预沉积Ge对Si(111)衬底上SSMBE外延生长SiC薄膜的影响

利用固源分子束外延(SSMBE)生长技术, 在Si(111)衬底上预沉积不同厚度(0、0.2、1 nm)Ge, 在衬底温度900 ℃, 生长SiC单晶薄膜. 利用反射式高能电子衍射仪(RHEED)、原子力显微镜(AFM)和傅立叶变换红外光谱(FTIR)等实验技术, 对生长的样品进行了研究. 结果表明, 预沉积少量Ge(0.2 nm)的样品, SiC薄膜表面没有孔洞存在, AFM显示表面比较平整, 粗糙度比较小, FTIR结果表明薄膜内应力比较小. 这说明少量Ge的预沉积抑制了孔洞的形成, 避免衬底Si扩散, 因而SiC薄膜的质量比较好. 没有预沉积Ge的薄膜, 结晶质量比较差, SiC薄膜表面有孔洞且有Si存在. 然而预沉积过量Ge (1 nm) 的样品, 由于Ge的岛状生长,导致生长的SiC表面粗糙度变大, 结晶质量变差, 甚至导致多晶产生.     

衬底温度对ZnO薄膜生长过程和微结构的影响

从原子尺度上去研究薄膜生长过程中温度对薄膜取向性、缺陷结构以及薄膜完整性的影响和作用规律, 对于解释薄膜生长的物理本质、控制生长条件、提高薄膜制备的质量具有重要意义. 本文应用基于反应力场的分子动力学方法研究了ZnO薄膜(000l)表面作为衬底的薄膜沉积生长过程, 初步讨论了衬底温度(200、500和800 K)变化对沉积较薄ZnO膜质量的影响, 部分结果与实验观察相符. 结果表明, 衬底温度在500 K左右时, 沉积原子结构径向分布函数曲线特征峰尖锐、明显, 有序度较高, 注入和溅射对薄膜完整性影响较小, 沉积形成的薄膜结构稳定而又致密. 在预置衬底表面平坦的情况下薄膜呈现一种链岛状的生长模式, 每原子层均具有两种生长取向, 导致其生长前锋交汇处形成了一种新的有序缺陷.     

Ga对在AlN衬底上直接生长石墨烯的远程催化

通过镓(Ga)远程催化,采用化学气相沉积(CVD)方法在氮化铝(AlN)衬底上直接生长石墨烯薄膜.研究了生长温度、催化剂距离对石墨烯生长及其光学性质和电学性质的影响规律.结果表明,在生长温度1070℃下可以制备厚度约为5层的石墨烯薄膜, Ga周围1.4 cm范围内可以得到厚度均匀的石墨烯薄膜.通过透光率和方阻表征了石墨烯的光学和电学性质,结果表明, 400～800 nm波长范围内石墨烯薄膜透光率可达90%以上,方阻约为230Ω/.第一性原理计算结果表明,石墨烯仍保持金属性, AlN衬底对石墨烯有吸附掺杂作用,可有效降低石墨烯的方阻,改善石墨烯和衬底的电学接触.     

用俄歇电子能谱分析Y-Ba-Cu-O超导薄膜与衬底的界面互作用

高T_c的Y-Ba-Cu-O超导材料在弱电方面进入实用的一个重要条件,就是需要制备出优质的超导薄膜。已有多种制备超导薄膜的方法见报道。用蓝宝石或Si衬底制备超导薄膜,通常会由于薄膜与衬底强烈的界面反应使其零电阻温度大为降低,严重时甚至变成非超导。而我们在实验中发现,YSZ(掺钇稳定立方氧化锆)衬底在高温下与薄膜的界面反应也较为严重。在YSZ衬底上沉积一层Ag缓冲层则可以减轻薄膜与村底的相互作用。     

聚酰亚胺LB膜热解制备SiC薄膜的XPS研究

用XPS对沉积在硅基片上的聚酰亚胺LB膜以及由它真空热解制备的SiC薄膜进行了研究 ,并对其形成过程进行了跟踪分析 .XPS结果显示聚酰亚胺LB膜结构均匀 ,质量良好 ;真空热解时 ,约在 6 70℃时LB膜中的C与衬底Si反应形成SiC ;Ar离子溅射深度俄歇谱表明所制备的SiC膜中Si和C浓度成梯度分布 ,说明SiC是由Si和C相互扩散反应形成的     

等离子体增强磁控溅射沉积碳化硅薄膜的化学结构与成膜机理

以CH4和Ar为工作气体,单晶硅为溅射靶,通过微波电子回旋共振(MW-ECR)等离子体增强非平衡磁控溅射方法在不同的CH4流量和沉积温度下制备了a-Si1-xCx∶H薄膜.利用傅里叶变换红外(FT-IR)光谱,X光电子能谱(XPS)和纳米硬度仪等表征方法研究不同沉积参数下薄膜的化学结构、化学配比和硬度的变化.结果表明:室温(25℃)下随CH4流量由5cm·3min-1增加到45cm3·min-1(标准状态)时,薄膜中Si—CH2键,C—H键含量逐渐增加,Si—H键变化不明显;膜中C原子百分比由28%增至76%,Si原子百分比由62%降至19%.当CH4流量为15cm3·min-1时,随沉积温度的升高,薄膜中Si和C原子百分比含量分别为52%和43%,且基本保持不变;膜中Si—H键和C—H键转化为Si—C键,薄膜的显微硬度显著提高,在沉积温度为600℃时达到29.7GPa.根据分析结果,提出了室温和高温下a-Si1-xCx:H薄膜生长模型.     

金属衬底上石墨烯的控制生长和微观形貌的STM表征

目前化学气相沉积(CVD)方法在不同的金属基底上大规模生长获得石墨烯得到了广泛的应用; 同时扫描隧道显微镜(STM)做为一种强大的精细直观的研究手段可以用于表征金属衬底上石墨烯的微观形貌, 指导石墨烯的控制生长. 本文侧重于Cu箔、Pt 箔和Ni 衬底上石墨烯的控制生长、表面微观形貌、表面缺陷态、堆垛形式的阐述, 得到结论: (1) 两种溶碳量较低的金属(Cu, Pt)上, 石墨烯的生长都符合表面催化的生长机制, 同时层间的范德华相互作用也可以诱导双层石墨烯的生长; (2) 衬底粗糙度的增加可以使石墨烯的电子态去简并化, 从而破坏石墨烯面内π键共轭结构, 导致部分碳原子转变为sp³杂化; (3) 原生的褶皱是由于界面热膨胀系数失配所导致; (4) Pt 箔表面石墨烯的平整度要远优于Cu箔表面的石墨烯, 且不同晶面共存的基底对于石墨烯的连续性并没有产生显著的影响.     

SiC衬底上石墨烯的性质、改性及应用研究

大面积高质量石墨烯的制备及其改性对于纳电子器件相关研究有重要意义. 本文综述了近年来SiC衬底上石墨烯的相关研究, 包括外延法制备石墨烯、石墨烯与SiC衬底的作用机理、SiC衬底上石墨烯的改性方法以及外延石墨烯在器件等方面应用的重要进展. 目前, 外延法的工艺较为成熟且制备的较大面积石墨烯品质较好. SiC衬底和石墨烯之间的相互作用与衬底的表面原子种类、表面态、原子成键、钝化程度、电荷转移等密切相关, 其对石墨烯的电子能带、载流子种类产生明显影响. 实验与理论计算的结合可望加深对SiC衬底与石墨烯作用机理的理解, 并指导外延石墨烯改性及其在器件应用方面的进一步研究.     

蓝宝石衬底上化学气相沉积法生长石墨烯

化学气相沉积(CVD)法是制备大面积、高质量石墨烯材料的主要方法之一,但存在衬底转移和碳固溶等问题,本文选用蓝宝石衬底弥补了传统CVD法的不足。利用CVD法在蓝宝石衬底上生长石墨烯材料,研究生长温度对石墨烯表面形貌和晶体质量的影响。原子力显微镜(AFM)、光学显微镜(OM)、拉曼光谱和霍尔测试表明,低温生长有利于保持材料表面的平整度,高温生长有利于提高材料的晶体质量。研究氢气和碳源对蓝宝石衬底表面刻蚀作用机理,发现氢气对蓝宝石衬底有刻蚀作用,而单纯的碳源不能对衬底产生刻蚀效果。在1200 ℃下,直径为50 mm的晶圆级衬底上获得平整度和质量相对较好的石墨烯材料,室温下载流子迁移超过1000 cm²·V^-1·s^-1。     

衬底温度对Fe3N薄膜生长和磁性的影响

采用直流磁控溅射方法, 以Si(100) 单晶片为衬底, 在衬底温度为150～450 ℃的范围内得到了ε-Fe3N薄膜样品. 利用 XRD, SEM和VSM等表征手段, 研究了衬底温度对ε-Fe3N薄膜的生长和磁性的影响. 实验结果表明, 随着衬底温度的升高, 薄膜的生长速率、晶粒尺寸和单位质量磁化强度均增大, 而矫顽力呈现先增加后减小的变化趋势, 当衬底温度为350 ℃时, 矫顽力达到最大值18.72 kA/m, 可以认为此时薄膜样品的晶粒尺寸接近于交换作用长度.     

Study on the applications of SiC thin films to MEMS techniques through a fabrication process of cantilevers

We have tried to find the most suitable conditions for the deposition process of silicon carbide thin films as a material for MEMS techniques. We have also studied its application to semiconductor processes. To do this, we have tried to fabricate several dimensions of cantilevers with these silicon carbide thin films. High quality silicon carbide thin films are grown by metal-organic chemical vapor deposition (MOCVD). This process employs single molecular precursors such as diethylmethylsilane (DEMS), 1,3-disilabutane (DSB) at a pressure of 1 × 10⁻³ Pa and a growth temperature in the range of 700–1000 °C. Two fabrication methods are tested for initial fabrication of cantilevers. First, deposit SiC thin films on Si based atomic force microscopy (AFM) cantilevers. Second, used the lift-off process. To get three-dimensional cantilever-shaped SiC thin films, moreover, we chemically etched silicon substrate with strong alkaline solution such as TMAH at 80 °C. In addition, a high resolution of probe tips on the cantilevers was achieved using electron-beam deposition in a carbon atmosphere.     

Ion‐beam synthesis of 3C‐SiC surface layers on silicon

The attempt to grow 3C‐SiC thin films on silicon substrates has become an area of significant scientific interest, largely as a consequence of the impressive electrical properties that this polytype displays. In this paper, we have utilized low‐energy (20 keV) high‐fluence carbon implantation and a subsequent annealing step to form layers of 3C‐SiC directly on a silicon surface, and have investigated the effect of implantation fluence on the resultant materials properties. The quality of the Si/SiC interface is shown to be highly fluence‐dependent, with the formation of voids decreasing significantly with increased fluence. The conversion of carbon into 3C‐SiC is found to be most efficient at near‐stoichiometric concentrations, while at higher implantation fluences clusters of excess carbon are discovered to form within the silicon and to diffuse to the surface of the grown 3C‐SiC layer upon annealing. Copyright © 2011 John Wiley & Sons, Ltd.     

Study of in-situ surface cleaning for Si and SiGe epitaxy on Si with a novel ion beam vapor/assisted deposition technique

Ion beam vapor deposition is a new technique to grow Si and SiGe layers on Si substrates at low temperatures. The in situ surface cleaning prior to the deposition is a crucial step in the epitaxial growth of Si and SiGe films and is achieved by Ar ion bombardment with substrates kept at ambient temperature. A high temperature annealing (800 °C) is needed to repair the damage caused by this bombardment. We studied the effects of ion beam energy and the substrate temperature during the in situ cleaning on the quality of the grown films. An ion beam energy of 150–200eV is found to be sufficient to clean the surface for epitaxial growth. While the films deposited on properly cleaned surfaces are epitaxially grown, the inadequately cleaned surface leads to the formation of polycrystalline layers especially at low substrate temperatures.     

Growth of c‐axis‐oriented aluminum nitride thin films onto different substrates and buffer layers

The growth of aluminum nitride thin films onto various substrates (glass, flexible polyimide, or silicon) and onto different buffer layers (Au, Nb, Cu, Ag, Co, Fe, NiFe, or IrMn) is reported. Samples grown on IrMn, Co, NiFe, Nb, or Au show smooth surfaces. This same smooth quality is observed in samples grown at a lower 200 °C temperature directly on glass, Si, or flexible polyimide. In applications where thin and smooth piezoelectric films are necessary, c‐axis‐oriented AlN can be grown onto a wide range of different surfaces: conducting, insulating, ferromagnetic, antiferromagnetic, or flexible. Copyright © 2014 John Wiley & Sons, Ltd.     

衬底温度对强流脉冲离子束烧蚀沉积类金刚石薄膜化学结构的影响

采用强流脉冲离子束(High-intensitypulsedionbeam,HIPIB)烧蚀技术在Si(100)基体上沉积类金刚石(Diamond-likecarbon,DLC)薄膜,衬底温度的变化范围为298～673K.利用Raman光谱和X射线光电子谱(XPS)对DLC薄膜的化学结合状态与衬底温度之间关系进行研究.薄膜XPS的C1s谱的解谱分析得出薄膜中含有sp³C(结合能为285.5eV)和sp²C(结合能为284.7eV)成分,根据解谱结果评价薄膜中sp³C含量.根据XPS分析可知,衬底温度低于473K时,sp³C的含量大约为40%左右;随着沉积薄膜时衬底温度的提高,sp³C的含量降低,由298K时的42.5%降到673K时的8.1%,从573K开始发生sp³C向sp²C转变.Raman光谱表明,随着衬底温度的提高,Raman谱中G峰的峰位靠近石墨峰位,G峰的半峰宽降低,D峰与G峰的强度比I_D/I_G增大,说明薄膜中的sp³C的含量随衬底温度增加而减少.     

Production and characterization of nitrided CVD-SiC films

Silicon Carbide (SiC) and SiC with free silicon [SiC(Si)] thin films were prepared by chemical vapor deposition (CVD) using a CH₃SiCl₃-H₂-Ar gas mixture at a temperature of 1223 K. Afterwards these layers were gas nitrided in an ammonia-hydrogen-argon mixture at 1273 K. The solid product is an extremely thin film of silicon nitride on SiC or SiC(Si)-basic layers. These ultra thin silicon nitride films were investigated by glow discharge optical spectroscopy (GDOS) and x-ray photoelectron spectroscopy (XPS). The thickness of the layers was determined to a maximum value of 30 nm.Dedicated to Professor Dr. rer. nat. Dr. h.c. Hubertus Nickel on the occasion of his 65th birthday     

Deposition of Silicon Carbide Thin Films from 1,1-Dimethyl-1-Silacyclobutane

1,1-Dimethyl-1-silacyclobutane was used as a single-source precursor to deposit SiC thin films on Si(100) and Si(111) by low-pressure chemical vapor deposition (LPCVD). Polycrystalline β-SiC thin films were grown at temperatures 1100 and 1200°C. At temperatures between 950 and 1100°C, amorphous thin films of silicon carbide were obtained. The films were studied by X-ray diffraction (XRD), infrared spectroscopy (IR), scanning electron microscopy (SEM), scanning transmission electron microscopy (STEM), and electron diffraction (ED).     

Growth of void-free 3C-SiC films by modified two-step carbonization methods

Highly preferred orientation 3C-SiC films were deposited on Si (111) substrates by a modified two-step carbonization method. The crystal quality of SiC films were examined by XRD. To evaluate the effect of the introducing of silane during carbonization, cross-sectional SEM was carried out. Results indicated that the introducing of silane during carbonization is effective to prevent the out-diffusion of silicon atoms from silicon substrates. And by adjusting the carbonization conditions, void-free 3C-SiC films were obtained. XPS results demonstrated that the prepared 3C-SiC films were corresponding with the stoichiometric ratio.     

Optimization of Graphene Layers Grown on Pt/Ti/SiO2 by Hot Filament Chemical Vapor Deposition

Large area single and bilayer graphene are grown on Pt/Ti/SiO₂ substrates by hot filament chemical vapor deposition (HFCVD) with and without the assistance of Cu foil. The quality and number of graphene layers deposited on the substrate are assessed by Raman Spectroscopy. Atomic Force Microscopy (AFM) is used for assessing the surface topography of the graphene films grown on the Pt/Ti/SiO₂ substrates. The microstructure and elemental analyses are performed by Scanning Electron Microscopy (SEM) and Energy Dispersive Spectroscopy (EDS). The results show that bilayer graphene growth is facilitated by a copper foil placed nearby Pt/Ti/SiO2 substrate and by a high filament temperature in the HFCVD reactor. Monolayer graphene grows only when no copper foil is placed near the Pt/Ti/SiO₂ substrate at a low filament temperature. The approach paves a novel pathway towards the layer-controlled growth of graphene on Pt/Ti/SiO₂ substrates by HFCVD for frontier applications.