大功率GaN基发光二极管的电流扩展效应及电极结构优化研究

定性分析了GaN基LED的电流扩展效应，发现电流密度和电流横向扩展的有效长度对电流均匀扩展有很大影响.基于此，对GaN基大功率LED提出了优化的电极结构，以减缓电流拥挤效应，降低器件串联电阻.通过用红外热像仪测量器件表面的温度分布，发现具有优化的环形插指电极结构的GaN基大功率LED表面温度分布比较均匀，证明芯片接触处电流扩展均匀，局部电流密度降低，减小了焦耳热的产生，增强了器件的可靠性.     

大功率GaN基发光二极管的电流扩展效应及电极结构优化研究

定性分析了GaN基LED的电流扩展效应,发现电流密度和电流横向扩展的有效长度对电流均匀扩展有很大影响.基于此,对GaN基大功率LED提出了优化的电极结构,以减缓电流拥挤效应,降低器件串联电阻.通过用红外热像仪测量器件表面的温度分布,发现具有优化的环形插指电极结构的GaN基大功率LED表面温度分布比较均匀,证明芯片接触处电流扩展均匀,局部电流密度降低,减小了焦耳热的产生,增强了器件的可靠性. 关键词： 氮化镓 发光二极管 电流扩展 电极结构优化     

影响倒装焊LED芯片电流分布均匀性的因素分析

为研究影响倒装LED芯片电流密度均匀分布的因素, 建立了芯片的三维有限元电学模型, 采用COMSOL有限元仿真方法, 分析了芯片尺寸、电极结构、电流注入点对倒装LED芯片电流分布均匀性的影响, 并对相关机理进行了探讨. 研究结果表明, 芯片尺寸的增加扩展了电流的横向传输路径与横向电阻, 使LED芯片电流分布的不均匀性呈指数型恶化; 叉指式电极结构可有效缩短电流传输途径, 增加叉指电极数目有利于电流均匀性的提高; 通过在块状电极上合理设计电流注入点可缩短电流传输路径, 显著提高电流的均匀性.     

插指型SiO_2电流阻挡层对大功率LED外量子效率的影响

为了改善蓝光大功率LED芯片p电极处的电流拥挤现象,提高大功率LED芯片的外量子效率,在ITO透明导电层与p-GaN间沉积插指型SiO_2电流阻挡层。采用等离子体增强化学气相沉积的方法沉积SiO_2薄膜,再经过光刻和BOE湿法刻蚀技术制备插指型SiO_2电流阻挡层。采用SimuLED仿真软件分析插指型SiO_2电流阻挡层对大功率LED芯片电流扩展性能的影响,研究插指型SiO_2电流阻挡层对大功率LED芯片外量子效率的影响。结果发现,插指型SiO_2电流阻挡层结构可以有效改善p电极附近的电流拥挤现象。与没有沉积插指型SiO_2电流阻挡层的大功率LED芯片相比,光输出功率得到显著的提高。在350 mA的输入电流下,沉积插指型SiO_2电流阻挡层后的大功率LED芯片的外量子效率提高了18.7%。     

GaN基LED电流扩展的有限元模型及电极结构优化

针对目前蓝宝石衬底上外延生长制备的GaN基半导体发光二极管(LED)器件存在电流分布不均匀的问题,建立了LED的电流扩展模型,提出了定量评价其特性的参数和标准。通过用有限元方法计算LED中电流的三维空间分布,对不同的电极结构进行了定量的比较,给出了优化的电极结构。计算结果显示,在相同工艺参数下,采用插指型电极结构的LED与采用传统型电极结构和扩展正极型电极结构的LED相比,电流扩展更均匀,串联电阻更小。在此基础上,对插指型电极结构作了进一步的参数优化,得出了使LED的串联电阻取最小值时的插指型电极的结构参数。根据优化得到的参数制作了相应的LED样品,并与采用扩展正极型电极结构的LED做了对比实验。实验结果表明,计算得出的结果与实验结果符合得很好。采用了优化后的插指型电极结构的LED与采用扩展正极型电极结构的LED相比,前者的串联电阻仅为后者的44.4%。     

高亮度大功率InGaAlP红光LED芯片研制

报道了大功率高亮度InGaAlP红光LED芯片的设计和工艺制备,实验芯片采用环形插指状电极。和传统的LED芯片相比较,环形插指状电极LED芯片电流扩展分布更均匀,而且更有利于与其它器件的集成。对制备好的芯片进行了I-V特性、光谱特性、光通量和光强的测量。芯片的电性能非常好,其开启电压VT为1.5V;当工作电压达到3V时,工作电流为500mA;在工作电流为350mA时,峰值波长为635nm,半峰全宽为16.4nm,光强为830mcd。在色度学测试中,色坐标为x=0.6943,y=0.3056,显色指数为18.4。因此可以得知高亮度大功率InGaAlP红光LED是未来LED作为普通照明光源应用的第一步,而且将会在科学研究和工业投资的很多应用领域中成为新的焦点。     

新型AlGaInP系发光二极管饱和特性与寿命的研究

针对AlGaInP系发光二极管(LED)电极阻挡出光、衬底吸收、全反射角小导致器件出光效率低、热积累大、饱和特性差等问题,提出了一种具有复合电流输运增透窗口层、复合DBR反射镜和电流阻挡层结构的新型LED,并测试了其饱和特性和寿命.电流分布模拟显示:新型LED电极下仅存在极小的无效电流;实验结果表明新型LED出光效率高,饱和电流大,饱和电流时光强约为常规LED的3倍,光电性能明显提升.器件饱和特性和老化实验研究显示:新型LED寿命长达17.8×104h,器件内部发热量低,具有高饱和特性和高可靠性,适合在大电流大功率下工作.     

高亮度大功率InGaAIP红光LED芯片研制

报道了大功率高亮度InGaAIP红光LED芯片的设计和工艺制备,实验芯片采用环形插指状电极。和传统的LED芯片相比较,环形插指状电极LED芯片电流扩展分布更均匀,而且更有利于与其它器件的集成。对制备好的芯片进行了I-V特性、光谱特性、光通量和光强的测量。芯片的电性能非常好,其开启电压VT为1．5V;当工作电压达到3V时,工作电流为500mA;在工作电流为350mA时,峰值波长为635nm,半峰全宽为16．4nm。光强为830mcd。在色度学测试中,色坐标为x=0．6943,y=0．3056,显色指数为18．4。因此可以得知高亮度大功率InGaAIP红光LED是未来LED作为普通照明光源应用的第一步,而且将会在科学研究和工业投资的很多应用领域中成为新的焦点。     

电流阻挡层对大功率LED光电热特性的影响

LED芯片作为LED光源的核心,其质量直接决定了器件的性能、寿命等,因此在内量子效率已达到高水平的情况下,致力于提高光提取效率是推动LED芯片技术发展的关键一步。由于蓝宝石衬底具有绝缘特性,传统LED将N和P电极做在芯片出光面的同一侧,而芯片出光面上的P电极焊盘金属会遮挡吸收其正下方发光区发出的大部分光而造成光损失,为改善这一现象并缓解P电极周围的电流拥挤效应,本文设计制备了在P电极正下方的氧化铟锡(ITO)透明导电层和p-GaN之间插入SiO_2薄膜作为电流阻挡层(CBL)的大功率LED,并与无CBL结构的大功率LED相比较。对未封装的有无CBL结构的LED在350 mA电流下进行正向偏压,辐射通量,主波长等裸芯性能测试,结果显示两种芯片的正向偏压均集中在3～3.1 V,而有CBL结构的LED光输出功率有明显提升,这是因为CBL阻挡了电流在P电极正下方的扩散,减少流向有源区的电流密度,故减小了P电极对光的吸收和遮挡,且电流通过CBL引导至远离P电极的区域,缓解了电极周围的电流拥挤。对两种芯片进行相同结构和工艺条件的封装,并对封装样品进行热特性及10～600 mA的变电流光电特性测试,得到两种器件的发光光谱及光功率等光学特性。结果表明随着电流增加,两种器件的光谱曲线均发生蓝移,且有CBL结构的LED主波长偏移量较无CBL结构LED少10 nm,可见有CBL结构的LED光谱受驱动电流变化的影响更小,因此其显色性能更为稳定。而在小电流条件下, CBL对器件光功率的影响不大,随着工作电流的增大, CBL对器件光功率的改善效果逐渐提升。在大电流条件下,无CBL结构的LED结温更高,正向电压更低,随电流的增大二者之间的电压差增大。在25℃的环境温度, 350 mA工作电流下,加入CBL结构使器件电压升高约0.04 V,但器件光功率最高提升了9.96%,且热阻明显小于无CBL结构器件,说明有CBL结构LED产热更少。因此CBL结构大大提高了器件的光提取效率,并使其光谱漂移更小,显色性能更为稳定。     

电流主动导引结构倒装AlGaInP LED

设计并制备了一种带有电流导引结构的新型倒装AlGaInP LED。实验结果表明,在20mA直流电流注入下,器件的电压为2.19V,输出光功率与普通倒装器件相比提高了17.33%。通过电流导引结构,使得器件注入电流被主动引导到电极以外部分,有效增大了上电极以外部分有源区中用于发光的有效载流子数目的比例,同时减轻了电流密度过大现象,大大提高了器件的出光效率。     

High power and high reliability GaN/InGaN flip-chip light-emitting diodes

High-power and high-reliability GaN/InGaN flip-chip light-emitting diodes (FCLEDs) have been demonstrated by employing a flip-chip design, and its fabrication process is developed. FCLED is composed of a LED die and a submount which is integrated with circuits to protect the LED from electrostatic discharge (ESD) damage. The LED die is flip-chip soldered to the submount, and light is extracted through the transparent sapphire substrate instead of an absorbing Ni/Au contact layer as in conventional GaN/InGaN LED epitaxial designs. The optical and electrical characteristics of the FCLED are presented. According to ESD IEC61000-4-2 standard (human body model), the FCLEDs tolerated at least 10\,kV ESD shock have ten times more capacity than conventional GaN/InGaN LEDs. It is shown that the light output from the FCLEDs at forward current 350mA with a forward voltage of 3.3\,V is 144.68\,mW, and 236.59\,mW at 1.0\,A of forward current. With employing an optimized contact scheme the FCLEDs can easily operate up to 1.0\,A without significant power degradation or failure. The life test of FCLEDs is performed at forward current of 200\,mA at room temperature. The degradation of the light output power is no more than 9\% after 1010.75\,h of life test, indicating the excellent reliability. FCLEDs can be used in practice where high power and high reliability are necessary, and allow designs with a reduced number of LEDs.     

ITO界面调制层对GZO电极LED器件性能的影响

采用磁控溅射制备GZO和具有ITO界面调控层的GZO(ITO/GZO)透明导电薄膜作为大功率LED的电流扩散层,对比研究界面调控层对LED器件性能的影响。研究结果表明,ITO/GZO薄膜的透过率在可见光区达80%以上,退火后的ITO/GZO薄膜有较低的电阻率(1.15×10^-3 Ω·cm)。ITO调控层的介入能够调制GZO表面粗糙度,有利于改善LED外量子效率,降低GZO/p-GaN界面的接触势垒,提高LED器件的光电性 能。通过ITO界面调控后,LED器件20 mA驱动电流下的工作电压从9.5 V降低为6.8 V,发光强度从245 mcd 升到297 mcd,提高了20%;驱动电流为35 mA时,其发光强度从340.5 mcd 升到511 mcd,提高了50%。     

Improvement of the light output and contact resistance of InGaN-based light-emitting diodes based on tantalum-doped indium tin oxide as p-type electrodes

This paper reports that highly transparent and low resistance tantalum-doped indium tin oxide (Ta-doped ITO) films contacted to p-type GaN have been prepared by the electron-beam evaporation technique. The Ta-doped ITO contacts become Ohmic with a specific contact resistance of $\sim 5.65\times 10^{ - 5}$~$\Omega \cdot$cm$^{2}$ and show the transmittance of $\sim $98% at a wavelength of 440~nm when annealed at 500~\du. Blue light emitting diodes (LEDs) fabricated with Ta-doped ITO p-type Ohmic contact layers give a forward-bias voltage of 3.21~V at an injection current of 20~mA. It further shows that the output power of LEDs with Ta-doped ITO contacts is enhanced 62% at 20~mA in comparison with that of LEDs with conventional Ni/Au contacts.     

High efficiency and enhanced ESD properties of UV LEDs by inserting p-GaN/p-AlGaN superlattice

Significantly improved electrostatic discharge(ESD)properties of InGaN/GaN-based UV light-emitting diode(LED)with inserting p-GaN/p-AlGaN superlattice(p-SLs)layers(instead of p-AlGaN single layer)between multiple quantum wells and Mg-doped GaN layer are reported.The pass yield of the LEDs increased from 73.53%to 93.81%under negative 2000 V ESD pulses.In addition,the light output power(LOP)and efficiency droop at high injection current were also improved.The mechanism of the enhanced ESD properties was then investigated.After excluding the effect of capacitance modulation,high-resolution X-ray diffraction(XRD)and atomic force microscope(AFM)measurements demonstrated that the dominant mechanism of the enhanced ESD properties is the material quality improved by p-SLs,which indicated less leakage paths,rather than the current spreading improved by p-SLs.     

Degradation behaviors of high power GaN-based blue light emitting diodes

The degradation mechanism of high power InGaN/GaN blue light emitting diodes(LEDs)is investigated in this paper.The LED samples were stressed at room temperature under 350-mA injection current for about 400 h.The light output power of the LEDs decreased by 35%during the first 100 h and then remained almost unchanged,and the reverse current at 5 V increased from 10 9A to 10 7A during the aging process.The power law,whose meaning was re-illustrated by the improved rate equation,was used to analyze the light output power-injection current(L–I)curves.The analysis results indicate that nonradiative recombination,Auger recombination,and the third-order term of carriers overflow increase during the aging process,all of which may be important reasons for the degradation of LEDs.Besides,simulating L–I curves with the improved rate equation reveal that higher-than-third-order terms of carriers overflow may not be the main degradation mechanism,because they change slightly when the LED is stressed.     

Si(110)和Si(111)衬底上制备InGaN/GaN蓝光发光二极管

分别在Si(110)和Si(111)衬底上制备了In Ga N/Ga N多量子阱结构蓝光发光二极管(LED)器件.利用高分辨X射线衍射、原子力显微镜、室温拉曼光谱和变温光致发光谱对生长的LED结构进行了结构表征.结果表明,相对于Si(111)上生长LED样品,Si(110)上生长的LED结构晶体质量较好,样品中存在较小的张应力,具有较高的内量子效率.对制备的LED芯片进行光电特性分析测试表明,两种衬底上制备的LED芯片等效串联电阻相差不大,在大电流注入下内量子效率下降较小;但是,相比于Si(111)上制备LED芯片,Si(110)上LED芯片具有较小的开启电压和更优异的发光特性.对LED器件电致发光(EL)发光峰随驱动电流的变化研究发现,由于Si(110)衬底上LED结构中阱层和垒层存在较小的应力/应变而在器件中产生较弱的量子限制斯塔克效应,致使Si(110)上LED芯片EL发光峰随驱动电流的蓝移量更小.