Effects of the passivation of SiNx with various growth stoichiometry on the high temperature transport properties of the two-dimensional electron gas in AlxGa1−xN/GaN heterostructures

Effects of the passivation of SiN_x on the high temperature transport characteristics of the two-dimensional electron gas (2DEG) in unintentionally doped Al_xGa_1−xN/GaN heterostructures have been investigated by means of high temperature Hall measurements. The 2DEG density increases much after SiN_x passivation, and the increment is proportional to the Si content in SiN_x layer, indicating that the increment is mainly caused by ionized Si atoms at the SiN/Al_xGa_1−xN interface with dangling bonds or by Si atoms incorporated into the Al_xGa_1−xN layer during the SiN_x growth, which is approved by strain analysis and X-ray photoemission spectroscopy (XPS). There is lower 2DEG mobility at room temperature in a passivated sample than in an unpassivated one. However, the 2DEG mobility becomes to be higher in a passivated sample than in an unpassivated one when the temperature is above 250 °C, which is suggested to be caused by different subband occupation ratios in the triangular quantum well at the heterointerface before and after passivation.     

Microstructure and thermal stability of Fe,Ti, and Ag implanted yttria-stabilized zirconia

Yttria-stabilized zirconia (YSZ) was implanted with 15 keV Fe or Ti ions up to a dose of 8×10¹⁶ at cm^–2. The resulting dopant concentrations exceeded the concentrations corresponding to the equilibrium solid solubility of Fe₂O₃ or TiO₂ in YSZ. During oxidation in air at 400° C, the Fe and Ti concentration in the outermost surface layer increased even further until a surface layer was formed of mainly Fe₂O₃ and TiO₂, as shown by XPS and ISS measurements. From the time dependence of the Fe and Ti depth profiles during anneal treatments, diffusion coefficients were calculated. From those values it was estimated that the maximum temperature at which the Fe- and Ti-implanted layers can be operated without changes in the dopant concentration profiles was 700 and 800° C, respectively. The high-dose implanted layer was completely amorphous even after annealing up to 1100° C, as shown by scanning transmission electron microscopy. Preliminary measurements on 50 keV Ag implanted YSZ indicate that in this case the amorphous layer recrystallizes into fine grained cubic YSZ at a temperature of about 1000° C. The average grain diameter was estimated at 20 nm, whereas the original grain size of YSZ before implantation was 400 nm. This result implies that the grain size in the surface of a ceramic material can be decreased by ion beam amorphisation and subsequent recrystallisation at elevated temperatures.     

Ion dose and anneal temperature dependent studies of silicon implanted AlxGa1−xN

Electrical and optical activation studies of Al_xGa_1−xN (x = 0.11 and 0.21) implanted with silicon were made as a function of ion dose and anneal temperature. Silicon ions were implanted at 200 keV with doses ranging from 1 × 10¹⁴ to 1 × 10¹⁵ cm⁻² at room temperature. The implanted samples were subsequently annealed from 1100 to 1300 °C for 20 min in a nitrogen environment. A maximum electrical activation efficiency of 91% was obtained for the Al_0.11Ga_0.89N implanted with the highest dose of 1 × 10¹⁵ cm⁻² even after annealing at 1150 °C. 100% activation efficiencies were successfully obtained for the Al_0.21Ga_0.79N samples after annealing at 1300 °C for both doses of 5 × 10¹⁴ and 1 × 10¹⁵ cm⁻². The mobility of the Si-implanted Al_xGa_1−xN increases with annealing temperature, and the highest mobilities are 109 and 98 cm²/V·s for Al_0.11Ga_0.89N and Al_0.21Ga_0.79N, respectively. The cathodoluminescence (CL) spectra for all the samples exhibited a sharp neutral-donor-bound exciton peak, and the CL intensity increases with annealing temperature, indicating successive improved implantation damage recovery as the annealing temperature is increased. These results provide the optimum annealing conditions for activation of implanted Si ions in Al_xGa_1−xN.     

Silicon nitride/silicon oxide interlayers for solar cell passivating contacts based on PECVD amorphous silicon

This Letter demonstrates improved passivating contacts for silicon solar cells consisting of doped silicon films together with tunnelling dielectric layers. An improvement is demonstrated by replacing the commonly used silicon oxide interfacial layer with a silicon nitride/silicon oxide double interfacial layer. The paper describes the optimization of such contacts, including doping of a PECVD intrinsic a‐Si:H film by means of a thermal POCl₃ diffusion process and an exploration of the effect of the refractive index of the SiN_x. The n⁺ silicon passivating contact with SiN_x /SiO_x double layer achieves a better result than a single SiN_x or SiO_x layer, giving a recombination current parameter of ～7 fA/cm² and a contact resistivity of ～0.005 Ω cm², respectively. These self‐passivating electron‐selective contacts open the way to high efficiency silicon solar cells. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Silicide formation by furnace annealing of thin Si films on large-grained Ni substrates

Si films with a thickness of approximately 250 nm have been electron-beam evaporated on thick, large-grained Ni substrates (grain size a few mm to 1 cm in diameter). An in situ sputter cleaning procedure has been used to clean the Ni surface before the Si deposition. Thermal annealings have been performed in a vacuum furnace. Ni₂Si is the first phase that grows at temperatures between 240 °C and 300 °C as a laterally uniform interfacial layer with a diffusion-controlled kinetics. The layer thicknessx follows the growth lawx ²=kt, withk=k ₀ exp(-E _a k _B T), wherek ₀=6.3 × 10^–4cm 2/s andE _a=(1-1±0.1) eV. Because of the virtually infinite supply of Ni, annealing at 800 °C for 130min yields a Ni-based solid solution as the final phase. The results are compared with those reported in the literature on suicide formation by the reaction of a thin Ni film on Si substrates, as well as with those for interfacial phase formation in Ni/Zr bilayers.     

Si-nanostructures formation in amorphous silicon nitride SiNx:H deposited by remote PECVD

The formation of silicon nanoclusters embedded in amorphous silicon nitride (SiN_x:H) can be of great interest for optoelectronic devices such as solar cells. Here amorphous SiN_x:H layers have been deposited by remote microwave-assisted chemical vapor deposition at 300 °C substrate temperature and with different ammonia [NH₃]/silane [SiH₄] gas flow ratios (R=0.5−5). Post-thermal annealing was carried out at 700 °C during 30 min to form the silicon nanoclusters. The composition of the layers was determined by Rutherford back scattering (RBS) and elastic recoil detection analysis (ERDA). Fourier transform infrared spectroscopy (FTIR) showed that the densities of SiH (2160 cm⁻¹) and NH (3330 cm⁻¹) molecules are reduced after thermal annealing for SiN:H films deposited at flow gas ratio R>1.5. Breaking the SiH bonding provide Si atoms in excess in the bulk of the layer, which can nucleate and form Si nanostructures. The analysis of the photoluminescence (PL) spectra for different stoichiometric layers showed a strong dependence of the peak characteristics (position, intensity, etc.) on the gas flow ratio. On the other hand, transmission electron microscopy (TEM) analysis proves the presence of silicon nanoclusters embedded in the films deposited at a gas flow ratio of R=2 and annealed at 700 °C (30 min).     

基于Si-rich SiNx/N-rich SiNy多层膜结构电致发光特性研究

利用等离子体增强化学气相沉积法制备了富硅氮化硅/富氮氮化硅多层膜,并以此氮化硅基多层膜作为有源层构建电致发光器件,在室温下观察到了较强的电致可见发光.在此基础上,研究多层膜结构中作为势垒层的富氮氮化硅层对器件电致发光性质的影响,实验结果表明通过改变势垒层的Si/N组分,调制其势垒高度,器件的电致发光效率可得到显著地提高. 关键词： 电致发光 多层膜 氮化硅     

X-ray photoelectron spectroscopy investigations of Si in non-stoichiometric SiNx LPCVD multilayered coatings

Si nanocrystals were formed in the non-stoichiometric Si-enriched SiN_x low-pressure chemical vapor deposited (LPCVD) coatings on Si wafers treated by various modes. The coating structure as a function of technological conditions was investigated by ellipsometry and X-ray photoelectron spectroscopy (XPS) depth profiling. It was found that nanocomposites on base of SiN_x films enriched by Si have a complex multilayered structure varying in dependence of deposition and annealing parameters. Analysis of the XPS spectra and Si 2s peaks shows the existence and quantity of four chemical structures corresponding to the Si–O, Si–N states, nanocrystalline and amorphous Si. The XPS results show evolution of the chemical structure of silicon nitride and formation of Si nanocrystals. It was found:

• The LPCVD technology of nanocrystals formation allows to get enough high concentration of Si nanocrystals on different depths from the sample surface.

• The volume fraction of nanocrystalline and amorphous Si is changed with depth; this relation depends from SiN_x composition and annealing parameters.

• XPS detects these two phase compositions of Si nanoparticles in SiN_x and SiO₂ layers. The ellipsometry, HR-TEM, and XPS results are in good agreement.

Blue cathodoluminescence from thulium implanted AlxGa1−xN and InxAl1−xN

Room temperature cathodoluminescence (RTCL) was obtained from Tm implanted Al_xGa_1−xN with different AlN contents (in the range 0≤x≤0.2) and from implanted In_xAl_1−xN with different InN contents (x=0.13 and 0.19) close to the lattice match with GaN. The Tm³⁺ emission spectrum depends critically on the host material. The blue emission from Al_xGa_1−xN:Tm peaks in intensity for an AlN content of x0.11. The emission is enhanced by up to a factor of 50 times with an increase of annealing temperature from 1000 to 1300 C. The blue emission from In_0.13Al_0.87N:Tm, annealed at 1200 C, is more than ten times stronger than that from Al_xGa_1−xN:Tm, x≤0.2. However, the intensity decreases significantly as the InN fraction increases from 0.13 to 0.19.     

Fluctuation analysis of the29Si (d,p)30Si reaction at 1.1–2.1 MeV

The excitation functions of the²⁹Si(d, p)³⁰Si reaction in the deuteron energy range of 1·1–2·1 MeV have been measured in steps of 9.3 keV at angles 40°, 60°, 90°, 100°, 110°, 130° and 150° for the following groups of protons: p_o (g.s. of the³⁰Si nucleus), p₁ (2·23 MeV), p₂ (3·51 MeV), p_3,4 (3·77 and 3·79 MeV), p_5,6 (4·81 and 4·83 MeV), p₁₀ (5·48 MeV) and p_n (5.61 MeV). Within the framework of Ericson's theory of statistical fluctuations the autocorrelations, cross-angle correlations and cross-group correlations have been calculated and the mean coherence width of the³¹P compound nucleus has been deduced to be 27 keV.The authors would like to express their thanks to K. Putz for the efficient performance of the electronical equipment and to the staff of the Van de Graaff laboratory for operating the accelerator.     

Direct observation of laser-induced crystallization of a-C:H films

The post-growth modification of diamond-like amorphous hydrogenated carbon a-C:H films by laser treatment has been studied by transmission electron microscopy and Raman spectroscopy. a-C:H films grown on Si substrates by benzene decomposition in a rf glow discharge were irradiated with 15 ns pulses of a KrF-excimer laser with fluences in the range of E=50–700 mJ/cm². At fluences below 100 mJ/cm² an increase in the number of graphitic clusters and in their ordering was evidenced from Raman spectra, while the film structure remained amorphous according to electron microscopy and electron diffraction observations. At higher fluences the appearance of diamond particles of 2–7 nm size, embedded into the lower crystallized graphitic matrix, was observed and simultaneously a progressive growth of graphite nanocrystals with dimensions from 2 nm to 4 nm was deduced from Raman measurements. The maximum thickness of the crystallized surface layer (400 nm) and the degree of laser annealing are limited by the film ablation which starts at E>250 mJ/cm². The laser-treated areas lose their chemical inertness. In particular, chemical etching in chromium acid becomes possible, which may be used for patterning the highly inert carbon films.     

Trap centers in Au-implanted MOS structures

Trap centers in the Si-SiO₂ interface region of MOS structures doped by ion implantation of gold have been investigated using constant capacitance deep level transient spectroscopy (CC-DLTS). Gold doses of 10¹²–3 × 10¹³ cm^–2 were implanted into the back surface of the wafers and were then redistributed during a diffusion anneal for 30 min at 1100° or 900° C. Three Au-related trap levels have been observed in the interface region, which were attributed to the Au-donor (E _v +0.35 eV), the Au-acceptor (E _v +0.53 eV), and the Au-Fe complex (E _v +0.45 eV). The trap concentration profiles show that the Si-SiO₂ interface affects the Au concentration in a depth range of 1 m from the interface and that gettering of Au occurs at the interface. The interface state density is independent of the Au concentration at the interface even for concentrations of 10¹⁵ cm^–3.     

Electronic structure of amorphous Nb1-x Si x films studied by X-ray emission and X-ray photoelectron spectroscopy

We present valence band spectra of the amorphous system Nb_1–x Si _x (0.2x0.8), of bcc-Nb and of a-Si obtained by X-ray photoelectron spectroscopy (XPS, Al K) and X-ray emission spectroscopy (XES, Si K-emission bands). The samples were prepared as thin films by sputtering. The origin of all prominent spectral features was identified and consistently correlated to Si 3s-, Si 3p-and Nb 4d-derived states. The Nb4d-Si3p coupling is stable in binding energy over a wide concentration range. There is strong experimental evidence that the short range order changes considerably within the concentration interval 0.4x0.7, whereas the partial density of states of the Si 3p-electrons is clearly altered in the small concentration range 0.50x0.57.     

The structure of28Si above 10 MeV excitation energy II: Assignments of quantum numbers

New assignments of quantum numbers have been obtained for more than 50 levels in²⁸Si between 8953 and 15915 keV excitation energy. They are based on the measurement of -ray angular distributions or anisotropies on 29 resonances of the²⁷Al(p, ) reaction and on the²⁴Mg(a, ) resonance atE =3355 keV. A total of 15 high-spin states withI=5–7 has been obtained and the spectrum ofT=1 states has been identified up to 15915 keV excitation energy and a maximum spinI=6.     

Low temperature selfion irradiation of quench-condensed aluminium-films

Al-films were prepared by quench-condensation from Al₂O₃-crucibles and W-boats, respectively and irradiated with 230 keV Al⁺-selfions at low temperatures (<15 K). Forsmall fluences (<5·10¹⁵ cm^–2) the irradiation induced changes of the superconducting transition temperatureT _c and the resistivity strongly depend on the chemical form of the oxygen incorporated into the films by the different preparation techniques. Forhigh fluences (>10¹⁶ cm^–2) the behavior of the irradiated films is determined only by the integral oxygen content of the layers. The results are discussed qualitatively taking into account different physical processes during irradiation.     

The structure of28Si above 10 MeV excitation energy I: gamma-decay modes and radiative widths of levels

The systematics of-decay modes and radiative widths of highly excited states in²⁸Si has been extended by taking-ray spectra on 60 resonances of the²⁷Al(p,) reaction in the range 1097 keVE _p 4492 keV (12643 keVE _x 15915 keV) and on the²⁴Mg(,) resonances atE =3355, 3431, 4003 keV (E _x =12860, 12925, 13 415 keV). The-decay modes of levels in the sub-resonance region (E _x =10–12.5 MeV) were studied with both the²⁷ A1(p, ) reaction and the²⁷ A1(d, n) reaction at E_d=4,5,6 MeV. Information on radiative widths of levels was obtained by measuring the resonance strengthsS =(2I+1) _p / for 52 resonances of the²⁷Al(p, ) reaction with an emphasis on prospective T=1 states.     

Ag implantation-induced modification of Ni–Ti shape memory alloy thin films

Nanocrystalline thin films of Ni–Ti shape memory alloy are deposited on an Si substrate by the DC-magnetron co-sputtering technique and 120?keV Ag ions are implanted at different fluences. The thickness and composition of the pristine films are determined by Rutherford Backscattering Spectrometry (RBS). X-Ray diffraction (XRD), atomic force microscopy (AFM) and four-point probe resistivity methods have been used to study the structural, morphological and electrical transport properties. XRD analysis has revealed the existence of martensitic and austenite phases in the pristine film and also evidenced the structural changes in Ag-implanted Ni–Ti films at different fluences. AFM studies have revealed that surface roughness and grain size of Ni–Ti films have decreased with an increase in ion fluence. The modifications in the mechanical behaviour of implanted Ni–Ti films w.r.t pristine film is determined by using a Nano-indentation tester at room temperature. Higher hardness and the ratio of higher hardness (H) to elastic modulus (E_r) are observed for the film implanted at an optimized fluence of 9?×?10¹⁵ ions/cm². This improvement in mechanical behaviour could be understood in terms of grain refinement and dislocation induced by the Ag ion implantation in the Ni–Ti thin films.     

Comparison of profile tailing in SIMS analyses of various impurities in silicon using nitrogen,oxygen, and neon ion beams at near-normal incidence

We have performed a systematic SIMS study into the effect of (i) the chemical nature and (ii) the energy of the primary ions on the decay length which characterizes the exponential fall-off of impurity sputter profiles. The samples consisted of low resistivity, p-type Si covered with thin metallic overlayers. Bombardment was carried out at 2° off normal. Aspect (i) was investigated for tracers of Cu and Ga using N ₂ ⁺ , O ₂ ⁺ , and Ne⁺ primary ions at an energy of 5 keV/atom. The effect of the beam energy, aspect (ii), was studied for eight different tracer species and N ₂ ⁺ primary ions at energies between 2 and 5 keV/atom. In the case of Ga, was found to be shorter with N ₂ ⁺ or O ₂ ⁺ primary ions (=7.0 and 7.5 nm, respectively) than with Ne⁺ (=12 nm). This effect is attributed to beam induced formation of Si₃N₄ or SiO₂ layers, whereby the effective width of the internal distribution of intermixed Ga impurities in the Si subsystem is reduced significantly. In contrast to Ga, the decay length for Cu is smallest under bombardment with Ne⁺ (=16 nm), quite large with N ₂ ⁺ (26 nm) and extremely large with O ₂ ⁺ (2.2 m). Segregation of Cu atoms at the Si₃N₄/Si and the SiO₂/Si interface, respectively, is responsible for this depressed impurity removal rate. Within experimental accuracy the observed variation of the decay length with N ₂ ⁺ energy E [keV/atom] can be written in the form =kE ^p, where k and p are element specific parameters which range from k=1.2 nm for Pb to 10 nm for Cu and from p=0.6 for Cu and Ag to 1.0 for Pb. The results are discussed with reference to conceivable shapes of the distribution of intermixed impurity atoms.On leave from NTT Applied Electronics Laboratories, 3-9-11, Midori-cho, Musashino-shi, Tokyo 180, Japan     

Change of sheet resistance of high purity alumina ceramics implanted by Cu and Ti ions

High purity alumina ceramics (99% Al₂O₃) was implanted by copper ion and titanium ion in a metal vapour vacuum arc (MEVVA) implanter, respectively. The influence of implantation parameters was studied varying ion fluence. The samples were implanted by 68 keV Cu ion and 82 keV Ti ion with fluences from 1 × 10¹⁵ to 1 × 10¹⁸ ions/cm², respectively. The as-implanted samples were investigated by scanning electron microscopy (SEM), glancing X-ray diffraction (GXRD), scanning Auger microscopy (SAM), and four-probe method. Different morphologies were observed on the surfaces of the as-implanted samples and clearly related to implantation parameters. For both ion implantations, the sheet resistances of the alumina samples implanted with Cu and Ti ion fluences of 1 × 10¹⁸ ions/cm², respectively, reached the corresponding minimum values because of the surface metallization. The experimental results indicate that the high-fluence ion implantation resulted in conductive layer on the surface of the as-implanted high purity alumina ceramics.     

Silicon and transition metal-silicides implanted with57Fe

Si(111) single crystals were implanted with⁵⁷Fe in a broad dose range in order to overlap the concentration range of bulk amorphous Fe _x Si_1−x samples. At high (≥10¹⁶ atoms/cm²) doses the measured hyperfine interaction values were found to be the same as in the bulk amorphous samples, suggesting the same Fe−Si bonding and a very similar structure for the two amorphous phases produced by different methods. A comparison of the isomer shift (δ) and quadrupole splitting (ΔE) values with the values of the stoichiometric crystalliine phases showed the same δ but different δE values indicating similar Fe−Si bonding but different atomic arrangement around the iron atom.