SH波对有部分脱胶衬砌的圆形孔洞的散射

本文研究了圆形孔洞内衬砌与孔洞部分脱胶时对ＳＨ波的散射．将脱胶区看作表面不相接触的弧形界面裂纹，利用波函数展开法，并引入裂纹面的位错密度函数，将问题归结为一组奇异积分方程．通过数值计算获得了动应力强度因子（ＤＳＩＦ）和远场位移及散射截面（ＳＣＳ）．结果显示：由于脱胶，ＤＳＩＦ和ＳＣＳ在较低的频率上发生共振．     

P波对界面部分脱胶的刚性圆柱夹杂物的散射

本文求解了弹性Ｐ波对界面部分脱胶的可动刚性圆柱夹杂物的散射问题。将脱胶区看作表面不相接触的弧形界面裂纹，借助波函数展开法并利用边界条件将问题转化为一组对偶级数方程。然后通过引入裂纹面的位错密度函数，将其化为一组具有Ｈｉｌｂｅｒｔ核的第二类奇异积分方程，并进一步化为Ｃａｕｃｈｙ型奇异积分方程组，数值求解方程组可获得动应力强度因子，夹杂物刚体振动位移和散射截面等重要参量。结果显示该类结构在较低的频率上发生共振，此低频共振特性与脱胶区大小，入射波方向、材料组合等多种参数有关。与已有方法相比，本文的方法更具一般性，适用于任意材料组合。     

黏弹性体界面裂纹的冲击响应

研究两半无限大黏弹性体界面Griffith裂纹在反平面剪切突出载荷下,裂纹尖端动应力强度因子的时间响应,首先,运用积分变换方法将黏弹性混合黑社会问题化成变换域上的对偶积分方程,通过引入裂纹位错密度函数进一步化成Cauchy型奇异积分方程,运用分片连续函数法数值求解奇异积分方程,得到变换域内的动应力强度因子,再用Laplace积分变换数值反演方法,将变换域的解反演到时间域内,最终求得动应力强度因子的时间响应,并对黏弹性参数的影响进行分析。     

剪切波作用下埋藏刚性椭圆与周围介质部分脱胶时的动力分析

本文利用波函数展开法和奇异积分方程技术研究了ＳＨ型反平面剪切波作用下埋藏刚性椭圆柱与周围介质部分脱胶时的动力特性，将脱胶区看作表面不相接触的椭圆弧形界面裂纹，利用波函数展开法，并引入裂纹位错密度函数为未知量，将问题归结为奇异积分方程。通过数值注解积分方程获得了远场和近场物理参量，度讨论了共振特性和各参数对共振的影响。     

剪切波作用下埋藏刚性椭圆柱与周围介质部分脱胶时的动力分析

本文利用波函数展开法和奇异积分方程技术研究了ＳＨ型反平面剪切波作用下埋藏刚性椭圆柱与周围介质部分脱胶时的动力特性．将脱胶区看作表面不相接触的椭圆弧形界面裂纹，利用波函数（Ｍａｔｈｉｅｕ函数）展开法，并引人裂纹面的位错密度函数为未知量，将问题归结为奇异积分方程，通过数值求解积分方程获得了远场和近场物理参量，并讨论了共振特性和各参数对共振的影响．     

多个纵向环形界面裂纹对P波散射的动应力强度因子

研究多个纵向环形界面裂纹的Ｐ波散射问题。以裂纹面的位错密度函数为未知量,利用Ｆｏｕｒｉｅｒ积分变换,将问题归结为第二类奇异积分方程,然后通过数值求解,获得裂纹尖端的动应力强度因子。最后给出了双裂纹动应力强度因子随入射波频率变化的关系曲线。     

圆夹杂内裂纹对SH波的动力响应

利用特殊函数的Graf加法公式和波函数展开方法得出了圆夹杂内作用集中力的格林函数．根据Bessel函数的渐近性质，对所得格林函数的奇异部分和有界部分进行了分离．利用所得的格林函数和互易定理得出了圆夹杂内裂纹在SH波作用下的散射场．根据裂纹的散射场建立了圆夹杂内裂纹的超奇异积分方程．对超奇异积分方程的数值求解，可得裂纹端点的动应力强度因子。     

薄膜涂层材料中币形界面裂纹的弹性波散射

研究了薄膜涂层材料中币形界面裂纹的弹性波散射问题,建立了含有币形界面裂纹的覆层半空间模型,采用Hankel积分变换,将裂纹对弹性波散射的问题转化为求解矩阵形式的奇异积分方程。结合渐近分析和围道积分技术得到积分方程的解,进一步推导了散射波的应力场和位移场,以及动应力强度因子的理论计算公式。在数值算例中,分析了不同材料组合和裂纹尺寸情况下动应力强度因子与入射波频率的关系,并给出了裂纹张开位移的结果。为薄膜涂层材料的动态破坏分析提供了一定的理论基础。     

带功能梯度材料的压电底层中周期裂纹对SH波的散射

本文研究了压电材料底层中周期裂纹对SH波的散射,通过渗透边界条件和界面上连续边界条件,将问题转化为一组带Hilbter核的奇异积分方程。利用利用切比雪夫多项式逼近方法求解Hilbter核的奇异积分方程,给出了标准动应力强度因子和电位移强度因子的表达式。最后通过数值算例说明了几何参数、物性参数,入射波频率和振幅等对强度因子的影响.     

折线型裂纹对SH波的动力响应

利用Fourier积分变换方法,得出了无限平面中用裂纹位错密度函数表示的单裂纹散射场．根据无穷积分的性质,把单裂纹的散射场分解为奇异部分和有界部分．利用单裂纹的散射场建立了折线裂纹在SH波作用下的Cauchy型奇异积分方程．根据折线裂纹散射场和所得的积分方程讨论了裂纹在折点处的奇性应力及折点处的奇性应力指数．利用所得的奇性应力定义了折点处的应力强度因子．对所得Cauchy型奇积分方程的数值求解,可得裂纹端点和折点处的动应力强度因子。     

Elastic wave scattering from a penny-shaped interface crack in coated materials

This paper is concerned with the elastic wave scattering induced by a penny-shaped interface crack in coated materials. Using the integral transform, the problem of wave scattering is reduced to a set of singular integral equations in matrix form. The singular integral equations are solved by the asymptotic analysis and contour integral technique, and the expressions for the stress and displacement as well as the dynamic stress intensity factors (SIFs) are obtained. Using numerical analysis, this approach is verified by the finite element method (FEM), and the numerical results agree well with the theoretical results. For various crack sizes and material combinations, the relations between the SIFs and the incident frequency are analyzed, and the amplitudes of the crack opening displacements (CODs) are plotted versus incident wavenumber. The investigation provides a theoretical basis for the dynamic failure analysis and nondestructive evaluation of coated materials.     

Dynamic fracture analysis of adhesive bonded material under normal loading

Dynamic fracture behavior of a Griffith crack along the interface of an adhesive bonded material under normal loading is studied. The singular integral equations are obtained by employing integral transformation and introducing dislocation density functions. By adopting Gauss-Jacobi integration formula, the problem is reduced to the solution of algebraic equations, and by collocation dots method. their solutions can be obtained Based on the parametric discussions presented in the paper, the following conclusions can be drawn： （1） Mode I dynamic stress intensity factor （DSIF） increases with increasing initial crack length and decreasing visco-elastic layer thickness, revealing distinct size effect; （2） The influence of the visco-elastic adhesive relaxation time on the DSIF should not be ignored.     

The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading

This paper studies the dynamic stress intensity factor (DSIF) at the interface in an adhesive joint under shear loading. Material damage is considered. By introducing the dislocation density function and using the integral transform, the problem is reduced to algebraic equations and can be solved with the collocation dots method in the Laplace domain. Time response of DSIF is calculated with the inverse Laplace integral transform. The results show that the mode Ⅱ DSIF increases with the shear relaxation parameter, shear module and Poisson ratio, while decreases with the swell relaxation parameter. Damage shielding only occurs at the initial stage of crack propagation. The singular index of crack tip is -0.5 and independent on the material parameters, damage conditions of materials, and time. The oscillatory index is controlled by viscoelastic material parameters.     

Dynamic stress intensity factors of two collinear mode-III cracks perpendicular to and on the two sides of a bi-FGM weak-discontinuous interface

The mechanical model was established for the anti-plane dynamic fracture problem for two collinear cracks on the two sides of and perpendicular to a weak-discontinuous interface between two materials with smoothly graded elastic properties, as opposed to a sharp interface with discontinuously changing elastic properties. The problem was reduced as a system of Cauchy singular integral equations of the first kind by Laplace and Fourier integral transforms. The integral equations were solved by Erdogan's collocation method and the dynamic stress intensity factors in the time domain were obtained through Laplace numerical inversion proposed by Miller and Guy. The influences of geometrical and physical parameters on the dynamic stress intensity factors were illustrated and discussed, based on which some conclusions were drawn: (a) to increase the thickness of the FGM strip on either side of the interface will be beneficial to reducing the DSIF of a crack perpendicular to a bi-FGM interface and embedded at the center of one of the FGM strips; (b) To increase the rigidity of the FGM strip where the crack is located will increase the DSIF. However, when the material in one side of the interface is more rigid, the DSIF of the interface-perpendicular embedded crack in the other side will be reduced; (c) To decrease the weak-discontinuity of a bi-FGM interface will not necessarily reduce the stress intensity factor of a crack perpendicular to it, which is different from the case of interfacial crack; (d) For two collinear cracks with equal half-length, when the distance between the two inner tips is less than about three times of the half-length, the interaction of them is intensified, however, when the distance is greater than this the interaction becomes weak.     

The scattering of general SH plane wave by interface crack between two dissimilar viscoelastic bodies

The scattering of general SH plane wave by an interface crack between two dissimilar viscoelastic bodies is studied and the dynamic stress intensity factor at the crack-tip is computed. The scattering problem can be decomposed into two problems: one is the reflection and refraction problem of general SH plane waves at perfect interface (with no crack); another is the scattering problem due to the existence of crack. For the first problem, the viscoelastic wave equation, displacement and stress continuity conditions across the interface are used to obtain the shear stress distribution at the interface. For the second problem, the integral transformation method is used to reduce the scattering problem into dual integral equations. Then, the dual integral equations are transformed into the Cauchy singular integral equation of first kind by introduction of the crack dislocation density function. Finally, the singular integral equation is solved by Kurtz's piecewise continuous function method. As a consequence, the crack opening displacement and dynamic stress intensity factor are obtained. At the end of the paper, a numerical example is given. The effects of incident angle, incident frequency and viscoelastic material parameters are analyzed. It is found that there is a frequency region for viscoelastic material within which the viscoelastic effects cannot be ignored. This work was supported by the National Natural Science Foundation of China (No.19772064) and by the project of CAS KJ 951-1-20     

Interaction of general plane P wave and cylindrical inclusion partially debonded from its viscoelastic matrix

The interaction of a general plane P wave and an elastic cylindrical inclusion of infinite length partially debonded from its surrounding viscoelastic matrix of infinite extension is investigated. The debonded region is modeled as an arc-shaped interface crack between inclusion and matrix with non-contacting faces. With wave functions expansion and singular integral equation technique, the interaction problem is reduced to a set of simultaneous singular integral equations of crack dislocation density function. By analysis of the fundamental solution of the singular integral equation, it is found that dynamic stress field at the crack tip is oscillatory singular, which is related to the frequency of incident wave. The singular integral equations are solved numerically, and the crack open displacement and dynamic stress intensity factor are evaluated for various incident angles and frequencies. The project supported by the National Natural Science Foundation of China (19872002) and Climbing Foundation of Northern Jiaotong University