水热法合成Zn1-xMnxO：Sn和Zn1-x-yMnxCoyO：Cu晶体的磁性

本文采用水热法,以ZnO为前驱物,添加适量的MnCl2·4H2O、SnCl2·2H2O和MnCl2·4H2O、CoCl2·6H2O、CuCl2·2H2O,3 mol/L KOH作矿化剂,430℃反应24 h,分别合成了Zn1-xMnxO:Sn晶体和Zn1-x-yMnxCoyO:Cu晶体.用扫描电镜(SEM)对合成物形貌进行分析,结果表明,Zn1-MnxO:Sn晶体为六棱柱状晶体,直径约为10 μm,较大面积显露正极面c{0001},同时也显露负极面-c{0001}、正锥面p{1011}、负锥面-p{1011}和柱面m{1010}.Zn1-x-yMnxCoyO:Cu晶体也显露负极面-c{0001}、正锥面p{1011}、负锥面-p{1011}和柱面m{1010},{0001}显露面小于{0001}.X射线能谱(EDS)分析表明晶体主要成分为ZnO,Mn2 、Co2 离子掺杂量超过2%;SQUID磁性测量显示所合成晶体在25 K具有反铁磁特征,高温为顺磁性.     

水热法合成Mnx Zn1-xO微晶体

本文采用水热法合成了MnxZn1-xO晶体,水热反应条件为3mol·L-1KOH作为矿化剂,填充度为35;,温度为430℃,在Zn(OH)2中添加一定量的MnO2为前驱物,反应时间为24h.通过X射线能谱仪测量了晶体中的Mn含量,随着前驱物中MnO2含量的增加,晶体中Mn的原子百分比随着增加,Mn最大原子百分比含量超过了2;,晶体的形貌具有纯ZnO晶体的六角柱形特征.显露柱面m{1010}、锥面p{1011}、负极面O面{0001}和正极面{0001}.晶体直径为50～200μm,高度为20～100μm.     

水热法合成Zn1-xMnxO稀磁半导体

本文采用水热法在430℃,以3mol%.L-1KOH作矿化剂,填充度为35%,反应时间24h,合成了Zn1-xMnxO稀磁半导体晶体。所合成晶体具有ZnO纤锌矿结构,晶面显露正极面{0001}、负极面{0001}、菱面{1011}及负菱面{1011}晶体高度为5~30μm,径高比约为2:1。X荧光能谱(EDS)显示Mn原子百分浓度为2.6%(x=0.026)。晶体呈现低温铁磁性,居里温度50K。     

常压化学水解反应生长氧化锌晶体

采用ZnCl2·2H2O在常压下高温水解反应生长ZnO晶体,反应温度为500℃.当以SiC为衬底时,可以获得六棱柱形氧化锌晶体,直径约为10μm,长为30～100 μm.当衬底为蓝宝石时,氧化锌沿[0001]呈定向柱状生长,柱的直径为5～10 μm,柱之间具有较多的内部缺陷.当以ZnO为衬底时,在{0001}面,形成连续膜,表面扫描电镜分析表明,晶体具有明显的极性生长特征,[0001]方向呈螺旋柱状生长.在{0001}面,晶体的平整性较好,呈现台阶性生长.     

水热合成奇异形态的ZnO晶体

本文采用水热法,以3mol/L KOH为矿化剂,填充度35;,温度430℃,在Zn(OH)2中添加SnCl2·2H2O,添加量为Sn2+:Zn2+=2;条件下,合成出ZnO晶体.产物中除了大量短六棱柱形晶体外,还出现了部分冰激凌形晶体.六棱柱形晶体具有典型的ZnO特征,显露正极面c{0001}、负极面-c{000-1}、柱面m{10-10}、正锥面p{10-11}和负锥面-p{10-1-1}.而冰激凌形晶体有明显的六棱锥晶体外壳,X光能谱(EDS)检测证实晶体各部位的组分均为ZnO.     

MOCVD法制备一维定向ZnO晶须阵列及掺杂研究

采用大气开放式MOCVD技术,以Zn(C5H7O2)2为前驱物,在玻璃和单晶硅基片上生长了沿c轴高度定向、规则排布的氧化锌晶须阵列.在此基础上,采用多气路输送不同金属有机源的方法,进行了ZnO晶须的掺杂,制备了掺铝元素的一维定向晶须阵列.XRD结果表明未掺杂ZnO晶须为六方纤锌矿结构,沿c轴高度取向;掺铝ZnO晶须晶体结构仍为六方纤锌矿结构,沿c轴择优取向.SEM结果显示,未掺杂的ZnO晶须阵列排布规则,长径比达到20;掺杂ZnO晶须随着铝掺杂浓度的增加,晶须的形貌及排布规则性变差.     

常压化学气相输运法合成Zn1-xCoxO晶体

本文采用高温化学气相输运法,温度970℃,在蓝宝石和石英基片上制备Zn1-xCoxO晶体.电子扫描显微镜(SEM)观察发现,蓝宝石晶片上的晶体形貌较SiO2 晶片上的规整,晶体呈现六棱柱或六棱锥体,一般显露柱面m{101-0}、正锥面p{101-1}、负极面c{0001-}和正极面c{0001},晶体表面光滑.在石英基片上得到的Zn1-xCoxO晶体生长的棱面较模糊,基片的部分晶体非定向密集生长,连续形成薄膜结构.X衍射证实晶体为ZnO纤锌矿结构.X光能谱﹙EDS﹚测量表明 ZnO 晶体有钴离子的存在,且浓度随原料中的Co2O3:ZnO的比值增大而增加 .     

Mn、Cu共掺ZnO磁性的研究

本文采用水热法,分别以ZnO、Zn(OH)2为前驱物,添加一定量的MnCl4.4H2O和CuSO4.2H2O, 3mol/LKOH作矿化剂,温度430℃,填充度35%,反应24h,制备了Mn、Cu共掺ZnO晶体。当前驱物为Zn(OH)2时,所得晶体大部分为短柱状晶体,显露正负极面{0001}、{0001-}、负锥面-p{101-1-}和柱面m{1-010},长度约为30 ～50μm。少部分晶体为单锥六棱柱状,显露正锥面p{101-1},柱面m{1-010},负极面-c{0001-},晶体的长度约为100μm,长径比为5:1。当ZnO用作前驱物时,短柱状晶体长度大约为10 ～30μm,晶体的六棱对称性都出现较大的偏差。X射线荧光能谱分析表明,前驱物为ZnO、Zn(OH)2时,Mn离子含量在分别为3.19%和1.62%原子分数,没有检测到Cu离子。虽然Mn、Cu离子的掺入会明显影响晶体形态,磁性测量显示掺杂Mn、Cu的ZnO仍为反铁磁。     

化学气相输运法制备ZnO晶体

本文采用化学气相输运法在常压开放系统中以(0001)蓝宝石为基片制备出定向生长的ZnO晶体.以ZnO粉体为原料,NH4Cl为输运气体,O2和H2O为反应气体,加入适量的HCl作刻蚀性气体,通过调节NH4Cl输运量,获得两种不同生长方向的ZnO晶体,分别为(1010)方向和(0002)方向.(0002)方向上生长的晶体呈现六角片状,a、b轴生长速度明显高于c轴方向,晶体在基片上呈外延生长,大面积显露c面,且和蓝宝石c面平行.文中对O2、H2O、NH4Cl、HCl在晶体的生长中的作用和生长机制进行了讨论.     

固结磨料研磨SiC晶片亚表面损伤截面显微检测技术

本文对采用截面显微检测法检测SiC晶片亚表面损伤时样品的制备、腐蚀液配方及腐蚀环境进行了系统地研究,并重点分析了固结磨料研磨SiC晶片(0001) Si面和(0001)C面亚表面损伤的深度及微裂纹构型.结果表明,采用腐蚀液配方为KOH:K2CO3 =20 g∶1 g,在420℃下腐蚀3min时亚表面损伤观测效果较好.在研磨压力为2 psi、金刚石磨粒粒径14 μm时,固结磨料研磨SiC晶片的亚表面损伤层深度约为2.6 μn,亚表面微裂纹构型有垂线状、斜线状、钩状、叉状、树枝状、人字状以及横线状.在相同的加工条件下,SiC晶片的(0001) Si面和(0001)C面的损伤深度基本相同.     

LPE生长GaN的不同极性面的光学性质

极化效应会导致GaN基发光器件的效率降低,因此关于非极性和半极性GaN单晶的研究受到了广泛关注.为了进一步探究不同极性GaN的发光特性和杂质掺入的内在机理,本文利用钠助熔剂法侧向生长出的不同极性面的GaN单晶作为研究对象,对比了不同极性面的光学性质及杂质掺入特点,讨论了黄光带(YL)峰的起源及其影响因素.首先利用阴极荧...     

Fe掺杂GaN晶体非极性面的光学各向异性研究

本文利用低温光致发光谱(PL)研究了Fe掺杂GaN晶体非极性a面{1120}、m面{1100} 的带边峰和Fe³⁺相关峰(⁴T₁(G)- ⁶A₁(S))的偏振发光特性。结果表明:a面与m面光学各向异性差别较小,线偏振光的电矢量E平行于c轴[0001]时(E∥c),GaN带边峰强度最小,而Fe³⁺零声子峰(1.299 eV)强度最强。带边峰线偏振度小,而Fe³⁺零声子峰线偏振度大,a面带边峰的线偏振度为26％,Fe³⁺零声子峰的偏振度在a面和m面分别达到55%和58%。在5 K低温下,进一步测量了Fe³⁺精细峰和声子伴线的偏振特性,结果表明,除了一个微弱的峰外,其他精细峰和声子伴线与Fe³⁺零声子峰偏振特性一致。本研究有助于拓展Fe掺杂GaN晶体材料在新型偏振光电器件领域的应用。     

Role of vapor-phase diffusion in selective-area MOVPE of InGaN/GaN MQWs

Selective-area growth (SAG) of InGaN/GaN multiple quantum wells (MQWs) was performed by metalorganic vapor phase epitaxy (MOVPE). The layers of a blue light-emitting diode (LED), that includes five InGaN quantum wells, were grown on a patterned GaN template on a sapphire substrate. In order to elucidate the contribution of vapor-phase diffusion of group-III precursors to the in-plane modulation of luminescence wavelength, the width of a stripe selective growth area was 60 μm that is sufficiently larger than the typical surface diffusion length, with the mask width varied stepwise between 30 and 240 μm. The distribution of the luminescence wavelength from the MQWs was measured with cathode luminescence (CL) across the stripe growth area. The peak wavelength ranged between 420 and 500 nm. The peak shifted to longer wavelengths and became broader as the measured point approached to the mask edge. Such a shift in the peak wavelength exhibited parabolic profile in the growth area and the wider mask shifted the entire peak positions to longer wavelengths. These trends clearly indicate that the vapor-phase diffusion play a dominant role in the in-plane modulation of the luminescence wavelength in the SA-MOVPE of InGaN MQWs, when the size of a growth area and/or the mask width exceeds approximately 10 μm.     

Selective area epitaxy of InGaN quantum well triangular microrings with a single type of sidewall facets

Triangular microrings have been formed by selective area epitaxy of GaN and InGaN quantum wells (QWs) on patterned (0 0 0 1) AlN/sapphire. SiO₂ patterns consist of triangular ring openings oriented with edges parallel to two different orientations. InGaN QW microrings with each edge parallel to the 〈1 1? 0 0〉 direction have very rough sidewalls while microrings with each edge parallel to the 〈1 1 2¯ 0〉 direction exhibit well formed and smooth sidewalls as a result of the generation of a single type of {1 1? 0 1} facets on the inner and outer sidewalls. These {1 1? 0 1} facets demonstrate similar cathodoluminescence (CL) spectra that appear to be the superposition of two peaks at photon energies ∼2.5 eV (500 nm) and 2.7 eV (460 nm). Moreover, spatially matched striations are observed in the CL intensity images and surface morphologies of the {1 1? 0 1} sidewall facets. The observed striations are found to be related to subtle surface morphologies of the underlying GaN structures.     

Anomalous behavior of excess energy curves of InxGa1−xN grown on GaN and InN

We worked out the excess energies for bulk In_xGa_1−xN and In_xGa_1−xN thin films on GaN and InN in order to investigate their thermodynamic stabilities. It has been found that the excess energy maximum shifted toward x0.80 for InGaN/GaN and x0.10 for InGaN/InN due to the lattice constraint in contrast with x0.50 for bulk. Moreover, it has been revealed that the excess energy for InGaN/GaN is larger than that for bulk at x>0.65. This suggests that In-rich films are less stable on GaN than bulk state. These results indicate that the lattice constraint has a significant influence on thermodynamic stabilities of thin films.     

First III–V-nitride-based violet laser diodes

InGaN multi-quantum-well (MQW) structure laser diodes (LDs) were grown by metalorganic chemical vapor deposition on a sapphire substrate with (11 0) orientation (A face). The mirror facet for a laser cavity was formed by cleaving the substrate along the (1 02) orientation (R-face). The structure of the LDs was an InGaN MQW/GaN/AlGaN separate confinement heterostructure (SCH). As an active layer, the InGaN MQW structure was used. The InGaN MQW LDs showed strong stimulated emission at a wavelength of 415.3 nm under pulsed current injection above 360 mA at room temperature. The laser threshold current density was 6 kA/cm². As a maximum characteristic temperature of the threshold current, T₀ = 313 K was obtained for the InGaN MQW/GaN/AlGaN SCH LDs.     

MOVPE homoepitaxy of high-quality GaN: Crystal growth and devices

Epitaxial growth on GaN bulk single crystal substrates sets new standards in GaN material quality. The outstanding properties provide insights into fundamental material parameters (e.g. lattice constants, exciton binding energies, etc.) with a precision not obtainable from heteroepitaxial growth on sapphire or SiC. With metalorganic vapor phase epitaxy (MOVPE) we realized unstrained GaN layers with dislocation densities about six orders of magnitude lower than in heteroepitaxy. By the use of dry etching techniques for surface preparation, an important improvement of crystal quality is achieved. Those layers reveal an exceptional optical quality as determined by a reduction of the low-temperature photoluminescence (PL) linewidth from 5 meV to 0.1 meV and a reduced X-ray diffraction (XRD) rocking curve width from 400 to 20 arcsec. As a consequence of the narrow PL linewidths, new features as, e. g. a fivefold fine structure of the donor-bound exciton line at 3.471 eV was detected. Additionally, all three free excitons as well as their excited states are visible in PL at 2 K.

Dry etching techniques for surface preparation allow morphologies of the layers suitable for device applications. We report on InGaN/GaN multi-quantum-well (MQW)_ structures as well as GaN pn- and InGaN/GaN double heterostructure light emitting diodes (LEDs) on GaN bulk single crystal substrates. Those LEDs are twice as bright as their counterparts grown on sapphire. In addition they reveal an improved high power characteristics, which is attributed to an enhanced crystal quality and an increased p-doping.     

Influence of the TEGa flow on the optical and structural properties of InGaN/GaN multiple quantum wells grown by MOCVD

We have investigated the influence of the TEGa flow on the optical and structural properties of InGaN/GaN multiple quantum wells (MQWs) with an indium composition around 20%. The samples with five-pairs InGaN/GaN MQWs were grown on sapphire substrates by metalorganic chemical vapor deposition. Photoluminescence spectra at 8 K showed that the MQWs grown with a low amount of TEGa flow gave a strong single peak and a higher emission energy. High-resolution X-ray diffraction measurements showed a deterioration of the InGaN/GaN interfaces in the sample grown with the large TEGa flow. The luminescence thermal quenching characteristics suggested that more structural defects acting as non-radiative recombination centers formed in the MQWs when the TEGa flow increased. The results indicate that decreasing the TEGa flow help to build up a new growth balance during the growth of InGaN wells, leading to less structural defects, more homogeneous indium distribution and the abrupt MQWs interfaces.     

Study of GaN and InGaN films grown by metalorganic chemical vapour deposition

In this paper GaN and InGaN films are examined, which are grown on basal plane (0001) sapphire substrates. Growth is performed in a novel type of vertical rotating disk reactor. The effects of several growth parameters on the film quality are discussed. The GaN and InGaN layers were evaluated by surface morphology studies, DC X-ray diffraction, electrical and optical characterisation.     

Impedance spectroscopy analysis of AlGaN/GaN HFET structures

For HFET application a series of samples with 30 nm Al_xGa_1−xN (x=0.02–0.4) layers deposited at 1040°C onto optimised 2 μm thick undoped GaN buffers were fabricated. The Al_xGa_1−xN/GaN heterostructures were grown on c-plane sapphire in an atmospheric pressure, single wafer, vertical flow MOVPE system. Electrical properties of the Al_xGa_1−xN/GaN heterostructures and thick undoped GaN layers were evaluated by impedance spectroscopy method performed in the range of 80 Hz–10 MHz with an HP 4192A impedance meter using a mercury probe. The carrier concentration distribution through the layer thickness and the sheet carrier concentration were evaluated. A non-destructive, characterisation technique for verification of device heterostucture quality from the measured C–V and G–V versus frequency characteristics of the heterostructure is proposed.