Determination of epoxy groups in epoxy resins by reaction-based headspace gas chromatography

This work reports on a new method for the determination of epoxy groups in epoxy resins by reaction-based headspace gas chromatography (HS-GC). After epoxy resins reacted with hydrochloric acid (HCl) solution, the remaining HCl reacted with bicarbonate solution in a closed headspace vial to form carbon dioxide that was measured by HS-GC. It was found that the first reaction can be finished in 30 min at room temperature and the second reaction, together with headspace equilibration, can be achieved within 15 min at 60 °C. The results showed that the method has a good precision and accuracy, in which the relative standard deviation in the repeatability measurement was 4.20%, and the relative differences between the data obtained by the HS-GC method and the reference method were within 8.04%. The present method is simple, efficient, and suitable for the used in the epoxy resin related research and applications.     

Preparation, thermal properties and flame retardancy of phosphorus- and silicon-containing epoxy resins

Phosphorus- and silicon-containing epoxy resins were prepared from (2,5-dihydroxyphenyl)diphenyl phosphine oxide (Gly-HPO), diglycidyloxy methylphenyl silane (DGMPS) and 1,4-bis(glycidyloxydimethyl silyl)-benzene (BGDMSB) as epoxy monomers and diaminodiphenylmethane (DDM), bis(3-aminophenyl)methyl phosphine oxide (BAMPO) and bis(4-aminophenoxy)dimethyl silane (APDS) as curing agents. Epoxy resins with different phosphorus and silicon content were obtained. Their thermal, dynamic mechanical and flame retardant properties were evaluated. The high LOI values confirmed that epoxy resins containing hetero-atoms are effective flame retardants, but a synergistic efficiency of phosphorus and silicon on flame retardation was not observed.     

Glass-reinforced epoxy novolac composites

Epoxy Phenolic novolac resins were prepared from the acid catalyzed condensation products of various phenols such as phenol, p-cresol, p-tert-butyl-phenol and cardanol with formaldehyde. All of these resins have been utilized to prepare the glass-reinforced composites. The fabricated composites were evaluated for their mechanical and dielectric properties. The incorporation of an epoxy fortifier yielded a significant improvement in mechanical properties.     

Kinetics and thermal properties of epoxy resins based on bisphenol fluorene structure

The fluorene-containing epoxy, diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) was synthesized by a two-step reaction procedure. In order to investigate the relationship between fluorene structure and material properties, DGEBF and a commonly used diglycidyl ether of bisphenol A (DGEBA) were cured with 4,4-diaminodiphenyl methane (DDM) and 4,4-(9-fluorenylidene)-dianiline (FDA). The curing kinetics, thermal properties and decomposition kinetics of these four systems (DGEBA/DDM, DGEBF/DDM, DGEBA/FDA, and DGEBF/FDA) were studied in detail. The curing reactivity of fluorene epoxy resins was lower, but the thermal stability was higher than bisphenol A resins. The onset decomposition temperature of cured epoxy resins was not significantly affected by fluorene structure, but the char yield and T_g value were increased with that of fluorene content. Our results indicated that the addition of fluorene structure to epoxy resin is an effective method to improve the thermal properties of resins, but excess fluorene ring in the chain backbone can depress the curing efficiency of the resin.     

Dilute solution properties of epoxy resins

Number-average molecular weights of fractions of epoxy resins were estimated by vapor-pressure osmometry and size exclusion chromatography coupled with multiple-angle light scattering. Potential reasons for differences between the two sets of data are examined. The molecular weight dependences of the intrinsic viscosity in tetrahydrofuran and chloroform are discussed in terms of theories which take into account the low-molecular weight character of poly(hydroxy ether) chains. The polymer-solvent interaction parameter is estimated. The impact of the presence of branched chains on the results of size exclusion chromatography is examined. It is shown that the universal calibration of size exclusion chromatographic columns by polystyrene is reliable at molecular weights above 2000 only.     

Synthesis and thermal properties of epoxy resins from ester-carboxylic acid derivative of alcoholysis lignin

Alcoholysis lignin (AL) was dissolved in ethylene glycol and the obtained mixture was reacted with succinic anhydride to form a mixture of ester-carboxylic acid derivatives (AL-polyacid, ALPA). Ethylene glycol-polyacid (EGPA) was also prepared from ethylene glycol. The obtained mixture of ester carboxylic acid derivatives was treated with ethylene glycol diglycidyl ether in the presence of catalytic amount of dimethylbenzylamine to form ester-epoxy resins. The curing reaction was analyzed by Ozawa's method using differential scanning calorimetry. The activation energy of curing reaction in the initial step was found to be ca. 84 kJ mol⁻¹. The molar ratios of epoxy groups to carboxylic acid groups ([EPOXY]/[AA] ratios) were varied from 0.8 to 1.3. The contents of ALPA in the mixture of ALPA and EGPA were also varied from 0 to 100%. Thermal properties of epoxy resins were studied by DSC and thermogravimetry. Glass transition temperatures of epoxy resins showed a maximum value of −11.5 °C when [EPOXY]/[AA] ratio was 1.1. T_g increased with increasing ALPA contents suggesting that lignin acts as a hard segment in epoxy resin networks. Thermal degradation temperatures of epoxy resins slightly decreased with increasing ALPA contents.     

Strategies for synthesis of epoxy resins from oleic acid derived from food wastes

The use of biomass‐sourced chemical feedstocks creates a conflict over land use between food and fuel/chemical production. Such conflict could be reduced by making use of the annual 1.3 Pg food waste resource. Oleic acid is available from seed oils such as pumpkin, grape, avocado and mango. Its esterification with diols 1,3‐propanediol, resorcinol and orcinol was used to form diesters and the naturally occurring norspermidine was used to prepare a diamide, all under ambient conditions. These compounds were then epoxidized and polymerized. When esterification was followed by epoxidation and subsequent curing at elevated temperature with p‐phenylenediamine or diethylenetriamine, hard insoluble resins were formed. When the sequence was changed such that the epoxidized oleic acid was first reacted with cis‐1,2‐cyclohexanedicarboxylic anhydride and then esterified with orcinol and resorcinol, insoluble crosslinked polymers were also obtained. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 3159–3170     

Silicon-containing flame retardant epoxy resins: Synthesis, characterization and properties

Epoxy resins with different silicon contents were prepared from silicon-containing epoxides or silicon-containing prepolymers by curing with 4,4′-diaminodiphenylmethane. The reactivity of the silicon-based compounds toward amine curing agents was higher than that of the conventional epoxy resins. The T_g of the resulting thermosets was moderate and decreased when the silicon content increased. The onset decomposition temperatures decreased and the char yields increased when the silicon content increased. Epoxy resins had a high LOI value, according to the efficiency of silicon in improving flame retardance.     

Thermal stability of microencapsulated epoxy resins with poly(urea-formaldehyde)

A series of microcapsules filled with epoxy resins with poly(urea-formaldehyde) (PUF) shell were synthesized by in situ polymerization, and they were heat-treated for 2 h at 100 °C, 120 °C, 140 °C, 160 °C, 180 °C and 200 °C. The effects of surface morphology, wall shell thickness and diameter on the thermal stability of microcapsules were investigated. The chemical structure and surface morphology of microcapsules were investigated using Fourier-transform infrared spectroscope (FTIR) and scanning electron microscope (SEM), respectively. The thermal properties of microcapsules were investigated by thermogravimetric analysis (TGA and DTA) and by differential scanning calorimetry (DSC). The thermal damage mechanisms of microcapsules at lower temperature (<251 °C) are the diffusion of the core material out of the wall shell or the breakage of the wall shell owing to the mismatch of the thermal expansion of core and shell materials of microcapsules. The thermal damage mechanisms of microcapsules at higher temperature (>251 °C) are the decomposition of shell material and core materials. Increasing the wall shell thickness and surface compactness can enhance significantly the weight loss temperatures (T_d) of microcapsules. The microcapsules with mean wall shell thickness of 30 ± 5 μm and smoother surface exhibit higher thermal stability and can maintain quite intact up to approximately 180 °C.     

Frontal cationic curing of epoxy resins

We studied the frontal curing of trimethylolpropane triglycidyl ether (TMPTGE) using two BF₃‐amine initiators and two fillers, kaolin and fumed silica. In the case of kaolin, the range of concentrations allowing for frontal polymerization to propagate was dependent on its heat absorption effect whereas in the case of silica it was a consequence of the rheological features of this additive. However, for both systems the velocity and front temperature show the same trends; in all cases front velocities were on the order of 1 cm/min with front temperatures about 200 °C. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 2000–2005, 2010     

Synthesis of oligomeric epoxycyclotriphosphazenes and their properties as reactive flame-retardants for epoxy resins

Hydroxyaryloxycyclophosphazenes containing 2–4 OH groups have been synthesized by the substitution of chlorine atoms of hexachlorocyclotriphosphazene via the reaction with sodium phenolates of halogenophenols followed by the interaction with sodium monophenolate of diphenylolpropane. Oligoepoxyphosphazenes (OEPs) with molecular masses up to 2000 and the contents of epoxy groups, phosphorus, and halogens atoms about 5–8, 5–8, and 5–11%, respectively, have been obtained via the interaction of the aforementioned phosphazenes with epichlorohydrin. The curing of the OEPs with amines or acid anhydrides gives rise to the formation of self-extinguishing composites. The incorporation of the OEPs (5–75 wt %) into commercial epoxy resins followed by their curing, results in the formation of composites with excellent nonflammability or capability of self-quenching, and good dielectric, heat resistant and mechanical properties. It has been established that mixtures of common epoxides with different amounts of the OEPs can be synthesized by a “single-reactor” method.     

Studies on polymers and composites from lignin and fiber derived from sugar cane

Sugarcane fiber (i.e. bagasse) lignin has a larger fraction of aromatics unsubstitution in the ortho position than hardwood or softwood lignin and hence has the greater ability to be derivatized. Furthermore, organosolv lignin has a higher purity than sulfonated and kraft lignins. This work examines the purification of organosolv lignin derived from bagasse and the physico‐chemical properties of the lignin and lignin‐phenol formaldehyde (PF) resin coatings, and composites. The wetability tests have shown that lignin and lignin‐PF resin films are effective water barrier coatings, though the contact angles of lignin‐PF resin films were considerably less than the wax films. The overall mechanical properties (i.e. peak stress, peak strain and modulus) of the bagasse fiber composites were lower than the values obtained with the composites without the inclusion of bagasse fiber. Copyright © 2007 John Wiley & Sons, Ltd.     

Luminescence spectroscopy as a tool for testing of cure kinetics of epoxy resins

In this paper, steady-state luminescence spectroscopy is used for the analysis of curing of epoxy resin. The advantage of this method is its rapidity, simplicity and sensitivity. Moreover, this method is contactless, and thus non-invasive. The aim is to analyze epoxy resin, mathematically describe its curing kinetics and determine its storage temperature. Using the photoluminescence method, a rapid procedure for obtaining the necessary technological data is achieved. This method is suitable for continuous measurement in production because there is no contact with the material, and the measurement itself can be performed very quickly. The elaborated mathematical model can serve as a basis for creating algorithms for automated data processing in case of fully robotic workplaces.     

Investigation of the curing reactions of some multifunctional epoxy resins using differential scanning calorimetry

Curing reaction of three tetrafunctional epoxy resins in the presence of tetraethylene tetramine was examined by differential scanning calorimetry at different heating rates. The kinetic parameters of the curing reaction were determined using various computational methods (Barrett, Borchardt–Daniels and Kissinger). The heating rate shows a great influence on the curing process. The activation energy varied in the range 43–80 kJ/mol, and the order of the curing reaction is observed to be ≈1.0 with slight variations.     

A new ultrasonic measurement system for the cure monitoring of thermosetting resins and composites

Measurements of the ultrasonic sound speed of thermosetting resins and composites can be used as an in-process cure monitoring technique. Ultrasonic measurements have an advantage over other in-process techniques in that ultrasonic sensors do not make contact with the part (thus leaving no imbedded sensor or witness mark) and can make true bulk measurements of the part. A new commercially available ultrasonic cure monitoring system has been developed which easily enables ultrasonic measurements to be made in compression molding, resin transfer molding, and autoclave processes. Advancements in ultrasonic sensor technology enable the sensor to maintain good coupling to the part during thermal cycling to 260C. Data is presented showing the change in ultrasonic sound speed during the compression molding of a graphite-epoxy prepreg. The data shows a good relationship to the ionic conductivity and resistivity data collected via dielectric cure monitoring.This effort was sponsored by the Manufacturing Technology Directorate, Wright Laboratory (WL/MTX), Air Force Material Command, USAF, under cooperative agreement award(s) to NCMS. The U. S. Government is authorized to reproduce and distribute reprints for Governmental purposes notwithstanding any copyright notation thereon. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of Wright Laboratory or the U.S. Government.     

Syntheses and characterizations of thermally reworkable epoxy resins II

Flip‐chip technology is a face‐down attachment of the active side of the silicon device onto the substrate. It is the ultimate packaging solution to integrated circuit devices used in 21st century electronic systems to meet the requirements of small size, high performance, and low cost. Underfill technology enhances the flip chip on board cycle fatigue life and thus dramatically extends the application of flip‐chip technology in electronics from high‐end to cost‐sensitive commodity products. Reworkable underfill is the key to addressing the nonreworkability of the underfill, so it is very important to electronic packaging. To meet the need for reworkable epoxy resins, four cycloaliphatic epoxides containing thermally cleavable carbonate linkages have been synthesized and characterized. These materials are shown to undergo curing reactions with cyclic anhydride similarly to a commercial cycloaliphatic diepoxide. Furthermore, these cured epoxides start to decompose at temperatures lower than 350 °C, the decomposition temperature for the cured sample of the commercial cycloaliphatic diepoxide. Two formulations based on two carbonate‐containing diepoxides start network breakdown around 220 °C, which is the targeted rework temperature. Moreover, these two formulations have similar properties, including the glass‐transition temperature, coefficient of thermal expansion, storage modulus, viscosity, and adhesion, compared to the standard commercial diepoxide formulation. As such, these two formulations are potential candidates for a successful reworkable underfill. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 3771–3782, 2000     

Syntheses and characterizations of thermally reworkable epoxy resins. Part I

To meet the need for reworkable epoxy resins, a series of cycloaliphatic diepoxides containing thermally cleavable carbamate linkages were synthesized and characterized. These materials were shown to undergo curing reactions with cyclic anhydride in a similar fashion as a commercial cycloaliphatic epoxide, except that the carbamate group within the diepoxides can act as the internal catalyst. Furthermore, cured samples of the formulations from these diepoxides started to decompose at lower temperatures, i.e., between 200–300°C as compared with 350°C for the cured sample of the commercial cycloaliphatic epoxide, which showed their potential to be used as reworkable underfill encapsulants in the electronic packaging area. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 2991–3001, 1999     

Adhesives and coatings based on phenolic/epoxy resins

Low molecular weight epoxy resin based on bis (4‐hydroxy phenyl) 1,1 cyclohexane was prepared and modified with various types of the prepared phenolic resins. Phenol–, cresol–, resorcinol–and salicylic acid–formaldehyde resins were used. The optimum conditions of formulation and curing process were studied to obtain modified wood adhesives characterized by high tensile shear strength values. This study indicated that the more suitable conditions are 1:2 weight ratio of phenol–or cresol–formaldehyde to epoxy resin in the presence of phthalic anhydride (20 wt%) of the resin content as a curing agent at 150°C for 80 min. Resorcinol–or salicylic acid–formaldehyde/epoxy resins formulated at 1:2 weight ratio were cured in the presence of paraformaldehyde (20 wt%) at 150°C for 60 min. The effect of the structure of phenolic resins on the tensile shear strength values of formulated resin samples, when mixed with the epoxy resins and cured under the previously mentioned optimum conditions for different times, was investigated. Metallic and glass coatings from the previous resins were also prepared and evaluated as varnishes or paints. Copyright © 1999 John Wiley & Sons, Ltd.     

Preparation and properties of epoxy/amine hybrid resins from in situ polymerization

Homogeneous and transparent epoxy/amine hybrid resins were successfully obtained through the in situ curing of bisphenol A epoxy and hexakis(methoxymethyl)melamine with 2 wt % (3‐glycidoxypropyl)trimethoxysilane as a facial coupling agent. The hybrid resins showed good miscibility, high glass‐transition temperatures, good thermooxidative stability, and good flame retardance. The outstanding properties of the hybrid resins may lead to their use in high‐performance green electronic products. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 1868–1875, 2004     

A study of the degradation of ester-modified epoxy resins obtained by cationic copolymerization of DGEBA with γ-lactones initiated by rare earth triflates

The thermal degradation of new thermosetting materials prepared by cationic copolymerization of mixtures with different proportions of diglycidylether of bisphenol A (DGEBA) with γ-valerolactone (γ-VL) or α-methyl-γ-butyrolactone (γ-MBL) initiated by scandium, ytterbium or lanthanum triflate and a complex of boron trifluoride was investigated. To study the thermal degradation thermogravimetry (TGA) was used. The materials are more degradable than conventional epoxy resins due to the presence of ester groups in the polymer chain, which are broken at the beginning of degradation. The degradability increased with the proportion of linear ester groups and the Lewis acidity of the initiator used in the polymerization and when the proportion of lactone in the initial mixture increased. The kinetic parameters of the degradation were calculated from TGA data by applying isoconversional procedures.