介质中双缺陷电荷对碳纳米管场效应晶体管量子输运特性的影响

用非平衡格林函数理论和紧束缚模型近似计算长沟道弹道输运p型碳纳米管场效应管中电流强度.研究当场效应管介质（SiO₂）中存在两个带电缺陷时，载流子散射所引起的电流强度减小和栅极阈值电压偏移量与缺陷位置的关系.介质中两个缺陷所带电荷Q₁=Q₂=+e（-e为电子电荷），都靠近源极或者都靠近漏极，或者一个电荷靠近源极另一个电荷靠近漏极.在工作状态下，所引起的电流强度相对减小比介质中只存在单个正电荷Q=+e且靠近源极（或漏极）时所引起的电流强度相对减小大得多.如果两个正电荷都在沟道中央附近，随着两个电荷的轴向距离减小，栅极阈值电压偏移的绝对值明显增加.栅极阈值电压偏移可达到-0.35 V.     

Study on the negative bias temperature instability effect under dynamic stress

This paper studies negative bias temperature instability (NBTI) under alternant and alternating current (AC) stress.Under alternant stress,the degradation smaller than that of single negative stress is obtained.The smaller degradation is resulted from the recovery of positive stress.There are two reasons for the recovery.One is the passivation of H dangling bonds,and another is the detrapping of charges trapped in the oxide.Under different frequencies of AC stress,the parameters all show regular degradation,and also smaller than that of the direct current stress.The higher the frequency is,the smaller the degradation becomes.As the negative stress time is too small under higher frequency,the deeper defects are hard to be filled in.Therefore,the detrapping of oxide charges is easy to occur under positive bias and the degradation is smaller with higher frequency.     

细菌视紫红质膜的光电荷转移 动力学过程的研究

实验测量了细菌视紫红质（bR）分别经波长为1064nm、532nm和355nm,脉冲宽度为10ns的三种不同的脉冲激光照射后产生的不同的光电压信号,着重用532nm脉冲光激发样品,从变化的测量回路的阻抗所得到的不同光电信号情况,研究并分析了细菌视紫红质的光电荷的产生和转移的微观机制。结果表明,其正负脉冲光电压信号是正负两种电荷移动的结果,而正电荷的产生比负电荷的产生和转移的微观机制。结果表明,其正负脉冲光电压信号是正负两种电荷移动的结果,而正电荷的产生比负电荷的产生需要克服更高的能量,同时,正负电荷既具有各自的转移特性又相互影响,如正电荷移动速度慢,负电荷移动速度快,负电荷对正电荷有牵引作用等,这些特性与电极和样品之间形成的界面效应有关,它使得细菌视紫红质的光电压信号的幅值和宽度对外接电阻的关系具有与其他光电响应器件所不同的特性。     

Study on the degradation of NMOSFETs with ultra-thin gate oxide under channel hot electron stress at high temperature

This paper studies the degradation of device parameters and that of stress induced leakage current (SILC) of thin tunnel gate oxide under channel hot electron (CHE) stress at high temperature by using n-channel metal oxide semiconductor field effect transistors (NMOSFETs) with 1.4-nm gate oxides. The degradation of device parameters under CHE stress exhibits saturating time dependence at high temperature. The emphasis of this paper is on SILC of an ultra-thin-gate-oxide under CHE stress at high temperature. Based on the experimental results, it is found that there is a linear correlation between SILC degradation and V_h degradation in NMOSFETs during CHE stress. A model of the combined effect of oxide trapped negative charges and interface traps is developed to explain the origin of SILC during CHE stress.     

总剂量辐照下沟道长度对部分耗尽绝缘体上硅p型场效应晶体管电特性的影响

本文通过实验研究了0.8μm PD(Partially Depleted)SOI(Silicon-On-Insulator)p型Metal-oxidesemiconductor-feld-efect-Transistor(MOSFET)经过剂量率为50 rad(Si)/s的60Coγ射线辐照后的总剂量效应,分析了沟道长度对器件辐照效应的影响.研究结果表明:辐照总剂量相同时,短沟道器件的阈值电压负向漂移量比长沟道器件大,最大跨导退化的更加明显.通过亚阈值分离技术分析得到,氧化物陷阱电荷是引起阈值电压漂移的主要因素.与长沟道器件相比,短沟道器件辐照感生的界面陷阱电荷更多.     

沟道宽度对ZnO-TFT电学性能的影响

用射频磁控溅射法生长的ZnO薄膜作为有源层,制备出了ZnO基薄膜晶体管(ZnO-TFT),并在空气环境下350℃退火1 h,研究了沟道宽度对ZnO-TFT器件性能的影响。实验结果表明:阈值电压随着沟道宽度的减小而增加,这是由于沟道越窄,载流子被捕获的几率越大,在相同栅压下沟道内可动载流子浓度越小,相应的阈值电压就越大;饱和迁移率随着沟道宽度的减小而增加,认为这是由源/漏电阻的侧壁效应及边缘电子场效应引起的附加电流所致。     

超深亚微米PMOS器件的NBTI退化机理

对超深亚微米PMOS器件的负栅压温度不稳定性(NBTI)退化机理进行了研究.主要集中在对器件施加NBT和随后的PBT应力后器件阈值电压的漂移上.实验证明反型沟道中空穴在栅氧中的俘获以及氢分子在栅氧中的扩散是引起NBTI退化的主要原因.当应力条件变为PBT时，陷落的空穴可以快速退陷，但只有部分氢分子可以扩散回栅氧与衬底界面钝化硅悬挂键，这就导致了PBT条件下阈值电压只能部分恢复. 关键词： 超深亚微米PMOS器件 负偏压温度不稳定性 界面陷阱 氢气     

深亚微米器件沟道长度对总剂量辐照效应的影响

研究了180 nm 互补金属氧化物半导体技术下的器件沟道长度对总剂量辐照效应的影响. 在其他条件如辐照偏置、器件结构等不变的情况下, 氧化层中的陷阱电荷决定了辐照响应. 浅沟槽隔离氧化层中的陷阱电荷使得寄生的侧壁沟道反型, 从而形成大的关态泄漏电流. 这个电流与沟道长度存在一定的关系, 沟道长度越短, 泄漏电流越大. 首次发现辐照会增强这个电流的沟道长度调制效应, 从而使得器件进一步退化.     

Total ionizing dose effect in an input/output device for flash memory

Input/output devices for flash memory are exposed to gamma ray irradiation. Total ionizing dose has been shown great influence on characteristic degradation of transistors with different sizes. In this paper, we observed a larger increase of off-state leakage in the short channel device than in long one. However, a larger threshold voltage shift is observed for the narrow width device than for the wide one, which is well known as the radiation induced narrow channel effect. The radiation induced charge in the shallow trench isolation oxide influences the electric field of the narrow channel device. Also, the drain bias dependence of the off-state leakage after irradiation is observed, which is called the radiation enhanced drain induced barrier lowing effect. Finally, we found that substrate bias voltage can suppress the off-state leakage, while leading to more obvious hump effect.     

发射光谱研究多针对板正电晕放电形貌

利用光学发射光谱(OES)法检测N₂发射光谱,研究了常压下多针对板正电晕放电中辉光放电和击穿流光放电的高能电子分布,并与相同电极结构下负电晕放电进行了比较。根据N₂第二正态激发谱峰I_SPB在空间的分布,较精确地确定了辉光放电电离区形貌和击穿流光放电电通道形貌,体积分辉光放电中I_SPB获知I_SPB与放电电流I之间的关系。辉光放电中,电离区范围和I_SPB比负电晕放电小,电子雪崩沿针径向比沿轴向发展范围大;随着U升高,电离区范围只沿针轴向小幅度增大;I_SPB的积分值与I近似成二阶线性关系。击穿流光放电中,针板之间形成放电通道;针尖周围I_SPB较强的区域成“子弹状”,距离针尖较远的放电通道内高能电子密度沿针轴向分布比较均匀,沿针径向先略有增大后减小。     

Total-Ionizing-Dose-Induced Body Current Lowering in the 130 nm PDSOI I/O NMOSFETs

The body current lowering effect of 130 nm partially depleted silicon-on-insulator(PDSOI) input/output(I/O)n-type metal-oxide-semiconductor field-effect transistors(NMOSFETs) induced by total-ionizing dose is observed and analyzed. The decay tendency of current ratio of body current and drain current I_b/I_d is also investigated.Theoretical analysis and TCAD simulation results indicate that the physical mechanism of body current lowering effect is the reduction of maximum lateral electric field of the pinch-off region induced by the trapped charges in the buried oxide layer(BOX). The positive charges in the BOX layer can counteract the maximum lateral electric field to some extent.     

Degradation mechanisms for polycrystalline silicon thin-film transistors with a grain boundary in the channel under negative gate bias stress

The negative gate bias stress (NBS) reliability of n-type polycrystalline silicon (poly-Si) thin-film transistors (TFTs) with a distinct defective grain boundary (GB) in the channel is investigated. Results show that conventional NBS degradation with negative shift of the transfer curves is absent. The on-state current is decreased, but the subthreshold characteristics are not affected. The gate bias dependence of the drain leakage current at V_ds of 5.0 V is suppressed, whereas the drain leakage current at V_ds of 0.1 V exhibits obvious gate bias dependence. As confirmed via TCAD simulation, the corresponding mechanisms are proposed to be trap state generation in the GB region, positive-charge local formation in the gate oxide near the source and drain, and trap state introduction in the gate oxide.     

高场应力及栅应力下AlGaN/GaN HEMT器件退化研究

采用不同的高场应力和栅应力对AlGaN/GaN HEMT器件进行直流应力测试,实验发现：应力后器件主要参数如饱和漏电流,跨导峰值和阈值电压等均发生了明显退化,而且这些退化还是可以完全恢复的;高场应力下,器件特性的退化随高场应力偏置电压的增加和应力时间的累积而增大;对于不同的栅应力,相对来说,脉冲栅应力和开态栅应力下器件特性的退化比关态栅应力下的退化大.对不同应力前后器件饱和漏电流,跨导峰值和阈值电压的分析表明,AlGaN势垒层陷阱俘获沟道热电子以及栅极电子在栅漏间电场的作用下填充虚栅中的表面态是这些不同应 关键词： AlGaN/GaN HEMT器件 表面态(虚栅) 势垒层陷阱 应力     

绝缘体上硅金属氧化物半导体场效应晶体管中辐射导致的寄生效应研究

基于⁶⁰Co γ射线源研究了总剂量辐射对绝缘体上硅（silicon on insulator,SOI）金属氧化物半导体场效应晶体管器件的影响.通过对比不同尺寸器件的辐射响应,分析了导致辐照后器件性能退化的不同机制.实验表明：器件的性能退化来源于辐射增强的寄生效应;浅沟槽隔离（shallow trench isolation,STI）寄生晶体管的开启导致了关态漏电流随总剂量呈指数增加,直到达到饱和;STI氧化层的陷阱电荷共享导致了窄沟道器件的阈值电压漂移,而短沟道器件的阈值电压漂移则来自于背栅阈值耦合;在同一工艺下,尺寸较小的器件对总剂量效应更敏感.探讨了背栅和体区加负偏压对总剂量效应的影响,SOI器件背栅或体区的负偏压可以在一定程度上抑制辐射增强的寄生效应,从而改善辐照后器件的电学特性.     

部分耗尽结构绝缘体上硅器件的低频噪声特性

针对部分耗尽结构绝缘体上硅(silicon-on-insulator, SOI)器件低频噪声特性展开实验与理论研究. 实验结果表明, 器件低频噪声主要来源于SiO₂-Si界面附近缺陷态对载流子的俘获与释放过程; 基于此理论可提取前栅和背栅氧化层界面附近缺陷态密度分别为8×10¹⁷ eV^-1·cm^-3和2.76×10¹⁷ eV^-1·cm^-3. 基于电荷隧穿机理, 在考虑隧穿削弱因子、隧穿距离与时间常数之间关系的基础上, 提取了前、背栅氧化层内缺陷态密度随空间的分布情况. 此外, SOI器件沟道电流归一化噪声功率谱密度随沟道长度的增加而线性减小, 这表明器件低频噪声主要来源于沟道的闪烁噪声. 最后, 基于电荷耦合效应, 分析了背栅电压对前栅阈值电压、沟道电流以及沟道电流噪声功率谱密度的影响.     

以能带理论诠释直流聚乙烯绝缘中空间电荷的形成和抑制机理

高压直流塑料交联聚乙烯电缆的研发难点是消除其中的空间电荷效应. 目前, 国内外学者普遍通过添加纳米粒子在聚乙烯体内形成深陷阱捕获电荷的机理来抑制电荷积聚, 但此抑制机理违背了电场的基本理论. 以能带理论全面阐述聚合物介质中空间电荷的形成和抑制机理, 从一级陷阱模型出发, 应用电荷入陷和脱陷动力方程, 推导了聚合物介质中空间电荷的形成过程. 在聚合物介质中引入深陷阱后, 介质Fermi能级位移, 电极与介质之间界面接触由Ohm接触转变为阻塞接触. 考虑到无定形相中大量的陷阱密度, 电荷耗尽区宽度小于100 Å, 电极与介质之间的界面对电子变得透明, 形成中性接触, 在电压作用下, 这种聚乙烯介质中不再可能形成空间电荷. 最后, 在纯聚乙烯和纳米改性后含有深陷阱的聚乙烯两种试样上, 分别测量了电导与电场强度的关系和空间电荷分布曲线, 实验结果符合理论推导. 关键词： 直流绝缘 能带理论 空间电荷 抑制机理     

Mechanism of NBTI Recovery under Negative Voltage Stress

Recovery phenomenon is observed under negative gate voltage stress which is smaller than the previous degradation stress. We focus on the drain current to study the degradation and recovery of negative bias temperature instability (NBTI) with a real-time method. By this method, different recovery phenomena among different size devices are observed. Under negative recovery stress, the drain current gradually recovers for the large size devices and gets into recovery saturation when long recovery time is involved. For small-size devices, a step-like recovery of drain current is observed. The recovery of the drain current is mainly caused by the holes detrapping and tunnelling back to the channel surface which are trapped in oxide. The model of hole detrapping explains the recovery under negative voltage stress reasonably.     

串口型铁电存储器总剂量辐射损伤效应和退火特性

对一款商用串口I2C型铁电存储器进行了⁶⁰Coγ 辐射和退火实验, 研究了铁电存储器的总剂量效应和退火特性. 使用了超大规模集成电路测试系统测试了铁电存储器的DC, AC, 功能参数, 分析了辐射敏感参数在辐射和退火过程中的变化规律. 实验结果表明: 总剂量辐射在器件内产生大量氧化物陷阱电荷, 造成了铁电存储器外围控制电路MOS管阈值向负向漂移, 氧化物陷阱电荷引入附加电场使铁电薄膜受肖特基发射或空间电荷限制电流的作用, 产生辐射感生漏电流. 由于浅能级亚稳态的氧化物陷阱电荷数量上多于深能级氧化物陷阱电荷, 使得器件功能和辐射敏感参数在常温退火过程中快速恢复. 关键词： 铁电存储器 总剂量辐射 退火特性     

Degradation characteristics and mechanism of PMOSFETs under NBT--PBT--NBT stress

Degradation characteristics of PMOSFETs under negative bias temperature--positive bias temperature--negative bias temperature (NBT--PBT--NBT) stress conditions are investigated in this paper. It is found that for all device parameters, the threshold voltage has the largest shift under the first NBT stress condition. When the polarity of gate voltage is changed to positive, the shift of device parameters can be greatly recovered. However, this recovery is unstable. The more severe degradation appears soon after reapplication of NBT stress condition. The second NBT stress causes in linear drain current to degrade greatly, which is different from that of the first NBT stress. This more severe parameter shift results from the wear out of silicon substrate and oxide interface during the first NBT and PBT stress due to carrier trapping/detrapping and hydrogen related species diffusion.     

Exploring the effect of width on performance enhancement in NMOSFETs with a silicon-carbon alloy stressor and a tensile stress silicon nitride liner

The stress distribution in the Si channel regions of a SiC source/drain and stressed silicon nitride liner NMOSFETs with various widths were studied using 3D simulations. The mobility enhancement was found to be dominated by the tensile stress along the transport direction. Stress along the width direction was found to have the least effect on the drain current. The compressive stress along the vertical direction perpendicular to the gate oxide (S_zz) contributes significantly to the mobility enhancement and cannot be neglected in NMOSFETs with a width between 0.05 and 1 μm. The impact of width on performance improvements such as the drive current gain was also analyzed.