基于0.13 μm SiGe BiCMOS工艺的12位1.6 GS/s折叠插值A/D转换器

提出了一种基于0.13 μm SiGe BiCMOS工艺的高速、高精度折叠插值A/D转换器。采用基于SEF开关的新型采样/保持电路,固定保持阶段电压,实现了高速、高精度、高线性度的信号采样。采用带有射极跟随器的折叠放大器,构成平均折叠和环形插值的四级级联结构,减少了比较器数目,降低了建立时间和整体功耗。采用新型两级比较器,将模拟与数字信号进行隔离,优化了回踢噪声。使用小尺寸晶体管,减小了再生时间。在3.3/5 V电源和0.13 μm SiGe BiCMOS工艺下,该折叠插值A/D转换器实现了1.6 GS/s的采样率,SFDR为71.3 dB,SNDR为63.6 dB,ENOB为10.27 bit。     

8 bit 400 MS/s CMOS折叠插值结构ADC的设计

折叠插值结构是高速ADC设计中的常用结构。提出了一种新的在折叠插值结构ADC中只对THA进行时间交织的技术,可以在基本不增加芯片功耗和面积的情况下,使ADC的系统速度提高近1倍。位同步技术可以保证粗分和细分通路之间的同步,在位同步的基础上设计了新的编码方式。基于上述技术设计了8 bit 400 MS/s CMOS折叠插值结构ADC,核心电路电流为110mA,面积仅1mm×0.8mm,Nyquist采样频率下SNDR为47.2dB,SFDR为57.1dB。     

基于0.18 μm CMOS工艺8 bit/150 MHz折叠插值ADC

折叠插值模数转换器的转换速度快,可实现并行一步转换,但由于受到面积、功耗以及CMOS工艺线性度和增益的限制,其精度较低.提出了一种电流模均衡电路,能够有效地消除折叠电路中的共模影响,提高折叠电路增益及线性度,从而提高电路的转换精度.应用此技术,设计了一款折叠插值A/D转换器,工作电压为3.3 V,采样时钟为150 MHz,并通过0.18μm CMOS工艺实现,版图总面积为0.22 mm2.     

一种低延迟折叠插值12位1.5 GS/s ADC

基于4级级联折叠插值架构,提出了一种12位ADC。电路采用0.18μm SiGe BiCMOS工艺设计。单核达到1.5 GS/s的转换速度,接口输出为2-lane LVDS,延迟时间小于7 ns。前端采样保持电路和折叠插值量化器采用纯双极设计,在不修调的情况下可达到12位量化精度。最后,给出版图设计要点和测试结果。     

一个低功耗1G-samples/s,6-bit折叠插值ADC芯片设计

本文提出了一种具有高线性度的折叠,插值结构数模转换器(ADC)。与高速并行数模转换器(Flash ADC)相比较,该结构具有面积小,功耗低的特点,适用于低功耗超宽带(UWB)接收机中。本文对电路各部分进行了设计,并在SMIC 0.18μm工艺下完成了版图设计和后仿真。版图核心电路面积(不包括PAD)仅为0.45mm2,在1G samples/s采样率,输入信号为488.77MHz时,总功耗仅为57mW,有效位(ENOB)达到5.74bits。     

一个5-bit 4 GS/s的插值型模数转换器设计

设计了一款5-bit 4 GS/s的电阻插值型模数转换器(ADC),由预放大器阵列、高速比较器和编码器模块组成。定量分析了预放大器阵列的带宽和增益对ADC性能的影响,选取了最优的预放大器阵列结构,采样保持电路则选择了分布式采样,并采用电流逻辑模(CML)的比较器和编码电路。基于TSMC 65 nm工艺下进行仿真:在4 GHz的采样频率下,输入信号为200 MHz时,有效位数(ENOB)为4.85,SNDR为30.97,系统功耗为85 m W。     

150Ms/s、6bit CMOS数字工艺折叠、电流插值A/D转换器

在1.2μm SPDM标准数字CMOS工艺条件下,实现6bit CMOS折叠、电流插值A/D转换器;提出高速度再生型电流比较器的改进结构,使A/D转换器(ADC)总功耗下降近30%;提出一种逻辑简单易于扩展的解码电路,以多米诺(Domino)逻辑实现.整个ADC电路中只使用单一时钟.在5V电压条件下,仿真结果为采样频率150-Ms/s时功耗小于185mW,输入模拟信号和二进制输出码之间延迟小于2个时钟周期.     

150Ms/s、6bit CMOS数字工艺折叠、电流插值A/D转换器

在1.2μm SPDM标准数字CMOS工艺条件下,实现6bit CMOS折叠、电流插值A/D转换器;提出高速度再生型电流比较器的改进结构,使A/D转换器(ADC)总功耗下降近30%;提出一种逻辑简单易于扩展的解码电路,以多米诺(Domino)逻辑实现.整个ADC电路中只使用单一时钟.在5V电压条件下,仿真结果为采样频率150-Ms/s时功耗小于185mW,输入模拟信号和二进制输出码之间延迟小于2个时钟周期.     

一种65nm CMOS工艺的6-bit时间交替ADC设计

描述了一种改进计时的基于65nm CMOS工艺的6位流水线模数转换器（ADC）实例。采用4个通道均由一个标有刻度的全动态流水线式二分查找 (PLBS)架构,并在折叠前端采用基于25%工作周期的计时同步方案,可将ADC转换率提高至3 GS/s,其功率损耗为4.1 mW。ADC实测结果,在低输入频率条件下测得的无杂散动态范围(SFDR)和信噪失真比（SNDR）分别为44.1和31.2 dB。与类似高速ADC相比,该设计将PLBS架构的速度提高了60%,同时也提高了ADC的功率效率。模数转换器原型核心电路面积为250 × 120 μm2。     

一个嵌入式应用的8位300MS/s折叠内插模数转换器

本文设计了一个1.4V电源电压8位300MS/s折叠内插结构的模数转换器。该模数转换器利用0.13μm CMOS工艺实现,有效面积仅为0.6mm2,非常适合嵌入式应用。系统对低功耗进行了优化。流水线式采样开关节省了用于实现信号完整建立而增加的额外功耗。失调平均电阻阵列被置于两级折叠电路之间也是出于节省功耗的考虑。该转换器在1MHz下达到了43.4dB的信噪失真比和53.3dB的无杂散动态范围,在奈奎斯特频率输入情况下信噪失真比和无杂散动态范围分别为42.1dB和49.5dB。测试结果表明在1.4V电源250MHz采样率下功耗为34mW,FoM值为1.14pJ/转换步长。     

An 8-b 300MS/s folding and interpolating ADC for embedded applications

A 1.4-V 8-bit 300-MS/s folding and interpolating analog-to-digital converter (ADC) is proposed. Fabricated in the 0.13-μm CMOS process and occupying only 0.6-mm2 active area, the ADC is especially suitable for embedded applications. The system is optimized for a low-power purpose. Pipelining sampling switches help to cut down the extra power needed for complete settling. An averaging resistor array is placed between two folding stages for power-saving considerations. The converter achieves 43.4-dB signal-to-noise and distortion ratio and 53.3-dB spurious-free dynamic range at 1-MHz input and 42.1-dB and 49.5-dB for Nyquist input. Measured results show a power dissipation of 34 mW and a figure of merit of 1.14 pJ/convstep at 250-MHz sampling rate at 1.4-V supply.     

一种折叠内插式高速模数转换器的设计

描述了一种8bit,125MS/s采样率的折叠内插式ADC采用折叠内插结构设计。系统采用全并行结构的粗量化器实现高3位的量化编码,细量化部分采用折叠内插结构实现低5位的量化编码。电路设计中涉及分布式采样保持电路、折叠内插电路并在文章最后提出一种粗量化修正电路设计。通过HSPICE仿真测试,在采样频率为125MHz下对100M以内的输入频率测试,ADC信噪比达到40.0dB以上,功耗仅为170mW。     

单通道8bit1.4GS/s折叠内插ADC

基于0.18 μm CMOS工艺设计并实现了一种8 bit 1.4 GS/s ADC.芯片采用多级级联折叠内插结构降低集成度,片内实现了电阻失调平均和数字辅助失调校准.测试结果表明,ADC在1.4GHz采样率下,有效位达6.4bit,功耗小于480 mW.文章所提的综合校准方法能够有效提高ADC的静态和动态性能,显示出...     

An 8-bit 200-MSample/s Folding and Interpolating ADC in 0.25 mm2

This article is presented to describe an area-efficient CMOS folding and interpolating analog-to-digital converter (ADC) for embedded application, which is fully compatible with standard digital CMOS technology. A modified MOS-transistor-only folding block contributes to a small chip area. At the input stage, offset averaging reduces the input capacitance and the distributed track-and-hold circuits are proposed to improve signal-to-noise-plus-distortion ratio (SNDR). An INL/DNL of 0.77 LSB/0.6 LSB was measured. An SNDR figure of 43.7 dB is achieved at 4 MHz input frequencies when operated at full speed of 200 MHz. The chip is realized in a standard digital 0.18 μm CMOS technology and consumes a total power of 181 mW from 3.3 V power supply. The active area is 0.25 mm².     

一种有效位为11.3比特的14位100兆CMOS流水线型模数转换器

This paper demonstrates a 14-bit 100-MS/s pipelined analog-to-digital converter(ADC) in 0.18μm CMOS process with a 1.8 V supply voltage.A fast foreground digital calibration mechanism is employed to correct capacitor mismatches.The ADC implements an SHA-less 3-bit front-end to reduce the size of the sampled capacitor. The presented ADC achieves a 70.02 dB signal-to-noise distortion ratio(SNDR) and an 87.5 dB spurious-free dynamic range(SFDR) with a 30.7 MHz input signal,while maintaining over 66 dB SNDR and 76 dB SFDR up to 200 MHz input.The power consumption is 543 mW and a total die area of 3 x 4 mm2 is occupied.     

An 8-bit 10 MS/s folding and interpolating ADC using thecontinuous-time auto-zero technique

An 8-bit 10-MS/s folding and interpolating analog-to-digital converter (ADC) using the continuous-time auto-zero technique is presented. Compared with the conventional architecture, it can improve the nonlinear errors and enhance the signal-to-noise-and-distortion ratio (SNDR). Both architectures have been fabricated on the same die of a 0.35-μm DPDM CMOS process and measured under the same conditions with a 2.7-V supply voltage and 10-MHz sampling rate. The continuous-time auto-zero architecture shows an ENOB of 7.7 bits while the conventional one shows 5.8 bits     

A 25-GS/s 6-bit time-interleaved SAR ADC with design-for-test memory in 40-nm low-leakage CMOS

This paper presents a 25-GS/s 6-bit time-interleaved (TI) SAR ADC in a 40-nm CMOS low-leakage (LL) process. The prototype utilizes 4 × 12 hierarchical sampling architecture to reduce the complexity of track-and-hold circuits and the timing skew calibration. The single-channel SAR ADC adopts asynchronous processing with two alternate comparators. A partially active reference voltage buffer is designed to reduce the power consumption. The method based on sinusoidal signal approximation is employed to calibrate timing skew errors. To characterize the ultra-high-speed ADC, an on-chip design-for-test memory is designed. At 25 GS/s, the ADC achieves the SNDR of 32.18 dB for low input frequency and 27.28 dB for Nyquist frequency. The chip consumes 800 mW and occupies 1.3 × 2.6 mm², including the TI ADC core and memory.