高功率半导体激光器微通道热沉的方案设计

对用于高功率半导体激光器的叠片式微通道热沉进行方案设计,利用计算流体力学和数值传热学对各种方案进行数值仿真,研究了微通道的特征尺寸和流量等因素对冷却效果和流动阻力特性的影响,一般情况下,减小微通道的特征尺寸和增加冷却水的流量可以降低传热热阻,但增加了流动压力损失;另外对金刚石热扩散片（次热沉）的效果也进行了数值计算,计算结果表明:金刚石热扩散片在该类型问题中降低温度作用明显。     

高功率半导体激光器微通道热沉的方案设计

 对用于高功率半导体激光器的叠片式微通道热沉进行方案设计,利用计算流体力学和数值传热学对各种方案进行数值仿真,研究了微通道的特征尺寸和流量等因素对冷却效果和流动阻力特性的影响,一般情况下,减小微通道的特征尺寸和增加冷却水的流量可以降低传热热阻,但增加了流动压力损失;另外对金刚石热扩散片（次热沉）的效果也进行了数值计算,计算结果表明:金刚石热扩散片在该类型问题中降低温度作用明显。     

微通道热沉内液氮流动沸腾的换热特性

本文研究了流最为50.1～880.5 kgm-2s-1,干度为0.01～0.25范围内微通道热沉内液氮流动沸腾的换热特性.热沉基材为一块长宽厚为50 min×30 mm×4 mm的不锈钢板,钢板上加工有宽1.0 mm,深2.0 mm的9个通道.实验结果表明在定热流密度条件下,热沉表面温度分布很不均匀,这主要是由微通道内...     

基于机器学习方法的微通道热沉性能预测研究

本文提出使用机器学习方法快速准确地预测歧管–二次流混合结构微通道热沉的泵功率和总热阻。将混合结构微通道热沉的结构特征参数进行了无量纲化,利用计算流体动力学的方法获得数据集。测试了不同机器学习算法在混合结构热沉性能预测任务上的表现。结果表明在数据集有限的情况下,随机森林算法能准确地学习到无量纲结构参数与泵功率和总热阻之间的映射关系。本文研究结果将有助于微通道热沉的优化设计。     

石墨片作辅助热沉的高功率半导体激光器热传导特性

为使边发射高功率单管半导体激光器有源区温度降低,增加封装结构的散热性能,降低器件封装成本,提出一种采用高热导率的石墨片作为辅助热沉的高功率半导体激光器封装结构。利用有限元分析研究了采用石墨片作辅助热沉后,封装器件的工作热阻更低,散热效果更好。研究分析过渡热沉铜钨合金与辅助热沉石墨的宽度尺寸变化对半导体激光器有源区温度的影响。新型封装结构与使用铜钨合金作为过渡热沉的传统结构相比,有源区结温降低4.5 K,热阻降低0.45 K/W。通过计算可知,激光器的最大输出功率为20.6 W。在研究结果的指导下,确定铜钨合金与石墨的结构尺寸,以达到最好的散热效果。     

高功率半导体巴条激光器的热特性分析

对采用5层叠焊的微通道无氧铜热沉冷却的巴条激光器进行了流体动力学(CFD)分析。建立了条宽10 mm、腔长1.5 mm巴条芯片的流固耦合共轭传热模型,得到了不同流量水冷下激光器的热阻和压力损失曲线。分析了300 m L/min水流时,激光器的温度分布和冷却水的流动性能。实验条件下,测试了该微通道热沉封装的808 nm巴条激光器的热阻和压力损失。数值计算和实验测试所得的结果一致,在300 m L/min水流下,巴条热阻为0.38℃/W,在温度不高于70℃时可满足连续模式下90 W的散热要求。     

基于沸腾-空化耦合效应的微通道线阵LD用热沉

针对大功率LD的冷却需求,基于沸腾-空化耦合效应,研制了一种微通道相变热沉,封装腔长1.5 mm的LD线阵。依据加工条件确定通道宽度、深度以及间距,采用2维数值模型估算了通道长度,热沉材料采用无氧铜,多层叠焊,外形尺寸为20 mm×12 mm×1.6 mm。实验测试了连续功率LD输出0～100 W时的电 光转换效率以及电流 输出功率等特性,冷却工质采用R134a,磁驱齿轮泵电机转速50 r/s时热沉热阻为0.3 ℃/W。结果显示微通道相变热沉具有良好的散热能力,能够满足大功率LD的散热要求。     

基于沸腾-空化耦合效应的微通道线阵LD用热沉

 针对大功率LD的冷却需求,基于沸腾-空化耦合效应,研制了一种微通道相变热沉,封装腔长1.5 mm的LD线阵。依据加工条件确定通道宽度、深度以及间距,采用2维数值模型估算了通道长度,热沉材料采用无氧铜,多层叠焊,外形尺寸为20 mm×12 mm×1.6 mm。实验测试了连续功率LD输出0～100 W时的电 光转换效率以及电流 输出功率等特性,冷却工质采用R134a,磁驱齿轮泵电机转速50 r/s时热沉热阻为0.3 ℃/W。结果显示微通道相变热沉具有良好的散热能力,能够满足大功率LD的散热要求。     

大功率LED灯珠与散热器直焊结构散热效果分析

散热是制约大功率LED发展的瓶颈,为了更好地解决散热问题,采用新型冷喷涂技术,在铝合金散热器表面喷涂铜层,实现了LED灯珠与散热器的直焊,取代了目前使用导热硅胶等热界面材料压接的方式,有效地消除了压接产生的接触热阻,显著改善了散热效果。通过建立LED灯具的三维模型,采用CAE软件模拟和实验两种方法验证了LED灯具直焊结构的散热效果明显优于压接结构,并且随着LED输入功率的增大,直焊结构的散热优势更加显著。     

基于康托尔分形微通道流动与传热的模拟

高密度、 小体积和高集成的电子元器件散热困难, 易造成过早失效, 采用微通道换热器可以实现小体积内高热流的散热, 但流动阻力很大. 为了保证传热效果, 降低流动阻力, 本文提出了一种新型的微通道结构并对其流动与传热特性进行了数值模拟. 首先研究了微通道形状和结构, 模拟结果表明: 进出口截面宽高比为0.8 的矩形微通道的换热效果最好; 并在此基础上提出一种康托尔分型凹槽结构, 研究了有无康托尔分形以及不同分形级数对流动与传热性能的影响, 综合对比发现: 第二级康托尔分形模型 N2 既能保证热阻显著降低, 又能相比阵列结构降低压降, 具有明显的换热优势; 最后对这种康托尔分形结构的凹槽形状, 尺寸及不同方向上的分形进行研究, 结果表明梯形凹槽的下上表面长度比b/a 为0.6 、 流动方向分形比fx 为1 .25 和通道高度方向分形比fy 为1 .5 时换热流动性能最佳.     

Constructal Optimization of Rectangular Microchannel Heat Sink with Porous Medium for Entropy Generation Minimization

A model of rectangular microchannel heat sink (MCHS) with porous medium (PM) is developed. Aspect ratio of heat sink (HS) cell and length-width ratio of HS are optimized by numerical simulation method for entropy generation minimization (EGM) according to constructal theory. The effects of inlet Reynolds number (Re) of coolant, heat flux on bottom, porosity and volume proportion of PM on dimensionless entropy generation rate (DEGR) are analyzed. From the results, there are optimal aspect ratios to minimize DEGR. Given the initial condition, DEGR is 33.10% lower than its initial value after the aspect ratio is optimized. With the increase of Re, the optimal aspect ratio declines, and the minimum DEGR drops as well. DEGR gets larger and the optimal aspect ratio remains constant with the increasing of heat flux on bottom. For the different volume proportion of PM, the optimal aspect ratios are diverse, but the minimum DEGR almost stays unchanged. The twice minimized DEGR, which results from aspect ratio and length-width ratio optimized simultaneously, is 10.70% lower than the once minimized DEGR. For a rectangular bottom, a lower DEGR can be reached by choosing the proper direction of fluid flow.     

C-mount封装激光器热特性分析与热沉结构优化研究

为了降低单管半导体激光器的结温、提高器件的散热效果,基于C-mount热沉的热特性分析提出了一种优化的台阶热沉结构,研究了单管激光器结温和腔面侧向温度分布曲线的影响。在热沉温度298 K和连续输出功率10 W的条件下,腔长为1.5 mm的典型C-mount封装结构激光器的结温为343.6 K,热阻为4.6 K/W。通过在典型C-mount热沉中引入台阶结构,使封装激光器的结温降低为333.8 K,热阻减小到3.5 K/W。计算表明,其输出功率可提高近20%。     

Experimental Investigation of the Effect of Flow Arrangements on the Performance of a Micro-Channel Heat Sink

Abstract

An experimental study is carried out to investigate the effect of entrance and exit conditions that prevail due to different flow arrangements on the thermal performance of a copper micro-channel heat sink. Three flow arrangements—U-type, S-type, and P-type—were considered for the analysis with a test piece having inlet and outlet plenum dimensions of 10 mm × 30 mm × 2.5 mm with an array of parallel micro-channels having an individual width of 330 μm and a uniform channel depth of 2.5 mm. Performance evaluations for different flow conditions at inlet and outlet plenums were made by maintaining constant heat supply at 125 W, 225 W, and 375 W with varying Reynolds number ranging from 224 to 1,121. Nusselt number and pressure drop were computed by measuring temperature difference and pressure drop across the inlet and outlet plenum for various test combinations. Maximum heat transfer was observed for the U-type flow arrangement, followed by the P-type and S-type; maximum pressure drop was noted for the S-type flow arrangement, followed by the U-type and P-type arrangements for a constant Reynolds number. A detailed analysis of the experimental results indicate that from a pressure drop point of view, the P-type flow arrangement is preferred, whereas from the heat transfer point of view, the U-type is found to be a better option.     

Experimental Investigation on Pressure Drop and Heat Transfer Characteristics of Copper Metal Foam Heat Sink

Abstract

The effect of the cooling performance of a copper metal foam heat sink under buoyancy-induced convection is investigated in this work. Experiments are conducted on copper metal foam of 61.3% porosity with 20 pores per inch. The pressure drop experiment is carried out to find the permeability and foam coefficient of the porous media. It is found that the property of porous media changes by changing the angle of inclination of the porous media from a horizontal to a vertical position while keeping the orientation and porosity the same. The Hazen-Dupuit Darcy model is used to curve-fit the longitudinal global pressure drop versus the average fluid speed data from an isothermal steady-flow experiment across the test section of the porous medium. The study concludes that the permeability and foam coefficient for copper foam is found to be 1.11 × 10^?7 m² and 79.9 m^?1, respectively. The heat transfer study shows that the thermal performance of copper metal foam is 35–40% higher than the conventional aluminum metal heat sink under an actual conventional mode.     

Thermo-Hydraulic Behavior of Microchannel Heat Exchanger System

This article presents an experimental study of thermo-hydrodynamic phenomena in a microchannel heat exchanger system. The aim of this investigation is to develop correlations between flow/thermal characteristics in the manifolds and the heat transfer performance of the microchannel. A rectangular microchannel fabricated by a laser-machining technique with channel width and hydraulic diameter of 87 μm and 0.17 mm, respectively, and a trapezoidal-shaped manifold are used in this study. The heat sink is subjected to iso-flux heating condition with liquid convective cooling through the channels. The temporal and spatial evolutions of temperature as well as total pressure drop across the system are monitored using appropriate sensors. Data obtained from this study were used to establish relationships between parameters such as longitudinal wall conduction factor, residence and switching time, and thermal spreading resistance with Reynolds number. Result shows that there exist an optimum Reynolds number and conditions for the microchannel heat exchanger system to result in maximum heat transfer performance. The condition in which the inlet manifold temperature surpasses the exit fluid temperature results in lower junction temperature. It further shows that for a high Reynolds number, the longitudinal wall conduction parameter is greater than unity and that the fluid has sufficient dwelling time to absorb heat from the wall of the manifold, leading to high thermal performance.     

Experimental Investigation on Heat Transfer Characteristics of a Gas-to-Gas Counterflow Microchannel Heat Exchanger

Heat transfer characteristics of a gas-to-gas counterflow microchannel heat exchanger have been experimentally investigated. Temperatures and pressures at inlets and outlets of the heat exchanger have been measured to obtain heat transfer rates and pressure drops. The heat transfer and the pressure drop characteristics are discussed. Since the partition wall of the heat exchanger is thick compared with the microchannel dimensions, a simple heat exchange model with constant wall temperature is proposed to predict the heat transfer rate. The predicted heat transfer rate using the constant wall temperature model agrees well with the experimental results.     

Heat Transfer and Fluid Flow Characteristics of Microchannel with Oval-Shaped Micro Pin Fins

A novel microchannel heat sink with oval-shaped micro pin fins (MOPF) is proposed and the characteristics of fluid flow and heat transfer are studied numerically for Reynolds number (Re) ranging from 157 to 668. In order to study the influence of geometry on flow and heat transfer characteristics, three non-dimensional variables are defined, such as the fin axial length ratio (α), width ratio (β), and height ratio (γ). The thermal enhancement factor (η) is adopted as an evaluation criterion to evaluate the best comprehensive thermal-hydraulic performance of MOPF. Results indicate that the oval-shaped pin fins in the microchannel can effectively prevent the rise of heat surface temperature along the flow direction, which improves the temperature distribution uniformity. In addition, results show that for the studied Reynolds number range and microchannel geometries in this paper, the thermal enhancement factor η increases firstly and then decreases with the increase of α and β. In addition, except for Re = 157, η decreases first and then increases with the increase of the fin height ratio γ. The thermal enhancement factor for MOPF with α = 4, β = 0.3, and γ = 0.5 achieves 1.56 at Re = 668. The results can provide a theoretical basis for the design of a microchannel heat exchanger.     

基于微蒸发腔制冷的大功率激光二极管制冷组件

利用节流的高压冷却介质在微蒸发腔内相变吸热,设计了一种用于大功率激光二极管制冷的封装组件。该组件采用高热导的无氧铜,用精密线切割、化学腐蚀等技术制作微蒸发腔,再通过自制的焊接设备完成制冷组件的封装。按照大功率激光二极管条的发热模型,理论上对微蒸发腔制冷组件的温度分布进行了数值模拟,结果与60 W激光二极管条的散热实验符合较好,得到制冷剂流量为23 m L/min时的热阻为0.289℃/W。