4～20 K温区固体界面导热填料接触热阻实验研究

超导量子干涉仪、超导光子探测器等深空探测器需要液氦温区制冷技术提供极低温温度,固体界面接触热阻的存在会增大耦合界面温度差,进而增加制冷机系统冷损.为定量探究4～20 K深低温区固体接触热阻,采用GM作为冷源,设计了一台可同时调节压力和低温温度的固体界面接触热阻测试实验台.利用感压纸进行接触界面压力校核,并对温度重复性进行验证.实验测试了不同导热介质填充情况下,温度和压力变化时固体接触热阻的变化规律.基于最小二乘法对实验数据进行半经验公式拟合,获得4～20 K温区不同压力加载条件下的接触热阻的定量参考.     

4~20 K 温区固体界面导热填料接触热阻实验研究

超导量子干涉仪、 超导光子探测器等深空探测器需要液氦温区制冷技术提供极低温温度, 固体界面接触热阻的存在会增大耦合界面温度差, 进而增加制冷机系统冷损. 为定量探究4~20 K 深低温区固体接触热阻, 采用GM 作为冷源, 设计了一台可同时调节压力和低温温度的固体界面接触热阻测试实验台. 利用感压纸进行接触界面压力校核, 并对温度重复性进行验证. 实验测试了不同导热介质填充情况下, 温度和压力变化时固体接触热阻的变化规律. 基于最小二乘法对实验数据进行半经验公式拟合, 获得4 ~20 K 温区不同压力加载条件下的接触热阻的定量参考.     

高斯表面的多尺度方法模拟接触热阻

通过结合微观的格子Boltzmann方法和宏观的有限差分法,建立了一种计算两个固体表面间接触热阻的多尺度分析方法。计算分析了表面粗糙度、压力、材料硬度、导热系数等对接触热阻的影响,结果表明拥有相同粗糙度的表面,在低压条件下,导热系数是主要影响因素,而在高压情况下,压力是主导影响因素。计算结果与实验数据的对比分析显示,该多尺度模型与实验数据有较好的一致性。     

基于CMY模型改进的界面热阻模型及其应用

导热膏填充的接触界面热阻由接触热阻和间隙热阻两部分组成。本文采用截锥体接触的单热流通道模型代替CMY模型中的圆盘接触的单热流通道模型,推导出了改进的接触热阻计算公式。本文还结合间隙热阻的计算公式,得到了一种改进的导热膏填充的接触界面热阻模型。通过分析得出了如下结论:对于使用导热膏填充的接触界面的热阻而言,其主要影响因素为接触表面的粗糙度和导热膏的导热系数,而接触界面间压力对其的影响则相对较小。     

高温超导直接冷却的氮化铝与无氧铜接触界面热阻的实验研究

氮化铝(AlN)具有高热导性、高电绝缘性,是超导二元电流引线热截流结构中常用的材料之一。根据稳态导热法建立低温真空实验装置,实验研究了超导冷却系统热截流结构中,界面温度和接触压力对AlN块材与无氧铜(OFHC-Cu)块材间接触界面热阻的影响。在实验温度(90K-210K)和压力(0.273MPa-0.985MPa)条件下,AlN/OFHC-Cu接触界面热阻随接触压力的提高而降低,而当界面温度上升时界面热阻由于热载子热运动的强化而降低,温度较高时,接触界面热阻随压力变化的速率趋缓。低温下AlN/OFHC-Cu间的接触界面热阻是直接冷却超导系统的设计和超导系统的热稳定性方面必需解决的问题。     

基于多块格子Boltzmann方法模拟接触热阻

本文基于OpenMP并行语言,采用拼接式的多块格子Boltzmann方法研究了接触压力、粗糙度、间隙介质导热系数对接触热阻的影响规律。结果表明:铝之间的接触热阻随着接触压力的增加而降低,随着粗糙度的增加而增加;当块体气凝胶之间的间隙填充空气时,气凝胶之间的接触热阻随压力的增加变化不大;而当气凝胶间隙趋于真空时,接触热阻随压力的增大而降低;间隙介质的气体导热对于接触热阻起着关键的作用,在低接触压力时。气凝胶间隙趋于真空时的接触热阻是填充空气的大约50倍。     

低温下固体接触热阻与接触电阻的实验研究

在低温工程中,两个接触固体之间存在着接触热阻与接触电阻,将对低温实验中热量及电流的传输产生显著的影响,是进行低温下物性研究的关键。自行研制了一套可同步实现固体接触热阻和接触电阻的测量装置,该系统具有较高的精度,可实现外界力、温度等对接触热阻的测量,同时具备接触电阻的实时测量功能。在此基础上,开展了外界压力、温度、电流对接触热阻和接触电阻的实验研究。实验结果显示:随着压力的增大,接触热阻与接触电阻随之减小;低温下,随着温度的增大接触热阻与接触电阻增大,接触电阻增大的速率要比接触热阻快。温度平衡时,20mA范围内的电流变化对接触电阻的影响显著,对接触热阻影响非常小。当界面温度达到室温后,首次观测到接触热阻和接触电阻会随着温度的增大而减小。     

热阻对液氮冷屏性能的影响研究

超导元件需用液氦降温至极低工作温度才能实现超导性能,液氦温区仅靠真空多层绝热方式无法达到理想绝热效果,采用液氮冷屏隔断液氦和环境之间的传热,能够有效降低液氦系统蒸发损失和液氦用量。为研究热阻对液氮冷屏传热特性的影响,建立了液氮冷屏热阻模型,通过理论传热计算得到了不同热阻与冷屏板温度及传热量之间的关系,利用数值模拟软件对不同热导率材料和不同板厚下冷屏板的温度分布进行了分析。结果表明,最不利热阻为接触热阻和导热热阻,采用高导热系数材料及适度增加冷屏板厚度有助于提高冷屏板温度分布的均匀性,减小接触热阻和冷屏板表面发射率有助于提高冷屏隔热性能,为改善冷屏热屏蔽效果提供依据。     

基于稳态电热拉曼技术的碳纳米管纤维导热系数测量及传热研究

利用稳态电热拉曼技术测量了碳纳米管纤维对流换热环境下的导热系数. 该方法基于材料拉曼信号与温度之间的关系, 实时探测一维材料在不同电加热(内热源)下的中心点温度, 利用对流环境下的稳态导热模型推导出材料的导热系数, 实现了一维微纳材料热物性的无损化和非接触式测量. 实验发现: 碳纳米管纤维的导热系数远低于单根碳纳米管的导热系数, 但高于碳纳米管堆积床的导热系数. 这表明碳纳米管体材料的热物性主要取决于内部管束的列阵和管束间的接触热阻.     

基于拉曼散射的石墨烯/氧化硅界面传热研究

本文提出了一种"拉曼热测量两步法",成功测量了单层石墨烯与二氧化硅基底之间的界面热阻和石墨烯在基底作用下的导热系数。第一步利用稳态电流加热石墨烯,利用拉曼响应测量其与基底的温差,继而测得石墨烯与基底之间的界面热阻。第二步通过激光加热,由拉曼散射信号获得不同加热功率下的石墨烯的局部温度,根据点热源热扩散模型推导出石墨烯的导热系数。研究发现非约束状态下的石墨烯在加热状态下由于具有明显的形貌变化(褶皱,局部脱离基底等),导致产生较大的接触热阻;同时实验发现由于界面处的声子散射和泄漏,基底状态下的石墨烯导热系数较低。本文利用拉曼热测量技术同时实现了石墨烯界面热阻和石墨烯导热系数的无损化和非接触式测量。     

低温真空下固体界面间接触热导实验分析

主要叙述了低温真空下接触热导实验装置的设计 ,通过改进实验装置来扩展研究的温度范围。在 10 0 K～ 30 0 K范围内 ,对铝、不锈钢和铜三种金属材料进行了大量的接触热导的实验研究 ,并分析了接触热导与界面载荷和温度之间的关系     

Heat conduction in extended X-junctions of single-walled carbon nanotubes

Non-equilibrium molecular dynamics (NEMD) simulations are employed to investigate the longitudinal thermal conductivity of non-orthogonal extended X-junction (EX-junction) of single-walled carbon nanotubes (SWCNTs). Different from standard junctions of SWCNTs, two distinct jumps in the temperature profile around the EX-junction are observed, which are responsible for the larger temperature gradient and reduction in thermal conductivity when compared to standard X-junction. Quantum corrected results show that the longitudinal thermal resistance of the X-junction and EX-junction decreases monotonically with increasing temperature which makes the longitudinal thermal conductivity of the tube with junction less sensitive to temperature above 400 K comparing with the individual pristine tube. The origin of the significant decrease of thermal conductivity of EX-junction is discussed through phonon spectra analysis.     

低温下用3ω法测量热导率的研究

3ω法是测量体材料和薄膜材料热导率的主要方法之一。低温真空条件下测量热物性往往受接触热阻以及加热器自热效应的影响比较大。文中针对低温下体材料热导率的测量,通过总结国内外近年来用3ω法测量热导率的主要研究成果,对如何选择合适的加热频率以减小这两方面所带来的影响做了一些研究,并指出了低温下用3ω法测量体材料热导率的进一步研究工作。     

Thermal conductivity and magnetic properties of the B substituted Ca3Co4O9

In this study, we reported the effects of the boron (B) substitution into the Ca site in the Ca₃Co₄O₉ system on the electrical, thermal and magnetic properties between 300 K and 5 K. The results indicated that the B-substitution into the system caused an increase of resistivity due to the decrease on carrier concentration. Thermal conductivity decreased for the x = 0.5 B-substituted sample and then increased with increasing the B-content. Analysis on the thermal conductivity of samples showed that the phonon–phonon interaction term is the dominant component in the total thermal conductivity for all the samples. It was found that the point defect contribution to the thermal conductivity increased by increasing the B-content. The temperature dependence of magnetic susceptibility showed a paramagnetic behavior at room temperature and ferrimagnetic behavior below 20 K for unsubstituted sample. But, the magnetization decreased in the B-substituted samples. The substitution of B into the Ca site destroyed the interlayer coupling, which resulted in the decrease of the ferromagnetic behavior. The susceptibility data was fitted using Curie–Weiss law with temperature independent term and the μ_eff values were calculated to be 1.42 μ_B and 3.89 μ_B for unsubstituted sample and the highest B-substitution, respectively.     

Thermal Conductivity of poly-p-phenylene-2,6-benzobisoxazole Film along the In-Plane Axis in the 10–300 K Temperature Range

The thermal conductivities of compression molded thin films of poly-p-phenylene-2,6-benzobisoxazole (PBO) were measured in directions along an in-plane axis in the 10–300?K temperature range by a steady-state heat flow method, with interest in the use of the material for superconductivity applications. The thermal conductivities of the PBO films increased from 0.3?W/mK to 9.0?W/mK with increasing temperature from 10?K to 300?K and these were much higher than those of polyimide films, epoxy resin and glass fiber reinforced plastics at all temperatures. The 9.0?W/mK at 300?K was 60% of that of stainless steel (SUS304). It was 6?W/mK at 150?K, which was half that of SUS304 and was 3.3?W/mK at 77?K, which was 33% of that of SUS304. The thermal conductivities of the PBO films were lower than those of a cloth of high strength ultrahigh molecular weight polyethylene fiber reinforced plastics in the 30?K–180?K temperature range and were almost equivalent to its values in the 180?K–300?K temperature range. The main contribution to the thermal conduction in the PBO films was from thermal phonon conduction along the molecular chains. Although many kinds of high thermal conductivity polymeric materials have been prepared by a uni-directional drawing process or by adding high thermal conductive additives, the PBO film showed high thermal conductivity without a uni-directional drawing process or high thermal conductive additive.     

固体材料低温热导率的测量

本实验以4.2K二级G-M制冷机为冷源,采用稳态轴向热流法测量了304不锈钢与环氧玻璃钢在低温下的热导率,讨论了样品上初始温差的成因及其影响,给出了热导率真实值所在的区间,并对测量误差以及各种漏热带来的影响进行了分析。     

CO_2水合物导热特性的分子动力学模拟

使用分子动力学模拟方法在NVT系综下对结构完整CO_2水合物以及结构缺陷CO_2水合物进行了导热模拟计算.对于结构完整的CO_2水合物,在200-230 K温度区间内,体系导热系数由0.4684 W·m~(-1)·K~(-1)变化到0.4836 W·m~(-1)·K~(-1),温度相关性较弱;而在230-280 K温度区间内,体系导热系数由0.4836 W·m~(-1)·K~(-1)变化到0.7494 W·m~(-1)·K~(-1),温度相关性变强;另外,通过计算功率图谱发现主体分子对水合物体系的导热贡献更大.对于结构缺陷CO_2水合物,发现晶穴占有率和笼形结构缺陷对体系导热均有一定影响,空笼晶胞导热系数约为完整晶胞导热系数的86.67%,体系的导热能力主要取决于主体结构的性质.     

考虑界面接触热阻的一维复合结构的热整流机理

建立了考虑变截面、变热导率及界面接触热阻效应的组合热整流结构的温度场及热整流系数的理论模型和有限元解.数值算例证明了本文模型及算法的可靠性,进而通过参数影响研究确定了若干几何及材料参数对结构热整流系数的影响规律,揭示界面接触热阻对热整流效果的影响机理.研究结果表明长度比、截面半径变化率、热导率、边界条件温差和界面接触热阻等因素必须通过优化设计才能得到最大的热整流系数,同时界面接触热阻的引入也为调控热整流系数提供了一条新的途径.     

Effect of triangular vacancy defect on thermal conductivity and thermal rectification in graphene nanoribbons

We investigate the thermal transport properties of armchair graphene nanoribbons (AGNRs) possessing various sizes of triangular vacancy defect within a temperature range of 200–600 K by using classical molecular dynamics simulation. The results show that the thermal conductivities of the graphene nanoribbons decrease with increasing sizes of triangular vacancy defects in both directions across the whole temperature range tested, and the presence of the defect can decrease the thermal conductivity by more than 40% as the number of removed cluster atoms is increased to 25 (1.56% for vacancy concentration) owing to the effect of phonon–defect scattering. In the meantime, we find the thermal conductivity of defective graphene nanoribbons is insensitive to the temperature change at higher vacancy concentrations. Furthermore, the dependence of temperatures and various sizes of triangular vacancy defect for the thermal rectification ration are also detected. This work implies a possible route to achieve thermal rectifier for 2D materials by defect engineering.