitrimer/graphene aerogel composites

Graphene-polymer composites have attracted great attention as sensing materials due to their tailorable electrical conductivity, physicochemical properties, and sensitivity to geometric and functional changes. Herein, we report the first example of cylindrical monolithic polyimine vitrimer/graphene composites with excellent mechanical, compressive, rehealable and recyclable, and piezoresistive properties via simple infiltration of polymer monomers into the pores of graphene aerogel followed by thermal curing. The composites exhibit excellent durable compressibility (negligible reduction in the compression properties even after 3000 consecutive compression cycles), rapid recovery to the original size upon stress released, high compressive strength (up to 1.2 MPa), and high conductivity (up to 79 S/m). Excellent piezoresistive properties were observed, displaying consistent and reliable change of the electrical resistance with the compression ratio. Furthermore, rehealing with ～100% recovery of the compressive strength and electric conductivity was achieved under mild rehealing conditions, which is highly desired but has rarely been reported for electronic materials. The facile strategy for fabrication of rehealable monolithic polymer/GAs can open new possibilities for the sustainable development of composites with high electrical conductivity for various applications such as sensing, health monitoring, and movement detection.     

Effects of chemical modifications and MMT nanoclay addition on transport phenomena of naturally woven coconut sheath/polyester nanocomposites

Studies on the behavior of molecular transport properties such as thermal conductivity, gas permeability, volume and surface resistivity have been carried out for the naturally woven coconut sheath (CS) fiber reinforced composites with the addition of nanoclay and chemical treatment of fiber. The compression molding technique was used to fabricate the coconut sheath/clay reinforced hybrid composites. The morphological studies such as X-ray diffractogram (XRD), transmission electron microscopy (TEM) and scanning electron microscopy (SEM) have been carried out for polyester nanocomposites and coconut sheath fiber. The decreased gas permeability, thermal conductivity and volume and surface resistivity have been observed with increasing the weight percentage of nanoclay in polyester matrix. In chemical modifications, the alkali and silane treated coconut sheath reinforced composites have shown great influence on the transport properties due to the increasing hydrophilic nature by the topographical changes at the fiber surface. Dielectric strength has also been reported in this paper for all types of composites. Infra-red (IR) spectra have also been taken to study the physical and chemical structural changes of treated coconut sheath.     

Thermal conductive PS/graphite composites

Polystyrene (PS) was compounded with graphite that possesses high thermal conductivity and layer structures, and the PS/graphite thermal conductive nano‐composites were prepared. Thermal conductivity of PS improved remarkably in the presence of the graphite, and a much higher thermal conductivity of 1.95 W/m K can be achieved for the composite with 34 vol% of colloidal graphite. The Maxwell‐Eucken model and the Agari model were used to evaluate the thermal conductivity of the composites. For the purpose of improving the interfacial compatibility of PS/graphite, realizing the exfoliation and nano‐dispersion of graphite in the PS matrix, three intercalation methods, including rolling intercalation, solvent intercalation, and pan milling intercalation, were applied to prepare the composites, and the morphologies, thermal conductivities, and mechanical properties of the composites were investigated. It should be noted that the one prepared by pan milling intercalation not only had excellent thermal conductivity but also much higher mechanical properties, resulting from a high degree of layer exfoliation of the graphite, the formation of the chain structure agglomerates of the graphite, and the creation of more conductive paths under the strong shear stress of pan milling. Copyright © 2008 John Wiley & Sons, Ltd.     

Thermal properties and moisture absorption of nanofillers‐filled epoxy composite thin film for electronic application

This current study aimed to enhance the thermal conductivity of thin film composites without compromising other polymer qualities. The effect of adding high thermal conductivity nanoparticles on the thermal properties and moisture absorption of thin film epoxy composites was investigated. Three types of fillers in nanosize with high thermal conductivity properties, boron nitride (BN), synthetic diamond (SD), and silicon nitride (Si₃N₄) were studied. SN was later used as an abbreviation for Si₃N₄. The contents of fillers varied between 0 and 2 vol.%. An epoxy nanocomposite solution filled with high thermal conductivity fillers was spun at 1500–2000 rpm to produce thin film 40–60 µm thick. The effects of the fillers on thermal properties and moisture absorption were studied. The addition of 2 vol.% SD produced the largest improvement with 78% increment in thermal conductivity compared with the unfilled epoxy. SD‐filled epoxy thin film also showed good thermal stability with the lowest coefficients of thermal expansion, 19 and 124 ppm, before and after T_g, respectively, which are much lower compared with SN‐filled and BN‐filled epoxy thin film composites. However the SD‐filled epoxy film has its drawback as it absorbs more moisture compared with BN‐filled and SN‐filled epoxy film. Copyright © 2012 John Wiley & Sons, Ltd.     

导热增强聚乙二醇相变复合材料的制备及其性能

本文以聚乙二醇(PEG)为相变材料,通过添加不同的无机填料,采用熔融共混浇筑方式制备了导热增强型相变复合材料。 通过扫描电子显微镜(SEM)、热常数分析仪、差示扫描量热仪(DSC)、红外热成像和热重分析仪研究了所制备复合材料的微观结构、导热性能与相变过程。 研究结果表明,相比于碳酸钙和氧化铝,在相同添加含量下,氮化硼(BN)可有效提高PEG的导热系数,当BN质量分数为40%时,导热系数可达到3.40 W/(m·K);当填料添加量相同时,片状BN和不规则纳米碳酸钙(CaCO₃)比球形氧化铝(Al₂O₃)对PEG具有更加优良的定型效果,在相变过程中,能够更加有效阻隔PEG的流动,保持复合材料的形状稳定性。