Relaxations in thermosets. XII. Dielectric effects during curing of nonstoichiometric DGEBA-based thermosets

The dielectric permittivity ε′ and loss ε″ of diglycidyl ether of bisphenol-A thermosets cured with nonstoichiometric amounts of diamino-diphenyl methane have been measured during the course of their chemical reactions from the sol to gel to glass-formation regions. ε′ monotonically decreases with time and ε″ initially decreases, increases to a peak value, and finally decreases to extremely low values characteristic of the glassy state. The initial decrease in ε″ is due to the decrease in the dc conductivity, and the peak is due to the dipolar reorientation. The appearance of these features shifts to longer time when the thermoset is stoichiometrically starved by decreasing the amount of the curing agent and, at a molar ratio of 4 : 1 of the epoxide to diamine, the ε″ peak does not appear during the curing process. Complex plane plots of ε′ and ε″ have the shape of an arc in all cases except when the molar ratio of the epoxide to diamine is 4 : 1. The dielectric consequences of the chemical changes with time during the crosslinking of a thermoset are analogous to the frequency dependence of ε″ of a condensed phase. The time dependence of ε″ follows a stretched exponential decay, ?(t = exp ? [(t/τ)^γ], where 0 < γ < 1. The parameter decreases with decreasing amine content. ε″ has been analyzed to obtain the increase in the relaxation time as curing progresses. A representation of ε^* in terms of electrical modulus M^* shows the occurrence of, first a Maxwell relaxation due to dc conductivity, and second a dipolar relaxation, during the period of a typical isothermal cure. Changes in the features of the isothermal cure that occur on changing the amount of the curing agent are discussed in terms of network formation in the thermoset, and the change in the electrical conductivity with curing time has been analyzed in terms of both a power law for gel formation and by a new equation that suggests an approach toward a singularity.     

Relaxations in thermosets. VI. Effects of crosslinking on sub-Tg relaxations during the curing and aging of epoxide-based thermosets

The dielectric permittivity and loss of diglycidyl ether of bisphenol-A-based thermosets cured with diaminodiphenyl methane and diaminodiphenyl sulfone have been measured over a temperature range 77–400 K after curing or aging for a predetermined duration. Of the two sub-T_g relaxations, the height of the γ relaxation peak monotonically decreases during both the cure and postcure periods, and the height of the β relaxation peak first increases to a maximum value and then decreases. This decrease is attributed to physical aging effects. The height of the α-relaxation peak decreases. The γ- and β-relaxation peaks become increasingly separated in temperature. A concept of accumulated equivalent curing time which is based upon known chemical kinetics has been introduced for use in both theoretical and practical aspects of the study of thermosets. It is shown that substantial curing of the sample occurs during its slow heating to the curing temperature. The use of this concept in the curing of thermosets is illustrated. A procedure for the analysis of the distribution of relaxation times from a set of results limited in both frequency and temperature range is described. The distribution parameter is 0.20 and 0.16 for the γ and β process, respectively, and remains constant with postcuring and physical aging. The distribution parameter for the α process decreases from 0.60 to 0.36 on curing.     

Relaxations in thermosets. XIX. Dielectric effects during curing of diglycidyl ether of bisphenol-A with a catalyst and the properties of the thermoset

Changes in the dielectric permittivity ε′ and loss epsiv;″ during the curing of DGEBA catalyzed by 10 mole % dimethylbenzylamine have been studied from sol to gel to glass formation regions at different temperatures from 323 to 390 K. The ε′ monotonically decreases with time of cure, and ε″ initially decreases by several orders of magnitude and then increases to reach a peak value before finally decreasing to a low value characteristic of the glassy state. The features shift to shorter times and the peak vanishes as the curing temperature is increased. The decrease of ε″ at the initial stage of cure has been analyzed in terms of dc conductivity σ₀, which follows a power law, σ₀ ∝? (t_g–t)^x, as well as a new singularity equation, σ₀ ∝? exp[–B/(t₀–t)] where t_g, x, B, and t₀ are empirical constants that vary with the curing temperature; t_g is close to the time for gelation; and t₀ ≥ time for vitrification. The dielectric properties of the thermoset formed after different periods of cure have been studied from 77 to 325 K. Similar studies of the thermosets formed at different temperatures have been made. Increase in the curing period decreases the heights of both the γ-and α-relaxation peaks and increases their separation, while a β-relaxation peak emerges. Isothermal curing at high temperatures decreases the height of the γ peak to a vanishingly small value and increases that of the β peak from a vanishingly small value. In both the uncured and fully cured states, there is only one sub-T_g relaxation process named γ for the uncured and β for the cured state. These results are discussed in terms of our general physical concepts of local mode motions in an amorphous matrix. © 1993 John Wiley & Sons, Inc.     

Relaxations in thermosets. X. Analysis of dipolar relaxations in DGEBA-based thermosets during isothermal cure

Dielectric properties measured during isothermal curing of DGEBA-based thermosets using a mixture of aromatic amines as curing agent are analyzed. The evolution of the dielectric features of thermosets during curing and after a time when their dc conductivity has reached a negligibly small value are phenomenologically similar to the dielectric features of physically and chemically stable dipolar liquids and solids observed with increasing frequency or decreasing temperature. This equivalence is a consequence of the invariance of the dynamic behavior of dielectric susceptibility with respect to either the frequency of measurement or the relaxation time of the substance and demonstrates that crosslinking of a thermoset causes its relaxation time to increase monotonically. It is shown that the stretched exponential relaxation function formalism satisfactorily describes the dielectric results and that the value of its distribution parameter initially decreases and, after gelation, reaches a constant value, which we denote γ, in the latter part of the cure. The value of the curing parameter, γ, which lies between 0.2 and 0.4, monotonically decreases with increasing curing temperature and tends to a limiting value characteristic of a thermoset at higher temperatures. This is in contrast with the increase found in the corresponding representation in the Kohlrausch-Williams-Watts parameter β with increasing temperature. The curing time dependence of the dipolar relaxation time ι has been determined and found to have the shape of an elongated S, with a well-defined point of inflexion, as ι increases during the cure, from a value characteristic of a liquid to an ultimate value characteristic of a glass.     

A new class of epoxy thermosets

The reinforcing strategies of epoxy thermosets rely on the control of the phase separation between the additive and the growing thermoset. With standard additives, such as reactive liquid rubbers, the length scale of the resulting domains is the micrometer. Here, we present a route that enable a control of the morphology down to the nanometer scale. This strategy is based upon the self-assembly process of blends of epoxy and SBM triblock copolymers, namely Poly(Styrene-b-1,4 Butadiene-b-Methyl methacrylate). It relies on the respective affinities between the epoxy precursors and each of the three blocks. Liquid epoxy has a strong affinity for PMMA, whilst it is not miscible with polystyrene nor polybutadiene at standard processing temperatures. Thus, within the reactive system, microphase separation leads to a regular network of S-B domains. This nanostructure is governed by thermodynamics. The size and geometry of the dispersed domains are controlled by the concentration and the ratio between blocks lengths. The domain size is of the order of magnitude of the chain length, ranging typically from 10 to 30 nanometers. What controls the blend's morphology throughout the curing process of the thermoset was one topic on which we focused our interest. Nanostructured thermosets have been obtained. These supramolecular architectures yield significant toughness improvements while preserving the transparency of the material. The reinforcing mechanisms are not yet fully understood : it is intriguing to induce significant toughening with elastomer domains smaller than 30 nanometers in diameter. Besides being efficient epoxy tougheners, SBM can broaden the scope of applications of thermosets due to specific rheological behaviors. Thanks to the self assembly process taking place in the blend of the SBM block copolymers with the epoxy thermosets precursors, the reactive solvent can be turned into a reactive gel or solid (before curing). This physical gelation is induced by the microphase separation and is thus thermoreversible. At relatively moderate loadings of block copolymers the reactive blend behaves like a thermoplastic material, with adjustable modulus and tackiness. These results evidence that SBM block copolymers open a broad area for designing new class of thermoset materials.     

The dielectric properties of dry and water-saturated nylon-12

The dielectric relaxation of 30% crystalline Nylon-12 of molecular weight 20,000 has been studied at frequencies from 12 Hz to 0.1 MHz and temperatures from 77 to 375 K, and the effect of water on the relaxation spectra has been investigated. Absorbed water increases both the rate and the intensity of both its α-and β-relaxation processes and increases the rate but decreases the intensity of its γ-relaxation process. These results are interpreted in terms of the hydrogen bonding effects of water on localized motions of dipoles in Nylon-12. The relatively large half-width of the α-relaxation, which becomes better resolved at high temperatures, is attributed mainly to the random distribution of crystalline regions in the polymer. It is suggested that water lowers the steric hindrance for the localized mode of dipolar reorientation and causes a redistribution of local sites such that the β-relaxation process grows at the expense of the γ-process.     

Relaxations in thermosets. XVI. Dielectric studies of negative feedback during curing of an epoxide-ethylene-diamine thermoset

The complex dielectric permittivity of thermosets of diglycidly ether of bisphenol-A cured with ethylene diamine has been studied during their isothermal curing at several temperatures. As cross-linking progresses, the dc conductivity decreases. At the beginning of the cure the dc conductivity can be fitted to both the scaling laws with a critical exponent of about 4 and an equation indicating approach toward a singularity. In the later stage of the cure, the change in permittivity corresponds to dipolar relaxation of an infinitely connected network, and the Argand diagram for the complex permittivity measured at a fixed frequency obtained as the curing process proceeds at 305 K is similar to that for the complex permittivity as frequency is varied for a time-invariant system which obeys a stretched exponential relaxation function with the curing parameter or exponent, γ = 0.29. Increase in the temperature of isothermal curing lowers both γ and the net decrease in the equilibrium permittivity on curing. A plot of the calculated relaxation time with curing time is sigmoidal and shifts to shorter times on increasing the curing temperature. Measurement of the dielectric properties during the cure but for different frequencies show that the various parameters for the curing kinetics are independent of the frequency of measurement. These observations confirm the development of our concepts of thermoset curing in terms of a phenomenon of negative feedback between molecular diffusion and chemical reactions.     

Multiarm star poly(glycidol)‐block‐poly(ε‐caprolactone) of different arm lengths and their use as modifiers of diglycidylether of bisphenol a thermosets

Well‐defined multiarm star copolymers, hyperbranched poly(glycidol)‐b‐poly(ε‐caprolactone), with an average of 100–110 arms per molecule and a molecular weight of arms of 3000 g/mol (PGOH‐b‐PCL₃₀) and 1000 g/mol (PGOH‐b‐PCL₁₀) were synthesized by cationic ring‐opening polymerization of ε‐caprolactone from a poly(glycidol) core and used to modify diglycidylether of bisphenol A formulations. The curing process, studied by dynamic scanning calorimetry, was only slightly retarded when PGOH‐b‐PCL_x were added to the formulation. By rheometry, the effect of this new topology and the arm length on the complex viscosity (η*) and gelation of the reactive mixture was analyzed in detail. The addition of these new reactive modifiers decreases the global shrinkage and increases the conversion at gelation. In addition, the modified thermosets have an improved reworkability. The homogeneity of pure DGEBA and modified thermosets was proved by dynamic thermomechanical analysis and electronic microscopy (FESEM). Addition of star‐like structures led to a more toughened fracture of the thermoset in comparison to pure DGEBA. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2011     

Relaxations of thermosets. VIII. Brillouin light scattering during the curing of diglycidyl ether of bisphenol-A thermosets

The kinetics of sol-gel-glass transformations have been studied in the thermosets of diglycidyl ether of bisphenol A cured with diamino diphenyl methane and diamino diphenyl sulfone, at different temperatures using Brillouin light scattering. The Shape of the Brillouin peak is generally broad. This is attributed to the damping of elastic waves in the mixture of unpolymerized low-molecular weight fluid and the polymer chains forming the networks. The Brillouin peak becomes sharp and narrow at complete curing of the thermosets. The phonon velocity increases and the attenuation decreases with the curing time. These changes occur in two steps with the second step appearing near the gelling time of the thermosets. A semilogarithmic plot of the time for the velocity and attenuation to reach half of their total change against the reciprocal temperature yields a straight line with different slopes for the two thermosets. It is suggested that Brillouin light scattering is a useful non-destructive, in-line, method for control in the processing of epoxy thermosets.     

Relaxations of thermosets. III. Sub-Tg dielectric relaxations of bisphenol-A–based epoxide cured with different cross-linking agents

The sub-T_g relaxations of bisphenol-A–based thermosets cured with diaminodiphenyl methane and diaminodiphenyl sulfone have been studied by dielectric measurements over the frequency range 12 Hz to 200 kHz from their ungelled or “least” cured states to their fully cured states. Both thermosets show two relaxation processes, γ and β, as the temperature is increased toward their T_gs. In the ungelled states, the γ process is more prominent than the β process. As curing proceeds, the strength of the γ process decreases and reaches a limiting value, while that of the β process initially increases, reaches a maximum value, and then decreases. An increase in the chain iength and the number of crosslinks increases the number of -OH dipoles and/or degree of their motions in local regions of the network matrix. This is partly caused by the decreasing efficiency of segmental packing as the curing proceeds. The sub-T_g relaxations become increasingly more, separated from the α relaxation during curing. Physical aging causes a decrease in the strength of the β relaxation of the thermosets as a result of the collapse of loosely packed regions of low cross-linking density, and this decrease competes against an increase caused by further crosslinking during the “post-cure” process.     

Thermally stable liquid crystalline thermosets based on aromatic copolyesters: Preparation and properties

The synthesis and physical properties are described for a thermally stable liquid crystalline (LC) thermoset based on all aromatic ester units. The persistence of the liquid crystalline phase throughout the curing process was monitored with polarizing optical microscopy. The applicability of these new liquid crystalline thermosets has been evaluated for use as an adhesive for bonding metals, namely titanium. The failure of the adhesive bonds always occurs within the polymer; thus it can be inferred that bonding at the polymer-metal interface is very good. This strong interfacial bonding is attributed to low cure shrinkage and CTE matching of the underlying substrate by the LC resins. The cohesive properties and strength of the cured resin can be greatly enhanced by the addition of filler materials. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35:1061–1067, 1997     

Thermally and oxidatively stable thermosets derived from preceramic monomers

Monomers 1,3-bis(4-phenylethynylphenyl)tetramethyldisiloxane and 1,7-bis(4-phenylethynylphenyltetramethyldisiloxyl)-m-carborane were synthesized and compared with bis(4-phenylethynylphenyl)dimethylsilane as potential preceramic precursors. These monomers were heated to free flowing liquids above 100°C and thermally polymerized above 300°C to form heat-resistant thermosets or ceramic residues. The ceramic yields for the silane (13%) and siloxane (30%) were much lower than that for the carborane (64%) monomer. The thermoset and ceramic made from the carborane monomer were the best thermally and oxidatively stable materials. After curing, the thermoset had a weight loss of only 6% and after pyrolysis, the ceramic residue had no additional weight loss up to 1000°C in air. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35: 1033–1038, 1997     

Synthesis,structure, and characterization of nematic liquid‐crystalline thermosets based on bisacrylates

Four bisacrylate mesogenic monomers and the corresponding liquid‐crystalline thermosets were synthesized. The chemical structures of the intermediate compounds and monomers obtained were confirmed by elemental analyses, Fourier transform infrared, and ¹H NMR and ¹³C NMR spectra. The mesomorphic properties and thermal stability were investigated with differential scanning calorimetry, thermogravimetric analysis, polarized optical microscopy, and X‐ray diffraction measurements. The influence of the curing temperatures and time on the phase behavior and thermal stability of the thermosets was discussed. All the monomers and thermosets exhibited a nematic schlieren texture. However, the monomers only showed the melting transition, and the thermosets displayed the glass transition. The experimental results demonstrated that the monomer structures strongly affected the phase behavior and the curing reaction rate, and the glass‐transition temperatures and thermal stability of the thermosets increased with the curing temperature and time. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 4478–4485, 2005     

Facile preparation of novel epoxy curing agents and their high‐performance thermosets

Two flame‐retardant epoxy curing agents, 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl‐tris(4‐hydroxyphenyl)methane (1) and 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl‐ (4‐aminophenyl)‐bis(4‐hydroxyphenyl)methane (2), were prepared by a facile, economic, one‐pot procedure. The structures of the curing agents were confirmed by IR, high‐resolution mass, 1‐D, and 2‐D NMR spectra. A reaction mechanism was proposed for the preparation, and the effect of electron withdrawing/donating effects on the stabilization of the carbocation was discussed. (1‐2) served as curing agents for diglycidyl ether of bisphenol A (DGEBA), dicyclopentadiene epoxy (HP‐7200), and cresol novolac epoxy (CNE). Properties such as glass transition temperature, coefficient of thermal expansion, thermal decomposition temperature, and flame retardancy of the resulting epoxy thermosets were evaluated. The resulting epoxy thermosets show high T_g, low thermal expansion, moderate thermostability, and excellent flame retardancy. The bulky biphenylene phosphinate pendant makes polymer chains difficult to rotate, explaining the high T_g and low thermal expansion characteristic. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 7898–7912, 2008     

Study of dielectric relaxations of anhydrous trehalose and maltose glasses

We investigated the frequency dependent dielectric relaxation behaviors of anhydrous trehalose and maltose glasses in the temperature range which covers a supercooled and glassy states. In addition to the α-, Johari-Goldstein (JG) β-, and γ-relaxations in a typical glass forming system, we observed an extra relaxation process between JG β- and γ-relaxations in the dielectric loss spectra. We found that the unknown extra relaxation is a unique property of disaccharide which might originate from the intramolecular motion of flexible glycosidic bond. We also found that the temperature dependence of the JG β-relaxation time changes at 0.95T(g) and it might be universal.     

Reactive compatibilization of epoxy/polyorganosiloxane blends

A new thermoset material based on DGEBA with polyaminosiloxane curing agents is presented. The system shows reaction-induced compatibilization which prevents coalescence of polysiloxane and DGEBA rich domains, leading to gradient structured morphologies. The influence of curing temperature and/or chemical nature of the siloxane on the morphology and surface microhardness were examined. When siloxane is pre-reacted with epoxypropylphenylether (EPPE), a more homogeneous material is obtained. Microhardness profiles on the material are strongly influenced by the extension of the compositional gradients.     

New epoxy thermosets modified with hyperbranched poly(ester-amide) of different molecular weight

The influence of hydroxy-functionalized hyperbranched poly(ester-amide) (HBP) of different molecular weight on the curing process of diglycidylether of bisphenol A (DGEBA) was studied using methyltetrahydrophthalic anhydride (MTHPA) as curing agent. By Differential Scanning Calorimetry (DSC) and Fourier Transform Infrared Spectroscopy (FTIR) the curing reaction was monitored and the covalent incorporation of the modifier in the matrix was proved. By thermomechanical analysis (TMA) the reduction of the contraction after gelation on changing the HBP proportion was observed. The incorporation of HBP increased the glass transition temperature (T_g) and reduced the overall shrinkage. The modified materials showed a higher thermal degradability than neat DGEBA thermosets allowing reworkability. Thermal expansion coefficient, Young’s modulus, impact strength and microhardness were improved. The water uptake behavior was also evaluated.     

Dielectric spectroscopy and calorimetry during postcuring of a linear chain polymer thermoset formed from a diepoxide and cyclohexylamine,and the nature of the products

The dielectric permittivity and loss spectra of an equimolar liquid mixture of diglycidyl ether of bisphenol-A and cyclohexylamine have been studied during the liquid's isothermal polymerization or curing in separate experiments at different temperatures and thereafter during the postcuring, both on rate-heating and isothermally. The spectra obtained during the growth of the linear chain polymer during the curing and postcuring show the evolution of an intermediate relaxation process whose position in the frequency plane remains relatively insensitive to the decrease in the configurational entropy during the postcuring, but whose strength increases. Postcuring ceases to occur once the calorimetric glass-liquid transition temperature of 345 K, corresponding to the ultimately formed polymeric state, has been reached. The increase in the number of covalent bonds, n, formed during curing and postcuring decreased the equilibrium dielectric permittivity, ε_s, and increased the characteristic relaxation time, τ₀, for all curing and postcuring conditions. For a fixed temperature and n, (dε_s/dT) and (dτ₀/dT), as well as the values ε_s and τ₀ of the ultimately formed state of the polymers differ significantly when the thermal history of polymerization differs. The slow dynamics in the glass-liquid transition region were analyzed in terms of the enthalpy relaxation and fictive temperature concepts. The distribution of relaxation times for these dynamics correspond to the stretched exponential parameter of 0.6, which is significantly greater than 0.39 determined for the dielectric α-relaxation spectra measured at a temperature 30 K higher. The enthalpy relaxation involves a narrower distribution of intermolecular barriers than dielectric relaxation. The results also show that the recently proposed method for determining the gelation time from the plots of the imaginary component of electrical impedance lacks scientific merit. © 1998 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 36 : 303–318, 1998     

Sub-TG relaxations in LiClO4-poly (propylene glycol)-2000 solutions

The dielectric permittivity and loss of LiClO₄ solutions in poly (propylene glycol (PPG)), molecular weight 2000, have been measured over a concentration range up to a ratio of Li⁺ to oxygen atoms in PPG of 33.3:100, between 77 and 350 K. The data have been analyzed in both the permittivity and electrical modulus formalisms. Addition of LiClO₄ to poly (propylene glycol) first increases the height of the β-relaxation peak, and ultimately a second sub-T_g relaxation peak at a higher temperature emerges. This is in addition to the β-relaxation peak due to the reorientation of PPG dipoles, whose strength decreases from that in pure PPG-2000. For a fixed temperature, the dc conductivity initially decreases with increasing Li⁺ concentration up to 20 Li⁺ per 100 O atoms and thereafter increases. This concentration corresponds to that at which the T_g of the solution reaches its limiting value of ca. 310 K. It is concluded that the formation of ion pairs causes a second and slower sub-T_g relaxation process and that the increase in the efficiency of chain packing reduces the strength of the β-relaxation of the polymer.