Surfactant-mediated growth of CoSi2 on Si(100)

Thin co-deposited CoSi₂ films grown at 500–600°C on Si(100) are studied by scanning tunneling microscopy (STM). With a Si rich deposition we observe initially the formation of elongated three-dimensional CoSi₂ islands. The use of one preadsorbed atomic layer of As as a surfactant results in a drastic increase of the island density. This effect appears to be a consequence of a decreased rate of surface diffusion of Co and Si. At higher coverages the roughness of the CoSi₂ film is reduced considerably by the surfactant. The results are discussed with regard to the method of allotaxy which allows the fabrication of buried silicide layers. Here, the requirements for small precipitates and high growth temperature can possibly be met more efficiently using As as a surfactant.     

On new two-dimensional structures produced on the Si (111) and Si (100) surface upon molecular-beam epitaxy of cobalt and silicon

Highly perfect epitaxial heterostructure CoSi₂ films have been grown on the surface of Si (111) and Si (100) single crystals by the method of molecular-beam epitaxy. The optimal regimes of the film growth with different thicknesses have been determined. It has been shown that short-term annealing of epitaxial films at T = 900–950 K leads to the formation of new CoSi₂/Si(111)-2 × 2 and CoSi₂/Si(100)−2 × 4 superstructures.     

Angle-resolved photoemission study of CoSi2 nanofilms grown on Si(111) substrates

We have carried out an angle-resolved photoemission study for CoSi₂ nanofilms grown on the Si(111)-7×7 substrates. The surface of CoSi₂(111) nanofilm changes from the bulk-truncated surface to the surface with additional Si-bilayer by annealing at higher temperature above 825 K. The angle-resolved photoemission spectra of the CoSi₂ nanofilm annealed at 853 K show the spectral features originated from the surface resonance state on the CoSi₂ surface terminated by Si-bilayer. From the detailed photoemission study, we discuss the surface electronic structure in CoSi₂(111) nanofilms grown on Si(111) substrates.     

Composition and properties of nanoscale Si structures formed on the CoSi<Subscript>2</Subscript>/Si(111) surface by Ar<Superscript>+</Superscript> ion bombardment

The variations in the composition and structure of CoSi₂/Si(111) surface layers under Ar⁺ ion bombardment with subsequent annealing has been studied. It has been demonstrated that nanocluster phases enriched with Si atoms form on the CoSi₂ surface at low doses D ≤ 10¹⁵ cm^–2, and a pure Si nanofilm forms at high doses.     

Low temperature ion beam mixing of Co/Si systems

Co/Si systems were ion beam mixed at 77 K using a 100 keV Ar beam. The formation of different phases as a function of irradiation dose has been studied, using Mössbauer spectroscopy (MS) and Rutherford backscattering spectroscopy (RBS). It was found that Co₂Si, CoSi and CoSi₂ are formed subsequently in parallel layers. After high dose irradiation, a phase with stoichiometry Co∶Si equal to 1∶3 was observed, suggesting CoSi₃ has been formed. However, MS gave clear evidence that this phase consists of precipitates of CoSi₂ and Si. Finally, we found that the amount of mixing scales linearly with the square root of the fluence, with a mixing rate of 1.0×10⁴Å⁴.     

Finite Element Analysis of CoSi2 Nanocrystals on Si(001)

In this work we present a finite element analysis of pyramidal and hut-shaped CoSi₂ nanocrystals reactively deposited onto Si(001) substrates. These dots have been observed by us, as well as by other groups. Our analyses have yielded four major conclusions: (1) Elastic relaxation of CoSi₂/Si mismatch strain by three-dimensional islands drives their nucleation, rendering flat, two-dimensional, layer energetically unfavourable. (2) The effect of the nanocrystal surface and interface energies for the observed vertical aspect ratios is negligible at small nanocrystal volumes. (3) Pyramids and huts with identical vertical aspect ratios are energetically degenerate. (4) Nanocrystal growth is only energetically favourable if accompanied by an increase in vertical aspect ratio. Most of these conclusions are consistent with those found in compressively strained layers, such as Si_1?x Ge _x layers on Si.     

CoSi2/Si (111) Interface study by X-ray standing waves

Summary The CoSi₂/Si (111) interface has been studied with the X-ray standing-wave technique. The interface (a 49? thick CoSi₂ layer) has been epitaxially grown on Si (111) under ultrahigh vacuum andin situ characterized with Auger spectroscopy and low-energy electron diffraction. The perpendicular lattice mismatch between epilayer and substrate has been measured with double-crystal X-ray diffraction. The X-ray standing-wave analysis gives clear indication that the Co atoms are fivefold coordinated at the interface. This work has been partially supported by Progetto Finalizzato ?Materiali e dispositivi per l'Elettronica a Stato Solido?.     

Scanning tunneling microscopy observation of ultrathin epitaxial CoSi<Subscript>2</Subscript>(111) films grown at a high temperature

Scanning tunneling microscopy (STM) is used to study the basic laws of growth of ultrathin epitaxial CoSi₂(111) films with Co coverages up to 4 ML formed upon sequential deposition of Co and Si atoms taken in a stoichiometric ratio onto the Co–Si(111) surface at room temperature and subsequent annealing at 600–700°C. When the coverage of Co atoms is lower than ~2.7 ML, flat CoSi₂ islands up to ~3 nm high with surface structure 2 × 2 or 1 × 1 grow. It is shown that continuous epitaxial CoSi₂ films containing 3–4 triple Si–Co–Si layers grow provided precise control of deposition. CoSi₂ films can contain inclusions of the local regions with (2 × 1)Si reconstruction. At a temperature above 700°C, a multilevel CoSi₂ film with pinholes grows because of vertical growth caused by the difference between the free energies of the CoSi₂(111) and Si(111) surfaces. According to theoretical calculations, structures of A or B type with a coordination number of 8 of Co atoms are most favorable for the CoSi₂(111)2 × 2 interface.     

Co-silicide layers studied by Mössbauer spectroscopy and Rutherford backscattering spectroscopy

Co-silicides were prepared with several techniques, such as annealing of evaporated Co-layers on a Si-substrate (silicide surface layers) and annealing of Co-implanted Si (buried silicide layers). By adding some⁵⁷Co to the stable⁵⁹Co, the formation of the various Co-silicides could clearly be followed as a function of annealing temperature by means of Mössbauer spectroscopy. In the case of surface silicide layers, Co₂Si, CoSi and CoSi₂ were formed subsequently. In the case of buried layers however, CoSi₂ was the only crystalline phase that could be observed. In both cases, the CoSi₂ spectra showed an anomalous side resonance. Moreover, it was found that when⁵⁷Fe was implanted (instead of⁵⁷Co), a drastic increase in the intensity of this side resonance could be detected by CEMS.     

Reactive epitaxy of cobalt disilicide on Si(111)

A study of the mechanism governing the initial stages in silicide formation under deposition of 1–10 monolayers of cobalt on a heated Si(111) 7×7 crystal is reported. The structural data were obtained by an original method of diffraction of inelastically scattered medium-energy electrons, which maps the atomic structure of surface layers in real space. The elemental composition of the near-surface region to be analyzed was investigated by Auger electron spectroscopy. Reactive epitaxy is shown to stimulate epitaxial growth of a B-oriented CoSi₂(111) film on Si(111). In the initial stages of cobalt deposition (1–3 monolayers), the growth proceeds through island formation. The near-surface layer of a CoSi₂(111) film about 30 Å thick does not differ in elemental composition from the bulk cobalt disilicide, and the film terminates in a Si-Co-Si monolayer triad.     

Reactive epitaxy of cobalt disilicide on Si(100)

The growth of cobalt disilicide on the Si(100) surface by reactive epitaxy at T=350°C was studied within the 10–40 ML cobalt coverage range. A new method of mapping the atomic structure of the surface layer by inelastically scattered medium-energy electrons was employed. The films thus formed were shown to consist of CoSi₂(221) grains of four azimuthal orientations turned by 90° with respect to one another. This domain structure originates from substrate surface faceting by (111) planes, a process occurring during silicide formation. B-oriented CoSi₂(111) layers grow epitaxially on (111) facets.     

Parallel and perpendicular transport in Si/CoSi2 and Si/CoSi2/Si heterostructures

It has recently become possible to grow epitaxial Si/CoSi₂/Si semiconductor-metal-semiconductor heterostructures of almost perfect crystalline quality. Electronic transport in the plane of the metal film (parallel transport) is investigated by the extensive studies of resistivity and superconducting properties of these films. The sharp influence of film thickness on both phenomena is presented and its physical origin is briefly discussed. The transfer of hot electrons emitted by the top Si_epi/PrmCoSi₂ diode to the Si_bulk/CoSi₂ through the metal film (perpendicular transport) is studied. Experimental data strongly favor the hypothesis of ballistic transport with a ballistic mean free path close to the one deduced from resistivity measurements.     

Thermal stability of nanoscale silver metallization in Ag/W/Co/Si(1 0 0) multilayer

In this work, we have studied thermal stability of nanoscale Ag metallization and its contact with CoSi₂ in heat-treated Ag(50 nm)/W(10 nm)/Co(10 nm)/Si(1 0 0) multilayer fabricated by sputtering method. To evaluate thermal stability of the systems, heat-treatment was performed from 300 to 900 °C in an N₂ ambient for 30 min. All the samples were analyzed by four-point-probe sheet resistance measurement (R_s), Rutherford backscattering spectrometry (RBS), X-ray diffractometry (XRD), and atomic force microscopy (AFM). Based on our data analysis, no interdiffiusion, phase formation, and R_s variation was observed up to 500 °C in which the Ag layer showed a (1 1 1) preferred crystallographic orientation with a smooth surface and R_s of about 1 Ω/□. At 600 °C, a sharp increase of R_s value was occurred due to initiation of surface agglomeration, WSi₂ formation, and interdiffusion between the layers. Using XRD spectra, CoSi₂ formed at the Co/Si interface preventing W silicide formation at 750 and 800 °C. Meantime, RBS analysis showed that in this temperature range, the W acts as a cap layer, so that we have obtained a W encapsulated Ag/CoSi₂ contact with a smooth surface. At 900 °C, the CoSi₂ layer decomposed and the layers totally mixed. Therefore, we have shown that in Ag/W/Co/Si(1 0 0) multilayer, the Ag nano-layer is thermally stable up to 500 °C, and formation of W-capped Ag/CoSi₂ contact with R_s of 2 Ω/□ has been occurred at 750-800 °C.     

Mössbauer and channeling measurements on buried layers of CoSi2 in Si

Single crystalline multilayered structures of Si/CoSi₂/Si were made by high dose implantation of Co into a Si wafer which was subsequently annealed. These structures were then investigated with both Mössbauer spectroscopy and channeling measurements. The experiments show that a change occurs in the structure of the CoSi₂ at a temperature between 150 K and 220 K.     

Photoelectron Si 2<Emphasis Type="Italic">p</Emphasis> spectra of ultrathin CoSi<Subscript>2</Subscript> layers formed on Si(100)2×1

Solid-phase formation of ultrathin CoSi₂ layers on Si(100)2×1 was studied using high-resolution (～140 meV) photoelectron spectroscopy with synchrotron radiation (hν=130 eV). The evolution of Si 2p spectra was recorded both under deposition of cobalt on the surface of samples maintained at room temperature and in the course of their subsequent annealing. It was shown that Co adsorption on Si(100)2×1 is accompanied by a loss of reconstruction of the original silicon surface while not bringing about the formation of a stable CoSi₂-like phase. As the amount of deposited cobalt continues to increase (up to six monolayers), a discontinuous film of the Co-Si solid solution begins to grow on the silicon surface coated by chemisorbed cobalt. The solid-phase reaction of CoSi₂ formation starts at a temperature close to 250°C and ends after the samples have been annealed to ～350°C.     

Annealing studies of the Co/Si(1 1 1) interface

The behaviour of the Co/Si(1 1 1) interface upon annealing is investigated by low energy electron diffraction (LEED), angle resolved ultraviolet (ARUPS) and X-ray (XPS) photoemission spectroscopy. According to the Co thickness two regimes can be distinguished. At low coverages (≲ 8 monolayers ML) no well defined bulk silicides other than the silicon rich epitaxial CoSi₂ phase can be identified. In contrast for larger Co thickness (≳ 15–100 ML) it is found that increasing progressively the annealing temperature (up to 600°C) and time (up to ∼ 30 min) leads to the successive arrival of the following silicides phases within the probing depth of our techniques (∼ 5–20 Å): Co, Co₂Si, CoSi, CoSi₂.     

Two routes to polycrystalline CoSi2 thin films by co-sputtering Co and Si

Two processes for the fabrication of polycrystalline CoSi₂ thin films based on the codeposition of Co and Si by sputtering were studied and compared. The first process involved “annealing after deposition”, where Co and Si are codeposited at ambient temperature and then crystallized by annealing. This process yielded randomly oriented plate-like CoSi₂ grains with a grain size that is governed by the nanostructure of the as-deposited film. Polycrystalline CoSi₂ thin films were obtained at a process temperature of 170 °C, which was much lower than the annealing temperature of 500 °C needed for Co/Si bilayers. The second process involved “heating during deposition”, where Co and Si are codeposited on heated substrates. This process yielded CoSi₂ grains with a columnar structure, and the grain size and degree of (1 1 1) orientation are temperature dependent. The sheet resistance of the resulting films was determined by the preparation temperature regardless of the deposition process used, i.e. “annealing after deposition” or “heating during deposition”. Temperatures of 500 °C and higher were needed to achieve CoSi₂ resistivity of 40 μΩ cm or lower for both processes.     

As在Co/Ti/Si三元固相反应中的分凝效应

在注入As的Si表面上,采用离子束溅射淀积Co/Ti双层金属膜。在氮气氛下对Co/Ti/Si进行多步热处理,研究As原子在Co/Ti/Si三元固相反应过程中的行为。实验采用背散射技术测量As原子在反应各阶段中的分布。结果表明,随着反应形成TiN(O)/Co-Ti-Si/CoSi₂/Si多层薄膜结构,一部分Si衬底中的As原子被分凝出来,向表面运动,并聚集在Co-Ti-Si三元硅化物中。对As原子的这一再分布行为进行了讨论。 关键词：     

Studies of the promising material CoSi2 on GaAs substrates

The thermal stability of CoSi₂ thin films on GaAs substrates has been studied using a variety of techniques. The CoSi₂ thin films were formed by depositing Co(500 Å) and Si(1800 Å) layers on GaAs substrates by electron-beam evaporation followed by annealing processes, where the Si inter-layer was used as a diffusion/reaction barrier at the interface. The resistivity of CoSi₂ thin films formed is about 30 cm. The Schottky barrier height of CoSi₂/n-GaAs is 0.76 eV and the ideality factor is 1.14 after annealing at 750° C for 30 min. The CoSi₂/GaAs interface is determined to be thermally stable and the thin film morphologically uniform on GaAs after 900° C/30 s anneal. The CoSi₂ thin films fulfill the requirements in GaAs self-aligned gate technology.     

Estimation of changes in parameters of a crystal lattice and energy bands upon variation in the size of nanocrystals and nanofilms of silicides prepared by ion implantation

Changes in the parameters of the crystal lattice and energy bands of CoSi₂ nanofilms and nanocrystals formed in the surface Si layers by ion implantation combined with annealing are studied. It is shown that the band gap E _g of CoSi₂/Si(100) nanofilms with the thickness θ ≤ 40–50 Å is higher by ～0.1 eV than for “thick” films; in the case of nanocrystals, E _g is 0.3–0.4 eV higher than for macrocrystals.