Effects of AsH3 surface treatment for the improvement of ultra-shallow area-selective regrown GaAs sidewall tunnel junction

Low-temperature (290°C) area-selective regrowth by molecular layer epitaxy (MLE) was applied for the fabrication of an ultra-shallow sidewall (50 nm) GaAs tunnel junction. Fabricated tunnel junctions have shown a record peak current density up to 35,000 A/cm². It is shown that the tunnel junction characteristics are strongly dependent on the sidewall orientation and the AsH₃ surface treatment conditions just prior to regrowth. The effects of AsH₃ surface treatment are discussed in view of the control of surface stoichiometry.     

Growth rate reduction in self-limiting growth of doped GaAs by molecular layer epitaxy

Self-limiting growth of GaAs with doping by molecular layer epitaxy (MLE) has been studied using the intermittent supply of TEG, AsH₃, and a dopant precursor, Te(C₂H₅)₂ (diethyl-tellurium: DETe) for n-type growth on GaAs (0 0 1). The self-limiting monolayer growth is applicable at 265°C, however, the growth rate per cycle of doping decreased and saturated at about 0.4 monolayer with increasing doping concentration. To clarify the mechanism of growth with doping and to solve the problem of the growth rate reduction, a doping cycle followed by several cycles of undoped growth was performed. The growth rate reduction in the TEG–AsH₃ system is due to the electrical characteristics of the growing surface, namely, the exchange reaction of TEG is reduced with increasing doping concentration.     

Non-stoichiometric growth of GaAs by the vapour pressure controlled Czochralski (VCz) method without B2O3 encapsulation

Results of the growth of semi-insulating GaAs crystals by the VCz method without B₂O₃ encapsulant are presented. Crystals have been grown from Ga-rich and near-stoichiometric melts controlled by As partial pressure in the range from 590°C to 630°C. The CO content in the gas atmosphere has been controlled. We investigated the influence of melt composition, reduced boron incorporation and adjusted carbon concentration. Native and impurity defect concentrations are compared with those of conventional VCz samples.     

In situ atomic layer deposition and synchrotron-radiation photoemission study of Al2O3 on pristine n-GaAs(0 0 1)-4 × 6 surface

This work presents the in situ reflection high-energy electron diffraction (RHEED), scanning tunneling microscopy (STM) and synchrotron-radiation photoemission studies for the morphological and interfacial chemical characterization of in situ atomic layer deposited (ALD) Al₂O₃ on pristine molecular beam epitaxy (MBE) grown Ga-rich n-GaAs (1 0 0)-4 × 6 surface. Both the RHEED pattern and STM image demonstrated that the first cycle of ALD-Al₂O₃ process reacted immediately with the GaAs surface. As revealed by in situ synchrotron-radiation photoemission studies, two types of surface As atoms that have excess in charge in the clean surface served as reaction sites with TMA. Two oxidized states were then induced in the As 3d core-level spectra with chemical shifts of +660 meV and +1.03 eV, respectively.     

Low-temperature growth of nitrogen-doped BeTe and ZnSe/BeTe:N superlattices for delta doping

We propose ZnSe/BeTe:N superlattice (SL) as a new p-type cladding layer with improved p-type dopability, in which nitrogen-doped BeTe (N-doped) layers are inserted into undoped ZnSe layers. We have optimized the growth temperature for ZnSe/BeTe:N SLs. Both equivalent beam pressure (BEP) ratio and growth rate are further optimized in low-temperature growth of BeTe:N layers. The structural properties of BeTe:N layers were analyzed by reflection high-energy electron diffraction and high-resolution X-ray diffraction. Electrical properties were evaluated by the van der Pauw method and capacitance–voltage (C–V) measurements. We achieve the net acceptor concentrations of 1.2×10¹⁹ cm⁻³ at the growth temperature of 350°C, BEP ratio of around 6, and growth rate of 35 nm/h.     

Electrical properties and interfacial chemical environments of in situ atomic layer deposited Al2O3 on freshly molecular beam epitaxy grown GaAs

Interfacial chemical analyses and electrical characterization of in situ atomic layer deposited (ALD) Al₂O₃ on freshly molecular beam epitaxy (MBE) grown n- and p- GaAs (001) with a (4 × 6) surface reconstruction are performed. The capacitance-voltage (C-V) characteristics of as-deposited and 550 °C N₂ annealed samples are correlated with their corresponding X-ray photoelectron spectroscopy (XPS) interfacial analyses. The chemical bonding for the as-deposited ALD-Al₂O₃/n- and p-GaAs interface is similar, consisting of Ga₂O (Ga¹⁺) and As-As bonding (As⁰) without any detectable arsenic oxides or Ga₂O₃; the interfacial chemical environments remained unchanged after 550 °C N₂ annealing for 1hr. Both as-deposited and annealed p-GaAs metal-oxide-semiconductor capacitors (MOSCAPs) exhibit C-V characteristics with small frequency dispersion (<5%). In comparison, n-GaAs MOSCAPs shows much pronounced frequency dispersion than their p-counterparts.     

Fluorescence EXAFS analysis of ErP grown on InP by organometallic vapor phase epitaxy using a new organometal Er(EtCp)3

We have investigated local structures of ErP grown by organometallic vapor phase epitaxy Er source: tris(ethylcyclopentadienyl)erbium (Er(EtCp)₃ by extended X-ray absorption fine structure (EXAFS) measurement. The EXAFS analysis revealed that NaCl-type ErP and Er–O(–C) compounds coexisted in the case of ErP growth by using Er(EtCp)₃. The NaCl-type ErP was preferentially formed on InP(1 1 1)A compared with InP(0 0 1) and InP(1 1 1)B. It is considered that formation of unexpected Er–O(–C) compounds is due to low but significant concentration of residual O and/or C in Er(EtCp)₃.     

Structural properties of V2O5 thin films prepared by vacuum evaporation

Vanadium pentoxide (V₂O₅) films were deposited on glass substrates by vacuum evaporation technique at various deposition temperatures (T_s) viz., 300, 473, 573, 623 and 673 K. The structural and microstructural properties of the films are analyzed using XRD and Raman scattering measurements. X-ray characterization revealed the films deposited at T_s473 K are amorphous and the film deposited at T_s573 K are polycrystalline with orthorhombic symmetry. The corrected lattice constant values are determined from Nelson-Riely plots. The lattice constants “a” and “c” are found to decrease with increase in the deposition temperature, which may be attributed to the increase in non-stoichiometry. Change in the preferred orientation is observed for films deposited at substrate temperatures 623 K which is likely to be governed by the recrystallization process. Various structural parameters such as lattice constants, grain size, and microstrain and dislocation density are determined and the influence of deposition temperature on the structural parameters are discussed.     

Role of interface chemistry and growing surface stoichiometry on the generation of stacking faults in ZnSe/GaAs

The existence of Zn-As and vacancy-contained Ga-Se interfacial layers are suggested by transmission electron microscopy of Zn-and Se-exposed (or - reacted) ZnSe/GaAs interfaces, respectively. A very low density of faulted defects in the range of ∼10⁴cm² was obtained in samples with Zn passivation on an Asstabilized GaAs-(2 × 4). However, the density of As precipitates increases as the surface coverage of c(4 × 4) reconstruction increased on the Zn-exposed Asstabilized GaAs-(2 × 4) surface and this is associated with an increase of the density of extrinsic-type stacking faults bound by partial edge dislocations with a core structure terminated on additional cations. On the other hand, densities of extrinsic Shockley-and intrinsic Frank-type stacking faults are of ∼5 × 10⁷/cm² in samples grown on Se-exposed Ga-rich GaAs-(4 × 6) surfaces. Annealing on this Se-exposed Ga-rich GaAs-(4 × 6) generated a high density of vacancy loops (1 × 10⁹/cm²) and an increase of the densities of both Shockley-and Frank-type stacking faults (>5 × 10⁸/cm²) after the growth of the films. Furthermore, we have studied the dependence of the generation and structure of Shockley-type stacking faults on the beam flux ratios in samples grown on Zn-exposed As-stabilized GaAs-(2 × 4) surfaces. Cation-and anion-terminated extrinsic-type partial edge dislocations were generated in samples grown under Zn-and Se-rich conditions, respectively. However, an asymmetric distribution on defect density under varied beam flux ratios (0.3 ≤ P_Se/P_Zn ≤ 10) is obtained.     

Calculation of the optimum vapor pressure for stoichiometry in PbTe and PbSnTe

Optimum vapor pressure for stoichiometry in growth of PbTe and PbSnTe has been calculated. The result is in a good agreement with the experimentally obtained ones for vapor pressure controlled Bridgman growth and liquid phase epitaxy. The procedure of calculation follows that performed earlier for GaAs, which assumed the equality of the chemical potentials of the volatile element in gas, liquid and solid phases. Also it is pointed out that the nonequilibrium reactions of interstitial Te atoms with Pb vacancies forming anti-site Te, as well as Te precipitations, take place at the highest applied Te vapor pressure region.     

The behaviour of in-diffused copper in n-type CdSnAs2

The concentration dependences of the Hall coefficient, electrical resistivity and carrier parameters are used to characterize the interaction of copper diffused from an electrolytic layer into n-type CdSnAs₂ with intrinsic defects.     

Nonstoichiometry and point defects in nonlinear optical crystals ABC2

Using thermodynamic calculation, the equilibrium concentrations of point defects in ZnGeP₂ and CdGeAs₂ depending on a liquidus temperature are obtained. The conclusion about a high degree of compensation of native donors and acceptors is made. The methods of a model pseudo-potential and large unit cell are used for investigation of deep levels created by vacancies and antisites in the forbidden band of ZnGeP₂. Optical transitions with participation of the defects are defined. It is supposed the possibility of conditions favourable for mid-IR optical absorption, as a result of the interaction of ionized zinc vacancies with GeP clusters.     

Structural, electrical and optical characterization of semiconducting Ru2Si3

Recent band structure calculations indicate, that ruthenium silicide (Ru₂Si₃) is semiconducting with a direct band gap. Electrical measurements lead to a band gap around 0.8 eV which is technologically important for fiber communications. This makes Ru₂Si₃ a promising candidate for silicon-based optical devices, namely LEDs. We present results on the epitaxial growth of ruthenium silicide films on Si(100) and Si(111) fabricated by the template method, a special molecular beam epitaxy technique. We structurally characterized the films by Rutherford backscattering and ion channeling, X-ray diffraction and transmission electron microscopy. To determine the electrical resistivity at high temperatures films were grown on insulating substrates to prevent parallel conduction through the substrate. Finally we show first results of the optical absorption performed by photothermal deflection spectroscopy indicating pronounced absorption above 1.5 eV.     

LP-MOCVD growth of ternary BxGa1−xAs epilayers on (0 0 1)GaAs substrates using TEB, TMGa and AsH3

Zinc-blende B_xGa_1−xAs alloys have been successfully grown on exactly oriented (0 0 1)GaAs substrates using triethylboron, trimethylgallium and arsine sources. The growth has been accomplished in a vertical low-pressure metalorganic chemical vapor deposition (LP-MOCVD) reactor. Boron incorporation behaviors have been extensively studied as a function of growth temperature and gas-phase boron mole fraction. The evolution of surface morphology was also observed.The maximum boron composition of 5.8% is obtained at the optimum growth temperature of 580 °C. RMS roughness over the surface area of 1×1 μm² is only 0.17 nm at such growth conditions. Based on the experimental results, it has been clearly shown that boron incorporation will decrease significantly at higher temperature (>610 °C) or at much lower temperature (?550 °C).     

Conduction type and defect levels of β-FeSi2 films grown by MBE with different Si/Fe ratios

[1 0 0]-oriented β-FeSi₂ films were grown on Si(0 0 1) substrates by molecular beam epitaxy (MBE) with a deposited Si to Fe atomic ratio (Si/Fe ratio) varied from 1.6 to 2.8. It was found that the conduction type of the β-FeSi₂ films changed from p- to n-type between the deposited Si/Fe=2.4 and 2.8. Rutherford Back Scattering (RBS) measurements revealed that the real Si/Fe ratio of β-FeSi₂ is 2.0–2.1 for all the samples after 900°C annealing for 14 h, showing that stoichiometry of the grown films is almost satisfied even though the deposited Si/Fe ratio was away from stoichiometry.     

On the profile of frequency dependent series resistance and surface states in Au/Bi4Ti3O12/SiO2/n-Si(MFIS) structures

The frequency dependent capacitance-voltage (C-V) and conductance-voltage (G/ω-V) characteristics of the metal-ferroelectric-insulator-semiconductor (Au/Bi₄Ti₃O₁₂/SiO₂/n-Si) structures (MFIS) were investigated by considering series resistance (R_s) and surface state effects in the frequency range of 1 kHz-5 MHz. The experimental C-V-f and G/ω-V-f characteristics of MFIS structures show fairly large frequency dispersion especially at low frequencies due to R_s and N_ss. In addition, the high frequency capacitance (C_m) and conductance (G_m/ω) values measured under both reverse and forward bias were corrected for the effect of series resistance to obtain the real capacitance of MFIS structures. The R_s-V plots exhibit anomalous peaks between inversion and depletion regions at each frequency and peak positions shift towards positive bias with increasing frequency. The C⁻²-V plot gives a straight line in wide voltage region, indicating that interface states and inversion layer charge cannot follow the ac signal in the depletion region, but especially in the strong inversion and accumulation region. Also, it has been shown that the surface state density decreases exponentially with increasing frequency. The C-V-f and G/w-V-f characteristics confirm that the interface state density (N_ss) and series resistance (R_s) of the MFIS structures are important parameters that strongly influence the electrical properties of MFIS structures.     

Control of Ga doping level in β-FeSi2 using Sn–Ga solvent

We have grown n- and p-type β-FeSi₂ single crystals by the temperature gradient solution growth method using Sn–Ga solvent. The conduction type and the carrier density of the crystals were controlled by the Ga composition in the Sn–Ga solvent. The conduction type was changed from n- to p-type between the Ga composition of 10.2 and 18.5 at% in the solvent. Depending on the Ga composition in the solvent, the carrier density of n- and p-type crystals was changed from 1.5×10¹⁷ to 3×10¹⁷ cm⁻³ and 4×10¹⁷ to 2×10¹⁹ cm⁻³, respectively. The activation energies of n-type crystals were 0.09–0.11 eV while that of p-type crystals were 0.02–0.03 eV.     

Interaction of electrical active intrinsic defects in Sn-doping Bi2Te3

Impure Sn produces the resonant states on the background of the allowed spectrum of states of the valence band in Bi₂Te₃. A high density of the resonant states stabilizes the Fermi level _F. Stabilization of _F leads to an enhancement of the volume homogeneity of the distribution of electrically active components.We report the results of an experimental study on the influence of doping Sn atoms on hole concentrations of Bi₂Te₃ and replace the part of Te atoms on Se atoms and the part of Bi atoms on Sb atoms. The estimation of the influence of resonant states on the process of crystal defects formation has been attempted theoretically.     

EPR studies of point defects in Cu-III–VI2 chalcopyrite semiconductors

EPR and PL spectra were measured to investigate point defects in I–III–VI₂ type chalcopyrite semiconductors where the group I element is Cu. Taking into account various optical spectra, the EPR signals observed were assigned to defect centers involving residual Fe impurities and Cu-vacancies. Some of the point defects were found to form defect-complexes.     

沉积温度对BiFeO3薄膜的微观结构与化学计量比的影响

采用高分辨透射电子显微镜并结合选区电子衍射、X射线能谱仪技术研究沉积温度对BiFeO3薄膜的微观结构与化学计量比的影响。与600℃和700℃沉积的BiFeO3薄膜相比,在500℃沉积的BiFeO3薄膜表面出现了许多岛状的二次相,即Bi2O3。当沉积温度提高到600℃和700℃时,外延BiFeO3薄膜是单晶,并且与SrRuO3缓冲层匹配良好,而且没有出现位错和二次相。通过大量的EDS数据统计分析,在500℃、600℃和700℃生长的BiFeO3薄膜,它们的Bi/Fe摩尔比分别为0.798、0.906和0.870,其中,Bi元素的缺乏可能是由于500℃时析出物Bi2O3的形成和700℃时Bi的挥发所致。