Thermomechanical behaviors and dielectric properties of polyaniline‐doped para‐toluene sulfonic acid/epoxy resin composites

Composites based on conductive organic/inorganic fillers dispersed in insulating matrix have been widely investigated because of their widespread applications such as electromagnetic shielding, electrostatic discharge, and sensors. In this context, novel composite materials based on epoxy resin matrix charged with polyaniline (PANI)‐doped para‐toluene sulfonic acid were elaborated. Fourier transform infrared spectroscopy, X‐ray diffraction and scanning electron microscopy were used to check the structure and the morphology of the samples. Viscoelastic behavior and thermal stability of the composites were explored by dynamic mechanical thermal analysis and thermogravimetric analysis. It was shown that the PANI particles exhibited a partial crystalline structure and were homogeneously dispersed in epoxy matrix. Consequently, this structure affected the thermal stability and viscoelastic properties of the composites. Furthermore, the dielectric and electrical properties were investigated up to 1 MHz. Measurements of dielectric properties revealed that with loading fillers in matrix, the dielectric parameters increased to high values at low frequency then decreased at values around 40 and 32 of real and imaginary parts, respectively, at 1 MHz with 15% of PANI content. Copyright © 2011 John Wiley & Sons, Ltd.     

Synthesis of multiwalled carbon nanotube/fluorine‐containing poly(p‐phenylene benzoxazole) composites exhibiting greatly enhanced dielectric constants

A series of high‐performance polymer/carbon nanotube (CNT) composites with different nanotube contents have been prepared via condensation of N‐silylated diamino terminated precursor of the polymer with acid chloride‐functionalized CNTs and subsequent thermal cyclodehydration. The composites have been fully characterized by infrared and Raman spectroscopy, electron microscopy, and thermal analysis. Various interesting morphologic features including helical structures have been observed in the composites as a result of covalent attachment of the polymer. The composites exhibit excellent thermal stability and a significant improvement in the dielectric constant and mechanical strength with the inclusion of CNTs. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2012     

The formation of percolative composites with a high dielectric constant and high conductivity

The dielectric constant and electrical conductivity of a composite of two insulators, poly(1,1-difluoroethylene) (yellow) and K(2) CO(3) (white), increased dramatically near the percolation threshold?f(c) (f=concentration of K(2) CO(3) ). This intriguing phenomenon can be interpreted in terms of interface percolation caused by the formation of chemically activated interfaces.     

The acquirement of desirable dielectric properties of carbon nanofiber composites based on the controlled crystallization

This study focused on uncovering the relationship among nanofiller, crystallization behavior, and dielectric property of polymer composites. The effects of carbon nanofibers (CNFs) and heat treatment on the crystalline structures and dielectric properties of the semi‐crystalline polymers were analyzed by using high density polyethylene (HDPE) as a matrix, which is a representative of non‐polar polymer and contains only one crystal structure. The experimental results showed that the degree of crystallinity, size distribution of crystallity, and relative amount of different crystal planes in the HDPE matrix were changing due to the addition of CNFs. With the increase of CNF loading, the dielectric constant, dielectric loss and AC conductivity of the HDPE composites were increased, presenting a typical percolation characteristic, and the dependence of the dielectric constant on frequency became more obvious. All kinds of electronic transmission, polarization effect, and relaxation behaviors in CNF/HDPE composite system were deeply analyzed. After heat treatment, the degree of crystallinity of HDPE composites was decreased with the enhanced cooling rate. For the CNF/HDPE composites with nanofiller content slightly higher than the percolation threshold, the significant increase of the dielectric constant and the dramatical reduction of the dielectric loss over a wide frequency range were realized simultaneously through rapid cooling treatment. The research indicated that a general commercial polymer material with excellent dielectric properties, which exhibited a high dielectric constant and a low dielectric loss, can be obtained by a simple technical approach different from traditional fabrication method of threshold composites.     

Dielectric,thermal, and mechanical properties of CeO2‐filled HDPE composites for microwave substrate applications

Cerium oxide‐filled high density polyethylene (HDPE) composites for microwave substrate applications were prepared by sigma‐blend technique. The HDPE was used as the matrix and the dispersion of CeO₂ in the composite was varied up to 0.5 by volume fraction, and the dielectric properties were studied at 1 MHz and microwave frequencies. The variations of thermal conductivity (k_eff), coefficient of thermal expansion (α_c) and Vicker's microhardness with the volume fraction of the filler were also measured. The relative permittivity (ε_eff) and dielectric loss (tan δ) were found to increase with increase in CeO₂ content. For 0.4 volume fraction loading of the ceramic, the composite had ε_eff = 5.7, tan δ = 0.0068 (at 7 GHz), k_eff = 2.6 W/m °C, α_c = 98.5 ppm/°C, Vicker's microhardness of 18 kg/mm² and tensile strength of 14.6 MPa. Different theoretical approaches have been used to predict the effective permittivity, thermal conductivity, and coefficient of thermal expansion of composite systems and the results were compared with the experimental data. © 2010 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 48: 998–1008, 2010     

Electric,dielectric, and dynamic mechanical behavior of carbon black/styrene‐butadiene‐styrene composites

The conductivity of styrene‐butadiene‐styrene block copolymers containing different amounts of extraconductive carbon black (CB) was investigated as a function of the mold temperature. The composites exhibited reduced percolation thresholds (between 1.0 and 2.0 vol % CB). The dynamic mechanical analysis characterization revealed that the glass‐rubber‐transition temperatures of both segments were not affected by the CB addition, although the damping of the polybutadiene phase displayed a progressive drop with an increase in the CB concentration. The normalized curves of tan δ/tan δ_max (where tan δ represents the value of the loss tangent at any measurement temperature and tan δ_max represents the loss tangent peak value at the corresponding temperature T_max) versus T/T_max (where T is the temperature and T_max is the maximum temperature), corresponding to both polystyrene and polybutadiene phases as well as the activation energy related to the glass‐rubber‐transition process, did not present any significant change with the addition of CB. The dielectric analysis revealed the presence of two relaxation peaks in the composite containing 1.5 vol % CB, the magnitude of which was strongly influenced by the frequency, being attributed to interfacial Maxwell‐Wagner‐Sillars relaxations caused by the presence of different interfaces in the composite. The mechanical properties were not affected by the presence of CB at concentrations of up to 2.5 vol %. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 2983–2997, 2003     

Synthesis and characterization of waterborne polyurethane/polyhedral oligomeric silsesquioxane composites with low dielectric constants

A facile method was developed to synthesize a new type of polyhedral oligomeric silsesquioxane (POSS). It contained a single amine group and seven aliphatic moieties on its corners. FT‐IR, ¹H‐NMR, ¹³C‐NMR, ¹³C‐¹H COSY, and ¹H‐¹H COSY confirmed that cages with eight corners were the main part of the product. This new POSS was used to modify the structure of hexamethylene diisocyanate trimer and then copolymerized with hexamethylene diisocyanate and poly (tetramethylene glycol) to get a serious of waterborne polyurethane (WPU)/POSS hybrid materials with low dielectric constants for microelectronics applications. The results showed that POSS particles were uniformly dispersed in the WPU dispersions. The WPU/POSS films did not show any macrophase separation, even when the POSS content was as high as 16%. As the POSS content increased from 0% to 16%, the tensile strength was increased from 2.3 to 7.3 MPa, the dielectric constant was decreased from about 2.9 to 2.0, and the thermal stability of the WPU/POSS was also improved.     

Preparation and dielectric properties of composites based on PVDF and PVDF-grafted graphene obtained from electrospinning-hot pressing method

In this work, graphene was modified by the grafting of poly(vinylidene fluoride) (PVDF) using Friedel-Crafts reaction to form PVDF-grafted graphene (PGG) filler, which was confirmed by transmission electron microscope, Fourier transform infrared, Raman spectroscopy, wide angle X-ray diffraction, and thermogravimetric analysis. The solution containing as-prepared PVDF-grafted graphene and PVDF was electrospun to form fibrous membranes, which was subjected to hot pressing in the laminating mode to prepare solid PGG/PVDF composite films. The structures of electrospun fibrous membrane and solid PGG/PVDF composite film were investigated by scanning electron microscope. Furthermore, it could be found that the dielectric constants of PGG/PVDF composites exhibiting relatively low dielectric loss factors were significantly higher than that of pure PVDF.     

Investigation of the dielectric,mechanical, and thermal properties of noncovalent functionalized MWCNTs/polyvinylidene fluoride (PVDF) composites

To improve the dispersion of multi‐walled walled carbon nanotubes (MWCNTs) and investigate the effect of dispersant for MWCNTs functionalization on the dielectric, mechanical, and thermal properties of Polyvinylidene fluoride (PVDF) composites, two different dispersants (Chitosan and TritonX‐100) with different dispersion capability and dielectric properties were used to noncovalently functionalize MWCNTs and prepare PVDF composites via solution blending. Fourier transform infrared, X‐Ray diffraction, and Raman spectroscopy indicated that TritonX‐100 and Chitosan were noncovalent functionalized successfully on the surface of MWCNTs. With the functionalization of Chitosan and TritonX‐100, the dispersion of MWCNTs changed in different extent, which was investigated by dynamic light scattering and confocal laser scan microscopy. The dielectric, mechanical, and thermal properties of PVDF composites were also improved. Meanwhile, it was also found that the dielectric properties of PVDF composites are closely related to the dielectric properties of dispersant. High dielectric constant of dispersant contributes to the grant dielectric constant of PVDF composites. The mechanical and thermal properties of MWCNTs/PVDF composites largely depend on the dispersion of MWCNTs in PVDF, interfacial interactions and the residual solvent. Copyright © 2016 John Wiley & Sons, Ltd.     

Dielectric properties and molecular mobility of organic/inorganic polymer composites

Microstructure-dielectric properties relationship and molecular mobility of organic/inorganic polymer composites (OIPCs), consisting of polyurethane (PU) and sodium silicate (NaSi), were investigated in this work. Broadband dielectric relaxation spectroscopy (DRS) and thermally stimulated depolarization current (TSDC) techniques were employed. Our interest was focused on the study of the glass transition mechanism and conductivity relaxation. The influence of the molecular weight of PU and inorganic phase content on the dielectric properties of the composites was of particular interest. Glass transition temperature shifts to higher temperatures with the addition of NaSi. The overall molecular mobility was found to increase in the composites, compared to the pure PU matrix. The results are more intense for the composites based on the PU with low molecular weight.     

Thermal,Mechanical and Dielectric Properties of Polyimide Composite Films by In-Situ Reduction of Fluorinated Graphene

Materials with outstanding mechanical properties and excellent dielectric properties are increasingly favored in the microelectronics industry. The application of polyimide (PI) in the field of microelectronics is limited because of the fact that PI with excellent mechanical properties does not have special features in the dielectric properties. In this work, PI composite films with high dielectric properties and excellent mechanical properties are fabricated by in-situ reduction of fluorinated graphene (FG) in polyamide acid (PAA) composites. The dielectric permittivity of pure PI is 3.47 and the maximum energy storage density is 0.664 J/cm³ at 100 Hz, while the dielectric permittivity of the PI composite films reaches 235.74 under the same conditions, a 68-times increase compared to the pure PI, and the maximum energy storage density is 5.651, a 9-times increase compared to the pure PI films. This method not only solves the problem of the aggregation of the filler particles in the PI matrix and maintains the intrinsic excellent mechanical properties of the PI, but also significantly improves the dielectric properties of the PI.     

Preparation and properties of hollow silica tubes/bismaleimide/diallylbisphenol A composites with improved toughness,dielectric properties,and flame retardancy

New high performance insulating composites based on hollow silica tubes (mHST) and bismaleimide/diallylbisphenol A (BDM/DBA) resin, which exhibit improved toughness, dielectric properties, and flame retardancy, were successfully developed. The effect of the amount of mHST on the properties of composites was systematically studied. Results show that the impact strength of the composite with 0.5 wt% mHST is about 2.2 times that of BDM/DBA resin. In addition, compared with BDM/DBA resin, the composites show lower and stable dielectric constant, better frequency stability of dielectric loss, significantly improved flame retardancy, and similarly outstanding thermal resistance. The reasons behind these attractive integrated properties are discussed from the view of structure–property relationship. Copyright © 2011 John Wiley & Sons, Ltd.     

Natural rubber–based composites filled with bioglasses from a CaO‐SiO2‐P2O5‐Ag2O system. Effect of Ag2O concentration in the filler on composite properties

Bioactive glass was first synthesized by L. Hench in 1971. There are many studies on the properties of several metals and metal ions dopants used in the SiO₂‐CaO‐P₂O₅ system of bioglasses, such as Ag, Cu, Zn, and Fe. A number of authors have carried out research related to the influence of silver oxide on the properties of bioglasses . However, publications on the properties of elastomer‐based composites containing bioactive glasses are relatively scarce. We have not found in the literature studies discussing how silver oxide concentration in bioglasses of the CaO‐SiO₂‐P₂O₅‐Ag₂O system affects the significant properties of a natural rubber biocomposite. In this regard, the purpose of the present work is to investigate the aforementioned influence on the properties of this type of composites, namely, vulcanization, physicomechanical, thermal, dynamic, dielectric, electric, and thermoconductive characteristics. We have established those parameters of the composites to be impacted considerably by both degree of filling with bioglass and the silver oxide content in the latter. The improvement in the composites thermostability and some of their physicomechanical performance is the most significant. The volume resistance decreases, and the thermal conductivity coefficients increase. Results from scanning electron microscopy and energy‐dispersive X‐ray (EDX) analyses have confirmed the influence of silver oxide initially on the phase composition of the bioglass, hence on the properties of the biocomposites through changes in the bioglass used as filler. The dielectric characteristics of some of the biocomposites suggest that they can be used as substrates and insulating layers in flexible antennas for short‐range wireless communications.     

Thermal, mechanical and electrical properties of copper powder filled low-density and linear low-density polyethylene composites

Low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE) with different copper contents were prepared by melt mixing. The copper powder particle distributions were found to be relatively uniform at both low and high copper contents. There was cluster formation of copper particles at higher Cu contents, as well as the formation of percolation paths of copper in the PE matrices. The DSC results show that Cu content has little influence on the melting temperatures of LDPE and LLDPE in these composites. From melting enthalpy results it seems as if copper particles act as nucleating agents, giving rise to increased crystallinities of the polyethylene. The thermal stability of the LDPE filled with Cu powder is better than that for the unfilled polymer. The LLDPE composites show better stability only at lower Cu contents. Generally, the composites show poorer mechanical properties (except Young's modulus) compared to the unfilled polymers. The thermal and electrical conductivities of the composites were higher than that of the pure polyethylene matrix for both the LDPE and LLDPE. From these results the percolation concentration was determined as 18.7 vol.% copper for both polymers.     

Electrical conductivity and photoconductivity of films of composites based on poly[2-methoxy-5-(2′-ethylhexyloxy)-1,4-phenylenevinylene] with additions of zinc octabutyl phthalocyanine and C60

Features of the photoconductivity of films of composites based on [2-methoxy-5-(2′-ethylhexyloxy)-1,4-phenylenevinylene] with additions of zinc 2,3,9,10,16,17,23,24-octabutylphthalocyanine and C₆₀ were studied. Luminescence quenching and an increase in the photoconductivity with the addition of C₆₀ to their composition were detected. The increase in the photoconductivity is connected with the capture of electrons and their transport along the C₆₀ molecules. __________ Translated from Teoreticheskaya i éksperimental’naya Khimiya, Vol. 42, No. 5, pp. 271–275, September–October, 2006.     

Analysis of degradation processes of C/C composites and coating layers with tracer elements in an air-acetylene flame by two-dimensional atomic absorption spectrometry

This paper describes a novel measurement technique for in-situ monitoring of the degradation processes of coated C/C composites (carbon fiber-reinforced carbon composites) in combusting fields. The samples tested in this experiment were C/C composites with double coating layers of SiC and glass materials doped with Ca and/or Mg as tracer elements. These samples were exposed in an C₂H₂/air flame emitted the diatomic molecules, and the light from the Mg-Ca hollow cathode lamp passed through the flame around the sample. The spectrally and spatially resolved images of emission were observed with a spectro CCD camera developed by our group. In this work, two-dimensional atomic absorption spectrometry by using the spectro CCD camera was applied to in-situ monitor the degradation processes of each coating layer and the substrate. The results indicated that the temporal changes in the spatial distribution of atomic absorption caused by Ca and Mg atoms proved to be a good measure for in-situ monitoring of the degradation processes of coated C/C composites in a high temperature flame.     

Investigation of correlation between microstructure and dielectric properties of cyanate ester/silicate tube hybrids by positron annihilation lifetime spectroscopy

The correlation between microstructure and dielectric properties of cyanate ester (CE)/hollow silicate tube (HST) hybrids was investigated by positron annihilation lifetime spectroscopy, coincidence Doppler‐broadening spectroscopy, Fourier transform infrared spectra, and dynamic mechanical analyses. The addition of HST to CE resin brings a multi‐aspect influence (cross‐linked structure and density, free volume, and interfacial action) on the structure of the cross‐linked network and thus results in significantly varied dielectric properties. There is an optimum content of HST in hybrids to get the lowest dielectric constant and loss. When the content of HST is smaller than the percolation threshold, the hybrid has decreased dielectric constant and loss; this mainly results in the reduced size of free volume and orthopositronium intensity (I₃), although when the content of HST is larger than the threshold, the increased I₃ and the size of free volume as well as the interfacial polarization are responsible for the significantly enlarged dielectric constant and loss. Copyright © 2011 John Wiley & Sons, Ltd.     

Crystallization,mechanical, thermal and rheological properties of polypropylene composites reinforced by magnesium oxysulfate whisker

Polypropylene(PP) composites containing magnesium oxysulfate whisker(MOSw) or lauric acid(LA) modified MOSw(LAMOSw) were prepared via melt mixing in a torque rheometer. The heterogeneous nucleating effect of LAMOSw was clearly observed in polarized light microscopy(PLM) pictures with the presence of an abundance of small spherulites. MOSw exhibited no nucleation effect and formed a few spherulites with large size. Compared with PP/MOSw composites, PP/LAMOSw exhibited better impact strength, tensile strength and nominal strain at break, ascribing to three possible reasons:(i) more β-crystal PP formed,(ii) better dispersity of LAMOSw in PP matrix and(iii) the plasticizing effect of LA. The results of dynamic mechanical thermal analysis(DMTA) indicated that brittleness of the PP matrix at low temperature was improved by the addition of LAMOSw, while the interfacial interactions between MOSw and PP matrix were actually weakened by LA, as evidenced by the higher tanδ values over the entire range of test temperatures. In terms of the rheological properties of the composites, both the η* and G′ at low frequencies increase with the addition of MOSw or LAMOSw, indicating that the PP matrix was transformed from liquid-like to solid-like. However, a network of whiskers did not form because no plateau was found in the G′ at low frequencies. With low filler content, LAMOSw produced a stronger solid-like behavior than MOSw mainly due to the better dispersion of the LAMOSw in PP matrix. However, for highly-filled composites, the η* of PP/LAMOSw at low frequencies was smaller than that of PP/MOSw composite, since the particleparticle contact effect played a major role.     

Morphology and dielectric properties of an epoxy network modified by end‐functionalized liquid polybutadiene

Epoxy resin networks modified with different functionalized liquid polybutadiene were characterized by scanning electron microscopy, atomic force microscopy (AFM), and dielectric thermal analysis techniques. Different morphologies were observed for these different systems, which were attributed to different interaction degrees between the components. Hydroxyl‐terminated polybutadiene (HTPB) and carboxyl‐ terminated polybutadiene (CTPB) resulted in epoxy networks with two‐phase morphology that differed in rubber particle size. The use of isocyanate‐terminated polybutadiene (NCOTPB) resulted in transparent thermoset material, whose rubber domains were in the nanoscale dimension, only detected by the AFM technique. The different morphological aspects in these epoxy systems also affected the dielectric properties. The epoxy–HTPB network exhibited two low temperature relaxation peaks corresponding to two different phases present in the system, whereas the epoxy–CTPB or epoxy–NCOTPB systems, whose rubber particles are well adhered to the epoxy matrix by chemical bonds, displayed only one single low temperature relaxation peak. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 4053–4062, 2004