SiOx interlayer to enhance the performance of InGaZnO-TFT with AlOx gate insulator

We have fabricated indium–gallium–zinc (IGZO) thin film transistor (TFT) using SiO_x interlayer modified aluminum oxide (AlO_x) film as the gate insulator and investigated their electrical characteristics and bias voltage stress. Compared with IGZO-TFT with AlO_x insulator, IGZO-TFT with AlO_x/SiO_x insulator shows superior performance and better bias stability. The saturation mobility increases from 5.6 cm²/V s to 7.8 cm²/V s, the threshold voltage downshifts from 9.5 V to 3.3 V, and the contact resistance reduces from 132 Ωcm to 91 Ωcm. The performance improvement is attributed to the following reasons: (1) the introduction of SiO_x interlayer improves the insulator surface properties and leads to the high quality IGZO film and low trap density of IGZO/insulator interface. (2) The better interface between the channel and S/D electrodes is favorable to reduce the contact resistance of IGZO-TFT.     

Reduction of the contact resistance in copper phthalocyanine thin film transistor with UV/ozone treated Au electrodes

Bottom-contact (BC) copper phthalocyanine (CuPc) thin film transistor with UV/ozone treated Au as a source/drain electrode was fabricated and the contact resistance was estimated from the transmission line method (TLM). Comparing the properties of OTFT with untreated Au electrode, the performance of the BC CuPc-TFT with the UV/ozone treated Au electrodes was significantly improved: saturation mobility increased from 4.69 × 10⁻³ to 2.37 × 10⁻² cm²/V s, threshold voltage reduced from −29.1 to −6.4 V, and threshold swing varied from 5.08 to 2.25 V/decade. The contact resistance of the device with UV/ozone treated Au electrodes was nearly 20 times smaller than that of the device with untreated Au electrodes at the gate voltage of −20 V. This result indicated that using the UV/ozone treated Au electrode is an effective method to reduce the contact resistance. The present BC configuration with UV/ozone treated Au electrodes could be a significant step towards the commercialization of OTFT technology.     

Optical switch with low-phase transition temperature based on thin nanocrystalline VOx film

An optical switch is fabricated by using micromachining technology, which is based on thin nanocrystalline vanadium oxide (VO_x) film, and it consists of four layers: a silicon (Si) substrate layer, a VO_x layer, a Si₃N₄ buffer layer, and an aurum (Au) electrode layer. By applying a switching power supply to a pair of the Au electrodes, the optical switch is controlled to exhibit from an “on” state with semi-conducting phase to an “off” state with metallic phase. The optical switch performance is investigated, and testing results show that its extinction ratio is about 14 dB, its switching response time can achieve about 1.5 ms, and the power dissipation required for stimulating switching to work can be below about 15 mW at least, which is lower than the power dissipation of conventional optical switches based on microstructure thin vanadium dioxide (VO₂) films. This kind of optical switch is potential to be applied as optical switch for optical communication.     

Electronic-beam evaporation processed titanium oxide as an electron selective contact for silicon solar cells

This work is dedicated to the study of electronic-beam (e-beam) evaporated titanium oxide (TiO_x) contact for polycrystalline silicon hetero-junction solar cells. A TiO_x material obtained by e-beam evaporation method is suggested as a possible alternative to the atomic layer deposition (ALD) process. The purpose is to achieve corresponding passivation efficiency between e-beam evaporation of TiOx and the ALD method. However, the TiOx in question achieved a relatively low passivation performance of S_eff = 113 cm⁻¹ in comparison to the reported ALD results. Nonetheless, as e-beam evaporation is well-established and an environmentally friendly deposition technology, e-beam evaporated TiO_x passivation layer has potential for improvement. What is clearly demonstrated in our work is how such an improvement in contact resistance dropped from >55 Ω/cm² to 2.29 Ω/cm². Indeed, our study established a correlation between the main process parameters of e-beam evaporation and their influence on the quality of electron selective TiO_x layer. Moreover, we reveal a possible scenario for the implementation of e-beam evaporated Titanium oxide as electron selective contact for asymmetrical hetero-junction solar cells.     

Improvement of electrical characteristics of InGaZnO thin film transistors by using HMDSO/O2 plasma deposited SiOCH buffer layer

In this work, we present the performance improved InGaZnO thin film transistors by inserting low temperature processed 10 nm thick SiOCH buffer layers between SiN_x insulator and InGaZnO channel layer. The influences of oxygen flow rate during the deposition of SiOCH buffer layer have been intensively investigated. Basing on the analysis of hall effect measurement and Fourier transform infrared spectrum, the SiOCH buffer layer can effectively increase the carrier concentration of the channel layer by the hydrogen doping due to re-sputtering and diffusion effect. The InGaZnO thin film transistor with buffer layer exhibits an enhanced performance with mobility of 13.09 cm²/vs, threshold voltage of −0.55 V and I_on/I_off over 10⁶.     

Thermal stability of Ti/Al/Pt/Au and Ti/Au Ohmic contacts on n-type ZnCdO

The specific contact resistivity and chemical intermixing of Ti/Au and Ti/Al/Pt/Au Ohmic contacts on n-type Zn_0.05Cd_0.95O layers grown on ZnO buffer layers on GaN/sapphire templates is reported as a function of annealing temperature in the range 200-600 °C. A minimum contact resistivity of 2.3 × 10⁻⁴ Ω cm² was obtained at 500 °C for Ti/Al/Pt/Au and 1.6 × 10⁻⁴ Ω cm² was obtained at 450 °C for Ti/Al. These values also correspond to the minima in transfer resistance for the contacts. The Ti/Al/Pt/Au contacts show far smoother morphologies after annealing even at 600 °C, whereas the Ti/Au contacts show a reacted appearance after 350 °C anneals. In the former case, Pt and Al outdiffusion is significant at 450 °C, whereas in the latter case the onset of Ti and Zn outdiffusion is evident at the same temperature. The improvement in contact resistance with annealing is suggested to occur through formation of TiO_x phases that induce oxygen vacancies in the ZnCdO.     

Low voltage operating OFETs based on solution-processed metal phthalocyanines

The class of sodium salts of sulphonated metal phthalocyanines (MePCS _x , S = SO₃Na, x=1–4) was investigated as a p-type channel component in organic field-effect transistors (OFETs). The solubility of these materials appears to be enhanced compared to their non-sulphonated counterparts (MePCs). We fabricated transistors based on MePCS _x varying the central metal atom (Me = Ni, Co, Zn, Al) and we evaluated the dependence of transistor performance on the nature of the central atom and the degree of sulphonation. The best results were obtained in the case of Ni and low sulphur content. In this case the mobility value is μ=1.08 cm² V⁻¹ s⁻¹ and the on/off current ratio ∼10³. The degree of sulphonation affects the electric field inside the active film in a way analogous to the case of polyelectrolyte-gated OFETs. The Na⁺ counter ions present in the channel contribute to the device characteristics but their concentration should be controlled in order to optimize device performance.     

Tailoring resistive switching characteristics in WOx films using different metal electrodes

We have investigated the role of the metal/oxide junction interface on the resistive switching (RS) characteristics in WO_3+x films. The WO_x films are fabricated on Pt substrates by magnetron sputtering at room temperature. Top metal contact (Au or Al) is fabricated by using thermal evaporator. The thicknesses of WO_x films and top electrodes are 1 μm and 200 nm, respectively. It has been found that the bi-polar RS direction is dependent on the choice of top metal electrode, Au or Al. The sample with a Au top electrode shows clockwise (CW) RS mode whilst the sample with a Al top electrode shows counter-clockwise (CCW) RS mode. The on/off ratio is 10 times for Au/WO_x/Pt and 100 times for Al/WO_x/Pt. The bi-polar RS modes are modeled in terms of the difference in the electronegativity of the top and bottom electrodes.     

Electrical properties of organic field effect transistors with thin graphite/metal electrode directly grown by ICP-CVD at low temperatures

The high contact resistance of organic thin film transistors (OTFTs), due to the work function difference between metal electrode and organic channel, seriously decreases the electrical properties. Graphene electrode could reduce the contact resistance and improve the electrical performance of OTFTs. However, the high chemical vapor deposition (CVD) temperature (900–1000 °C) limits the available OTFT substrate in the case of direct graphene growth on S/D metal electrodes. Furthermore, the application of a transferred graphene electrode induces significant problems due to the transfer process. In this work, thin graphite sheet was directly grown on a metal electrode by the inductively coupled plasma-chemical vapor deposition (ICP-CVD) method at as low temperature as 400, 500 °C. We show that OFETs with thin graphite sheet/metal, grown at 400, 500 °C, exhibit much lower contact resistance than OFETs with metal-only electrode.     

Specific contact resistance of IGZO thin film transistors with metallic and transparent conductive oxides electrodes and XPS study of the contact/semiconductor interfaces

In this work, the specific contact resistance (ρ_c) between amorphous indium-gallium-zinc-oxide (IGZO) semiconductor and different contact electrodes was obtained from thin film transistors (TFTs). Ti/Au (10/100 nm), aluminum doped zinc oxide (AZO, 100 nm) and indium tin oxide (ITO, 100 nm) were used as source/drain electrodes to fabricate IGZO TFTs. Chemical states of the contacts/semiconductor interfaces were examined by depth profile X-ray photoelectron spectroscopy (XPS) analysis to explain the origin of the differences on specific contact resistance. The lowest ρ_c achieved using Ti/Au was related to the formation of a TiO_x interlayer due to oxygen atoms diffusing out from the semiconductor under layer, increasing the carrier concentration of IGZO at the interface and lowering the ρ_c. On the contrary, no interfacial reactions were observed between IGZO and AZO or ITO source/drain. However, IGZO resistivity increased with ITO contacts likely due to oxygen vacancies filling during ITO deposition. This fact seems to be the origin of the high contact resistance between IGZO and ITO, compared to IGZO-AZO and IGZO-Ti/Au interfaces.     

Hole mobility and remote scattering in strained InGaSb quantum well MOSFET channels with Al2O3 oxide

Hall mobility and major scattering mechanisms in surface and buried MBE grown strained InGaSb quantum well (QW) MOSFET channels with in‐situ grown Al₂O₃ gate oxide are analyzed as a function of sheet hole density, top‐barrier thickness and temperature. Mobility dependence on Al_0.8Ga_0.2Sb top‐barrier thickness shows that the relative contribution of interface‐related scattering is as low as ～30% in the surface QW channel. An InAs top capping layer reduces the interface scattering even further; the sample with 3 nm total top‐barrier thickness demonstrates mobility of 980 cm²/Vs giving sheet resistance of 4.3 kΩ/sq, very close to the minimum QW resistance in the bulk. The mobility–temperature dependences indicate that the interface‐related scattering is dominated by remote Coulomb scattering at hole densities <1 × 10¹² cm^–2. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Tuning the contact resistance in organic thin-film transistors with an organic-inorganic hybrid interlayer

We demonstrated the tunable contact resistance in pentacene thin film transistor (TFT) by inserting an organic-inorganic hybrid interlayer between Au electrode and pentacene layer. The contact resistance of pentacene-TFT varies with concentration of pentacene-TFT varies with concentration of MoO_x in organic-inorganic hybrid interlayer. MoO_x in organic-inorganic hybrid interlayer. The contact resistance of the device with 55 wt% MoO_x doped pentacene interlayer is about 7.8 times smaller than that of device without interlayer at the gate voltage of −20 V. Comparing the properties of pentacene-TFT without interlayer, the performance of the pentacene-TFT with 55 wt% MoO_x doped pentacene was significantly improved: saturation mobility increased from 0.39 to 0.87 cm²/V s, threshold voltage reduced from −21.3 to −7.2 V, and threshold swing varied from 3.75 to 1.39 V/dec. Our results indicated that the organic-inorganic hybrid interlayer is an effective way to improve the performance of p-channel OTFTs.     

ZrB2-based Ohmic contacts to p-GaN

The annealing temperature dependence of contact resistance and layer stability of ZrB₂/Ti/Au and Ni/Au/ZrB₂/Ti/Au Ohmic contacts on p-GaN is reported. The as-deposited contacts are rectifying and transition to Ohmic behavior for annealing at ≥750 °C, a significant improvement in thermal stability compared to the conventional Ni/Au Ohmic contact on p-GaN, which is stable only to <600 °C. A minimum specific contact resistance of ∼2 × 10⁻³ Ω cm⁻² was obtained for the ZrB₂/Ti/Au after annealing at 800 °C while for Ni/Au/ZrB₂/Ti/Au the minimum value was 10⁻⁴ Ω cm⁻² at 900 °C. Auger Electron Spectroscopy profiling showed significant Ti, Ni and Zr out diffusion at 750 °C in the Ni/Au/ZrB₂/Ti/Au while the Ti and Zr intermix at 900 °C in the ZrB₂/Ti/Au. These boride-based contacts show promise for contacts to p-GaN in high temperature applications.     

Investigation of ultra-thin and flexible Au–Ag–Au transparent conducting electrode

The performance of ultra-thin Au–Ag–Au tri-layer film deposited thermally over a flexible substrate is investigated using structural, optical, mechanical and electrical-transport measurements. The optimum total thickness of the tri-layer for high transparency and conductivity is determined to be around 8 nm using a theoretical model. The Au–Ag–Au tri-layer shows maximum transmittance (≅ 62%) at wavelength 500 nm. XRD pattern shows peak corresponding to (111) plane of Au and/or Ag. Sheet resistance (≅ 10.42 Ω/□) measured at 300 K using four probe technique is stable up to 150 °C. Hall effect measurements show high conductivity (1.34 × 10⁵ (Ω cm)⁻¹), carrier concentration (2.48 × 10²³/cm³), and mobility (3.4 cm²/Vs). Scotch tape test confirms good adhesion of the film onto PET substrate. Bending-twisting tests using an indigenous apparatus indicate high resistance-stability even after 50,000 cycles. These results imply the viability of Au–Ag–Au tri-layer film as a transparent conducting electrode worth exploring for optoelectronic applications.     

High efficiency screen-printed n-type silicon solar cell using co-diffusion of APCVD boron emitter and POCl3 back surface field

We present the fabrication and analysis of Passivated Emitter and Rear Totally Diffused (PERT) solar cells on n-type silicon using a co-diffusion process. In a single high temperature step, a BSG/SiO_x stack deposited by APCVD and a POCl₃ back surface field diffuse into the wafer to form the boron doped emitter and phosphorus doped back surface field. The SiO_x layer on top of BSG acts as a masking layer to prevent cross-doping of phosphorus as well as a blocking layer for boron out-diffusion. This resulted in an initial sheet resistance of 76 Ω/□ with good uniformity and a final p⁺ emitter sheet resistance of 97 Ω/□ after boron rich layer removal. Additionally, bulk lifetime was investigated before and after the high temperature step that resulted in an increase from 1.2 ms to 1.5 ms due to a POCl₃ gettering effect. A peak cell efficiency of 20.3% was achieved and each recombination component in terms of saturation current density was calculated and analyzed to understand the cell for further efficiency enhancement.     

超薄EuF3电极修饰层对有机场效应晶体管性能的提升

采用EuF₃薄层修饰低功函数金属Ag源、漏电极,制备了CuPc有机场效应晶体管,研究了不同厚度EuF₃对器件性能的影响。结果表明,EuF₃的厚度由0 nm增至0.6 nm时,接触电阻由23.65×10⁵ Ω·cm减 至3.86×10⁵ Ω·cm,使得器件载流子迁移率由1.5×10^-3 cm²·V^-1·s^-1提高到4.65×10^-3 cm²·V^-1·s^-1。 UPS测试结果表明,薄层EuF₃在Ag与有机半导体间形成了界面偶极势垒,使源漏电极表面功函数增大,空穴注入势垒降低,Ag电极与有机半导体层界面的接触电阻减小,进而提升了空穴的注入效率。     

Cu(In,Ga)Se2 superstrate-type solar cells with Zn1−xMgxO buffer layers

Superstrate-type Cu(In,Ga)Se₂ (CIGS) thin film solar cells were fabricated using Zn_1−xMg_xO buffer layers. Due to the diffusion of Cd into CIGS during the growth of the CIGS layer, the conventional buffer material of CdS is not suitable. ZnO is a good candidate because of higher thermal tolerance but the conduction band offset (CBO) of ZnO/CIGS is not appropriate. In this study, the Zn_1−xMg_xO buffer layers were used to fulfill both the requirements. The superstrate-type solar cells with a soda-lime glass/In₂O₃:Sn/Zn_1−xMg_xO/CIGS/Au structure were fabricated with different band gap energies of the Zn_1−xMg_xO layer. The CIGS layers [Ga/(In + Ga)∼0.25] were deposited by co-evaporation method. The substrate temperature during the CIGS deposition of 450 °C did not cause the intermixing of the Zn_1−xMg_xO and CIGS layers. The conversion efficiency of the cell with Zn_1−xMg_xO was higher than that with ZnO due to the improvement of open-circuit voltage and shunt resistance. The results well corresponded to the behavior of the adjustment of CBO, demonstrating that the usefulness of the Zn_1−xMg_xO layer for the CBO control in the superstrate-type CIGS solar cells.     

The effect of a surface layer capping p-InGaN/p-GaN superlattices on the contact to p-GaN

In this study, the influence of the surface layer (p-InGaN or p-GaN) capping p-InGaN/p-GaN superlattices (SLs) on the contact to p-type GaN was investigated. It was found that the specific contact resistance (_ρc)$\left({\rho }_c\right)$ to p-type GaN is lower when using p-InGaN as the surface layer. The lowest value of _ρc${\rho }_c$ was 1.99×10⁻⁴ Ω cm² at room temperature. It was also found that low temperature growth of the p-GaN layers in the SLs is beneficial for lowering the ohmic contact resistance. Unlike Ni/Au deposited directly on p-GaN (without the strained p-InGaN/p-GaN SLs), Ni/Au deposited on p-InGaN/p-GaN SLs produces ohmic behavior even before annealing.     

Ohmic contact and space-charge-limited current in molybdenum oxide modified devices

The effect of indium-tin oxide (ITO) surface treatment on hole injection of devices with molybdenum oxide (MoO₃) as a buffer layer on ITO was studied. The Ohmic contact is formed at the metal/organic interface due to high work function of MoO₃. Hence, the current is due to space charge limited when ITO is positively biased. The hole mobility of N, N′-bis-(1-napthyl)-N, N′-diphenyl-1, 1′biphenyl-4, 4′-diamine (NPB) at various thicknesses (100–400 nm) has been estimated by using space-charge-limited current measurements. The hole mobility of NPB, 1.09×10⁻⁵ cm²/V s at 100 nm is smaller than the value of 1.52×10⁻⁴ cm²/V s at 400 nm at 0.8 MV/cm, which is caused by the interfacial trap states restricted by the surface interaction. The mobility is hardly changed with NPB thickness for the effect of interfacial trap states on mobility which can be negligible when the thickness is more than 300 nm.     

Effect of buffer layer on VOx film fabrication by reactive RF sputtering

Vanadium oxide VO_x films were fabricated by RF magnetron sputtering on various metal buffer layers or silica glass substrates at a substrate temperature of 400 °C. V₂O₅ film was fabricated on a silica glass substrate, and VO₂ films were fabricated on V, W, Fe, Ni, Ti, and Pt metal buffer layers. The transition temperature of the sample on the V buffer layer was 68 °C and that on the W buffer layer was 53 °C. The VO₂ film was also fabricated on the V buffer layer by non-reactive sputtering using a V₂O₅ target at a substrate temperature of 400 °C.