静态随机存储器单粒子翻转效应三维数值模拟

针对特征尺寸为1.5 μm的国产静态随机存储器（SRAM）,构建了三维SRAM存储单元模型,并对重离子引起的SRAM单粒子翻转效应进行了数值模拟.计算并分析了单粒子引起的单粒子翻转和电荷收集的物理图像,得到了SRAM器件的单粒子翻转截面曲线.单粒子翻转的数值模拟结果与重离子微束、重离子宽束实验结果比较一致,表明所建立的三维器件模型可以用来研究SRAM器件的单粒子翻转效应. 关键词： 三维数值模拟 单粒子翻转 微束 宽束     

基于重离子试验数据预测纳米加固静态随机存储器质子单粒子效应敏感性

为实现对纳米DICE (dual interlocked cell)加固器件抗质子单粒子能力的准确评估,通过对65 nm双DICE加固静态随机存储器(static random access memory, SRAM)重离子单粒子翻转试验数据的分析,获取了其在重离子垂直和倾角入射时的单粒子翻转(single event upset, SEU)阈值以及离子入射最劣方位角,并结合蒙卡仿真获取不同能量质子与器件多层金属布线层发生核反应产生的次级粒子LET(linear energy transfer)值最大值以及角度分布特性,对器件在不同能量下的质子单粒子效应敏感性进行了预测,质子单粒子效应实验结果验证了预测方法的有效性以及预测结果的准确性,并提出针对DICE加固类器件在重离子和质子单粒子效应试验评估中均应开展离子最劣方位角下的倾角入射试验.     

纳米静态随机存储器质子单粒子多位翻转角度相关性研究

器件特征尺寸的减小带来单粒子多位翻转的急剧增加, 对现有加固技术带来了极大挑战. 针对90 nm SRAM(static random access memory, 静态随机存储器)开展了中高能质子入射角度对单粒子多位翻转影响的试验研究, 结果表明随着质子能量的增加, 单粒子多位翻转百分比和多样性增加, 质子单粒子多位翻转角度效应与质子能量相关. 采用一种快速计算质子核反应引起单粒子多位翻转的截面积分算法, 以Geant4中Binary Cascade模型作为中高能质子核反应事件发生器, 从次级粒子的能量和角度分布出发, 揭示了质子与材料核反应产生的次级粒子中, LET(linear energy transfer)最大, 射程最长的粒子优先前向发射是引起单粒子多位翻转角度相关性的根本原因. 质子能量、临界电荷的大小是影响纳米SRAM器件质子多位翻转角度相关性的关键因素. 质子能量越小, 多位翻转截面角度增强效应越大; 临界电荷的增加将增强质子多位翻转角度效应.     

基于蒙特卡洛和器件仿真的单粒子翻转计算方法

文章提出了一种基于蒙特卡洛和器件仿真的存储器单粒子翻转截面获取方法,可以准确计算存储器单粒子效应,并定位单粒子翻转的灵敏区域.基于该方法,计算了国产静态存储器和现场可编程门阵列(FPGA)存储区的单粒子效应的截面数据,仿真结果和重离子单粒子效应试验结果符合较好.仿真计算揭示了器件单粒子翻转敏感程度与器件n,p截止管区域面积相关的物理机理,并获得了不同线性能量转移(LET)值下单粒子翻转灵敏区域分布.采用蒙特卡洛方法计算了具有相同LET、不同能量的离子径迹分布,结果显示高能离子的电离径迹半径远大于低能离子,而低能离子径迹中心的能量密度却要高约两到三个数量级.随着器件特征尺寸的减小,这种差别的影响将会越来越明显,阈值LET和饱和截面将不能完全描述器件单粒子效应结果.     

欧空局监测器单粒子翻转能量和角度相关性

结合欧空局推广需求,以及国内加速器和国际加速器比对的愿望,将欧空局单粒子翻转监测器(Europe space agency single event upset monitor,ESA SEU Monitor)成功应用于国内串列重离子加速器束流标定.通过和欧洲主要加速器的数据结果进行比对,分析系统内部单粒子翻转物理位图,验证了串列加速器在重离子束流监测技术方面的准确性.结合多方试验数据,观察到在低LET(linear energy transfer)单粒子翻转截面曲线亚阈区,相同LET值不同能量重离子引起ESA SEU Monitor翻转截面相差1—3个量级.采用基于试验数据的方法,确定了器件灵敏体积的几何尺寸、临界电荷以及收集效率,通过蒙特卡罗仿真揭示了ESA SEU Monitor单粒子翻转能量相关性的物理机理.同时针对试验中低LET值倾斜角度时,ESA SEU Monitor存储阵列中不同模块单粒子翻转所表现的敏感性差异,基于对器件结构的分析和计算验证,表明低LET重离子倾斜入射时,离子穿过不同模块灵敏区上方层间介质的差异是引起单粒子翻转角度相关性的根本原因.     

重离子微束单粒子翻转与单粒子烧毁效应数值模拟

用束径0.4μm的微束重离子数值模拟了单粒子翻转SEU和单粒子烧毁效应SEB.单粒子翻转给出了不同离子注入后漏区的电压(电流)随时间变化规律;计算了CMOSSRAM电路的单粒子翻转;给出了收集电荷随LET值的变化曲线并给出了某一结构器件的临界电荷;VDMOS器件单粒子烧毁给出了不同时刻沿离子径迹场强、电位线、电流和碰撞离化率的变化.     

252Cf源和重离子加速器对FPGA的单粒子效应

 对10万门基于静态随机存储器的现场可编程门阵列（FPGA）分别在锎-252（²⁵²Cf）源和HI-13串列加速器下进行了单粒子效应试验研究,测试了静态单粒子翻转截面及发生单粒子闩锁的线性能量转移阈值,并对试验结果进行了等效性分析比较。试验结果表明²⁵²Cf源引起的FPGA单粒子翻转截面比重离子加速器引起的约低1个数量级;使用²⁵²Cf源未能观测到该器件的单粒子闩锁现象,而使用重离子加速器可以测出该FPGA发生单粒子闩锁的线性能量转移阈值;在现代集成电路的宇航辐射效应地面模拟单粒子效应试验中²⁵²Cf源不是理想的测试单粒子闩锁的辐射源。     

用12C离子模拟质子引起的单粒子效应

在理论分析的基础上 ,提出了一种利用兰州重离子加速器提供的高能12C离子模拟质子引起单粒子效应的途径 .在保证核反应机制是引起单粒子效应主要机制的前提下,用高能12C离子可以模拟质子在功率金属 -氧化物 -半导体场效应晶体管中引起的单粒子烧毁以及单粒子栅极击穿 ,获得质子单粒子效应的饱和截面 ,定性研究质子单粒子效应的角度效应 ,还可以作为高能质子单粒子效应实验前的预备实验 .该方法拓展了兰州重离子加速器加速的轻的重离子在单粒子效应实验研究方面的应用 ,对现阶段国内开展质子单粒子效应实验研究具有重要意义. The mechanisms for proton and heavy ion induced single event effect (SEE) are discussed and a method to simulate proton induced SSEE (PSEE) with high energy 12 C is proposed in this paper. The experiments which can be done by using this method include single event burnout (SEB) and single event gate rupture in power MOSFET, single event upset (SEU) and single event transient (SET) in less sensitive device and angle effect. The experimets with high energy ...     

重离子加速器的现状

1911年卢瑟福发现原子核以后的约50年中,核反应的入射粒子主要局限于质子、氘、氚、氦核和中子。在轻粒子核反应的实验基础上,发展了两种解释反应机制的理论——复合核模型和直接作用模型(壳结构)。这两种模型都基本上没有考虑核物质的集体运动。重离子加速器为重离子核反应的发展提供了条件。     

高能质子单粒子翻转效应的模拟计算

在分析质子与硅反应的基础上,提出质子单粒子翻转截面理论计算模型,建立了模拟计算方法.计算得到了不同能量的高能质子在存储单元的灵敏区内沉积的能量.指出高能质子主要通过与硅反应产生的重离子在存储单元灵敏区内沉积能量,产生电荷,导致单粒子效应,得到了单粒子翻转截面与质子能量以及随临界电荷变化的关系.并将计算得到的单粒子翻转截面与实验数据进行了比较.     

深亚微米SRAM质子单粒子翻转实验研究

宇航半导体器件运行在一个复杂的空间辐射环境中,质子是空间辐射环境中粒子的重要组成部分,因而质子在半导体器件中导致的辐射效应一直受到国内外的关注。利用兰州重离子加速器(Heavy Ion Research Facility In Lanzhou) 加速出的H2 分子打靶产生能量为10 MeV 的质子,研究了特征尺寸为0.5/0.35/0.15 μm体硅和绝缘体上硅(SOI) 工艺静态随机存储器(SRAM) 的质子单粒子翻转敏感性,这也是首次在该装置上开展的质子单粒子翻转实验研究。实验结果表明特征尺寸为亚微米的SOI 工艺SRAM器件对质子单粒子翻转不敏感,但随着器件特征尺寸的减小和工作电压的降低,SOI 工艺SRAM器件对质子单粒子翻转越来越敏感;特征尺寸为深亚微米的体硅工艺SRAM器件单粒子翻转截面随入射质子能量变化明显,存在发生翻转的质子能量阈值,CREME-MC模拟结果表明质子在深亚微米的体硅工艺SRAM器件中通过质子核反应导致单粒子翻转。Microelectronic devices are used in a harsh radiation environment for space missions. Among all the reliability issues concerned, proton induced single event upset (SEU) is becoming more and more noticeable for semiconductor components exposed on space. In this work, an experimental research of SEU induced by 10 MeV proton for static random access memory (SRAM) of 0.5, 0.35 and 0.15 m feature size is carried out on HeavyIon Research Facility in Lanzhou for the rst time. The experimental results show that proton induced SEUs in submicron and deep-submicron (SRAMs) are dominated by secondary ions generated by proton nuclear reaction events. The silicon-on-insulator SRAMs characters natural radiation-hardened SEU by proton. For the deep-submicron bulk-silicon technology SRAM, the proton SEU cross section is closely related to the proton energy and there is a threshold energy for the SEU occurrence by proton indirect ionization. CREME-MC simulation indicates that the SEU events in deep-submicron SRAM are induced by the proton nuclear reaction.     

Impact of energy straggle on proton-induced single event upset test in a 65-nm SRAM cell

This paper presents a simulation study of the impact of energy straggle on a proton-induced single event upset(SEU)test in a commercial 65-nm static random access memory cell. The simulation results indicate that the SEU cross sections for low energy protons are significantly underestimated due to the use of degraders in the SEU test. In contrast, using degraders in a high energy proton test may cause the overestimation of the SEU cross sections. The results are confirmed by the experimental data and the impact of energy straggle on the SEU cross section needs to be taken into account when conducting a proton-induced SEU test in a nanodevice using degraders.     

重离子在14-nm FinFET SRAM器件引起的单粒子翻转

通过重离子实验研究了14-nm FinFET工艺静态随机存取存储器(SRAM)的单粒子翻转(SEU)特性。通过使用Weibull函数拟合SEU截面获得该器件的线性能量转移(LET)阈值:0.1 MeV/(mg/cm2)。对多位翻转(MBU)贡献的统计结果表明,当LET等于40.3 MeV/(mg/cm2)时,MBU的占比超过95%。此外,FinFET SRAM的SEU截面呈现出与Fin相关的入射角度的各向异性。该研究对基于FinFET工艺的抗辐射CMOS集成电路(IC)的设计具有一定的指导作用。     

Simulation of temporal characteristics of ion-velocity susceptibility to single event upset effect

Using a Monte Carlo simulation tool of the multi-functional package for SEEs Analysis(MUFPSA), we study the temporal characteristics of ion-velocity susceptibility to the single event upset(SEU) effect, including the deposited energy,traversed time within the device, and profile of the current pulse. The results show that the averaged dposited energy decreases with the increase of the ion-velocity, and incident ions of209 Bi have a wider distribution of energy deposition than132 Xe at the same ion-velocity. Additionally, the traversed time presents an obvious decreasing trend with the increase of ion-velocity. Concurrently, ion-velocity certainly has an influence on the current pulse and then it presents a particular regularity. The detailed discussion is conducted to estimate the relevant linear energy transfer(LET) of incident ions and the SEU cross section of the testing device from experiment and simulation and to critically consider the metric of LET.     

Probing the nuclear symmetry energy with heavy-ion reactions induced by neutron-rich nuclei

Heavy-ion reactions induced by neutron-rich nuclei provide a unique means to investigate the equation of state of isospin-asymmetric nuclear matter, especially the density dependence of the nuclear symmetry energy. In particular, recent analyses of the isospin diffusion data in heavy-ion reactions have already put a stringent constraint on the nuclear symmetry energy around the nuclear matter saturation density. We review this exciting result and discuss its implications on nuclear effective interactions and the neutron skin thickness of heavy nuclei. In addition, we also review the theoretical progress on probing the high density behaviors of the nuclear symmetry energy in heavy-ion reactions induced by high energy radioactive beams.      

Dependence of single event upsets sensitivity of low energy proton on test factors in 65 nm SRAM

In order to accurately predict the single event upsets(SEU) rate of on-orbit proton, the influence of the proton energy distribution, incident angle, supply voltage, and test pattern on the height, width, and position of SEU peak of low energy protons(LEP) in 65 nm static random access memory(SRAM) are quantitatively evaluated and analyzed based on LEP testing data and Monte Carlo simulation. The results show that different initial proton energies used to degrade the beam energy will bring about the difference in the energy distribution of average proton energy at the surface and sensitive region of the device under test(DUT), which further leads to significant differences including the height of SEU peak and the threshold energy of SEU. Using the lowest initial proton energy is extremely important for SEU testing with low energy protons. The proton energy corresponding to the SEU peak shifts to higher average proton energies with the increase of the tilt angle, and the SEU peaks also increase significantly. The reduction of supply voltage lowers the critical charge of SEU, leading to the increase of LEP SEU cross section. For standard 6-transitor SRAM with bit-interleaving technology,SEU peak does not show clear dependence on three test patterns of logical checkerboard 55 H, all "1", and all "0". It should be noted that all the SEUs in 65 nm SRAM are single cell upset in LEP testing due to proton's low linear energy transfer(LET) value.     

Single event upsets of spacecraft microelectronics exposed to solar cosmic rays

The technique for evaluating the SEU rate induced by solar particle incidence on spacecraft microelectronics is described, including the contributions from the primary (heavy ion-induced) and secondary (proton-induced) SEU mechanisms. The technique is based on original computational models for solar particle energy spectra and for SEU occurrence in electronics. The technique was used to analyze the data of the TDRS-1 Fairchild 93L422 IC exposed to protons and ions during the solar cosmic ray event of September–October 1989. The analysis included the distribution of the microcircuit shielding. A strong dependence of solar proton-to-ion ratio on the shielding thickness was indicated by the calculations.     

中子单粒子效应TCAD仿真

分析了核裂变与聚变情况下,典型能量的中子与半导体器件反应,所产生的次级粒子及其能谱分布。根据中子所能导致的最恶劣情况,讨论了65nm工艺尺寸下,半导体静态存储器的单粒子效应,并给出了TCAD仿真的结果。结果显示,商用6管单元难以避免中子单粒子效应的发生。双互锁存储单元(DICE)结构在高密度设计时,也由于电荷共享效应,发生了单粒子翻转。由于电荷共享效应难以用SPICE仿真的方法得到,TCAD仿真更适用于中子单粒子免疫的SRAM设计验证。最后,讨论了65nm工艺下,中子单粒子免疫的SRAM设计,指出6管单元加电容的方式,可能是更有竞争力的方案。     

On the nuclear matter approach to the heavy-ion optical potential

A simple theory of the heavy-ion optical potential oV, based on the local density approximation, is presented. The colliding ions are described locally as two slabs of nuclear matter. The real part of the energy density of the two slabs is derived from the properties of nuclear matter, and for the imaginary part the “frivolous model” is applied. Results for oV in the case of two slabs are presented and compared with results of other calculations. Arguments are given in favour of using the frivolous model in the optical potential and the VUU calculations for heavy-ion collisions.