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1.
《Microelectronics Reliability》2015,55(2):442-447
This study suggests an improved junction structure of solder joints that enable an increased junction area and enhance the reliability of solder joints. A finite element analysis was carried out to compare the thermo-mechanical characteristics of the solder joints before and after the improvement. In the suggested junction structure, holes were created in the existing Cu pillar bump to increase its junction area, compared to that of the existing junction structure, and to raise the solder quantity of the joint. Drawing from the analysis results of the thermo-mechanical characteristics on the existing junction structure and the newly suggested junction structure, it was confirmed that shear stress was reduced in the solder joint with the suggested junction structure, as it was lower by around 5–20 MPa in the suggested junction structure. It was also found that the final value of the equivalent stress during a thermal cycle was lower by around 30 MPa in the suggested junction structure. Moreover, in terms of its equivalent strain value, the suggested junction structure had a slightly higher value of elastic equivalent strain although it carried a lower value of plastic equivalent strain in the high-temperature range. Therefore, it is considered that the suggested junction structure will be advantageous in terms of its long-term reliability of thermo-mechanical characteristics. 相似文献
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J. Liang S. Downes N. Dariavach D. Shangguan S. M. Heinrich 《Journal of Electronic Materials》2004,33(12):1507-1515
Reliability of lead-free solder joints has been a hot topic widely debated in the electronic industry. Most published data
indicate that a change to lead-free soldering has the potential benefit of more reliable solder joints than the current Sn-Pb
eutectic solder joints. However, in reality many mechanical, metallurgical, thermal, and environmental factors affect the
service reliability of solder joints. This paper tries to shed some light on the effects of mechanical loading and thermal
conditions on solder joint reliability. These conditions are determined not only by external environments but also by the
solder alloy itself and the joint geometry. Analyses with first principles are carried out on solder joints of both areal
array and peripheral packages. Effects on fatigue life of solder joint geometry, thermal and mechanical characteristics of
components and substrate materials, and application conditions are discussed. The analysis helps explain why lead-free solder
joints may not be more reliable in certain application conditions than the current Sn-Pb eutectic solder joints. 相似文献
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Tsung-Yu Pan Steven C. White Edwin L. Lutz Howard D. Blair John M. Nicholson 《Journal of Electronic Materials》1999,28(11):1276-1285
Power diodes in an alternator convert alternating current, generated by the spinning magnetic field, to direct current to
be used by the battery and all the automotive electrical/electronic components. The diodes are press-fit into aluminum heatsinks
to quickly and efficiently dissipate the heat from the silicon dies in the diode body. The diodes are soldered to a rectifier
circuit board through the diode leads by a wave soldering process using a Pb-free, eutectic Sn-3.5Ag solder. A set of positive
diodes reside on a different substrate than the set of negative diodes, resulting in differences in the lengths of the diode
leads. The distance from the diode body to the solder joint on the leads of the positive diodes is 7 mm less than those of
the negative diodes. Solderability, cross-section micrographs, and thermal-cycling fatigue reliability studies were compared
between the positive and negative diodes and between diode designs from different suppliers. Wetting balance testing showed
significant differences in solderability between positive and negative diodes and between the two different diode designs.
Combining the diode body and lead together had a more drastic effect on the solderability than the lead alone. It was discovered
that, although the nature of the diode design is to dissipate the heat away from the diode quickly and efficiently, there
is a large temperature gradient along the lead immediately above the solder bath which can be as much as 100°C just 2 mm from
the bath. This large temperature gradient caused some leads to be too “cold” to form good solder fillets. The solder fillets
obtained in the laboratory wetting tests matched those observed in the actual alternators. The inadequate solder fillets resulted
in a 250% difference in the thermal cycling fatigue reliability between the two diode designs. 相似文献
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针对低Ag无铅焊膏的市场需求,研究开发了一种适用于99.0Sn0.3Ag0.7Cu低Ag无铅焊膏用松香型无卤素助焊剂(WTO—LF3000),配制了相应的无铅焊膏(WTO—LF3000—SAC0307),并对其板级封装工艺适应性及焊点可靠性进行了考察,用测试后样品的电气可靠性作为接头可靠性评价条件。结果表明:所开发的低Ag无铅焊膏熔点和润湿性符合产品实际要求。配制的焊膏印刷质量良好,焊点切片观察其孔隙率<25%,满足行业标准IPC—A—610D之要求。样品分别经跌落、震动和温度循环试验后,无焊点脱落等现象,电气功能正常。 相似文献
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《Microelectronics Reliability》2014,54(12):2922-2928
In this study, low-cycle fatigue test was conducted for a lead-free solder joint at two test temperatures (348 K, 398 K) and three strain amplitudes (3%, 4%, and 8%). Fatigue failure behavior was analyzed and the fatigue life was evaluated using the Coffin–Manson relationship and Morrow energy-based model. The results show that the maximum load gradually drops with increasing the number of loading cycles. When the strain range or temperature is low, the maximum load drop curve can be divided into three stages. Then, it degrades into a linear stage with increasing the strain range or temperature. Both the softening of solder and the reduction of effective load-bearing area are responsible for the maximum load drop depending on the test condition. Fatigue crack initiates at the corner of the solder joint and propagates along the strain concentrated zone. Spacing distance between fatigue striations is enlarged with increasing the temperature in accordance with the degradation of fatigue resistance. In addition, both the Coffin–Manson model and Morrow energy-based model can be used to evaluate the fatigue life of solder joint under high temperature. The fatigue ductility exponent α in Coffin–Manson model and the fatigue ductility coefficient C in Morrow model are dependent on temperature, whereas other parameters in these two models keep stable under different temperature. 相似文献
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李志民 《电子产品可靠性与环境试验》2005,23(2):31-34
主要介绍了Sn—Pb合金焊接点发生失效的各个失效阶段的各种表现形式,探讨发生失效的各种原因.如热应力与热冲击、金属的溶解、基板和元件过热、超声清洗的损害,以及如何在工艺上进行改进以改善焊点的可靠性,使焊点有良好的可靠性、不易损坏,能够承受变化的负载等,从而提高产品的质量。 相似文献
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Li Huakang Lv Kehong Qiu Jing Chen Bailiang 《International Journal of Electronics》2018,105(6):1011-1024
The test path of solder joint intermittent connection faults under direct-current stimulus is examined in this paper. According to the physical structure of the circuit, a network model is established first. A network node is utilised to represent the test node. The path edge refers to the number of intermittent connection faults in the path. Then, the selection criteria of the test path based on the node degree index are proposed and the solder joint intermittent connection faults are covered using fewer test paths. Finally, three circuits are selected to verify the method. To test if the intermittent fault is covered by the test paths, the intermittent fault is simulated by a switch. The results show that the proposed method can detect the solder joint intermittent connection fault using fewer test paths. Additionally, the number of detection steps is greatly reduced without compromising fault coverage. 相似文献
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由于SMT中焊点形态影响焊点质量和可靠性,国外对SMT焊点形态的预测和控制研究有所重视。文中用有限元方法对RC3216片式元件焊点三维形态进行计算,考虑了焊点钎料量对焊点三维形态的影响;提出了一种用触针测量法研究点三维形态的实验方法,并对计算结果和实验结果进行了比较,结果表明,计算结果与实验结果吻合良好。 相似文献
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This paper reports a novel method to enhance solder ball or solder ring bonding strength by using electrowetting-on-dielectric (EWOD) effect. With a low melting point, the metal Sn has been widely used in electronic packaging technology. Since Sn will be molten into liquid when the temperature is increased above the melting point, the method for treating liquid can be herein employed. Contact angle of the molten Pb-free balls or ring structure on silicon substrate have been experimentally changed by applying electric field across the thin dielectric film between the molten solder and the conductive silicon substrate. The contact area between the solder and the substrate is enlarged due to the decrease of the contact angle. Our testing results on the EWOD enhanced packaging structures of solder balls, flip-chip and solder ring hermetic package generally show about 50% enhancement in bonding shear strength. The significantly enhanced solder link bonding strength is hopeful for improving packaging reliability and is promising to be used in high performance silicon based electronic or microelectromechanic SiP (system in package) technologies. 相似文献
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概述了化学镀镍层中的微量添加剂(PDIS)浓度对化学镀Ni/Pa/Au镀层的析出速度、耐蚀性、焊料湿润性和焊料接合可靠性的影响。 相似文献
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Seung Wook Yoon Chang Jun Park Sung Hak Hong Jong Tae Moon Ik Seong Park Heung Sup Chun 《Journal of Electronic Materials》2000,29(10):1233-1240
Chip scale packages (CSP) have essential solder joint quality problems, and a board level reliability is a key issue in design
and development of the CSP type packages. There has been an effort to eliminate Pb from solder due to its toxicology. To evaluate
the various solder balls in CSP package applications, Pb-free Sn-Ag-X (X=In, Cu, Bi) and Sn-9Zn-1Bi-5In solder balls were
characterized by melting behavior, phases, interfacial reaction, and solder joint reliability. For studying joint strength
between solders and under bump metallurgy (UBM) systems, various UBMs were prepared by electroplating and electroless plating.
After T/C (temperature cycle) test, Sn3.5Ag8.5In solder was partially corroded and its shape was distorted. This phenomenon
was observed in a Sn3Ag10In 1Cu solder system, too. Their fractured surface, microstructure of solder joint interface, and
of bulk solder ball were examined and analyzed by optical microscopy, SEM and EDX. To simulate the real surface mounting condition
and evaluate the solder joint reliability on board level, Daisy chain test samples using LF-CSP packages were prepared with
various Pb-free solders, then a temperature cycle test (−65∼ 150°C) was performed. All tested Pb-free solders showed better
board level solder joint reliability than Sn-36Pb-2Ag. Sn-3.5Ag-0.7Cu and Sn-9Zn-1Bi-5In solders showed 35%, 100% superior
solder joint reliability than Sn-36Pb-2Ag solder ball, respectively. 相似文献
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Jong-Woong Kim Dae-Gon Kim Won Sik Hong Seung-Boo Jung 《Journal of Electronic Materials》2005,34(12):1550-1557
The microstructural investigation and thermomechanical reliability evaluation of the Sn-3.0Ag-0.5Cu solder bumped flip-chip
package were carried out during the thermal shock test of the package. In the initial reaction, the reaction product between
the solder and Cu mini bump of chip side was Cu6Sn5 intermetallic compound (IMC) layer, while the two phases which were (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 were formed between the solder and electroless Ni-P layer of the package side. The cracks occurred at the corner solder joints
after the thermal shocks of 400 cycles. The primary failure mechanism of the solder joints in this type of package was confirmed
to be thermally-activated solder fatigue failure. The premature brittle interfacial failure sometimes occurred in the package
side, but nearly all of the failed packages showed the occurrence of the typical fatigue cracks. The finite-element analyses
were conducted to interpret the failure mechanisms of the packages, and revealed that the cracks were induced by the accumulation
of the plastic work and viscoplastic shear strains. 相似文献
19.
倒装焊复合SnPb焊点应变应力分析 总被引:1,自引:1,他引:1
近年来,在微电子工业中,轻、薄、短、小是目前电子封装技术发展的趋势。因此,倒装焊技术应用越来越广,而焊点的可靠性在倒装焊技术中变得越来越重要。采用有限元软件,模拟、分析了焊点高度和下填料对焊点在热载荷作用下的应力应变值。 相似文献
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The ball impact test was developed as a package-level measure for the board-level drop reliability of solder joints in the
sense that it leads to fracturing of solder joints around intermetallics, similar to that from a board-level drop test. We
investigated numerically the effects of constitutive relationships of solder alloy on transient structural responses of a
single package-level solder joint subjected to ball impact testing. This study focused on the characteristics of the ascending
part of the impact force profile. According to the piecewise linear stress-strain curve obtained for the Sn-4Ag-0.5Cu solder
alloy, parametric studies were performed by varying either segmental moduli or characteristic stresses of the curve at fixed
ratios, with regard to the lack of available rate-dependent material properties of solder alloys. 相似文献