Preparation of Meldrum's acid-functionalized polyimides exhibiting organo-soluble,reactive, self-crosslinkable,and colorless features

Functional polyimides (PIs) having some desired properties, for example, organo-solubility, chemical reactivity, crosslinkable feature, and high transparency in visible region, are attractive for specific applications. This work reports an effort to integrate the above-mentioned properties in one polyimide through introduction of Meldrum's acid (MA) moieties to polyimide chains with using a MA-containing diamine (MADA) as a monomer. The polyimide prepared with MADA and 4,4′-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) (PI[MADA-6FDA]) has a number-averaged molecular weight of 56,800 g mol⁻¹, shows good solubility in tetrahydrofuran and aprotic high polar solvents, and exhibits post-reactivity/crosslinkability through MA-mediated ketene chemistry. Crosslinked PI(MADA-6FDA) film shows a glass transition temperature of 289°C, a dielectric constant of about 2.78, and high flexibility bearing a near-180° bending. The MA-mediated ketene chemistry contributes to in situ building up covalent linkages between PI chains and silica nanoparticles (SNPs) in preparation of PI/SNPs nanocomposite films (NCF). Formation of the PI/SNPs NCFs enhances the thermal and mechanical properties, reduces the dielectric constants, and increases the transparency. The properties of the MA-functionalized PI are attractive for further studies on their applications.     

Synthesis and properties of fluorinated polyimides. 1. Derived from novel 4,4″‐bis(aminophenoxy)‐3,3″‐trifluoromethyl terphenyl

A new diamine monomer, 4,4″‐bis(aminophenoxy)‐3,3″‐trifluoromethyl terphenyl (ATFT) was synthesized that led to a number of novel fluorinated polyimides by solution as well as thermal imidization routes when reacted with different commercially available dianhydrides like pyromellatic dianhydride (PMDA), benzophenone tetracarboxylic acid dianhydride (BTDA), or 2,2‐bis(3,4‐dicarboxyphenyl) hexafluoropropane (6FDA). The polyimides ATFT/BTDA and ATFT/6FDA derived from both routes were soluble in several organic solvents such as N,N‐dimethylformamide, N,N‐dimethylacetamide, and dimethyl sulfoxide. The polyimide ATFT/PMDA was only soluble in N‐methylpyrollidone. The polyimide films had low water absorption of 0.3–0.7%, low dielectric constants of 2.72–3.3 at 1 Hz, refractive indices of 1.594–1.647 at 589.3 nm, and optical transparency >85%. These polyimides showed very high thermal stability with decomposition temperatures (5% weight loss) up to 532 °C in air and good isothermal stability; only 7% weight loss occurred at 400 °C after 7 h, and less than 0.6% weight loss was observed at 315 °C for 5 h. Transparent thin films of these polyimides exhibited tensile strengths up to 112 MPa, a modulus of elasticity up to 3.05 GPa, and elongation at break up to 21% depending on the repeating unit structure. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1016–1027, 2002     

耐超高温双酮酐型聚酰亚胺的合成及性能

以4,4'-对苯二甲酰二邻苯二甲酸酐(TDPA)为芳二酐单体,对苯二胺(PPD)为芳二胺单体,经低温溶液缩聚制得成膜性能优良的高相对分子质量聚酰胺酸(PAA),再经过热亚胺化制备双酮酐型聚酰亚胺(PI)薄膜。 采用傅里叶变换红外光谱仪(FT-IR)、广角X射线衍射(WAXD)、差示扫描量热仪(DSC)、动态热机械分析仪(DMA)、热重分析仪(TGA)、紫外-可见分光光度计(UV-Vis)及力学性能等技术手段表征了聚酰亚胺膜的结构和性能,考察了不同亚胺化温度对合成的双酮酐型聚酰亚胺膜性能的影响。 结果表明,经程序升温至320 ℃能使PAA热亚胺化基本趋于完成。 PI薄膜为部分有序聚集态结构,玻璃化转变温度(T_g)为298 ℃,具有优异的热性能,热失重温度(T_5%)为523 ℃。 拉伸强度达到130 MPa,弹性模量为5.77 GPa。 PI薄膜紫外光透过截止波长为375 nm,在可见光区具有良好的透光性能及耐溶剂性能。     

含氟及硫醚基团聚酰亚胺光波导材料的合成及表征

通过分子设计,合成了含三氟甲基及硫醚基团的二胺单体4,4'-双(4-胺基-2-三氟甲基苯硫基)二苯硫醚(6FSEDA),利用其与6种芳香二酐单体:3,3',4,4'-联苯四羧酸二酐(BPDA)、4,4'-氧双邻苯二甲酸酐(ODPA)、3,3',4,4'-二苯酮四酸二酐(BTDA)、4,4'-(六氟异丙基)-苯二酸酐(6FDA)、3,3',4,4'-二苯硫醚四酸二酐(DTDA)及3,3',4,4'-二苯砜四酸二酐(DSDA)经一步法合成了一系列含氟及硫醚基团的聚酰亚胺(PI),并对其结构与性能进行了研究.结果表明,该系列PI的玻璃化温度Tg(DSC)在199.8～231.7℃范围,5%和10%热失重的温度(N2氛围)分别在491℃和517℃以上,在400～700 nm的可见光波长范围内具有优异的光学透明性,在光通讯波段(1310 nm和1550 nm处)均无明显吸收,且在这两个波长处测得的平均折射率范围分别为1.5401～1.6142和1.5389～1.6124,在波长632.8 nm测得的双折射范围为0.0012～0.0045.可见,含氟及硫醚基团聚酰亚胺薄膜具有良好的热稳定性和光学性能.     

Photosensitive fluorinated polyimides with a low dielectric constant based on reaction development patterning

The fluorinated polyimide PI(6FDA/HFBAPP) was prepared by the reaction of 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride (6FDA) with 2,2‐bis[4‐(4‐aminophenoxy)phenyl]hexafluoropropane (HFBAPP) in 1‐methyl‐2‐pyrrolidone/toluene. A multiblock copolyimide with both fluorinated and rigid‐rod segments, PI(6FDA/HFBAPP)(BPDA/2‐DMB), was prepared by the addition of a second dianhydride, 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), and a second diamine, 2,2′‐dimethylbenzidine (2‐DMB), to the polyimide main chain. The potential lithographic performance of photosensitive polyimides composed of nonphotosensitive fluorine‐containing polyimides and photosensitive diazonaphthoquinone (DNQ) was studied on the basis of a new imaging principle recently proposed by our laboratory, that is, reaction development patterning. Neat PI(6FDA/HFBAPP) showed a low dielectric constant (?) of 2.41 and a low dissipation factor (tan δ) of 0.0027 at 20 GHz, and a 10‐μm resolution of the fluorinated polyimide/DNQ system was demonstrated with reactive development with a solution including ethanolamine after ultraviolet exposure. Although slight changes in the dielectric properties were observed in the presence of DNQ residues, these values (? = 2.63 and tan δ = 0.0033 at 20 GHz) were low enough for use in microelectronic applications. However, PI(6FDA/HFBAPP)(BPDA/2‐DMB), having a lower coefficient of thermal expansion (CTE; 33 ppm/°C) than PI(6FDA/HFBAPP) (49 ppm/°C), exhibited good positive photosensitivity, whereas the relatively low‐CTE multiblock copolyimide displayed a much higher ? value (3.48 at 1 MHz) than the highly fluorinated polyimide (2.88 at 1 MHz). A film consisting of PI(6FDA/HFBAPP)(BPDA/2‐DMB) and the remaining DNQ derivatives showed a CTE value comparable to that of the neat polyimide film. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 861–871, 2003     

A study on dielectric characteristics of fluorinated polyimide thin film

In this work, the effects of fluorination of polyimide thin films on surface and dielectric characteristics were studied using X-ray photoelectron spectroscopy (XPS) and dielectric spectrometry, respectively. The thermal and mechanical properties of the film were characterized by thermogravimetric analysis (TGA) and tensile strengths, respectively. The fluorine content of the polyimide thin film was increased with increasing treatment concentration, resulting in decreasing dielectric constant of the film. It was found that the replacement of fluorine led to the decrease of the local electronic polarizability of polyimide, or to the increase of the free volume, which can be attributed to the relatively large size of fluorine. Nevertheless, the fluorination did not significantly affect thermal or mechanical properties of the polyimide film under mild conditions in this system.     

含异山梨醇结构单元聚酰亚胺的合成与表征

以异山梨醇为原料,合成了含异山梨醇的二胺单体.将该单体与4,4′-(六氟异丙基)双邻苯二甲酸二酐(6FDA)反应,制备了含异山梨醇结构单元的聚酰亚胺.采用红外光谱、氢核磁共振、紫外光谱和热分析等手段,对产物的结构、热性能及光学性能等进行了表征.结果表明,所得到的聚酰亚胺具有较好的热稳定性和光学性能、并在极性溶剂中具有较好的溶解性.     

Structure-property relationship study of partially aliphatic copolyimides for preparation of flexible and transparent polyimide films

The structure-property relationship of partially aliphatic copolyimides has been studied for the development of flexible, transparent polyimide films. A structurally rigid cycloaliphatic dianhydride and three aromatic dianhydrides having different structural flexibility were reacted with 4,4′-oxydianiline to prepare the copolyimides. In order to control the balance between aromaticity and aliphaticity and between rigidity and flexibility of the copolyimides, the molar ratio of the dianhydrides was varied. Polyimide properties such as viscosity, solubility, optical transparency, color, dielectric constants, film flexibility and thermal stability are influenced by aromaticity/aliphaticity and/or flexibility/rigidity of the monomers.     

引入三氟甲基侧基对对苯醚型聚酰亚胺薄膜吸水性及水蒸汽透过性的影响

合成了3种含三氟甲基的芳香二胺,进而与3,3′,4,4′-联苯四甲酸二酐(BPDA)缩聚,得到3种对苯醚型含氟聚酰亚胺薄膜,并由4,4′-二氨基二苯醚（4,4′-ODA）与BPDA缩聚得到聚酰亚胺薄膜。 对4种聚酰亚胺薄膜的水蒸汽透过率、吸水性和热学性能的测试结果表明,其中聚合物PI-1（2,2′-BTF-4,4′-BADE+BPDA;BTF：双三氟甲基;BADE：二氨基二苯醚）的水蒸汽透过率为7.70 g/（h·m2）,吸水率为0.67%,玻璃化转变温度为259.74 ℃,质量损失5%的温度为521.40 ℃,具有良好的水蒸汽透过性和低吸水性。     

Fluorinated polyimide/POSS hybrid polymers with high solubility and low dielectric constant

A series of fluorinated polyimide/POSS hybrid polymers(FPI-4-FPI-16) were prepared via a facile synthetic route using 2,2'-bis(trifluoromethyl)benzidine, 4,4'-oxydiphthalic dianhydride and monofunctional POSS as starting materials. The hybrid polymers showed excellent solubility and film formation ability. Flexible and robust hybrid films could be conveniently obtained via solution-casting. The hybrid films demonstrated low dielectric constants and high thermal stability. Their dielectric constants were in the range of 2.47–2.92 at 1 MHz measured for their capacitance, and were tunable and decreased with an increase of POSS content. Their 10% weight loss temperatures were in the range of 539-591 ℃ and the weight residual at 800 ℃ ranged from 48% to 53% in nitrogen atmosphere. These hybrid films also possessed good mechanical properties and hydrophobic characteristics. This work could provide a potential strategy for the preparation of fluorinated polyimide/POSS hybrid polymers.     

A positive-working photosensitive alkaline-developable polyimide with a highly dimensional stability and low dielectric constant based on poly(amic acid) as a polyimide precursor and diazonaphthoquinone as a photosensitive compound

A positive-working photosensitive polyimide precursor based on fluorinated poly(amic acid) (FPAA) and 2,3,4-tris(1-oxo-2-diazonaphthoquinon-4-ylsulfonyloxy)benzophenone (D4SB) as a photosensitive compound has been developed. FPAA was prepared by ring-opening polyaddition of dianhydrides, pyromellitic dianhydride and biphenyltetracarboxylic dianhydride, with diamine, 2,2′-bis(trifluoromethyl)benzidine, in methanol. The FPAA film showed excellent transparency to UV light and good solubility in a wide range of organic solvents. The dissolution behavior of FPAA containing 30 wt % D4SB after exposure was studied, and it was found that the difference of dissolution rate between exposed and unexposed parts was enough to get high contrast due to the photochemical reaction of D4SB in the polymer film. The photosensitive fluorinated polyimide (FPI) precursor containing 30 wt % D4SB showed a sensitivity of 80 mJ cm⁻² and a contrast of 7.8 with 365 nm light when it was developed with 0.3% aqueous tetramethyl ammonium hydroxide solution at room temperature. The FPI film cured up to 360°C had a low coefficient of thermal expansion of 10.3 ppm °C⁻¹ and a low dielectric constant of 3.04. © 1998 John Wiley & Sons, Inc. J. Polym. Sci. A Polym. Chem. 36: 2261–2267, 1998     

Synthesis of Low Dielectric Constant Polyetherimide Films

As the demand for downsizing in microelectronics is increasing, devices require material with lower dielectric constant accordingly. The dielectric constants for most polyimide (PI), including polyetherimide (PEI), films are ∼3.5. In this study, we modified the PEI by incorporating various monomers (fluorinated dianhydride 6FDA and phenylene ether diamines) to reduce the dielectric constant. The dielectric constants of synthesized PEIs decreased with increasing amounts of 6FDA content and phenylene ether units. The T_g decreased gradually with PEI containing longer phenylene ether units, but increased with the content of 6FDA. The thermal decomposition temperatures at 10% weight loss were ∼550 °C, indicating that these PEIs have high thermal stability. Both the tensile strength and the modulus decreased with the PEI containing longer phenylene ether units. The PEI synthesized with 40% 6FDA dianhydride and 1,4-bis(4-aminophenoxy)benzene (pBAB) diamine has the lowest dielectric constant of 2.78 at 1 MHz.     

吡啶桥联的聚酰亚胺的合成与性能研究

以3,4-二甲基苯乙酮与3,5-双(三氟甲基)苯甲醛为原料,通过Chichibabin反应制备了吡啶桥联的四甲基化合物,该化合物再经氧化、脱水反应制备了主链含有吡啶环、侧链带有双三氟甲基取代苯侧基的新型含氟芳香族二酐单体,2,6双(3′,4′-二羧基苯基)-4-(3″-,5″-双三氟甲基苯基)吡啶二酐(6FDAPA).FT IR、NMR、质谱以及元素分析等测试结果表明,6FDAPA的结构与预期的相符.利用6FDAPA与另外一种不含氟的二酐单体2,6双(3′,4′二羧基苯基)4苯基吡啶二酐(DAPA)分别与含氟二胺单体,1,4双(2三氟甲基4氨基苯氧基)苯(6FAPB)通过两步热亚胺化法制备了两种聚酰亚胺(PI)薄膜.测试结果表明,6FDAPA6FAPB(PI2)与DAPA6FAPB(PI1)相比具有相近的耐热性能,玻璃化转变温度为280℃,起始热分解温度为580℃、700℃时的重量保持率64.5%.同时PI2具有更为优良的透光性,紫外可见光谱(UV Vis)测试表明,PI2与PI1薄膜在450nm处的透光率分别为85.7%与69.4%.     

基于多层结构设计的高储能密度氧化石墨烯/聚酰亚胺复合材料

采用逐层涂布、 分层控制固化程度的方法, 利用聚酰胺酸(PAA, 聚酰亚胺前体)溶液和含有氧化石墨烯（GO）的PAA溶液制备了一系列由高绝缘性PI层与GO@PI介电层交替组合而成的界面清晰且紧密衔接的多层复合薄膜. 通过调控介电层中GO含量及分层结构, 使多层复合薄膜兼具高介电常数和高击穿强度特征. 结果表明, 三层复合薄膜PI/1.0GO@PI/PI的击穿强度为261.5 kV/mm, 储能密度达到1.27 J/cm³, 与相同介电层厚度的单层薄膜相比, 击穿强度和储能密度分别提高了97%和144%, 同时, 其介电损耗也保持在较低水平(tanδ=0.0079). 绝缘层和高介电常数层的协同作用提升了氧化石墨烯/聚酰亚胺复合薄膜的储能密度. 这种简单的多层结构设计有利于氧化石墨烯/聚合物复合材料在介质储能领域的应用.     

一种含酚酞结构聚酰亚胺的合成及性能表征

通过酚酞的硝化和还原,得到了一种新型的含酞结构和酚羟基的二胺单体,通过二胺和4,4'-六氟亚异丙基二(邻苯二甲酸酐)(6FDA)缩聚并高温亚胺化,得到了相应的含酚羟基聚酰亚胺PI-HP.利用1H-NMR、FTIR、GPC及热分析表征了PI-HP的结构和热性能,利用紫外-可见光谱表征了其透明性.结果表明,PI-HP在部分极性有机溶剂中如DMF、THF、丙酮中具有良好的溶解性,具有较高的热稳定性并在可见光区域具有较好的透明性,其含羟基可进一步修饰用于制备各种功能材料.     

Synthesis and properties of cross‐linkable high molecular weight fluorinated copolyimides

A series of novel high molecular weight fluorinated co‐polyimides (Co‐PIs) containing styryl side chain based on 1,3‐bis(2‐trifluoromethyl‐4‐aminophenoxy)‐5‐(2,3,4,5‐tetrafluorophenoxy)benzene (6FTFPB) were successfully synthesized. The weight‐average molecular weights (M_ws) and polydispersities of the co‐polyimides were in the range 8.93–10.81 × 10⁴ and 1.33–1.82, respectively. The co‐polyimide film showed excellent solubility in organic solvents, high tensile properties (tensile strength exceeded 91 MPa), excellent optical transparency (cutoff wavelength at 332–339 nm and light transparencies above 89% at a wavelength of 550 nm), and high thermal stability (5% thermal weight‐loss temperature up to 510 °C). The casting and spinning films could be cross‐linked by thermal curing. The cured films show better combination property (including excellent resistance to solvents) than that of co‐polyimides. For instance, the glass transition temperature of Co‐PI‐1 (the molar weight ratio of 6FTFPB was 30%) increased from 217 to 271 °C, the tensile strength enhanced from 94 to 96 MPa, the 5% thermal weight‐loss temperature improved from 514 to 525 °C. Moreover, after cured, Co‐PI‐1 film also has a coefficient of thermal expansion (CTE) value of 60.3 ppm °C^?1, low root mean square surface roughness (R_q) at 4.130 nm and low dielectric constant of 2.60. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 349–359     

Dielectric properties of oxydianiline‐based polyimide thin films according to the water uptake

For polyimide thin films, the dielectric properties were investigated with the capacitance and optical methods. The dielectric constants of the 4,4′‐oxydianiline (ODA)‐based polyimide thin films varied from 2.49 to 3.10 and were in the following decreasing order: 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA)–ODA > 1,2,4,5‐benzenetetracarboxylic dianhydride (PMDA)–ODA > 4,4′‐hexafluoroisopropylidene diphthalic dianhydride (6FDA)–ODA. According to the absorption of water, the diffusion coefficients in the films varied from 4.8 × 10^?10 to 7.2 × 10^?10 cm²/s and were in the following increasing order: BPDA–ODA < PMDA–ODA < 6FDA–ODA. The dielectric constants and diffusion coefficients of the polyimides were affected by the morphological structures, including the molecular packing order. However, because of the water uptake, the changes in the dielectric constants in the polyimide thin films varied from 0.49 to 1.01 and were in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. Surprisingly, 6FDA–ODA with bulky hexafluoroisopropylidene groups showed less of a change in its dielectric constant than PMDA–ODA. The total water uptake for the polyimide thin films varied from 1.43 to 3.19 wt % and was in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. This means that the changes in the dielectric constants in the polyimide thin films were significantly related to the morphological structure and hydrophobicity of hexafluoroisopropylidene groups. Therefore, the morphological structure and chemical affinity in the polyimide thin films were important factors in controlling the dielectric properties. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 40: 2190–2198, 2002     

Synthesis and characterization of fluorine functionalized graphene oxide dispersed quinoline-based polyimide composites having low-k and UV shielding properties

Polyimide nanocomposites having low-k and UV shielding properties have been developed using fluorine functionalized graphene oxide and bis(quinoline amine) based polyimide. The polyimide was synthesized using bis(quinoline amine) and pyromellitic dianhydride at appropriate experimental conditions, and its molecular structure was confirmed through various spectral analysis such as FTIR and NMR. The polyimide (PI) composites were prepared using bis(quinoline amine), pyromellitic dianhydride, and separately filled with 1, 5, 10 wt% of fluorinated graphene oxide (FGO) through in situ polymerization. The polymer composites were characterized using thermo gravimetric analysis (TGA), X-ray powder diffraction (XRD), and scanning electron microscopy (SEM). In addition, the water contact angle, dielectric behavior, and UV–Vis shielding behavior of FGO/PI composites were evaluated. The value of the water contact angle of the polyimide was increased with increment of FGO in the polyimide matrix. The highest water contact angle of polyimide composites observed 108° was obtained for 15 wt% FGO reinforced polyimide composite. The value of the dielectric constant for neat, 1, 5, and 15 wt% FGO reinforced polyimide composites was obtained as 4.5, 3.7, 2.6, and 2.0, respectively. It is also observed from by UV–Vis spectroscopy analysis that the FGO reinforced polyimide composites have good UV shielding behavior.     

一种含三氟甲基取代不对称芳香二胺及其可溶性透明聚醚酰亚胺 的合成与表征

以2,6-二甲基苯酚和4-硝基苯甲酰氯为起始原料, 经三步有机反应设计合成了一种含氟不对称芳香二胺: (4’-(4’’-胺基-2’’-三氟甲基苯氧基)-3’,5’-二甲基苯)-(4-胺基苯)甲酮(3); 并由该二胺单体和二苯醚四酸二酐经一步法缩聚制备了一种新型含氟聚醚酰亚胺, 其特性粘度为0.68 dL/g. 该聚醚酰亚胺表现出优良的溶解性能和光学性能: 室温下不仅可以溶于N-甲基-2-吡咯烷酮、N,N-二甲基乙酰胺、N,N-二甲基甲酰胺等强极性溶剂中, 还能溶于低沸点的氯仿、四氢呋喃、二氯甲烷等溶剂中; 由该聚合物溶液所制的薄膜无色透明, 截断波长在352, 400 nm后具有高的透明性. 此外该聚醚酰亚胺还表现出良好的热性能和机械性能: 玻璃化转变温度在288 ℃, 氮气中起始分解温度在508 ℃; 该聚合物薄膜的拉伸强度为91 MPa, 断裂伸长率在10%～15%, 起始模量为1.7 GPa.     

PAA/PU合金制备多孔PI薄膜及结构与性能研究

以N,N-二甲基乙酰胺(DMAc)为溶剂, 在聚氨酯(PU)溶液中使均苯四酸二酐(PMDA)与4,4′-二氨基二苯醚(4,4′-ODA)缩聚成聚酰亚胺(PI)预聚体聚酰胺酸(PAA), 从而制成PAA/PU的混合溶液, 然后刮涂成膜, 经过热处理使得PAA亚胺化和PU降解, 制备多孔PI薄膜. 通过对薄膜进行红外光谱,热失重分析及透射电镜(TEM)观察, 结果表明, 最佳的PU热降解温度为360 ℃, PU降解后在PI基体中留下长条状纳米孔, 且孔径大小随聚氨酯含量的增加而增大. 通过对薄膜进行力学性能、 介电性能和吸水率研究, 结果表明, 随着体系中PU用量的增加, 热处理后的多孔PI薄膜的介电常数逐渐下降, 但拉伸强度降低, 吸水率上升.