Cure behavior of epoxy resin/montmorillonite/imidazole nanocomposite by dynamic torsional vibration method

Flory’s gelation theory, the non-equilibrium thermodynamic fluctuation theory and the Avrami equation have been used to predict the cure behavior of epoxy resin/organo-montmorillonite (Org-MMT)/imidazole intercalated nanocomposites at various temperatures and Org-MMT loadings. The theoretical prediction is in good agreement with the experimental results obtained by a dynamic torsional vibration method. The results show that the addition of Org-MMT reduces the gelation time t_g and increases the rate of the curing reaction, the value of the kinetic constant k. The half-time t_1/2 of cure after the gel point decreases with increasing of cure temperature, and the value of n is around 3 at lower temperature (<90 °C) and decreases to ∼2 as the temperature increases. The addition of Org-MMT has no obvious effect on the apparent activation energy of the cure reaction. There is no special curing process required for the formation of an epoxy resin/Org-MMT/imidazole intercalated nanocomposite.     

不饱和聚酯/有机蒙脱土复合材料的固化动力学

用动态扭振法研究不饱和聚酯／有机蒙脱土复合材料的固化动力学行为。结果表明该实验体系能够很好地应用Flory理论和Avami方程进行拟合。用非平衡态热力学涨落理论对纳米复合材料的固化作了理论顸估,顸估结果与实验固化曲线有很好的相符性。有机蒙脱土的加入降低了不饱和聚酯的固化反应速率,对固化反应表现活化能和复合材料的形成过程没有很大的影响。根据实验结果分析不饱和聚酯在有机蒙脱土存在下的固化分为定型和熟化两个阶段,在一定的固化温度和填充含量下。从动态扭振曲线上可以明显地观察到这种“二次固化”现象。     

动态扭振法研究聚甲基丙烯酸甲酯/蒙脱土纳米复合材料的本体插层聚合

用动态扭振法研究热塑性塑料聚甲基丙烯酸甲酯(PMMA)/蒙脱土(MMT)复合体系的本体插层聚合.并试用处理交联体系固化的Flory理论、非平衡态热力学涨落理论和Avrami方程研究PMMA/MMT复合体系的本体插层聚合,求取表观活化能Ea.实验发现,PMMA/MMT插层聚合转化率曲线中后期与热固性树脂的固化曲线极为类似,表明剥离后的蒙脱土片层在复合材料中起到交联点的作用.     

环氧树脂/蒙脱土/咪唑纳米复合材料固化行为的研究

运用非平衡态热力学涨落理论预估了环氧树脂 有机蒙脱土 咪唑插层型纳米复合体系在不同温度及不同有机蒙脱土用量时的固化行为 ,理论曲线与动态扭振的实验有良好的符合 .实验表明 ,有机蒙脱土的加入 ,使凝胶化时间tg 缩短 ,固化速率加快 ,但对凝胶点后的固化反活化能ΔH影响不大     

Thermal characterization of carbonate rocks,Kozani area,North-western Macedonia,Greece

The curing of a thermoreactive alkyd-melamine-formaldehyde resin system was investigated by rheologycal, TG and TMA-analysis, in order to construct the time-temperature-transformation diagram. The points of the gelation curve were determined by measuring the increase in viscosity during isothermal curing at different temperatures. A power-function could be fitted to the gelation curve, which is suitable to estimate gelation at any curing conditions, as well as to establish storage conditions. The reaction in the resin matrix was followed by monitoring the loss of mass during isothermal curing at different temperatures. The final section of the resulted iso-curing temperature (iso-T _cure) diagrams could be fitted with logarithmic functions, which may be used for estimating the conditions needed to a given, desirable mass loss, i.e. conversion. The steepness of the curves increases with temperature suggesting the forthcoming of degradation during cure with increasing temperature. From these data the iso-mass loss curves of the TTT-diagram were constructed. For determining the iso-Tg curves of the TTT-diagram isothermal curing was carried out in a drying oven at different temperatures, followed by TMA measurements. The iso-Tcure diagrams served to determine T _{g ￥}, and to construct the iso-T _g curves of the TTT diagram. Vitrification curve is far beyond conditions of storage, curing and degradation, meaning that the resin matrix is in rubbery physical state before, during and after the cure. Curing conditions resulting degradation can also be estimated from the TTT-diagram. This revised version was published online in August 2006 with corrections to the Cover Date.     

Relaxations in thermosets. XIX. Dielectric effects during curing of diglycidyl ether of bisphenol-A with a catalyst and the properties of the thermoset

Changes in the dielectric permittivity ε′ and loss epsiv;″ during the curing of DGEBA catalyzed by 10 mole % dimethylbenzylamine have been studied from sol to gel to glass formation regions at different temperatures from 323 to 390 K. The ε′ monotonically decreases with time of cure, and ε″ initially decreases by several orders of magnitude and then increases to reach a peak value before finally decreasing to a low value characteristic of the glassy state. The features shift to shorter times and the peak vanishes as the curing temperature is increased. The decrease of ε″ at the initial stage of cure has been analyzed in terms of dc conductivity σ₀, which follows a power law, σ₀ ∝? (t_g–t)^x, as well as a new singularity equation, σ₀ ∝? exp[–B/(t₀–t)] where t_g, x, B, and t₀ are empirical constants that vary with the curing temperature; t_g is close to the time for gelation; and t₀ ≥ time for vitrification. The dielectric properties of the thermoset formed after different periods of cure have been studied from 77 to 325 K. Similar studies of the thermosets formed at different temperatures have been made. Increase in the curing period decreases the heights of both the γ-and α-relaxation peaks and increases their separation, while a β-relaxation peak emerges. Isothermal curing at high temperatures decreases the height of the γ peak to a vanishingly small value and increases that of the β peak from a vanishingly small value. In both the uncured and fully cured states, there is only one sub-T_g relaxation process named γ for the uncured and β for the cured state. These results are discussed in terms of our general physical concepts of local mode motions in an amorphous matrix. © 1993 John Wiley & Sons, Inc.     

Exploitation of introducing of catalytic centers into layer galleries of layered silicates and related epoxy nanocomposites. I. Epoxy nanocomposites derived from montmorillonite modified with catalytic surfactant‐bearing carboxyl groups

Montmorillonite (MMT) was modified with the acidified cocamidopropyl betaine (CAB) and the resulting organo‐montmorillonite (O‐MMT) was dispersed in an epoxy/methyl tetrahydrophthalic anhydride system to form epoxy nanocomposites. The intercalation and exfoliation behavior of the epoxy nanocomposites were examined by X‐ray diffraction and transmission electron microscopy. The curing behavior and thermal property were investigated by in situ Fourier transform infrared spectroscopy and DSC, respectively. The results showed that MMT could be highly intercalated by acidified CAB, and O‐MMT could be easily dispersed in epoxy resin to form intercalated/exfoliated epoxy nanocomposites. When the O‐MMT loading was lower than 8 phr (relative to 100 phr resin), exfoliated nanocomposites were achieved. The glass‐transition temperatures (T_g's) of the exfoliated nanocomposite were 20 °C higher than that of the neat resin. At higher O‐MMT loading, partial exfoliation was achieved, and those samples possessed moderately higher T_g's as compared with the neat resin. O‐MMT showed an obviously catalytic nature toward the curing of epoxy resin. The curing rate of the epoxy compound increased with O‐MMT loading. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 1192–1198, 2004     

Toughening of a trifunctional epoxy system: IV. Dynamic mechanical relaxational study of the thermoplastic-modified cure process

Dynamic mechanical spectroscopy has been used to investigate the cure of a thermoplastically modified trifunctional epoxy resin. The complex dissolution, curing behavior, and variations in the glass transition of the thermoplastic (PSF) phase were described, as was the T_g behavior of the epoxy phase. Prereaction of the PSF material with the epoxy resin was found to greatly increase the solubility of the PSF in the epoxy phase with little effect on the concentration of the epoxy monomer dissolving in the PSF phase. The curing behavior of the epoxy component in the thermoplastic phase was also investigated, in addition to changes in the mobility of the network at both gelation and vitrification. © 1997 John Wiley & Sons, Inc.     

Study on curing reaction of epoxy resin modified with prepolymers containing spiro orthocarbonate

Prepolymers were prepared by the reaction of 3,9-dihydroxyethyl-3′9′-dibenzyl-1,5,7,11-tetraoxaspiro(5,5)undecane with 4,4′-diphenylmethane diisocyanate (MDI) and 1,6-hexa-methylene diisocyanate (HDI). The number-average molecular weights of the prepolymers can be controlled by changing the mole ratios of spiro compound and diisocyanates. Kinetic studies of the cure reaction for the epoxy resin system modified with or without prepolymers were followed by a HLX-1 dynamic torsional vibration apparatus. The results indicated that gel time (t_g) and activation energy (E_a) increased as the content of prepolymers in the epoxy resin system increased. A difference with the cure reaction of the pure epoxy resin, the second-order reaction for the epoxy resin modified with the prepolymers, was obtained. Rate constants (k) of the cure reaction are 0.231 min^?1 for the epoxy resin, and 0.312 min^?1 for the modified epoxy resin. The mechanism of the cure reaction was discussed. © 1995 John Wiley & Sons, Inc.     

Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120–150°C. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between T_g and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 773–783, 1998     

The effect of masked isocyanates on the moisture absorption of MY 720/DDS epoxy resin

Several masked isocyanates were prepared with variations in both the type of isocyanate and masking group. They were characterized by elemental analysis and NMR spectroscopy, and their unblocking temperatures were determined. In general, higher unblocking temperatures were obtained using acyclic and cyclic aliphatic isocyanates and fluorinated phenols. Those with unblocking temperatures in the range of 120–180°C were incorporated into MY 720/DDS epoxy resin prior to cure. Highly fluorinated variations were incompatible with the resin. IR and DSC analyses showed that residual functional groups in the epoxy resin reacted with the masked isocyanates. Reductions in moisture absorption as high as 65% were obtained depending on the masked isocyanate. DMA studies showed that the T_g of the epoxy resin is lowered by incorporation of the masked isocyanate but the elastic modulus (E′) is relatively unchanged at temperatures below T_g.     

Effect of Non-Woven Carbon Nanofiber Mat Presence on Cure Kinetics of Epoxy Nanocomposites

Summary : An investigation was carried out into the cure kinetics of carbon nanofiber (CNF) mat-epoxy nanocomposites, composed of bisphenol-A based epoxy resin and diethylene triamine as a curing agent. It was observed that the rate of cure reaction for CNF mat-epoxy nanocomposites was higher than that for neat epoxy resin at low curing temperatures and the presence of the CNF mat produced the maximum influence at a certain curing temperature and time. At high curing temperature and long curing times, the effect of CNF mat on the cure rate was insignificant. The CNF mat-epoxy composite exhibited somewhat lower value of activation energy than that of the neat epoxy system at the beginning of the curing stage. The weight fraction of CNF mat also affected the cure reaction of epoxy nanocomposites at the same curing temperature. As the amount of CNF mat increased, the cure rate was higher at the same cure time. However, at high CNF mat loading, the cure reaction was retarded since the amount of epoxy and hardener decreased dramatically at high CNF contents together with the hindering effect of the CNF mat on the diffusion of epoxy resin and the curing agent, leading to lower crosslinking efficiency. Although the curing efficiency of epoxy nanocomposites dropped at high CNF mat content, the glass transition temperature (T_g) was still high due to the ultra-high strength of the CNF mat. The cure kinetics of CNF mat-epoxy nanocomposites was in good agreement with Kamal's model.     

Effect of thermoplastic toughening agent on glass transition temperature and cure kinetics of an epoxy prepreg

The isothermal time–temperature-transformation (TTT) cure diagram is developed in this article to investigate the effect of thermoplastic toughening agent on glass transition temperature (T _g) and cure kinetics of an epoxy carbon fiber prepreg, Cycom 977-2 unidirectional (UD) tape. The glass transition temperature was measured using differential scanning calorimetry (DSC) over a wide range of isothermal cure temperatures from 140 to 200 °C. Times to gelation and vitrification were measured using shear rheometry. The glass transition temperature master curve was obtained from the experimental data and the corresponding shift factors were used to calculate the activation energy. The kinetic rate model was utilized to construct iso-T _g contours using the calculated activation energy. It was observed that the iso-T _g contours did not follow the behavior of the neat epoxy resin, since they deviated from the gel time curve. This deviation was believed to be the effect of the thermoplastic toughening agent. The behavior of the neat epoxy resin in 977-2 was shown by constructing the iso-T _g contours using the activation energy obtained from gel time modeling.     

Isothermal cure kinetics of epoxy/phenol‐novolac resin blend system initiated by cationic latent thermal catalyst

The investigation of the cure kinetics of a diglycidyl ether of bisphenol A (DGEBA)/phenol‐novolac blend system with different phenolic contents initiated by a cationic latent thermal catalyst [N‐benzylpyrazinium hexafluoroantimonate (BPH)] was performed by means of the analysis of isothermal experiments using a differential scanning calorimetry (DSC). Latent properties were investigated by measuring the conversion as a function of curing temperature using a dynamic DSC method. The results indicated that the BPH in this system for cure is a significant thermal latent initiator and has good latent thermal properties. The cure reaction of the blend system using BPH as a curing agent was strongly dependent on the cure temperature and proceeded through an autocatalytic kinetic mechanism that was accelerated by the hydroxyl group produced through the reaction between DGEBA and BPH. At a specific conversion region, once vitrification took place, the cure reaction of the epoxy/phenol‐novolac/BPH blend system was controlled by a diffusion‐control cure reaction rather than by an autocatalytic reaction. The kinetic constants k₁ and k₂ and the cure activation energies E₁ and E₂ obtained by the Arrhenius temperature dependence equation of the epoxy/phenol‐novolac/BPH blend system were mainly discussed as increasing the content of the phenol‐novolac resin to the epoxy neat resin. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2945–2956, 2000     

酸酐固化环氧树脂/蒙脱土复合材料的等温固化动力学

用等温差示扫描量热法(DSC)研究了酸酐固化环氧树脂/蒙脱土复合材料的等温固化过程，考察了未处理的蒙脱土(MMT)和有机蒙脱土(OMMT)对环氧树脂固化动力学的影响. 实验表明， 环氧树脂的固化过程包含自催化机理，加入蒙脱土没有改变固化反应机理. 用Kamal方程对该体系的固化过程进行拟合，得到反应级数m、n，反应速率常数k1、k2，总反应级数(m + n)在2.4～3.0之间. MMT的加入使环氧树脂体系的k1、k2有所降低，而OMMT的加入对体系的k1、k2影响较为复杂，加入蒙脱土对环氧树脂固化体系的活化能影响较小.     

Epoxy resins (DGEBA): The curing and physical aging process

Differential scanning calorimetry (DSC) and infrared spectroscopy (IR) were used to monitor the degree of cure of partially cured epoxy resin (Epon 828/MDA) samples. The extent of cure, as determined by residual heat of reaction, concurred with that determined by monitoring the infrared radiation absorbance of the epoxide group near 916 cm^?l. The fictive temperature T_{f, g} was found to increase with the degree of cure, increasing rapidly during cure until reaching a value near the cure temperature T_c of 130°C (approximately 80% cure) where the material vitrified. The greatly reduced reaction rate during the final 20% of cure was not only a consequence of vitrification but, as revealed by infrared spectroscopy, the result of the depletion in the number of reactive epoxide groups. The endothermic peak areas and peak temperatures evident during the DSC scans were used as a measure of the extent of “physical aging” which took place during the cure of this resin, and after, fully cured samples were aged 37°C below their ultimate glass temperature for various periods of time. The rate of physical aging slowed as the temperature increment (T_t,g ? T_c) increased. Although an endothermic peak was evident after only 1 h of cure (T_{f, g} = 138.3°C), such a peak did not appear until fully cured samples were aged for 16 h or more. Enthalpy data revealed that for partially cured material, the fictive temperature T_{f, a}, reflecting physical aging, increased with curing time. In contrast, the T_{f, a}, for fully cured samples decreased with sub-T_g aging time. The characteristic jump in the heat capacity ΔC_p which occurred at the T_{f, g} decreased as curing progressed. This decrease appears to be dependent upon the rotational and vibrational degrees of freedom of the glass. Finally, a graphical method of determining the fictive temperature T_{f, a}, of partially and fully cured epoxy material from measured endothermic peak areas was developed.     

The evolution of the viscoelastic retardation spectrum during the development of an epoxy resin network

The evolution of the viscoelastic behavior of an epoxy resin at various stages of curing has been followed with the changes in the retardation spectrum. The creep J(t) and recoverable creep compliance J_r(t) curves of the neat epoxy resin Epon l00lF (Shell) were determined at temperatures between 30 and 77°C. The viscosity decreased over 8 orders of magnitude as the temperature was increased. Specimens with eight stages of network development were prepared by reacting all of the epoxy resin's oxirane rings with amine hydrogens from varying ratios of a monofunctional amine (methyl aniline) and a tetrafunctional amine 4,4′-diamino diphenyl sulfone (DDS). Preparations in which 25, 35, and 40% DDS were used did not result in a molecular network, so they were viscoelastic liquids. With 45% DDS, the product had a nascent network and was judged to be just beyond the point of incipient gelation. The remaining preparations from 0.50, 0.60, 0.70, and 1.0 DDS yielded tighter less compliant molecular networks. The creep and recoverable compliance curves were measured over a range of temperatures above the glass transition temperature, T_g. They were reduced to T_g, and retardation spectra L(ln τ) were calculated.     

Epoxy resin/poly(ϵ‐caprolactone) blends cured with 2,2‐bis[4‐(4‐aminophenoxy)phenyl]propane. I. Miscibility and crystallization kinetics

Crystalline thermosetting blends composed of 2,2′‐bis[4‐(4‐aminophenoxy)phenyl]propane (BAPP)‐cured epoxy resin (ER) and poly(?‐caprolactone) (PCL) were prepared via the in situ curing reaction of epoxy monomers in the presence of PCL, which started from initially homogeneous mixtures of diglycidyl ether of bisphenol A (DGEBA), BAPP, and PCL. The miscibility of the blends after and before the curing reaction was established with differential scanning calorimetry and dynamic mechanical analysis. Single and composition‐dependent glass‐transition temperatures (T_g's) were observed in the entire blend composition after and before the crosslinking reaction. The experimental T_g's were in good agreement with the prediction by the Fox and Gordon–Taylor equations. The curing reaction caused a considerable increase in the overall crystallization rate and dramatically influenced the mechanism of nucleation and the growth of the PCL crystals. The equilibrium melting point depression was observed for the blends. An analysis of the kinetic data according to the Hoffman–Lauritzen crystallization kinetic theory showed that with an increasing amorphous content, the surface energy of the extremity surfaces increased dramatically for DGEBA/PCL blends but decreased for ER/PCL blends. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 1085–1098, 2003     

Effects of curing on the glass transition temperature and moisture absorption of a neat epoxy resin

Apparent glass transition temperature (T_g) measurements were made on smaples of a neat epoxy resin that had been cured at four different temperature and for four different times at each temperature. The apparent T_g data increase with cure time toward an asymptote that was dependent on cure temperature. The asymptotic dependence of T_g on cure temperature may be explained by the effect of cure temperature on the reaction rates and available reaction sites. The asymptotic increase with cure time may be understood in terms of the resin's extent of cure. Moisture-conditioning studies were also made and the amount of moisture absorbed was correlated with the extent of cure. The absorbed moisture's interaction with the resin's molecular structure was deduced to by primarily at hydroxyl sites.     

Curing Kinetics and Thermal Property Characterization of Bisphenol-F Epoxy Resin and MeTHPA System

The curing kinetics of bisphenol-F epoxy resin (BPFER) and curing agent 3-methyl-1,2,3,6-tetrahydrophthalic anhydride (MeTHPA), with N,N-dimethyl-benzylamine as an accelerator, were studied by differential scanning calorimetry (DSC). Analysis of DSC data indicated that an autocatalytic behavior showed in the first stages of the cure for the system, which could be well described by the model proposed by Kamal, which includes two rate constants, k ₁ and k ₂, and two reaction orders, m andn. The curing reaction at the later stages was practically diffusion-controlled. To consider the diffusion effect more precisely, diffusion factor, d(a), was introduced into Kamal's equation. The glass transition temperatures (T _gs) of the BPFER/MeTHPA samples were determined by means of torsional braid analysis (TBA). The thermal degradation kinetics of cured BPFER were investigated by thermogravimetric analysis (TG). This revised version was published online in August 2006 with corrections to the Cover Date.