Competitive technologies of third generation infrared photon detectors

Hitherto, two families of multielement infrared (IR) detectors are used for principal military and civilian infrared applications; one is used for scanning systems (first generation) and the other is used for staring systems (second generation). Third generation systems are being developed nowadays. In the common understanding, third generation IR systems provide enhanced capabilities like larger number of pixels, higher frame rates, better thermal resolution as well as multicolour functionality and other on-chip functions. In the paper, issues associated with the development and exploitation of materials used in fabrication of third generation infrared photon detectors are discussed. In this class of detectors two main competitors, HgCdTe photodiodes and quantum well IR photoconductors (QWIPs) are considered. The performance figures of merit of state-of-the-art HgCdTe and QWIP focal plane arrays (FPAs) are similar because the main limitations come from the readout circuits. However, the metallurgical issues of the epitaxial layers such as uniformity and number of defected elements are the serious problems in the case of long wavelength infrared (LWIR) and very LWIR (VLWIR) HgCdTe FPAs. It is predicted that superlattice based InAs/GaInSb system grown on GaSb substrate seems to be an attractive to HgCdTe with good spatial uniformity and an ability to span cutoff wavelength from 3 to 25 μm.     

Third-generation sensors for night vision

Third generation sensors are under development to enhance capabilities for target detection and identification, threat warning, and 3D imaging. Distinct programs for both cooled HgCdTe and uncooled microbolometer devices are part of this thrust. This paper will describe the technology for HgCdle two-colour, high-definition imaging sensors and threat warning devices, avalanche photodiode arrays for 3D imaging, and the supporting technology being developed to enhance the readouts that support these devices. Uncooled detector initiatives will also be described to reduce pixel size in conjunction with the production of 480×640 arrays. Finally, efforts are also beginning to move both photon and thermal detectors closer to radiative-limited performance while simultaneously reducing the cooling requirements for photon detectors. The paper presented there appears in Infrared Photoelectronics, edited by Antoni Rogalski, Eustace L. Dereniak, Fiodor F. Sizov, Proc. SPIE Vol. 5957, 59571Z (2005).     

New material systems for third generation infrared photodetectors

Third-generation infrared (IR) systems are being developed nowadays. In the common understanding, these systems provide enhanced capabilities-like larger numbers of pixels, higher frame rates, and better thermal resolution as well as multicolour functionality and other on-chip functions. In this class of detectors, two main competitors, HgCdTe photodiodes and quantum-well photoconductors, have being developed. Recently, two new material systems have been emerged as the candidates for third generation IR detectors, type II InAs/GaInSb strain layer superlattices (SLSs) and quantum dot IR photodetectors (QDIPs). In the paper, issue associated with the development and exploitation of multispectral photodetectors from these new materials is discussed. Discussions is focused on most recently on-going detector technology efforts in fabrication both photodetectors and focal plane arrays (FPAs). The challenges facing multicolour devices concerning complicated device structures, multilayer material growth, and device fabrication are described.     

Assessment of HgCdTe photodiodes and quantum well infrared photoconductors for long wavelength focal plane arrays

Recent trends in infrared detectors are towards large, electronically addressed two-dimensional arrays. In the long wavelength infrared (LWIR) spectral range HgCdTe focal plane arrays (FPAs) occupy a dominant position. However, the slow progress in the development of large LWIR photovoltaic HgCdTe infrared imaging arrays and the rapid achievements of novel semiconductor heterostructure systems have made it necessary to foresee the future development of different material technologies in fabrication large FPAs. Among the competing technologies in LWIR are the quantum well infrared photoconductors (QWIPs) based on lattice matched GaAs/AlGaAs and strained layer InGaAs/AlGaAs material systems. This paper compares the technical merits of two IR detector arrays technologies; photovoltaic HgCdTe and QWIPs. It is clearly shown that LWIR QWIP cannot compete with HgCdTe photodiode as the single device especially at higher temperature operation (>70 K) due to fundamental limitations associated with intersubband transitions. However, the advantage of HgCdTe is less distinct in temperature range below 50 K due to problems involved in HgCdTe material (p-type doping, Shockley–Read recombination, trap-assisted tunnelling, surface and interface instabilities). Even though the QWIP is a photoconductor, several of its properties such as high impedance, fast response time, long integration time, and low power consumption, well satisfy the requirements of fabrication of large FPAs. Due to the high material quality at low temperature, QWIP has potential advantages over HgCdTe for very LWIR (VLWIR) FPA applications in terms of the array size, uniformity, yield and cost of the systems.     

Polycrystalline lead selenide: the resurgence of an old infrared detector

The existing technology for uncooled MWIR photon detectors based on polycrystalline lead salts is stigmatized for being a 50-year-old technology. It has been traditionally relegated to single-element detectors and relatively small linear arrays due to the limitations imposed by its standard manufacture process based on a chemical bath deposition technique (CBD) developed more than 40 years ago. Recently, an innovative method for processing detectors, based on a vapour phase deposition (VPD) technique, has allowed manufacturing the first 2D array of polycrystalline PbSe with good electro optical characteristics. The new method of processing PbSe is an all silicon technology and it is compatible with standard CMOS circuitry. In addition to its affordability, VPD PbSe constitutes a perfect candidate to fill the existing gap in the photonic and uncooled IR imaging detectors sensitive to the MWIR photons. The perspectives opened are numerous and very important, converting the old PbSe detector in a serious alternative to others uncooled technologies in the low cost IR detection market. The number of potential applications is huge, some of them with high commercial impact such as personal IR imagers, enhanced vision systems for automotive applications and other not less important in the security/defence domain such as sensors for active protection systems (APS) or low cost seekers. Despite the fact, unanimously accepted, that uncooled will dominate the majority of the future IR detection applications, today, thermal detectors are the unique plausible alternative. There is plenty of room for photonic uncooled and complementary alternatives are needed. This work allocates polycrystalline PbSe in the current panorama of the uncooled IR detectors, underlining its potentiality in two areas of interest, i.e., very low cost imaging IR detectors and MWIR fast uncooled detectors for security and defence applications. The new method of processing again converts PbSe into an emerging technology.     

Advantages of QWIP technology in infrared thermal cameras

Standard GaAs/AlGaAs quantum well infrared photodetectors(QWIP)have been seriously considered as atechnological choice for the 3~(rd) generation of thermal imagers in the long wave infrared band(LWIR)for some time.Alternative technology like MCT(HgCdTe)was the technology choice of the 2~(nd) generation because of its high quantum efficiency.In the paper,measurements on the QWIP technology will be presented and a comparison with alternative technology will be done.     

Quantum structure based infrared detector research and development within Acreo’s centre of excellence IMAGIC

Acreo has a long tradition of working with quantum structure based infrared (IR) detectors and arrays. This includes QWIP (quantum well infrared photodetector), QDIP (quantum dot infrared photodetector), and InAs/GaInSb based photon detectors of different structure and composition. It also covers R&D on uncooled microbolometers. The integrated thermistor material of such detectors is advantageously based on quantum structures that are optimised for high temperature coefficient and low noise. Especially the SiGe material system is preferred due to the compatibility with silicon technology. The R&D work on IR detectors is a prominent part of Acreo’s centre of excellence “IMAGIC” on imaging detectors and systems for non-visible wavelengths. IMAGIC is a collaboration between Acreo, several industry partners and universities like the Royal Institute of Technology (KTH) and Linköping University.     

Material considerations for third generation infrared photon detectors

In the paper, issues associated with the development and exploitation of materials used in fabrication of third generation infrared photon detectors are discussed. In this class of detectors two main competitors, HgCdTe photodiodes and quantum well photoconductors are considered. The performance figures of merit of state-of-the-art HgCdTe and QWIP focal plane arrays (FPAs) are similar because the main limitations come from the readout circuits. The metallurgical issues of the epitaxial layers such as uniformity and number of defected elements are the serious problems in the case of long wavelength infrared (LWIR) and very LWIR (VLWIR) HgCdTe FPAs. It is predicted that superlattice based InAs/GaInSb system grown on GaSb substrate seems to be an alternative to HgCdTe with good spatial uniformity and an ability to span cutoff wavelength from 3 to 25 μm. In this context the material properties of type II superlattices are considered more in detail.     

Recent infrared detector technologies,applications, trends and development of HgCdTe based cooled infrared focal plane arrays and their characterization

Infrared thermal imaging, using cooled and uncooled detectors, is continuously gaining attention because of its wide military and civilian applications. Futuristic requirements of high temperature operation, multispectral imaging, lower cost, higher resolution (using pixels) etc. are driving continuous developments in the field. Although there are good reviews in the literature by Rogalski [1–4], Martyniuk et al. [5] and Rogalski et al. [6] on various types of infrared detectors and technologies, this paper focuses on some of the important recent trends and diverse applications in this field and discusses some important fundamentals of these detectors.     

History of infrared detectors

This paper overviews the history of infrared detector materials starting with Herschel??s experiment with thermometer on February 11^th, 1800. Infrared detectors are in general used to detect, image, and measure patterns of the thermal heat radiation which all objects emit. At the beginning, their development was connected with thermal detectors, such as thermocouples and bolometers, which are still used today and which are generally sensitive to all infrared wavelengths and operate at room temperature. The second kind of detectors, called the photon detectors, was mainly developed during the 20^th Century to improve sensitivity and response time. These detectors have been extensively developed since the 1940??s. Lead sulphide (PbS) was the first practical IR detector with sensitivity to infrared wavelengths up to ??3 ??m. After World War II infrared detector technology development was and continues to be primarily driven by military applications. Discovery of variable band gap HgCdTe ternary alloy by Lawson and co-workers in 1959 opened a new area in IR detector technology and has provided an unprecedented degree of freedom in infrared detector design. Many of these advances were transferred to IR astronomy from Departments of Defence research. Later on civilian applications of infrared technology are frequently called ??dual-use technology applications.?? One should point out the growing utilisation of IR technologies in the civilian sphere based on the use of new materials and technologies, as well as the noticeable price decrease in these high cost technologies. In the last four decades different types of detectors are combined with electronic readouts to make detector focal plane arrays (FPAs). Development in FPA technology has revolutionized infrared imaging. Progress in integrated circuit design and fabrication techniques has resulted in continued rapid growth in the size and performance of these solid state arrays.     

Development of an infrared detector: Quantum well infrared photodetector

The progress in the quantum well infrared photo-detector (QWIP) based on quantum confinement in semiconductor in recent 10 years has been reviewed. The differences between QWIP and the HgCdTe (HCT) infrared detector as well as their compensation are analyzed. The outlook for near-future trends in QWIP technologies is also presented. Supported by the National Natural Science Foundation of China (Grant Nos. 10474020, 10734090, and 60221502) and the Key Program of Basic Research of China (Grant No. 2004CB619004)     

THALES long wave QWIP thermal imagers

THALES have developed for volume manufacture high performance low cost thermal imaging cameras based on the THALES Research Technology (TRT) third generation gallium arsenide long wave QWIP array. Catherine XP provides 768 × 575 CCIR video resolution and Catherine MP provides 1280 × 1024 SXGA video resolution. These compact and rugged cameras provide 24 h passive observation, detection, recognition, identification (DRI) in the 8–12 μm range, providing resistance to battlefield obscurants and solar dazzle, and are fully self contained with standard power and communication interfaces. The cameras have expansion capabilities to extend functionality (for example, automatic target detection) and have network battlefield capability. Both cameras benefit from the high quantum efficiency and freedom from low frequency noise of the TRT QWIP, allowing operation at 75 K, low integration times and non interruptive non uniformity correction. The cameras have successfully reached technology readiness level 6/7 and have commenced environmental qualification testing in order to complete the development programmes. These latest additions to the THALES Catherine family provide high performance thermal imaging at an affordable cost.     

Infrared negative luminescent devices and higher operating temperature detectors

Infrared LEDs and negative luminescent devices, where less light is emitted than in equilibrium, have been attracting an increasing amount of interest recently. They have a variety of applications, including as a ‘source’ of IR radiation for gas sensing; radiation shielding for, and non-uniformity correction of, high sensitivity staring infrared detectors; and dynamic infrared scene projection. Similarly, infrared (IR) detectors are used in arrays for thermal imaging and, discretely, in applications such as gas sensing. Multi-layer heterostructure epitaxy enables the growth of both types of device using designs in which the electronic processes can be precisely controlled and techniques such as carrier exclusion and extraction can be implemented. This enables detectors to be made which offer good performance at higher than normal operating temperatures, and efficient negative luminescent devices to be made which simulate a range of effective temperatures whilst operating uncooled. In both cases, however, additional performance benefits can be achieved by integrating optical concentrators around the diodes to reduce the volume of semiconductor material, and so minimise the thermally activated generation-recombination processes which compete with radiative mechanisms. The integrated concentrators are in the form of Winston cones, which can be formed using an iterative dry etch process involving methane/hydrogen and oxygen. We present results on negative luminescence in the mid- and long-IR wavebands, from devices made from indium antimonide and mercury cadmium telluride, where the aim is sizes greater than 1 cm×1 cm. We also discuss progress on, and the potential for, operating temperature and/or sensitivity improvement of detectors, where very high-performance imaging is anticipated from systems which require no mechanical cooling.     

Uncooled MWIR and LWIR photodetectors in Poland

The history, status, and recent progress in the middle and long wavelength Hg_1−xCd_xTe infrared detectors operating at near room temperatures are reviewed. Thermal generation of charge carriers in narrow gap semiconductor is a major limitation or sensitivity. Cooling is a straightforward way to suppress thermal generation of charge carriers and reduce related noise. However, at the same time, cooling requirements make infrared systems bulky, heavy, and inconvenient in use. A number of concepts to improve performance of photodetectors operating at near room temperatures have been proposed and implemented. Recent considerations of the fundamental detector mechanisms suggest that near perfect detection can be achieved without the need for cryogenic cooling. This paper, to a large degree, is based on the research, development, and commercialization of uncooled HgCdTe detectors in Poland. The devices have been based on 3D-variable band gap and doping level structures that integrate optical, detection and electric functions in a monolithic chip. The device architecture is optimized for the best compromise between requirements of high quantum efficiency, efficient and fast collection of photogenerated charge carriers, minimized thermal generation, reduced parasitic impedances, wide linear range, wide acceptance angles and other device features. Recent refinements in the devices design and technology have lead to sensitivities close to the background radiation noise limit, extension of useful spectral range to > 16 μm wavelength and picosecond range response times. The devices have found numerous applications in various optoelectronic systems. Among them there are fast scan FTIR spectrometers developed under MEMFIS project.     

HOT infrared photodetectors

At present, uncooled thermal detector focal plane arrays are successfully used in staring thermal imagers. However, the performance of thermal detectors is modest, they suffer from slow response and they are not very useful in applications requiring multispectral detection. Infrared (IR) photon detectors are typically operated at cryogenic temperatures to decrease the noise of the detector arising from various mechanisms associated with the narrow band gap. There are considerable efforts to decrease system cost, size, weight, and power consumption to increase the operating temperature in so-called high-operating-temperature (HOT) detectors. Initial efforts were concentrated on photoconductors and photoelectromagnetic detectors. Next, several ways to achieve HOT detector operation have been elaborated including non-equilibrium detector design with Auger suppression and optical immersion. Recently, a new strategies used to achieve HOT detectors include barrier structures such as nBn, material improvement to lower generation-recombination leakage mechanisms, alternate materials such as superlattices and cascade infrared devices. Another method to reduce detector’s dark current is reducing volume of detector material via a concept of photon trapping detector. In this paper, a number of concepts to improve performance of photon detectors operating at near room temperature are presented. Mostly three types of detector materials are considered — HgCdTe and InAsSb ternary alloys, and type-II InAs/GaSb superlattice. Recently, advanced heterojunction photovoltaic detectors have been developed. Novel HOT detector designs, so called interband cascade infrared detectors, have emerged as competitors of HgCdTe photodetectors.     

Demonstration of large format mid-wavelength infrared focal plane arrays based on superlattice and BIRD detector structures

We have demonstrated the use of bulk antimonide based materials and type-II antimonide based superlattices in the development of large area mid-wavelength infrared (MWIR) focal plane arrays (FPAs). Barrier infrared photodetectors (BIRDs) and superlattice-based infrared photodetectors are expected to outperform traditional III–V MWIR and LWIR imaging technologies and are expected to offer significant advantages over II–VI material based FPAs. We have used molecular beam epitaxy (MBE) technology to grow InAs/GaSb superlattice pin photodiodes and bulk InAsSb structures on GaSb substrates. The coupled quantum well superlattice device offers additional control in wavelength tuning via quantum well sizes and interface composition, while the BIRD structure allows for device fabrication without additional passivation. As a demonstration of the large area imaging capabilities of this technology, we have fabricated mid-wavelength 1024 × 1024 pixels superlattice imaging FPAs and 640 × 512 MWIR arrays based on the BIRD concept. These initial FPA have produced excellent infrared imagery.     

Uncooled infrared photodetectors in Poland

The history and present status of the middle and long wavelength Hg_1-xCd_xTe infrared detectors in Poland are reviewed. Research and development efforts in Poland were concentrated mostly on uncooled market niche. Technology of the infrared photodetectors has been developed by several research groups. The devices are based on mercury-based variable band gap semiconductor alloys. Modified isothermal vapour phase epitaxy (ISOVPE) has been used for many years for research and commercial fabrication of photoconductive, photoelectromagnetic and other devices. Bulk growth and liquid phase epitaxy was also used. At present, the fabrication of IR devices relies on low temperature epitaxial technique, namely metalorganic vapour phase deposition (MOCVD), frequently in combination with the ISOVPE. Photoconductive and photoelectromagnetic detectors are still in production. The devices are gradually replaced with photovoltaic devices which offer inherent advantages of no electric or magnetic bias, no heat load and no flicker noise. Potentially, the PV devices could offer high performance and very fast response. At present, the uncooled long wavelength devices of conventional design suffer from two issues; namely low quantum efficiency and very low junction resistance. It makes them useless for practical applications. The problems have been solved with advanced 3D band gap engineered architecture, multiple cell heterojunction devices connected in series, monolithic integration of the detectors with microoptics and other improvements. Present fabrication program includes devices which are optimized for operation at any wavelength within a wide spectral range 1–15 μm and 200–300 K temperature range. Special solutions have been applied to improve speed of response. Some devices show picoseconds range response time. The devices have found numerous civilian and military applications. The paper presented there appears in Infrared Photoelectronics, edited by Antoni Rogalski, Eustace L. Dereniak, Fiodor F. Sizov, Proc. SPIE Vol. 5957, 59570K (2005).     

Exploring novel methods to achieve sensitivity limits for high operating temperature infrared detectors

A review of high operating temperature (HOT) infrared (IR) photon detector technology vis-a-vis material requirements, device design and state of the art achieved is presented in this article. The HOT photon detector concept offers the promise of operation at temperatures above 120 K to near room temperature. Advantages are reduction in system size, weight, cost and increase in system reliability. A theoretical study of the thermal generation–recombination (g–r) processes such as Auger and defect related Shockley Read Hall (SRH) recombination responsible for increasing dark current in HgCdTe detectors is presented. Results of theoretical analysis are used to evaluate performance of long wavelength (LW) and mid wavelength (MW) IR detectors at high operating temperatures.     

浅谈防空夜视装备的发展

针对我军现代夜间反空袭作战的制约瓶颈——缺乏夜视装备，提出在预警领域采用被动红外周视扫描系统，在先进的火控领域采用制冷式红外热成像系统．在老式的防空火控系统上利用微光和非制冷红外技术进行改造的方案比较符合我国国情，也是比较现实和可行的。     

Microthermomechanical infrared sensors

We present a state-of-the-art overview of microthermomechanical infrared sensor technology. The working principle of this sensor is based on a bi-material actuated micromechanical deflection, generated by an induced temperature rise due to incident infrared radiation absorption. In order to generate a thermal image the thermomechanical deflections of the freestanding microstructures are read by either capacitive, piezoresistive or optical means. Research and development activities in this field began in the early 1990s. The development of this technology within the last 20 years has resulted in innovations such as uncooled multiband infrared detection, high-speed infrared sensing and uncooled THz imaging. This paper outlines representative milestones of this technology and analyses important results of notable groups. Significant activities on capacitive and optical readout techniques of thermomechanical infrared arrays are presented. Furthermore the advantages of microthermomechanical infrared sensors over current well-established uncooled infrared technologies are summarized. In conclusion the latest developments of this technology offer a highly potential solution for a variety of important energy-saving, safety and security applications.