Enthalpic, entropic, and square gradient contributions to the surface energetics of amine-cured epoxy systems

The evolution of surface tension during polymerization of three amine-cured epoxy systems was investigated. Due to the chemical reaction of the epoxy groups with primary and secondary amines, the energetic status of an epoxy-amine system increased during polymerization. At the same time, the polymerization process induced entropic variations, also contributing to the evolution of surface energetics. A simple relation expressing the surface tension as a function of the bulk energy, the entropy of the system, and the square gradient of the polymer density was derived. The bulk and surface energetics were expressed in terms of solubility parameter and surface tension, respectively. The former was predicted using the Van Krevelen group contribution method, while the latter was directly measured using the Wilhelmy wetting method. Results indicated that, in all the three epoxy-amine systems under investigation, a unique relationship combining the surface tension, the bulk energy, the entropy, and the density square gradient of the system could be used. On the basis of the present study, and taking into account all contributory factors, it was concluded that the enthalpy component to the surface energetics is the dominant contribution.     

Acid-base interactions and adhesion capacity in the system constituted by an epoxy coating and a metal

Free surface energy and acidity parameter of solid surfaces of polyepoxides used as anticorrosive coatings were measured. Formulations of epoxy resins with various curing agents were studied. The adhesion capacity of epoxy films to various metallic surfaces was evaluated.     

反气相色谱法测定环氧树脂的表面张力和溶解度参数

采用反气相色谱(IGC)测定了环氧E51树脂在30、40、50和60 ℃下的表面张力和溶解度参数。采用Schultz法,以正癸烷、正壬烷、正辛烷和正庚烷为非极性溶剂探针,计算了不同温度下环氧E51树脂的色散表面张力。根据Good-van Oss方程,以甲苯为碱性探针,二氯甲烷为酸性探针,计算得到环氧E51树脂的极性表面张力。结果表明,环氧E51树脂的色散表面张力和极性表面张力均随着温度的升高而线性降低。根据不同溶剂探针与树脂间的Flory-Huggins相互作用参数,采用DiPaola-Baranyi和Guillet方法计算得到环氧E51树脂在不同温度下的溶解度参数,其在30、40、50和60 ℃下分别为11.78、11.57、11.48和11.14 MPa1/2。根据表面张力、内聚能和溶解度参数的相互关系,计算得到不同温度下溶解度参数的色散和极性分量。结果发现,环氧E51树脂的溶解度参数的色散分量大于极性分量,且均随着温度的升高而降低。     

Evaluation of solubility parameters during polymerisation of amine‐cured epoxy resins

A new procedure for the calculation of solubility parameter evolution during polymerisation has been developed for amine‐cured epoxy systems, which allows quantitative thermodynamic modelling of chemically induced phase separation (CIPS). Solubility parameters calculation, chemical analysis based on near infrared spectroscopy and curing kinetics results obtained by differential scanning calorimetry will allow to model the evolution of the Flory–Huggins interaction parameter in amine‐cured epoxy blends. The resin system investigated was based on a diglycidyl ether bisphenol A (DGEBA) epoxy resin cured with isophorone diamine (IPD) blended with various reactive epoxydised dendritic hyperbranched polymer modifiers (HBP), yielding a CIPS‐controlled morphology. The analysis showed the evolution of the different contributions to the solubility parameters to follow the polymerisation kinetics. The dispersive contribution had the highest value at all stages of polymerisation, but the hydrogen and polar contributions showed the largest variation. By evaluating the dynamic evolution of the solubility parameter components, the Flory–Huggins interaction parameter in the epoxy resin‐hyperbranched polymer blends has been modelled as a function of time. This procedure, combined with thermodynamic modelling, will enable to predict phase diagrams in CIPS thermosetting blends quantitatively. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 1883–1892, 2000     

Preparation and properties of epoxy resins cured with silyl esters of phenol novolak and cresol novolak

The curing agents of epoxy resin, trimethylsilyl ethers of phenol novolak (TMSPN) and cresol novolak (TMSCN) were prepared by refluxing phenol novolak and cresol novolak respectively, with the mixture of hexamethyldisilazane and chlorotrimethylsilane in THF. The curing reaction of epoxy resin with these curing agents and the thermal properties of cured resins were examined. The Tg values of epoxy resins cured with TMSPN were a little higher than those cured with TMSCN. The maximum of Tg is 118°C for TMSPN-cured epoxy resin against 112°C for TMSPN-cured epoxy resin. The water absorption of hydrophobic epoxy resins cured with TMSPN was a little lower than those cured with TMSCN. The clear decrease of water absorption is attributed to the difficulty of the micro-void formation caused by the more tight primary structures of TMSPN. The water absorption at 25°C containing trimethylsilyl groups is about one-tenth of that of epoxy resins cured with conventional curing agents and even one-half of that of the epoxy resins cured with active esters. The low water absorption is attributed to the presence of trimethylsilyl groups, which are more hydrophobic than ester groups, and to the absence of hydroxyl groups of the cured resins. This revised version was published online in July 2006 with corrections to the Cover Date.     

Comparative study of the effect of tail corrections on surface tension determined by molecular simulation

We report results from a comparative study of the influence of tail corrections on the surface tension of the Lennard-Jones fluid. We find that cutoff-independent surface tensions can be obtained by applying a set of tail corrections recently introduced by Janecek at each step of an interfacial Monte Carlo (MC) or molecular dynamics (MD) simulation. The effect of tail corrections on an alternative methodology for calculating surface tension, the combination of finite-size scaling and grand-canonical transition-matrix Monte Carlo (FSS/GC-TMMC), was also investigated. Using this indirect method, surface tensions were calculated with standard (bulk-fluid) tail corrections and lattice sums, the latter usually considered more accurate but computationally more intensive than the former. With standard tail corrections, we find that the surface tension decreases with increasing cutoff distance, reaching a limiting value corresponding to the maximum cutoff possible, namely half the simulation box length. In contrast, surface tension values obtained with the lattice summation were cutoff-independent. More importantly, these values were equivalent to those surface tension values obtained using standard tail corrections and a cutoff distance of half the box length. We also find that the surface tension values obtained here are in agreement with those found in the literature. Last, we find that surface tension values obtained by MD and FSS/GC-TMMC are in decent agreement so long as the appropriate tail correction schemes are used, and that the relative uncertainties in the surface tensions calculated by MD are generally an order of magnitude greater than those calculated by FSS/GC-TMMC. However, the time required by MD on a single central processing unit is less than that required by FSS/GC-TMMC.     

Syntheses and properties of cured epoxy resins containing the perfluorobutenyloxy group. I. Epoxy resin cured with perfluorobutenyloxyphthalic anhydride

Perfluorobutenyloxyphthalic anhydride (PFPA) has been synthesized as a new curing agent for epoxy resins, and the properties of epoxy resin cured with PFPA have been investigated. Good PFPA synthesis yields were realized by a dehydrating ring closure of perfluorobutenyloxyphthalic acid, which was obtained through the reaction of hexafluoropropene trimers with 4-hydroxyphthalic acid. Epoxy resin cured with PFPA was found to have several excellent properties. Its boilding water absorption was 0.45%, which is about a one-fourth that for conventionally cured epoxy resin. Its heat resistance was excellent, and its critical surface tension was almost the same as for PTFE.     

STUDY ON COPOLYMER EPOXY RESIN MATRIX WITHOUT SHRINKAGE PART I VOLUME CHANGE DURING CURE PROCESSES

The volume change of the copolymer epoxy resins can be controlled by copolymerizing epoxy resin ESI with 3,9-di (5-norbornene-2, 2)-1, 5, 7, 11-tetraoxaspiro [5, 5] undecane (NSOC). During curing, the volume changes of copolymer epoxy resins with various amounts of NSOC were measured with a dilatometer. Cure process does not produce volume change when epoxy resin E51 : NSOC is 5.88 : 1 in equivalent.     

Adhesion between coating layers based on epoxy and silicone

The adhesion between a silicon tie-coat and epoxy primers, used in marine coating systems, has been studied in this work. Six epoxy coatings (with varying chain lengths of the epoxy resins), some of which have shown problems with adhesion to the tie-coat during service life, have been considered. The experimental investigation includes measurements of the surface tension of the tie-coat and the critical surface tensions of the epoxies, topographic investigation of the surfaces of cured epoxy coatings via atomic force microscopy (AFM), and pull-off tests for investigating the strength of adhesion to the silicon/epoxy systems. Calculations for determining the roughness factor of the six epoxy coatings (based on the AFM topographies) and the theoretical work of adhesion have been carried out. The coating surfaces are also characterized based on the van Oss-Good theory. Previous studies on the modulus of elasticity of the polymers involved have also been considered. It was found that adhesion problems might be due to inadequate wetting, the significantly different topographies, and differences in the mechanical strengths of the epoxies. Acid-base interactions calculated from the van Oss-Good theory were found useful in explaining the enhanced adhesion for some epoxy/silicon surfaces.     

电子束固化环氧树脂的物理特征及其分析

分析了环氧树脂电子束辐射固化的物理特征 ,电子束辐射固化过程受活性中心扩散控制 ,整个固化区域由片层状结构组成 .与电子能量沉积分布相对应 ,环氧树脂辐射固化度的最高值是在一定深度而不是在辐射表面出现 .对电子束辐射环氧树脂体系的固化过程进行了模型解释 ,固化区域大小主要由电子的能量传递范围和浓度决定 ,反应活性中心的扩散作用影响较弱     

New thermosets obtained from DGEBA and Meldrum acid with lanthanum and ytterbium triflates as cationic initiators

Ytterbium and lanthanum triflates were used as cationic initiators to cure mixtures of diglycidylether of bisphenol A (DGEBA) and Meldrum acid (MA) in several proportions of comonomers and initiators. The evolution of epoxy and lactone groups during curing, and of linear ester formed in the final materials were evaluated by Fourier transform infrared in the attenuated-total-reflection mode (FTIR/ATR).

The global evolution of the curing process was investigated by calorimetric analysis and the activation energy was calculated by isoconversional procedures.

Shrinkage on curing and thermal degradability of the final materials on varying the initiator and the proportion of Meldrum acid in the mixtures were evaluated. The expandable character of MA was confirmed. The materials obtained were more degradable than conventional epoxy resins due to the tertiary ester groups incorporated into the network by copolymerization, especially those obtained with ytterbium triflate. On increasing the proportion of initiator the degradability was also increased.     

非等温法研究TGDDM/DDS体系固化反应动力学

采用DSC对4,4′-四缩水甘油基二氨基二苯基甲烷(TGDDM)和3,3′-二氨基二苯基砜(DDS)体系的固化反应动力学进行了研究.分别通过n级反应法和Malek的最大概然机理函数法确定了固化反应机理函数,求解了固化反应动力学参数,得到了固化反应动力学模型.结果表明,通过Kissinger,Crane方法求解动力学参数所得到的n级反应模型与实验值差别较大;而采用Malek方法判别机理,表明该固化反应按照自催化反应机理进行,实验得到的DSC曲线与模型计算所得到的曲线吻合的较好,所确立的模型在5~20K/min的升温速率下能较好地描述TGDDM/DDS体系的固化反应过程,并为工艺参数的选择和工艺窗口的优化提供了理论依据.     

Styrylpyridine-based epoxy resins: Synthesis and characterization

Polymers containing rigid aromatic structures in the chain backbone usually gave high thermal stability and good flammability resistance. Three glycidyl ethers of epoxy resins were prepared from 2,4-di(p-hydroxystyryl)pyridine (2,4-DGESP), 2,6-di-(p-hydroxystyryl)pyridine (2,6-DGESP), and 2,4,6-tri-(p-hydroxystyryl)pryidine (2,4,6-TGESP) to study the relationships of structure to polymer degradation. To prepare a highly crosslinked material, trimethoxyboroxine (TMB) was used as the curing agent. The relative char yields of the three different resins, as measured by TGA, were 2,4-DGESP ≈ 2,6-DGESP > 2,4,6-TGESP. The char yield of the cured 2,6-DGESP varied with different amounts of the TMB curing agent, and was higher than the uncured 2,6-DGESP. The oxygen index increased as a function of thermal curing time for the 2,6-DGESP epoxy resin. An intermolecular Diels–Alder reaction with 2,6-DGESP is proposed as a primary reaction during thermal curing.     

Oligo-fluoropolymer Modified Cycloaliphatic Epoxy Resins with Excellent Compatibility,Waterproof and Mechanical Properties for LED Encapsulation

An oligo-fluoropolymer(PFM) with functional cycloaliphatic epoxy and fluorinated groups was obtained via free radical polymerization and applied to the modification of cycloaliphatic epoxy resins(CE). The chemical structure of PFM was characterized by Fourier transform infrared(FTIR) spectroscopy, gel permeation chromatography(GPC) and nuclear magnetic resonance(NMR) spectroscopy, and the effects of different PFM concentrations(0.5%—6%, mass fraction) on the thermal resistance, mechanical properties, surface dewettability, light transmission, refractive index and various cured polymer properties were studied in detail. The DSC and TGA results demonstrate that the modified epoxy resins possess a higher thermal resistance than the neat epoxy resin. The improvements in the surface dewettability and water resistance are caused by the high crosslinking density and the enrichment of the oligo-fluorinated random copolymers dispersed in the matrix. The fracture surface morphologies of the thermosets were investigated by scanning electron microscopy(SEM) and transmission electron microscopy(TEM). It was observed that the optical transmittance of the composites was maintained even though microphase separation occurred during the curing process. With respect to the corresponding properties of the neat epoxy resins, the 2 phr(parts per hundreds of resin) PFM thermoset exhibited relatively better comprehensive properties, making the cured material a good candidate for light-emitting diode(LED) encapsulation.     

Preparation and properties of aniline chain-extended thermoplastic epoxy resin using triphenylphosphine as catalyst

Thermoplastic resins have been widely used in fiber reinforced polymer composites because of its recyclability and short cycle times. However, the high viscosity after heating and melting restricts its infiltration on the surface of fiber. In this study, a series of thermoplastic epoxy resins were prepared via the chain extension reaction of epoxy groups with liquid aniline using triphenylphosphine (TPP) as catalyst. The relationship between polymer network structure and performance was comprehensively investigated. The solubility tests indicated that excessive aniline or TPP facilitated the crosslinking of resins. Besides, on the premise of thermoplasticity, appropriate TPP could increase the degree of chain extension, molecular weight, and glass transition temperature of resins. Furthermore, the in-situ polymerization process facilitated infiltration between epoxy resin and the fibers before chain extension reaction. The bending test showed that the flexural performance of the sample with 2 phr of TPP was improved by 38.8%. Therefore, this work provides a feasible method to prepare the thermoplastic epoxy resins and its fiber-reinforced composites with good mechanical properties.     

环氧/粘土纳米复合材料的形成机理与性能

粘土／聚合物纳米复合材料由于具有优良的物理力学性能和特殊功能而倍受关注。实验证明,粘土也很容易被环氧树脂插层,并在固化过程中剥离,得到纳米复合材料。本文重点综述了粘土／环氧纳米复合材料的形成机理,结构形态和力学性能,并对该类材料的应用前景进行了展望。     

Studies on the cure parameters of cyanate ester–epoxy blend system through rheological property measurements

Thermosetting blend system of co-cured cyanate ester with epoxy resin is receiving importance for high technological applications because of its wide range of thermo-mechanical, rheological, and electrical properties. However, processing of these system warrant proper knowledge of the rheological behavior of the blend during the curing process. This article discusses the rheological behavior of the blend systems with respect to the pot life, gel time, gelation temperature and also evaluated fitting parameters for the prediction of gelation time and viscosity during the entire curing process from the isothermal rheological measurements.     

Effect of substituents on the curing of liquid crystalline epoxy resin

The synthesis of an aromatic ester based liquid crystalline epoxy resin (LCE) with a substituent in the mesogenic central group is described. Chlorine and methyl groups were introduced as substituents. The curing behaviors of three epoxy resins were investigated using diaminodiphenyl ester as the curing agent. The curing rate and heat of curing of LCE were measured with dynamic and isothermal DSC. The chlorine substituent accelerated the curing of LCE, while the methyl substituent decelerated the curing of LCE. The heat of curing of substituted LCE was diminished compared to LCE with no substituent. Glass transition temperature and elastic modulus of LCE decreased with increasing the size of the substituent. Three liquid crystalline epoxy resins based on aromatic ester mesogenic groups formed a liquid crystalline phase after curing, and the liquid crystalline phase was stable up to the decomposition temperature. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 911–917, 1998