ESCA studies of copper oxides and copper molybdates

Valence band, $\text{Cu}\text{2p}{}_{\mathrm{<mtext>3</mtext><mtext>2</mtext>}}\text{,}\text{O}\text{1s,}\text{Mo}\text{3d}$, and Cu L₃M₄₅M₄₅ photoelectron and X-ray-induced Auger spectra were recorded for metallic copper, Cu₂O, CuO, Cu₂Mo₃O₁₀, Cu₆Mo₄O₁₅, CuMoO₄, Cu₃Mo₂O₉, and Cu_3.85Mo₃O₁₂. $\text{Cu}\text{2p}{}_{\mathrm{<mtext>3</mtext><mtext>2</mtext>}}$ binding energy is 0.9 eV lower for Cu⁺-containing molybdates than for Cu₂O and 0.7 eV higher for Cu²⁺-containing molybdates with respect to that of CuO. Calculation of net chemical shift demonstrates the influence of Madelung potential on the binding energy of core electrons. On the basis of differences in binding energy it was possible to distinguish between various Cu-containing phases and to follow the surface redox processes of copper molybdates which, as it was seen, follow the same reactions as in the bulk processes. Auger spectra suggest the presence of a very thin layer of “surface phase” common for all five studied molybdates and independent of bulk structure and composition.     

Diffusion in aqueous copper sulfate and copper sulfate-sulfuric acid solutions

Diffusion coefficients of copper sulfate-water and copper sulfate-sulfuric acid-water solutions have been determined at 25°C using conductimetric and diaphragm-cell techniques. The ternary diffusion measurements indicate that diffusion of sulfuric acid can produce large counterflows of copper sulfate and vice versa. If diffusion of copper sulfate in aqueous sulfuric acid solutions is treated as a binary process, the measured apparent diffusivities of copper sulfate can be 1 to 8% lower than the salt's true diffusivity. Equations are developed to predict transport coefficients from the concentrations and mobilities of the diffusing species.     

Synthesis of copper sulphide and copper nanoparticles with microemulsion method

The present work is focused on the synthesis of nanocopper and nanocopper sulphide metallic particles. The precise control of size and shape is best achievable with microemulsion technique, with in situ synthesis in microemulsion. The effect of most crucial operating parameter, water-to-surfactant molar ratio (w), on the product specification including size as well as size distribution and morphology were investigated. The variation of size was observed with variation in w for copper sulphide and copper. Product specifications were analyzed using transmission electron microscope imaging, dynamic light scattering with particle size analyzer and absorption spectra using UV-visible spectrophotometer. It was observed that bigger particles were achieved at higher water-to-surfactant ratio. From systematic study of effect of w on the size and size distribution of copper nanoparticles, the optimum value was chosen for preparation of in situ catalyst. As copper on alumina catalyst has wide catalytic applications of commercial importance, alumina was selected as support. A novel deposition method is developed successfully to deposit the copper nanoparticles from microemulsion on the support. Thus prepared catalyst was analyzed with UV-visible spectrophotometer and found to contain characteristic peak of copper at 655 nm, indicating proper copper deposition on support. XRD analysis of copper on alumina catalyst confirmed presence of metallic copper.     

The titrimetric determination of copper(I), copper(II) and copper metal in admixture

Summary Copper(I) can be determined in the presence of copper(II) by oxidation with an excess of potassium iodate, the copper(II) being masked with oxalate. The unconsumed iodate is determined iodimetrically and the total copper is then determined on the same solution by demasking with acid and iodide, followed by iodimetric titration. The method can be extended to include elemental copper which can be separated from copper(I) and copper(II) oxides by dissolving the oxides in an ammonium chloride-ascorbic acid solution. The separated copper metal can then be determined by the iodate procedure. The methods are accurate and reproducible and have been applied to the determination of commercial copper(I) chloride, copper powder and partially oxidized copper powder. The relative standard deviation is about 0.35% in the range of 5.8–100 mg of Cu.

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Trimetrische Bestimmung von Kupfer(I), Kupfer(II) und metallischem Kupfer in Gemischen

Zusammenfassung Cu(I) kann in Gegenwart von Cu(II) durch Oxidation mit überschüssigem Kaliumiodat unter Maskierung des Cu(II) mit Oxalat bestimmt werden. Das unverbrauchte Iodat wird iodometrisch erfaßt und anschließend Gesamtkupfer in derselben Lösung iodometrisch nach Demaskierung mit Säure und Iodid bestimmt. Das Verfahren kann noch auf metallisches Kupfer erweitert werden, das von Cu(I)- und Cu(II)-oxiden abgetrennt wird, indem man letztere in Ammoniumchlorid-Ascorbinsäurelösung löst. Das elementare Kupfer wird dann mit Iodat bestimmt. Die Methoden sind genau und reproduzierbar und sind zur Analyse von handelsüblichem Kupfer(I)-chlorid, Kupferpulver und teilweise oxidiertem Kupferpulver angewendet worden. Die relative Standardabweichung liegt im Bereich von 5,8–100 mg Cu bei 0,35%.

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This paper is respectfully dedicated to Professor Dr. Herbert Weisz on the occasion of his 60th birthday.

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The authors are grateful to Emeritus Professor Ronald Belcher for his interest in this work.     

Polarographic determination of copper, arsenic and arsenic in copper arsenite

A method is proposed in which Cu^II, As^III and As^v can be determined in copper arsenite without prior separation. It is based on the fact that Cu^II and As^III yield prominent, distinguishable, widely-separated cathodic polarographic waves in a 0.1M LiCl-0.01M EDTA—0.001M LiOH solution using a dropping mercury electrode, whereas As^v does not give a wave in this medium. The As^v is determined by difference after reduction with sulphurous acid.     

Thermogravimetry of copper and copper oxides (Cu2O-CuO)

The thermogravimetry of mixtures of metallic copper and copper oxides was studied. The experiments were performed by heating the samples in air to 700–800° to transform all the components to copper(II) oxide, and continuing the heating in nitrogen to 1050–1100° when the dissociation of copper(II) oxide to copper(I) oxide is complete. The identification of the components and their quantitative determination were carried out by determining the shape, size, and ratio of the segments of the curves obtained during the heating. The method can be used for quantitative analysis of mixtures of copper and/or copper oxides.

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Zusammenfassung Gemische von metallischem Kupfer und Kupferoxiden wurden thermogravimetrisch untersucht. Zur Überführung aller Komponenten in Kupfer(II)-oxid erhitzte man sie in Luft auf 700–800°, um daraufhin bis zur vollständigen Dissoziation des Kupfer-(II)-oxids zu Kupfer(I)-oxid unter Stickstoff die Temperatur bis auf 1050–1100° zu steigern. Die Identifizierung der Komponenten und ihre quantitative Bestimmung erfolgten durch die Form, Größe und die Verhältnisse der verschiedenen Abschnitte der erhaltenen Kurven. Diese Methode ist zur quantitativen Bestimmung von Gemischen aus Kupfer und Kupferoxid sowie von Kupferoxiden geeignet.

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Résumé Étude thermogravimétrique de mélanges du cuivre métallique et d'oxydes de cuivre. Les échantillons sont d'abord chauffés dans l'air jusqu'à 700–800° jusqu'à ce que tous les constituants soient transformés en oxyde de cuivre(II); le chauffage est ensuite poursuivi dans l'azote jusqu'à 1010–1100°, où la dissociation de l'oxyde de cuivre(II) en oxyde de cuivre(I) est complète. Les constituants ont été identifiés et dosés en utilisant la forme, la dimension et les proportions des différentes parties des courbes pendant le chauffage. La méthode peut être utilisée pour l'analyse quantitative de mélanges de cuivre et ou d'oxydes de cuivre.

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. 700–800: ( (), 1050–1100° [ () (I)]. , , . / .

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The author wishes to acknowledge the financial assistance provided by the Technion — Israel Institute of Technology.The author wishes also to thank Dr. R. F. Tylecote (University of Newcastle Upon Tyne, England) for very helpful comments and useful discussions of this investigation and to Mrs. N. Leder for chemical analyses.     

铜冶炼物料中铜的分析质量控制方法综述

目前国内铜精矿供应紧俏,铜冶炼行业的原料复杂,有些偏离了认证和认可标准方法的样品,在检测时,用认证、认可文件不能很好地进行质量管控,需要对分析方法加以改进,从技术上进行管控。结合国内铜冶炼企业的实际情况和多年的实践经验,从样品的加工和保存环节、铜分析的技术环节、人员培训、质量抽查、定期开展质量分析会等方面对铜的分析质量控制进行了总结。在具体的质量控制中,针对铜冶炼行业成分复杂、易变化的物料分析,应根据实际情况进行质量管控,以提高铜分析的准确度。     

Aqueous synthesis of copper nanocubes and bimetallic copper/palladium core-shell nanostructures

We have synthesized copper nanocubes with uniform shape and size and copper/palladium core-shell bimetallic nanostructures in high yield by a two-stage procedure in the presence of dodecyl benzene sulfonic acid sodium. The copper nanocubes with a slight hole in the centers of the six {100} surfaces was prepared at the first stage. Later, the bimetallic copper/palladium core-shell nanostructures formed on the basis of the successive reduction of H2PdCl4 and the Pd growth on the surfaces of the Cu seeds.     

Adsorption properties of complexes of chitosan with copper and zinc chlorides and copper sulfate

The adsorption properties of complexes of chitosan with copper and zinc chlorides and copper sulfate with respect to n-alkanes (C₆H₁₄-C₉H₂₀) and n-alcohols (CH₃OH-C₃H₇OH) were investigated by means inverse gas chromatography in the Henry region. It was found that the capability of the chitosan complexes for dispersion interaction is somewhat less pronounced in comparison with the initial chitosan. It was shown that complexation give rises to more ordered supramolecular structures, which make for an increase in the adsorption capacity of complexes with respect to n-alcohols. The small adsorption values measured were explained by the interaction of the n-alcohols only with weakly specific OH groups, since the NH₂ group is inaccessible because of its being involved in the coordination bonding with the metal ion.     

New copper and silver trimethylsilylchalcogenolates

The synthesis and characterization of the copper and silver trimethylsilylchalcogenolates (EtPh2P)3MESiMe3 and (Et2PhP)3MESiMe3 (M = CuI, AgI) are reported. These chalcogenolate complexes can be prepared in high yield; however, they are thermally unstable. Low-temperature single-crystal X-ray analysis of (EtPh2P)3CuSSiMe3 (1b) and (Et2PhP)3CuSeSiMe3 (2a) confirms the terminal coordination of the chalcogen ligand and the tetrahedral coordination about the metal. Protonolysis of 2a with EtOH yields the terminal selenol complex (Et2PhP)3CuSeH (6). Reaction of 1b with EtPh2P-solubilized AgOAc yields the heterometallic cluster [Cu9Ag3S6(PEtPh2)8] (7) in good yield.     

Instrumental neutron activation analysis of manganese,copper and vanadium in some commercial steel samples and of copper in copper base alloys

The instrumental neutron activation analysis (INAA) of industrially important steel samples, viz. IS-226, IS-2002, IS-2062, SS-304, SS-310, SS-316 and of copper base alloys, viz. high brass, gun metal and copper-silver alloys is carried out with a 2 Ci²⁵²Cf neutron source. The copper and vanadium content of all the steel samples and manganese content of former three steel samples are estimated by measuring the gamma activity of⁶⁶Cu,⁵²V and⁵⁶Mn radioisotopes, respectively, using a high purity germanium (HPGe) detector coupled to a 4 K multichannel analyzer (MCA). Similarly, the copper content of copper base alloys was also determined.Dedicated to Prof. H. J. Arnikar, Professor Emeritus, University of Poona, on the occasion of his 75th birthday.     

碘量法测定废杂铜屑中的铜含量

采用硝酸-盐酸溶解样品,在硫酸体系下加入氢溴酸,使得氢溴酸与试样中的砷、锑、锡等元素反应生成易挥发的溴化物,从而消除其干扰,滴定前用氟化氢氨掩蔽铁,在pH=3.0～4.0的范围采用碘量法测定废杂铜屑中的铜含量。用于测定金属样废杂铜屑中铜的含量,测定结果的相对标准偏差(RSD,n=7)为0.20%～0.25%,加标回收率在98.8%～101%,方法简单准确,能够满足日常检测需求。     

Thermal oxidative degradation of isotactic polypropylene catalyzed by copper and copper oxide interfaces

The oxidative degradation of isotactic polypropylene films coated on well-defined Cu(Cu₂O), CuO_0.67, and CuO films in a temperature range of 90–120°C in a quartz-spoon-gauge-reaction vessel was studied. This catalytic reaction has been compared with the oxidation of polypropylene without copper or oxide films. The reaction vessel contained, if needed, P₂O₅ and/or KOH as “getters” for H₂O and CO₂, these substances could be menitored continuously. Cu(Cu₂O) films were transformed during oxidation of the polymer to yellow CuO_0.67 below 100°C and above this temperature to black CuO in the presence of H₂O and CO₂, whereas in the absence of these compounds CuO was formed below 100°C and CuO_0.67 at 120°C. Characteristic autoxidation curves obtained in the absence of H₂O and CO₂ showed induction periods that were shorter for copper oxide-polymer interfaces than for glass-polymer interfaces (i.e., for uncatalyzed oxidation). Abnormalities were observed for Cu(Cu₂O)-polymer interfaces because of further oxidation of Cu during the reaction. The rates of oxygen consumption were faster for CuO_0.67-polymer and CuO-polymer than for the uncatalyzed reaction; the catalytic action of CuO_0.67 was somewhat larger than that of CuO. The important observation was made that the mechanism of oxidation is not the same in the absence and presence of reaction products; that is, H₂O and CO₂. This was confirmed by ion beam scattering experiments, which also revealed that an oxidation-reduction process takes place at Cu and their oxide interfaces. A mechanism for the catalytic oxidation process, based on the ease by which copper ions are released from the metal oxides at the interface, was formulated. These ions diffuse subsequently as actions of carboxylate anions into the bulk of the polymer. Arrhenius equations of oxygen consumption are given for all cases; the energy of activation calculated for the initiation of the uncatalyzed oxidation agrees with its literature value. The energy of activation for the initiation of the catalyzed reaction was a few kilocalories lower than that for the uncatalyzed reaction. Catalytic action is mainly operative for the initiation reaction at the interface and for the decomposition of hydroperoxides by copper ions. Preventing the delivery of copper ions to the polymer would be the most efficient way of inhibiting the catalysis.     

Pure copper vs. mixed copper and palladium hexacyanoferrates for glucose biosensing applications

A glucose amperometric biosensor was developed. Glucose oxidase enzyme was immobilized by means of a Nafion membrane on glassy carbon modified with an electrochemically deposited mixed Cu and Pd hexacyanoferrate (CuPdHCF). According to the data provided by X-ray atomic spectroscopy measurements, this Cu- and Pd-based hexacyanoferrate is likely to be a mixture of single CuHCF and PdHCF pure phases. The biosensor performances were evaluated by recording the steady-state currents due to submillimolar additions of glucose to a potassium buffer solution (pH 5.5) and exploiting the electrocatalytic reduction of the enzymatically produced hydrogen peroxide. The CuPdHCF-based biosensor exhibited a sensitivity of 8.1?±?0.6 A M^?1 m^?2, a limit of detection of 1.4?×?10^?5 M, and a linear response range extending between 5?×?10^?5 and 4?×?10^?4 M, with a dynamic response range up to 4?×?10^?3 M glucose. Electrode sensitivity and signal stability resulted more satisfactory as compared to those of a CuHCF-based biosensor fabricated according to the same procedure. The selectivity was investigated through an interference study. The response to easily oxidizable species was found to be low enough to allow glucose determination in biological samples.     

Experimental study of copper leveling additives and their wafer and pattern-scale effect on copper planarization

The impact of Cu leveling additives on electrodeposited Cu topography and subsequent planarization behaviour was studied on both the pattern and wafer scales. The leveling agent significantly reduces as-deposited Cu topography, especially “mounding”. The reduction in topography results in a higher effective Cu removal rate during subsequent Cu planarization, both at the pattern and wafer scales. On the wafer scale, this effect is more evident for lower overburdens as the topography must be eliminated in a shorter total polish time. For Cu electrodeposited from leveler additive-free chemistries, significant pattern-scale topography persists throughout almost the entire planarization process, whereas for Cu deposited using a leveling agent only very wide features (～ > 100 μm) show any significant topography evolution during Cu polish. It is shown that excess electrodeposited Cu topography can lead to poor in-plane Cu wiring leakage performance.     

Release of copper from commercial solid-state copper ion-selective electrodes

The release of copper from two commercial solid-state cupric ion-selective electrodes [Orion 94-29 Cupric Electrode (I) and Radiometer F1112 Selectrode (II)] was measured by immersion in the following media: 0.1M potassium nitrate (pH = 4.7), 0.5M sodium chloride (pH = 4.7) and 0.1M nitric acid. In the 0.1M potassium nitrate medium, the amount of copper released from both electrodes causes interference when they are used for the determination of cupric ion at the 10⁻⁷M level. In comparison with the 0.1M potassium nitrate medium, the copper release in the 0.5M sodium chloride and 0.1M nitric acid media was increased for electrode II but not for electrode I. The release of copper was not affected by removal of oxygen from the media but can be substantially lowered by coating the electrodes with a thin cation-exchange membrane (Nafion). The mechanism of copper dissolution is investigated.