A moving mode-III crack in functionally graded piezoelectric material: permeable problem

In this paper a moving mode-III crack in functionally graded piezoelectric materials (FGPM) is studied. The crack surfaces are assumed to be permeable. The governing equations for FGPM are solved by means of Fourier cosine transform. The mathematical formulation for the permeable crack condition is derived as a set of dual integral equations, which, in turn, are reduced to a Fredholm integral equation of the second kind. The results obtained indicate that the stress intensity factor of moving crack in FGPM depends only on the mechanical loading. The gradient parameter of the FGPM and the moving velocity of the crack do have significant influence on the dynamic stress intensity factor.     

Love waves in functionally graded piezoelectric materials

To investigate the features of Love waves in a layered functionally graded piezoelectric structure, the mathematical model is established on the basis of the elastic wave theory, and the WKB method is applied to solve the coupled electromechanical field differential equation. The solutions of the mechanical displacement and electrical potential function are obtained for the piezoelectric layer and elastic substrate. The dispersion relations of Love waves are deduced for electric open and short cases on the free surface respectively. The actual piezoelectric layer–elastic substrate systems are taken into account, and some corresponding numerical examples are proposed comparatively. Thus, the effects of the gradient variation about material constants on the phase velocity, the group velocity, the coupled electromechanical factor and the cutoff frequency are discussed in detail. So the propagation behaviors of Love waves in inhomogeneous medium is revealed, and the dispersion and the anti-dispersion are analyzed. The conclusions are significant both theoretically and practically for the surface acoustic wave devices.     

Thermal fracture of a functionally graded/homogeneous bimaterial with system of cracks

The thermal fracture of a bimaterial consisting of a homogeneous material and a functionally graded material (FGM) with a system of internal cracks and an interface crack is investigated. The bimaterial is subjected to a heat flux. The thermal properties of FGM are assumed to be continues functions of the thickness coordinate, while the elastic properties are constants. The method of the solution is based on the singular integral equations. For a special case where the interface crack is much larger than the internal cracks in the FGM the asymptotic analytical solution of the problem is obtained as series in a small parameter (the ratio between sizes of the internal and interface crack) and the thermal stress intensity factors (TSIFs) are derived as functions of geometry of the problem and material characteristics. A parametric analysis of the effects of the location and orientation of the cracks and of the inhomogeneity parameter of FGM’s thermal conductivity on the TSIFs is performed. The results are applicable to such kinds FGMs as ceramic/ceramic FGMs, e.g., TiC/SiC, MoSi₂/Al₂O₃ and MoSi₂/SiC, and also some ceramic/metal FGMs.     

The transient fracture behavior for a functionally graded layered structure subjected to an in-plane impact load

The transient fracture behavior of a functionally graded layered structure subjected to an in-plane impact load is investigated. The studied structure is composed of two homogeneous layers and a functionally graded interlayer with a crack perpendicular to the boundaries. The impact load is applied on the face of the crack. Fourier transform and Laplace transform methods are used to formulate the present problem in terms of a singular integral equation in Laplace transform domain. Considering variations of parameters such as the nonhomogeneity constant, the thickness ratio and the crack length, the dynamic stress intensity factors (DSIFs) in time domain are studied and some meaningful conclusions are obtained.The project supported by the National Science Foundation for Excellent Young Investigators (10325208), the National Natural Science Foundation of China (10432030) and the China Postdoctoral Science Foundation (2004036018)The English text was polished by Ron Marshall.     

Coupled thermal/mechanical analysis for the fracture of functionally graded materials under transient thermal loading

A comprehensive treatment of fracture of functionally graded materials (FGMs) is provided. It is assumed that the material properties depend only on the coordinate perpendicular to the crack surfaces and vary continuously along the crack faces. By using a laminated composite plate model to simulate the material non-homogeneity, an algorithm for solving the system based on Laplace transform and Fourier transform techniques is presented. Unlike earlier studies that considered certain assumed property distributions and a single crack problem, the current investigation studies multiple crack problem in the FGMs with arbitrarily varying material properties. Transient thermal stresses are presented. Project supported by the National Natural Science Foundation of China (Nos 10102004 and 19902003).     

Thermal fracture analysis of nonhomogeneous piezoelectric materials using an interaction energy integral method

This paper presents a modified interaction energy integral method to analyze the thermal stress intensity factors (TSIFs) and electric displacement intensity factor (EDIF) in nonhomogeneous piezoelectric materials under thermal loading. This modified method is demonstrated to be domain-independent, even when the nonhomogeneous piezoelectric materials contain interfaces with thermo-electro-mechanical properties. As a result, the method is shown to be convenient for determining the TSIFs and EDIF in nonhomogeneous piezoelectric materials with interfaces. Several examples are shown, and they successfully verify the domain-independence of the present interaction energy integral. The study results also show that the mismatch of material properties can significantly influence the TSIFs and EDIF, particularly when the crack tip is close to the interface. Crack angles and temperature boundary conditions are also shown to significantly influence the TSIFs and EDIF.     

Impact response of a functionally graded piezoelectric plate with a vertical crack

The dynamic fracture problem for a functionally graded piezoelectric plate containing a crack perpendicular to the free boundaries is considered in this study. It is assumed that the electroelastic properties of the medium vary continuously in the thickness direction. Integral transform techniques and dislocation density function are employed to reduce the problem to the solution of a singular integral equation. Mode I dynamic energy density factors are presented for an internal crack as well as an edge crack for various values of dimensionless parameters representing the size and location of the crack and the material nonhomogeneity.     

Basic solution of two parallel mode-I permeable cracks in functionally graded piezoelectric materials

The basic solution of two parallel mode-I permeable cracks in functionally graded piezoelectric materials was studied in this paper using the generalized Almansi’s theorem. To make the analysis tractable, it was assumed that the shear modulus varies exponentially along the horizontal axis parallel to the crack. The problem was formulated through a Fourier transform into two pairs of dual integral equations, in which unknown variables are jumps of displacements across the crack surface. To solve the dual integral equations, the jumps of displacements across the crack surfaces were directly expanded as a series of Jacobi polynomials. The solution of the present paper shows that the singular stresses and the singular electric displacements at the crack tips in functionally graded piezoelectric materials carry the same forms as those in homogeneous piezoelectric materials; however, the magnitudes of intensity factors depend on the gradient of functionally graded piezoelectric material properties. It was also revealed that the crack shielding effect is also present in functionally graded piezoelectric materials.     

The dynamic behavior of two parallel symmetric cracks in functionally graded piezoelectric/piezomagnetic materials

The dynamic behavior of two parallel symmetric cracks in functionally graded piezoelectric/piezomagnetic materials subjected to harmonic antiplane shear waves is investigated using the Schmidt method. The present problem can be solved using the Fourier transform and the technique of dual integral equations, in which the unknown variables are jumps of displacements across the crack surfaces, not dislocation density functions. To solve the dual integral equations, the jumps of displacements across the crack surfaces are directly expanded as a series of Jacobi polynomials. Finally, the relations among the electric, magnetic flux, and dynamic stress fields near crack tips can be obtained. Numerical examples are provided to show the effect of the functionally graded parameter, the distance between the two parallel cracks, and the circular frequency of the incident waves upon the stress, electric displacement, and magnetic flux intensity factors at crack tips.     

Propagation of an anti-plane moving crack in a functionally graded piezoelectric strip

Summary The propagation of an anti-plane moving crack in a functionally graded piezoelectric strip (FGPS) is studied in this paper. The governing equations for the proposed analysis are solved using Fourier cosine transform. The mixed boundary value problems of the anti-plane moving crack, which is assumed to be either impermeable or permeable, are formulated as dual integral equations. By appropriate transformations, the dual integral equations are reduced to Fredholm integral equations of the second kind. For the impermeable crack, the stress intensity factor (SIF) of the crack in the FGPS depends on both the mechanical and electric loading, whereas, the SIF for the permeable crack depends only on the mechanical loading. The results obtained show that the gradient parameter of the FGPS and the velocity of the crack have significant influence on the dynamic SIF.Support from the Research Grants Council of the Hong Kong Special Administrative Region, China (Project No. HKU 7081/00E) is acknowledged. Support from the National Natural Science Foundation of China (Project No. 10072041) is also acknowledged.     

Near-tip out of plane displacement fields for dynamic crack propagation in functionally graded materials

Asymptotic expansion for the out of plane displacement field around a crack propagating along the gradient in a functionally graded material is developed. The irregular behavior of one of the terms in the expansion at low crack speeds is further examined and a remedial solution, which is well behaved at low crack speeds, is proposed. The developed out of plane displacement field is used to estimate stress intensity factor from quasi-static finite element solution. The results indicate that inclusion of the proposed nonhomogeneity specific terms gives estimates of stress intensity factor, which are consistent with existing analytical predictions.     

The interaction of two parallel Mode-I limited-permeable cracks in a functionally graded piezoelectric material

In this paper, the interaction of two parallel Mode-I limited-permeable cracks in a functionally graded piezoelectric material was investigated by using the generalized Almansi's theorem. In the analysis, the electric permittivity of the air inside the crack was considered. The problem was formulated through Fourier transform into two pairs of dual integral equations, in which unknown variables are jumps of displacements across the crack surface. To solve the dual integral equations, the jumps of displacements across the crack surfaces were directly expanded as a series of Jacobi polynomials. The solution of the present paper shows that the singular stresses and the singular electric displacements at the crack tips in functionally graded piezoelectric materials carry the same forms as those in homogeneous piezoelectric materials; however, the magnitudes of intensity factors depend on the electric permittivity of the air inside the crack and the gradient parameter of functionally graded piezoelectric material properties. It was also revealed that the crack shielding effect is also present in functionally graded piezoelectric materials.     

Stress intensity factors for three-dimensional cracks in functionally graded materials using enriched finite elements

A three-dimensional enriched finite-element methodology is presented to compute stress intensity factors for three-dimensional cracks contained in functionally graded materials (FGMs). A general-purpose 3D finite-element based fracture analysis program, FRAC3D, is enhanced to include this capability. First, using available solutions from the literature, comparisons have been made in terms of stresses under different loading conditions, such as uniform tensile, bending and thermal loads. Mesh refinement studies are also performed. The fracture solutions are obtained for edge cracks in an FGM strip and surface cracks in a finite-thickness FGM plate and compared with existing solutions in the literature. Further analyses are performed to study the behavior of stress intensity factor near the free surface where crack front terminates. It is shown that three-dimensional enriched finite elements provide accurate and efficient fracture solutions for three-dimensional cracks contained in functionally graded materials.     

The dynamic response of an edge crack in a functionally graded orthotropic strip

The dynamic response of a functionally graded orthotropic strip with an edge crack perpendicular to the boundaries is studied. The material properties are assumed to vary continuously along the thickness direction. Laplace and Fourier transforms are applied to reduce the problem to a singular integral equation. Numerical results are presented to illustrate the influences of parameters such as the nonhomogeneity constant and geometry parameters on the dynamic stress intensity factors (SIFs).     

The behavior of a crack in functionally graded piezoelectric/piezomagnetic materials under anti-plane shear loading

Summary In this paper, the behavior of a crack in functionally graded piezoelectric/piezomagnetic materials subjected to an anti-plane shear loading is investigated. To make the analysis tractable, it is assumed that the material properties vary exponentially with the coordinate parallel to the crack. By using a Fourier transform, the problem can be solved with the help of a pair of dual integral equations in which the unknown variable is the jump of the displacements across the crack surfaces. These equations are solved using the Schmidt method. The relations among the electric displacement, the magnetic flux and the stress field near the crack tips are obtained. Numerical examples are provided to show the effect of the functionally graded parameter on the stress intensity factors of the crack.The authors are grateful for financial support from the Natural Science Foundation of Hei Long Jiang Province (A0301), the National Natural Science Foundation of China (50232030, 10172030), the Natural Science Foundation with Excellent Young Investigators of Hei Long Jiang Province(JC04-08) and the National Science Foundation with Excellent Young Investigators (10325208).     

A penny-shaped interface crack between a functionally graded piezoelectric layer and a homogeneous piezoelectric layer

The problem of a penny-shaped interface crack between a functionally graded piezoelectric layer and a homogeneous piezoelectric layer is investigated. The surfaces of the composite structure are subjected to both mechanical and electrical loads. The crack surfaces are assumed to be electrically impermeable. Integral transform method is employed to reduce the problem to a Fredholm integral equation of the second kind. The stress intensity factor, electric displacement intensity factor and energy release rate are derived, some typical numerical results are plotted graphically. The effects of electrical loads, material nonhomogeneity and crack configuration on the fracture behaviors of the cracked composite structure are analyzed in detail.     

Dynamic response for functionally graded materials with penny-shaped cracks

This paper provides a method for studying the penny-shaped cracks configuration in functionally graded material(FGM) structures subjected to dynamic or steady loading. It is assumed that the FGMs are transversely isotropic and all the material properties only depend on the axial coordinatez. In the analysis, the elastic region is treated as a number of layers. The material properties are taken to be constants for each layer. By utilizing the Laplace transform and Hankel transform technique, the general solutions for the layers are derived. The dual integral equations are then obtained by introducing the mechanical boundary and layer interface conditions via the flexibility/stiffness matrix approach. The stress intensity factors are computed by solving dual integral equations numerically in Laplace transform domain. The solution in time domain is obtained by utilizing numerical Laplace inverse. The main advantage of the present model is its ability for treating multiple crack configurations in FGMs with arbitrarily distributed and continuously varied material properties by dividing the FGMs into a number of layers with the properties of each layer slightly different from one another. This work was supported by Failure Mechanics Laboratory of State Education Commission and the Post-doctor Research Fund of China.     

An anti-plane propagating crack in a functionally graded piezoelectric strip bonded to a homogeneous piezoelectric strip

Summary A finite crack propagating at constant speed in a functionally graded piezoelectric strip (FGPS) bonded to a homogeneous piezoelectric strip is considered. It is assumed that the electroelastic material properties of the FGPS vary exponentially across the thickness of the strip, and that the bimaterial strip is under combined anti-plane mechanical shear and in-plane electrical loads. The analysis is conducted for the electrically unified crack boundary condition, which includes both the traditional permeable and the impermeable ones. By using the Fourier transform, the problem is reduced to the solution of Fredholm integral equations of the second kind. Numerical results for the stress intensity factor and the crack sliding displacement are presented to show the influences of the crack propagation speed, electric loads, FGPS gradation, crack length, electromechanical coupling coefficient, properties of the bonded homogeneous piezoelectric strip and crack location.     

A finite element formulation for analysis of functionally graded plates and shells

Summary A finite element formulation is derived for the thermoelastic analysis of functionally graded (FG) plates and shells. The power-law distribution model is assumed for the composition of the constitutent materials in the thickness direction. The procedure adopted to derive the finite element formulation contains the analytical through-the-thickness integration inherently. Such formulation accounts for the large gradient of the material properties of FG plates and shells through the thickness without using the Gauss points in the thickness direction. The explicit through-the-thickness integration becomes possible due to the proper decomposition of the material properties into the product of a scalar variable and a constant matrix through the thickness. The nonlinear heat-transfer equation is solved for thermal distribution through the thickness by the Rayleigh-Ritz method. According to the results, the formulation accounts for the nonlinear variation in the stress components through the thickness especially for regions with a variation in martial propperties near the free surfaces.     

Hamilton体系下功能梯度梁的热冲击动力屈曲分析

在Hamilton体系下,基于Euler梁理论研究了功能梯度材料梁受热冲击载荷作用时的动力屈曲问题;将非均匀功能梯度复合材料的物性参数假设为厚度坐标的幂函数形式,采用Laplace变换法和幂级数法解析求得热冲击下功能梯度梁内的动态温度场:首先将功能梯度梁的屈曲问题归结为辛空间中系统的零本征值问题,梁的屈曲载荷与屈曲模态分别对应于Hamilton体系下的辛本征值和本征解问题,由分叉条件求得屈曲模态和屈曲热轴力,根据屈曲热轴力求解临界屈曲升温载荷。给出了热冲击载荷作用下一类非均匀梯度材料梁屈曲特性的辛方法研究过程,讨论了材料的梯度特性、结构几何参数和热冲击载荷参数对临界温度的影响。