Epitaxial growth of fully relaxed Si0.75Ge0.25 on SOI substrate

A fully relaxed Si_0.75Ge_0.25 film with low dislocation densities is fabricated by epitaxial growth on SOI substrate without depositing graded buffers. The relaxation mechanism of the SiGe layer directly grown on SOI substrate is also analyzed. For SiGe grown on SOI with low Ge content, the strain is redistributed between SiGe and the top Si of SOI substrate, and the strain residing in SiGe layer can be fully relaxed by the formation and expansion of dislocation half-loops near the SiGe/Si interface. The surface morphology and crystal quality of all samples are analyzed by optical microscopy and transmission electron microscopy (TEM), respectively. Compared to the Si_0.75Ge_0.25 layer epitaxially grown on graded buffer, the Si_0.75Ge_0.25 directly grown on SOI substrate appears good surface morphology and perfect crystal quality.     

高能电子衍射研究H钝化偏角Si衬底上Si,GexSi1-x的分子束外延生长模式

用高能电子衍射(RHEED)研究H钝化偏角Si衬底上Si,Ge_xSi_1-x材料的分子束外延(MBE)生长模式,发现经低温处理的H钝化Si衬底上要经过10nm左右的Si生长才能获得比较平整的表面.Si,Ge_xSi_1-x外延时的稳定表面均以双原子台阶为主,双原子台阶与单原子台阶并存的结构.Si双原子台阶上的Si二聚体列(dimerrow)取向垂直于台阶边缘,而Ge_xSi_1-x双原 关键词：     

Observation of strain relaxation in Si1-xGex layers by optical and electrical characterisation of a Schottky junction

We have studied the effect of the strain relaxation on the band-edge alignments in a Pt/p-Si_1-xGe_x Schottky junction with x=0.14 by internal photoemission spectroscopy and current–voltage measurements. We have shown that the variations in the band-edge alignments can be observed directly by measuring the optical and electrical properties of a simple Schottky junction. The strain in the Si_1-xGe_x layer has been partially relaxed by thermal treatments at two different temperatures. The degree of relaxation and other structural changes have been determined by a high-resolution X-ray diffractometer. Both optical and electrical techniques have shown that the barrier height of the Pt/Si_0.86Ge_0.14 junction increases with the amount of relaxation in the Si_1-xGe_x layer. This shows that the valence-band edge of the Si_1-xGe_x layer moves away from the Fermi level of the Pt/Si_1-xGe_x junction. The band-edge movement results from the increase in the band gap of the Si_1-xGe_x layer after the strain relaxation. This result agrees with the theoretical predictions for the strain-induced effects on the Si_1-xGe_x band structure. Received: 18 October 2000 / Accepted: 19 December 2000 / Published online: 23 March 2001     

Surfactant-mediated growth of Si1-xSnx layers by molecular-beam epitaxy

1-x Sn_x (0.01≤x≤0.04) layers on Si(001) and relaxed Si-Ge substrates. The Si_1-xSn_x layers were investigated using Rutherford backscattering spectrometry, atomic force microscopy, transmission electron microscopy and preferential-etching experiments. The investigation of surfactant-mediated growth of epitaxial Si_1-xSn_x was motivated by a possible use of relatively higher growth temperatures without relaxation by surface precipitation. It is demonstrated that higher growth temperatures are attainable when Bi is used as surfactant if the surface-segregated Sn layer is relatively small, equivalent to Si_1-xSn_x layers of low strain. The increase in growth temperature leads to a significant improvement in the crystalline quality of these Si_1-xSn_x layers. Received: 4 December 1998/Accepted: 9 December 1998     

(Si)n/(Ge)n超晶格几何结构

本文用Keating模型计算了Si_1-xGe_x(x=0—1)作衬底、沿(100)方向生长的(Si)_n/(Ge)_n(n=1—6)应力超晶格的几何结构,并讨论了衬底对超晶格生长的影响,计算结果发现对于(Si)_n/(Ge)_n超晶格,用适当的Si_1-xGe_x作衬底有利于超晶格的生长。 关键词：     

Dopant diffusion and segregation in semiconductor heterostructures: Part 2. B in GexSi1-x/Si structures

x Si_1-x/Si heterostructures have been obtained. Here the chemical effects seem to be of less importance. The Fermi-level effect determines the ionized boron solubilities in Ge_xSi_1-x and in Si, as well as the thermal equilibrium concentration of the singly-positively-charged crystal self-interstitials I⁺ which governs the boron diffusion process. The junction carrier concentration affects the concentration of I⁺ and solubility of B in the region and hence controls B diffusion across the heterojunction. Received: 20 August 1998/Accepted: 23 September 1998     

Electronic structure,mechanical and optical properties of ternary semiconductors Si1-xGexC (X = 0, 0.25, 0.50, 0.75, 1)

The electronic structure of silicon carbide with increasing germanium content have been examined using first principles calculations based on density functional theory. The structural stability is analysed between two different phases, namely, cubic zinc blende and hexagonal phases. The zinc blende structure is found to be the stable one for all the Si_1-xGe_xC semiconducting carbides at normal pressure. Effect of substitution of Ge for Si in SiC on electronic and mechanical properties is studied. It is observed that cubic SiC is a semiconductor with the band gap value 1.243?eV. The band gap value of SiC is increased due to the substitution of Ge and the band gap values of Si _0.75 Ge _0.25 C, Si _0.50 Ge _0.50 C, Si _0.25 Ge _0.75 C and GeC are 1.322 eV, 1.413 eV, 1.574 eV and 1.657?eV respectively. As the pressure is increased, it is found that the energy gap gets decreased for Si_1-x Ge_xC (X?=?0, 0.25, 0.50, 0.75, 1). The elastic constants satisfy the Born – Huang elastic stability criteria. The bulk modulus, shear modulus, Young’s modulus and Poisson’s ratio are also calculated and compared with the other available results.     

Strain-balanced Si<Subscript>1-x</Subscript>Ge<Subscript>x</Subscript>/Si type II quantum wells for 1.55 μm detection and emission

This work deals with the optoelectronic properties of heterostructures built on type II Si_1-xGe_x/Si strained quantum wells grown on relaxed Si_1-yGe_y/Si (001) pseudo-substrates. To limit the intrinsic problem due to the real-space indirect nature of the interface, we propose and model three heterostructures having three different potential profiles of the valence and conduction bands which consist in various arrangements of Si and Si_1-xGe_x barriers of different Ge contents. The proposed stacks are designed in a pragmatic way for a pseudomorphic growth on relaxed Si_1-yGe_y assuming individual layer thickness being smaller than the known critical thickness and an overall compensation of the strain. Variation of thickness and compositions (x>y) permits to optimize i) the quantum confinement of electrons and heavy-hole levels and ii) the wave function's overlap and the out-of-plane oscillator strength. The optimum parameters satisfy a fundamental emission at a key 1.55 μm wavelength below the absorption edge of each layer constitutive of the stacks. A comparison between the characteristics of the three heterostructures brings out the superior advantages of the W architecture.     

The mobility of electrons in strained silicon

The development of Si and Si_1−xGe_x layer growth by molecular beam epitaxy has enabled heterostructures and HEMT devices to be made with Group IV semiconductors. Strain is very important in determining the electronic behaviour of this system and as an initial step towards understanding mobility in SiGe HEMT structures a Monte Carlo technique has been used to simulate electron transport in bulk Si, strained by commensurate growth on a (001) Si_1−yGe_y buffer. The in-plane mobility initially increases with increasing strain but then falls at higher strains and fields. Results are presented for both undoped and 10¹⁷ cm⁻³ n-type Si, fields of 10² to 10⁴ Vcm⁻¹ and strain levels up to the equivalence of growth on a Si_0.25Ge_0.75 buffer. The results are explained by the splitting of the degenerate conduction band minimum and the transition probability between the two-fold and four-fold split minima.     

GexSi1-x/Si应变层超晶格的分子束外延生长及其特性研究

在Si(100)衬底上用分子束外延在不同的温度下生长了不同组份的Ge_xSi_1-x/Si应变层超晶格。用反射式高能电子衍射、X射线双晶衍射、卢瑟福背散射、透射电子显微镜以及Raman。散射等测试方法研究了Ge_xSi_1-x/Si超晶格的生长及其结构特性。结果表明,对不同合金组份的超晶格,其最佳生长温度不同。x值小,生长温度高;反之,则要求生长温度低。对于x为0.1—0.6,在400—600℃的生长温度范围能够长成界面平整、 关键词：     

A one-dimensional SiGe superlattice grown by UHV epitaxy

One-dimensional SiGe superlattices with periods ranging from 100 to 800 Å have been deposited on Si substrates by periodically varying the Ge content of a mixed Si_1-x Ge _x multilayer structure fromx=0 tox=0.15. The deposition was successful, employing and UHV evaporation technique at a substrate temperature of 750°C fulfilling the four conditions: Single crystal growth, no interdiffusion, two-dimensional growth, and pseudomorphic growth. It is shown that mismatch above 8 · 10^?3 favours growth by three-dimensional nucleation. The experimentally determined spacing of misfit dislocations is compared with theoretical results obtained by van der Merwe. The pseudomorphic growth behaviour of layers thinner than a critical thickness could be confirmed.     

Ge metal oxide semiconductor field effect transistors with optimized Si cap and HfSiO2 high-k metal gate stacks

High mobility metal-oxide-semiconductor-field-effect-transistors (MOSFETs) are demonstrated on high quality epitaxial Si_0.75Ge_0.25 films selectively grown on Si (100) substrates. With a Si cap processed on Si_0.75Ge_0.25 channels, HfSiO₂ high-k gate dielectrics exhibited low C–V hysteresis (<10 mV), interface trap density (7.5 × 10¹⁰), and gate leakage current (∼10⁻²A/cm² at an EOT of 13.4 Å), which are comparable to gate stack on Si channels. The mobility enhancement afforded intrinsically by the Si_0.75Ge_0.25 channel (60%) is further increased by a Si cap (40%) process, resulting in a combined ∼100% enhancement over Si channels. The Si cap process also mitigates the low potential barrier issues of Si_0.75Ge_0.25 channels, which are major causes of the high off-state current of small band gap energy Si_0.75Ge_0.25 pMOSFETs, by improving gate control over the channel.     

Formation of relaxed SiGe on the buffer consists of modified SiGe stacked layers by Si pre-intermixing

High-quality relaxed SiGe films on Si (0 0 1) have been demonstrated with a buffer layer containing modified SiGe (m-SiGe) islands in ultra-high vacuum chemical vapor deposition (UHV/CVD) system. The m-SiGe islands are smoothened by capping an appropriate amount of Si and the subsequent annealing for 10 min. This process leads to the formation of a smooth buffer layer with non-uniform Ge content. With the m-SiGe-dot multilayer as a buffer layer, the 500-nm-thick uniform Si_0.8Ge_0.2 layers were then grown. These m-SiGe islands can serve as effective nucleation centers for misfit dislocations to relax the SiGe overlayer. Surface roughness, strain relaxation, and crystalline quality of the relaxed SiGe overlayer were found to be a function of period's number of the m-SiGe-dot multilayer. By optimizing period number in the buffer, the relaxed Si_0.8Ge_0.2 film on the 10-period m-SiGe-dot multilayer was demonstrated to have a threading dislocation density of 2.0 × 10⁵ cm⁻² and a strain relaxation of 89%.     

Dopant activation in Sb-implanted relaxed Si1−xGex alloy layers grown on compositionally graded buffers

Supersaturated solid solutions of substitutional, electrically active Sb have been obtained by ion implantation of relaxed epitaxial Si_1?xGe_x alloy layers grown on compositionally graded buffers. Substitutional and nonsubstitutional Sb fractions in relaxed Si_0.85Ge_0.15, Si_0.65Ge_0.35 and Si_0.50Ge_0.50 alloy layers implanted to a dose of 5×10¹⁵ Sb cm^?2 and annealed isothermally at temperatures ranging from 400 to 850°C have been studied by Rutherford backscattering/channeling, transmission electron microscopy and Hall-effect and sheet resistivity measurements. A supersaturated solution of Sb corresponding to a peak carrier concentration of 4×10²⁰ cm^?3 and an electrically active fraction of 40% of the implanted dose is observed by Hall measurements for the case of Si_0.85Ge_0.15 and Si_0.65Ge_0.35 alloys annealed at 550°C.     

Specific features of plastic relaxation of a metastable Ge x Si1 − x layer buried between a silicon substrate and a relaxed germanium layer

Heterostructures Ge/Ge _x Si_{1 ? x} /Si(001) grown by molecular beam epitaxy have been investigated using atomic scale high-resolution electron microscopy. A germanium film (with a thickness of 0.5–1.0 μm) grown at a temperature of 500°C is completely relaxed. An intermediate Ge_0.5Si_0.5 layer remains in a strained metastable state, even though its thickness is 2–4 times larger than the critical value for the introduction of 60° misfit dislocations. It is assumed that the Ge/GeSi interface is a barrier for the penetration of dislocations from a relaxed Ge layer into the GeSi layer. This barrier is overcome during annealing of the heterostructures for 30 min at a temperature of 700°C, after which dislocation networks having different degrees of ordering and consisting predominantly of edge misfit dislocations are observed in the Ge/GeSi and GeSi/Si(001) heteroboundaries.     

Preparation of five-layered Si/SixGe1−x nano-films by RF helicon magnetron sputtering

Five-layered Si/Si_xGe_1−x films on Si(1 0 0) substrate with single-layer thickness of 30 nm, 10 nm and 5 nm, respectively were prepared by RF helicon magnetron sputtering with dual targets of Si and Ge to investigate the feasibility of an industrial fabrication method on multi-stacked superlattice structure for thin-film thermoelectric applications. The fine periodic structure is confirmed in the samples except for the case of 5 nm in single-layer thickness. Fine crystalline Si_xGe_1−x layer is obtained from 700 °C in substrate temperature, while higher than 700 °C is required for Si good layer. The composition ratio (x) in Si_xGe_1−x is varied depending on the applied power to Si and Ge targets. Typical power ratio to obtain x = 0.83 was 7:3, Hall coefficient, p-type carrier concentration, sheet carrier concentration and mobility measured for the sample composed of five layers of Si (10 nm)/Si_0.82Ge_0.18 (10 nm) are 2.55 × 10⁶ /°C, 2.56 × 10¹² cm⁻³, 1.28 × 10⁷ cm⁻², and 15.8 cm⁻²/(V s), respectively.     

用深能级瞬态谱方法研究赝晶Si/Ge0.25Si0.75/Si单量子阱的价带偏移

应变的Ge_xSi_1-x层和未应变的硅层间的能带偏移主要是价带偏移。量子阱中载流子的热发射能与界面的能带偏移有着密切的关系。本文用深能级瞬态谱(DLTS)研究分子束外延生长的p型Si/Ge_0.25Si_0.75/Si单量子阱的价带偏移,阱宽为15nm,考虑到电场的影响和量子阱中第一子能级的位置,对从DLTS得到的热发射能进行适当的修正,可以计算出Si/Ge_0.25Si_0.75/S 关键词：     

MoxGe1-x,MoxSi1-x薄膜的非晶形成成份及超导转变温度

用直流吸气溅射法在液氮冷底板上分别制备了Mo_xGe_1-x,Mo_xSi_1-x的薄膜。其形成非晶的成份分别为Ge>22at%,Si>18at％。超导转变临界温度T_c在非晶状态下随着Ge,Si的含量增加而下降(约6—3K)。非晶Mo₇₇Ge₂₃膜的晶化温度为780℃,而非晶Mo₇₈Si₂₂膜的晶化温度为480℃。 关键词：     

高完整GexSi1-x/Si应变超晶格的X射线双晶衍射研究

本文用X射线双晶衍射技术对分子束外延生长的Ge_xSi_1-x/Si应变超晶格的结构参数进行研究,分别采用X射线运动学理论和动力学理论对超晶格的双晶摆动曲线进行计算模拟,得出超晶格的全部结构参数;并对这两种理论计算模拟的结果进行比较,发现这两种理论计算的结果基本一致,只是在细微结构上略有差别,对高完整Ge_xSi_1-x/Si超晶格,用动力学理论计算的曲线更接近于实验曲线。 关键词：     

Effective barriers induced by confined carriers in space charge spectroscopy of Si/Ge quantum wells

Results are presented concerning the characterization of p-Si/Si_1-xGe_x/Si quantum wells (QW) by space charge spectroscopy. Analysis of potential barriers at the QW enables us to determine the valence band offset from such measurements. Admittance spectroscopy data of QWs with 30 nm undoped spacers, acceptor concentration N_A of about 10¹⁷cm^-3 in the cap and buffer layers, x=0.25 and a QW thickness in the range from 1 to 5 nm are in fair agreement with the proposed theoretical model. A decrease of the effective potential barriers due to hole tunneling via shallow acceptor states in the barrier is experimentally confirmed for 5 nm QW structures without spacers.